CN206884100U - Semiconductor packaging mold gum-filling mechanism - Google Patents
Semiconductor packaging mold gum-filling mechanism Download PDFInfo
- Publication number
- CN206884100U CN206884100U CN201720637812.6U CN201720637812U CN206884100U CN 206884100 U CN206884100 U CN 206884100U CN 201720637812 U CN201720637812 U CN 201720637812U CN 206884100 U CN206884100 U CN 206884100U
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- China
- Prior art keywords
- injection head
- head fixed
- fixed seat
- connecting rod
- disk
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Abstract
A kind of semiconductor packaging mold gum-filling mechanism,Including injection head,Connecting rod,Connector,Spring,Injection head fixed seat and injection head fixed block,Injection head is at the top of connecting rod,Cylindrical section and disk are arranged at connecting rod bottom,Connector is by straight bar section,Annular disk,Vertical plate and level board composition,Level board one end is provided with the U-shaped gap for cylindrical section insertion,The other end is connected with vertical plate plan vertical,Vertical plate bottom is vertically mounted on annular disk top surface,The mounting groove for disk insertion is formed between level board and annular disk,Annular disk is arranged at the top of straight bar section,Injection head fixed seating is below connector,Spring housing is on straight bar section and withstands between annular disk and injection head fixed seat,Straight bar section bottom is connected with injection head fixed block,Injection head fixed block is mounted in injection head fixed seat in the stepped hole opened up by the step ledge on itself outer wall,Injection head fixed seat is on die shoe.Connecting rod convenient disassembly in the utility model, whole process are very time saving and energy saving.
Description
Technical field
Semiconductor packaging mold is the utility model is related to, is especially a kind of semiconductor packaging mold gum-filling mechanism.
Background technology
As shown in figure 3, existing semiconductor packaging mold gum-filling mechanism generally comprises injection head 40, connecting rod 41, injection head
The 48, first fixed plate 45 of seat, the second fixed plate 46 and arm-tie 47, injection head 40 is mounted in the top of connecting rod 41, connecting rod 41
Bottom is provided with cylindrical section 51 and flat plug division 49, and triangular groove 43 is offered in the left and right ends side wall of plug division 49,
The top of injection headstock 48 offers the flat hole 50 inserted for plug division 49, and annular chamber 42, annular chamber 42 are arranged at the bottom of flat hole 50
Symmetrical on inwall that two positioning beads 44 are housed, in the first fixed plate 45, the first fixed plate 45 is mounted in for injection headstock 48 bottom
In second fixed plate 46, the second fixed plate 46 is on arm-tie 47.During work, pass through reciprocating linear of the injection head 40 in barrel
Move to realize the injecting glue encapsulation work of semiconductor.
Because connecting rod 41 and injection headstock 48 are by flat plug division 49, flat hole 50, annular chamber 42 and positioning
Pearl 44 realizes connection, therefore, when installing connecting rod 41, it is necessary to insert annular after flat plug division 49 is aligned into flat hole 50
In chamber 42, then it is rotated by 90 °, makes two positioning beads 44 respectively while be caught in the triangular groove 43 at the both ends of plug division 49；When
When changing connecting rod 41, then need again to be rotated by 90 ° connecting rod 41, and ensure that flat plug division 49 is accurately right with flat hole 50
Qi Hou, connecting rod 41 is transferred to.Thus it is not difficult to find out, the dismounting of connecting rod 41 has alignment and rotational sequence, operates very
Trouble, in the process, if the anglec of rotation slightly deviation may result in plug division 49 can not insert in annular chamber 42, connecting rod 41
Installing not in place or plug division 49 can not be transferred to out of annular chamber 42, and whole installation is wasted time and energy.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of semiconductor packaging mold gum-filling mechanism, its dismounting side
Just, it is time saving and energy saving to operate.
Technical solution of the present utility model is to provide a kind of semiconductor packaging mold glue-injection machine with following structure
Structure, including injection head, connecting rod, connector, spring, injection head fixed seat and injection head fixed block, injection head are mounted in connecting rod
Top, connecting rod bottom are sequentially provided with cylindrical section and disk from top to bottom, and connector is by straight bar section, annular disk, vertical plate and water
Flat board is formed, and level board one end offers the U-shaped gap for cylindrical section insertion, and the other end is connected with vertical plate plan vertical, is erected
Straight panel bottom is vertically mounted on annular disk top surface, and the mounting groove for disk insertion, annular are formed between level board and annular disk
Disk is arranged at the top of straight bar section, injection head fixed seating below the connector, spring housing on straight bar section and withstand on annular disk with
Between injection head fixed seat, straight bar section bottom is connected with injection head fixed block, and injection head fixed block on itself periphery wall by setting
In the stepped hole that the step ledge put opens up in injection head fixed seat, injection head fixed seat is on die shoe.
Semiconductor packaging mold gum-filling mechanism described in the utility model, wherein, the cross section of injection head fixed seat is in
Vertical T shapes, injection head fixed seat are mounted on die shoe in the T-slot opened up by the T-shaped structure, and the one of injection head fixed seat
End is equipped with latch, and one end of injection head fixed seat is also equipped with the positioning screw for Fixed latches, is offered on die shoe for inserting
The shrinkage pool of bottom insertion is sold, the backing pin for being used for stopping the abjection of injection head fixed seat is housed at latch on die shoe.
Semiconductor packaging mold gum-filling mechanism described in the utility model, wherein, cylindrical section and connecting rod and cylindrical section
Circular arc chamfering is equipped with the connecting portion of disk, circular arc chamfering R values are in below 0.5mm.
After above structure, compared with prior art, the utility model semiconductor packaging mold gum-filling mechanism have with
Lower advantage：With prior art connecting rod in dismounting, there are alignment and the process being accurately rotated by 90 °, cause dismounting to bother, very
Waste time and energy difference, and the utility model opens the bottom design of connecting rod into cylindrical section and disc structure, and in level board one end
If for the U-shaped gap of cylindrical section insertion, the mounting groove for disk insertion will be formed between level board and annular disk, therefore, in work
When people installs connecting rod, cylindrical section need to be only inserted in U-shaped gap, installation can easily be realized by disk is located in mounting groove；
During dismounting, opposite direction push-and-pull connecting rod, so that it may easily cylindrical section is transferred to out of U-shaped gap, realizes dismounting.It is obvious that this reality
With the new process for eliminating prior art Accurate align and being rotated by 90 °, when realizing the fast assembling-disassembling of connecting rod, and entirely
Process is very time saving and energy saving, and installation effectiveness is also greatly enhanced.
By the way that injection head fixed seat is inserted on die shoe in the T-slot opened up, latch, screwed in place spiral shell are then pressed
Nail, you can the Fast Installation of injection head fixed seat is realized, so as to further improve installation effectiveness of the present utility model.
Cylindrical section is equipped with circular arc chamfering with connecting rod and the connecting portion of cylindrical section and disk, the circular arc chamfering R values
In below 0.5mm, this can fully ensure that the connection of cylindrical section and installation capability.
Brief description of the drawings
Fig. 1 is the main view broken section structural representation of the utility model semiconductor packaging mold gum-filling mechanism；
Fig. 2 be in Fig. 1 a wherein connecting rod from U-shaped gap deviate from when mplifying structure schematic diagram；
Fig. 3 is the side structure schematic view of existing semiconductor packaging mold gum-filling mechanism.
Embodiment
The utility model semiconductor packaging mold gum-filling mechanism is made with reference to the accompanying drawings and detailed description further
Describe in detail：
As depicted in figs. 1 and 2, in this embodiment, the utility model semiconductor packaging mold gum-filling mechanism bag
Include injection head 10, connecting rod 11, connector, spring 19, injection head fixed seat 23 and injection head fixed block 24.Injection head 10 fills
At the top of connecting rod 11, the bottom of connecting rod 11 is sequentially provided with cylindrical section 12 and disk 13 from top to bottom；Connector by straight bar section 18,
Annular disk 17, vertical plate 16 and level board 14 form, and the right-hand member of level board 14 offers the U-shaped gap 15 inserted for cylindrical section 12,
The left end of level board 14 is connected with the plan vertical of vertical plate 16, and the bottom of vertical plate 16 is vertically mounted on the top surface of annular disk 17, horizontal
The mounting groove 25 inserted for disk 13 is formed between plate 14 and annular disk 17, annular disk 17 is arranged on the top of straight bar section 18；Injection
Head fixed seat 23 be located at below connector, spring 19 be enclosed on straight bar section 18 and withstand on annular disk 17 and injection head fixed seat 23 it
Between, the bottom of straight bar section 18 is connected with injection head fixed block 24, and injection head fixed block 24 passes through the step that is set on itself periphery wall
In the stepped hole that flange opens up in injection head fixed seat 23, injection head fixed seat 23 is on die shoe 30.
The cross section of the injection head fixed seat 23 is mounted in the T-shaped stood upside down, injection head fixed seat 23 by the T-shaped structure
In the T-slot opened up on die shoe 30, the left end of injection head fixed seat 23 is equipped with latch 20, and the left end of injection head fixed seat 23 is also
Equipped with the positioning screw 21 for Fixed latches 20, the shrinkage pool for the insertion of the bottom of latch 20 is offered on die shoe 30；Die shoe
The backing pin 22 for being used for stopping that injection head fixed seat 23 is deviate from is housed on 30 at latch 20.By the way that injection head fixed seat 23 is inserted
Enter in the T-slot opened up on die shoe 30, then press latch 20, screwed in place screw 21, you can realize injection head fixed seat
23 Fast Installation, so as to further improve installation effectiveness of the present utility model.
The cylindrical section 12 and the connecting portion of connecting rod 11 and cylindrical section 12 and disk 13 are equipped with circular arc chamfering, should
Circular arc chamfering R values are in below 0.5mm.Cylindrical section 12 and the connecting portion of connecting rod 11 and cylindrical section 12 and disk 13 are equipped with
Circular arc chamfering, for circular arc chamfering R values in below 0.5mm, this can fully ensure that the connection of cylindrical section and installation capability.
Injecting glue principle of the present utility model is same as the prior art, and the reciprocating linear by injection head 10 in barrel
Move to realize the injecting glue encapsulation work of semiconductor.
With prior art connecting rod in dismounting, there are alignment and the process being accurately rotated by 90 °, cause dismounting to bother, very
Waste time and energy difference, the utility model by the bottom design of connecting rod 11 into cylindrical section and disc structure, it is and right in level board 14
End opens up the U-shaped gap 15 inserted for cylindrical section 12, the installation for disk insertion will be formed between level board 14 and annular disk 17
Groove 25, therefore, when worker installs connecting rod 11, cylindrical section 12 need to be only inserted in U-shaped gap 15, make disk 13 positioned at peace
Installation can be easily realized in tankage 25；During dismounting, opposite direction push-and-pull connecting rod 11, so that it may easily cylindrical section 12 slits from U-shaped
Transferred in mouth 15, realize dismounting.
Embodiment described above is only that preferred embodiment of the present utility model is described, not to this practicality
New scope is defined, and on the premise of the utility model design spirit is not departed from, those of ordinary skill in the art are to this
The various modifications and improvement that the technical scheme of utility model is made, all should fall into the scope of protection of the utility model.
Claims (3)
1. a kind of semiconductor packaging mold gum-filling mechanism, including injection head (10) and connecting rod (11), injection head (10) dress
At the top of connecting rod (11), it is characterised in that：Also consolidate including connector, spring (19), injection head fixed seat (23) and injection head
Determine block (24), connecting rod (11) bottom is sequentially provided with cylindrical section (12) and disk (13) from top to bottom, the connector by
Straight bar section (18), annular disk (17), vertical plate (16) and level board (14) composition, described level board (14) one end are offered for circle
The U-shaped gap (15) of shell of column (12) insertion, the other end are connected with vertical plate (16) plan vertical, and vertical plate (16) bottom is hung down
Directly it is arranged on annular disk (17) top surface, the peace for disk (13) insertion is formed between the level board (14) and annular disk (17)
Tankage (25), the annular disk (17) are arranged at the top of straight bar section (18), and the injection head fixed seat (23) is located under connector
Side, the spring (19) are enclosed on straight bar section (18) and withstood between annular disk (17) and injection head fixed seat (23), described straight
Bar segment (18) bottom is connected with injection head fixed block (24), and the injection head fixed block (24) on itself periphery wall by setting
In the stepped hole that step ledge opens up in injection head fixed seat (23), the injection head fixed seat (23) is mounted in die shoe
(30) on.
2. semiconductor packaging mold gum-filling mechanism according to claim 1, it is characterised in that：The injection head fixed seat
(23) cross section is opened up in the T-shaped stood upside down, the injection head fixed seat (23) by the T-shaped structure on die shoe (30)
T-slot in, one end of the injection head fixed seat (23) is equipped with latch (20), and one end of injection head fixed seat (23) is also equipped with
For the positioning screw (21) of Fixed latches (20), offered on the die shoe (30) for the recessed of latch (20) bottom insertion
Hole, the backing pin (22) for being used for stopping injection head fixed seat (23) abjection is housed close to latch (20) place on die shoe (30).
3. semiconductor packaging mold gum-filling mechanism according to claim 2, it is characterised in that：The cylindrical section (12) is with connecting
The connecting portion of extension bar (11) and cylindrical section (12) and disk (13) is equipped with circular arc chamfering, and circular arc chamfering R values are in 0.5mm
Below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720637812.6U CN206884100U (en) | 2017-06-02 | 2017-06-02 | Semiconductor packaging mold gum-filling mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720637812.6U CN206884100U (en) | 2017-06-02 | 2017-06-02 | Semiconductor packaging mold gum-filling mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206884100U true CN206884100U (en) | 2018-01-16 |
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ID=61320118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720637812.6U Active CN206884100U (en) | 2017-06-02 | 2017-06-02 | Semiconductor packaging mold gum-filling mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206884100U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109228127A (en) * | 2018-10-24 | 2019-01-18 | 安徽大华半导体科技有限公司 | Substrate class wrapper mold |
-
2017
- 2017-06-02 CN CN201720637812.6U patent/CN206884100U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109228127A (en) * | 2018-10-24 | 2019-01-18 | 安徽大华半导体科技有限公司 | Substrate class wrapper mold |
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