CN206885445U - A kind of film sticking apparatus for IC chip - Google Patents
A kind of film sticking apparatus for IC chip Download PDFInfo
- Publication number
- CN206885445U CN206885445U CN201720836189.7U CN201720836189U CN206885445U CN 206885445 U CN206885445 U CN 206885445U CN 201720836189 U CN201720836189 U CN 201720836189U CN 206885445 U CN206885445 U CN 206885445U
- Authority
- CN
- China
- Prior art keywords
- conveyer belt
- rebound
- chip
- pad pasting
- rotating cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
It the utility model is related to electronic component manufacture field, a kind of more particularly to film sticking apparatus for IC chip, including frame, delivery unit and pad pasting unit, the delivery unit includes the first conveyer belt and the second conveyer belt positioned at the first conveyer belt output end, it is vertically-mounted in the frame to have rebound, rebound rebound upper surface between the first conveyer belt and the second conveyer belt is consistent with delivery unit face height, and the rebound is provided with cutting blade close to one end of the second conveyer belt；The pad pasting unit includes pressing mechanism and the tumbler for winding pad pasting, and the tumbler is located above rebound, and the pressing mechanism includes being used for the extruding rotating cylinder for extruding IC chip, and the extruding rotating cylinder is located at rebound.By implementing the technical program, solve the problems, such as that labor intensity present in existing IC chip Filming Technology is big or cost is high.
Description
Technical field
It the utility model is related to electronic component manufacture field, more particularly to a kind of film sticking apparatus for IC chip.
Background technology
IC chip processing and manufacturing complete after need to its surface carry out pad pasting protection, with prevent storage, transport
During its surface of scratch, influenceing its attractive in appearance also influences its sale.Existing pad pasting mode has plenty of by manually to realize,
I.e. when carrying out pad pasting to IC chip, reel diaphragm is fixed on IC chip one end first, then pull diaphragm to stick film
On the ic chip, instrument is then reused to press film on the ic chip completely.The pad pasting mode is artificial due to being completely dependent on, because
The problem of pad pasting efficiency is low, labor intensity is big be present in this.Some then carries out pad pasting work using numerical control device, although this side
The pad pasting speed of formula is fast, efficiency high, but its cost is higher, large enterprise's application is only applicable to, for conventional small processing enterprise
For cost it is too high.
Utility model content
The utility model is intended to provide a kind of film sticking apparatus for IC chip, to solve in existing IC chip Filming Technology
The problem of existing labor intensity is big, cost is high.
To reach above-mentioned purpose, base case of the present utility model is as follows：A kind of film sticking apparatus for IC chip, including
Frame, delivery unit and pad pasting unit, the delivery unit include the first conveyer belt and positioned at the first conveyer belt output end the
Two conveyer belts, vertically-mounted in the frame to have rebound, the rebound is between the first conveyer belt and the second conveyer belt, institute
State that rebound upper surface is consistent with delivery unit face height, the rebound is provided with cutting close to one end of the second conveyer belt
Blade；The pad pasting unit includes pressing mechanism and the tumbler for winding pad pasting, and the tumbler is located above rebound, institute
Stating pressing mechanism includes being used for the extruding rotating cylinder for extruding IC chip, extrudes and is connected with stage clip, the extruding between rotating cylinder and frame
Rotating cylinder is located at rebound.
The principle of this programme is：By pad pasting around being located on tumbler, and its free end is stretched at negative pressure mouth, works as IC
Chip from the first conveyer belt be sent to rebound when, IC chip right-hand member offsets with pad pasting, with IC chip continue transmission extruding
Rotating cylinder by pad pasting compress on the ic chip, after IC chip is by rebound, extruding rotating cylinder in the presence of stage clip by pad pasting to
Under be squeezed on cutting blade, so as to which the pad pasting of IC chip left end be cut off, so complete the film process of an IC chip.
The advantages of this programme, is：1. this programme can complete the film process of IC chip without manpower intervention, reduce
The labor intensity of staff.2. this programme is by low accessory groups of cost such as conveyer belt, extruding rotating cylinder, rebound, cutting blades
Conjunction forms, so as to reduce the cost of this equipment.3. by setting a rebound between two conveyer belts, and in rebound
The film that cutting blade is set in side wall to realize in the IC chip completed to each pad pasting carries out surface trimming separation.
Preferred scheme 1：Based on scheme improvement, the frame is provided with negative pressure mouth, and the negative pressure mouth is located at cutter
Between piece and the second conveyer belt, by above-mentioned setting, around the free end for the pad pasting being located on tumbler in the presence of negative pressure mouth,
All the time downwards to ensure effective covering of the pad pasting to IC chip.
Preferred scheme 2：Preferably 1 improvement, the pressing mechanism also include rotating shaft and are fixedly connected on rotating shaft
On support frame, the free end of the support frame is rotatably connected on extruding rotating cylinder both ends, by above-mentioned setting, extrudes rotating cylinder and pad pasting
IC chip rotate contact, reduce abrasion compared to sliding contact.
Preferred scheme 3：Preferably 2 improvement, the end sleeve of the rotating shaft are provided with gear, engaged on gear with teeth
Bar, the rack are driven by the cylinder, and by above-mentioned setting, the rotational angle of rotary shaft can be driven by the reciprocating motion of cylinder, from
And adjust compaction degree of the extruding rotating cylinder to IC chip.
Preferred scheme 4：Preferably 3 improvement, the extruding drum surface are provided with rubber layer, utilize rubber layer
Flexibility, on the one hand when pad pasting is compressed on the ic chip, make pad pasting everywhere uniform force so as to ensure that pad pasting and IC cores
Effective fitting of piece；On the other hand protect cutting blade not easily damaged when the rubber layer with extruding rotating cylinder contacts.
Brief description of the drawings
Fig. 1 is a kind of structural representation of film sticking apparatus embodiment for IC chip of the utility model.
Embodiment
The utility model is described in further detail below by embodiment：
Reference in Figure of description includes：First conveyer belt 1, the second conveyer belt 2, rebound 3, cutting blade 4,
Negative pressure mouth 5, tumbler 6, extruding rotating cylinder 7, pad pasting 8, IC chip 9.
Embodiment is substantially as shown in Figure 1：A kind of film sticking apparatus for IC chip, including frame, delivery unit and patch
Film unit 8, delivery unit include the first conveyer belt 1 and the second conveyer belt 2 positioned at the output end of the first conveyer belt 1, erected in frame
Rebound 3 directly is installed, the rebound 3 is between the first conveyer belt 1 and the second conveyer belt 2, the upper surface of rebound 3 and transmission
Cell operation face is generally aligned in the same plane, when 9 cross drive of IC chip, the distance between the first conveyer belt 1 and the second conveyer belt 2
Less than the half of the length of IC chip 9, cutting blade 4, the length of cutting blade 4 are installed with the right side wall of rebound 3
More than the width of pad pasting 8.Negative pressure mouth 5 is offered in frame, negative pressure mouth 5 is communicated with negative pressure pump, and the negative pressure mouth 5 is located at cutting blade 4
And second between conveyer belt 2, and negative pressure mouth 5 is located at the lower section of cutting blade 4.
Pad pasting unit 8 includes pressing mechanism and the tumbler 6 for winding pad pasting 8, and the tumbler 6 is located on rebound 3
Side, pressing mechanism include being used for the extruding rotating cylinder 7 for extruding IC chip 9, extrude and stage clip is connected between rotating cylinder and frame, and extruding turns
Cylinder is at rebound.Extruding rotating cylinder 7 surface is provided with rubber layer, and the extruding rotating cylinder 7 is located at the cutting blade 4 of rebound 3,
In normality, extruding rotating cylinder 7 offsets with cutting blade 4.Pressing mechanism also includes rotating shaft and the support being fixedly connected in rotating shaft
Frame, the free end of support frame are rotatably connected on extruding rotating cylinder 7 both ends.The end sleeve of rotating shaft is provided with gear, is engaged on gear with teeth
Bar, the rack are driven by the cylinder.
In real work, by pad pasting 8 around being located on tumbler 6, and its free end is stretched at negative pressure mouth 5, works as IC
Chip 9 from the first conveyer belt 1 be sent to rebound 3 when, the right-hand member of IC chip 9 offsets with pad pasting 8, continues to transport with IC chip 9
Dynamic, pad pasting 8 is pressed in IC chip 9 by extruding rotating cylinder 7, and when the left end of IC chip 9 is by rebound 3, extruding rotating cylinder 7 is being pressed
Pad pasting 8 is pressed downwardly against on cutting blade 4 in the presence of spring, so as to which the pad pasting 8 of the left end of IC chip 9 be cut off, so completed
The process of pad pasting 8 of one IC chip 9.
Above-described is only embodiment of the present utility model, the general knowledge such as known concrete structure and/or characteristic in scheme
Do not describe excessively herein.It should be pointed out that for those skilled in the art, before the utility model design is not departed from
Put, several modifications and improvements can also be made, these should also be considered as the scope of protection of the utility model, and these are all without shadow
Ring effect and practical applicability that the utility model is implemented.This application claims protection domain should be with its claim
Appearance is defined, and the record such as embodiment in specification can be used for the content for explaining claim.
Claims (5)
1. a kind of film sticking apparatus for IC chip, it is characterised in that including frame, delivery unit and pad pasting unit, the biography
Sending unit includes the first conveyer belt and the second conveyer belt positioned at the first conveyer belt output end, vertically-mounted in the frame to have
Cab apron, the rebound is between the first conveyer belt and the second conveyer belt, the rebound upper surface and delivery unit working face
Highly consistent, the rebound is provided with cutting blade close to one end of the second conveyer belt；The pad pasting unit includes pressing mechanism
With the tumbler for winding pad pasting, the tumbler is located above rebound, and the pressing mechanism includes being used to extrude IC chip
Extruding rotating cylinder, and extrude and stage clip be connected between rotating cylinder and frame, the extruding rotating cylinder is located at rebound.
A kind of 2. film sticking apparatus for IC chip according to claim 1, it is characterised in that：The frame is provided with negative
Mouth is pressed, the negative pressure mouth is between cutting blade and the second conveyer belt.
A kind of 3. film sticking apparatus for IC chip according to claim 2, it is characterised in that：The pressing mechanism also wraps
Rotating shaft and the support frame being fixedly connected in rotating shaft are included, the free end of the support frame is rotatably connected on extruding rotating cylinder both ends.
A kind of 4. film sticking apparatus for IC chip according to claim 3, it is characterised in that：The end sleeve of the rotating shaft
Provided with gear, rack is engaged with gear, the rack is driven by the cylinder.
A kind of 5. film sticking apparatus for IC chip according to claim 4, it is characterised in that：The extruding drum surface
Provided with rubber layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720836189.7U CN206885445U (en) | 2017-07-11 | 2017-07-11 | A kind of film sticking apparatus for IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720836189.7U CN206885445U (en) | 2017-07-11 | 2017-07-11 | A kind of film sticking apparatus for IC chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206885445U true CN206885445U (en) | 2018-01-16 |
Family
ID=61296322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720836189.7U Expired - Fee Related CN206885445U (en) | 2017-07-11 | 2017-07-11 | A kind of film sticking apparatus for IC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206885445U (en) |
-
2017
- 2017-07-11 CN CN201720836189.7U patent/CN206885445U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180116 Termination date: 20200711 |