CN206870352U - A kind of cooling device in cavity blow mold - Google Patents

A kind of cooling device in cavity blow mold Download PDF

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Publication number
CN206870352U
CN206870352U CN201720557193.XU CN201720557193U CN206870352U CN 206870352 U CN206870352 U CN 206870352U CN 201720557193 U CN201720557193 U CN 201720557193U CN 206870352 U CN206870352 U CN 206870352U
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China
Prior art keywords
heat conduction
mold insert
cavity
cooling device
die
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CN201720557193.XU
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Chinese (zh)
Inventor
刁增
张春宇
钱伟
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JIANGSU VICTORY MACHINERY CO Ltd
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JIANGSU VICTORY MACHINERY CO Ltd
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  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

The utility model discloses the cooling device in a kind of cavity blow mold that can improve the temperature distribution state of die cavity everywhere, including:Die ontology, die ontology is provided through the cooling duct of die ontology in arragement direction of the lower section of die cavity along die cavity, die ontology is respectively arranged with heat conduction mold insert placement hole in the both sides of each die cavity, the heat conduction mold insert being made from a material that be thermally conductive is inlaid with heat conduction mold insert placement hole, heat-conducting glue is perfused with the gap between heat conduction mold insert and heat conduction mold insert placement hole.Cooling device described in the utility model can be widely applied in various blow molds.

Description

A kind of cooling device in cavity blow mold
Technical field
It the utility model is related to blow mold, and in particular to the cooling device in a kind of cavity blow mold.
Background technology
As shown in figure 1, the cooling device in current cavity blow mold, its is relatively simple for structure, generally includes:Mould Has body 1, the cooling that die ontology 1 is provided through die ontology 1 in arragement direction of the lower section of die cavity 3 along die cavity 3 is led to Road 2.In actual use, due to die cavity both sides A, B, C, D, E, F area far from cooling duct farther out, its heat can not be timely Release, cause the temperature distributing disproportionation weighing apparatus of die cavity everywhere, have influence on the quality of finished product.
Utility model content
Technical problem to be solved in the utility model is:There is provided a kind of can improve the temperature distribution state of die cavity everywhere Cavity blow mold in cooling device.
In order to solve the above technical problems, the technical solution adopted in the utility model is:In a kind of cavity blow mold Cooling device, including:Die ontology, die ontology are provided through mould sheet in arragement direction of the lower section of die cavity along die cavity The cooling duct of body, described die ontology are respectively arranged with heat conduction mold insert placement hole, heat conduction mold insert in the both sides of each die cavity The heat conduction mold insert being made from a material that be thermally conductive is inlaid with placement hole.
As a kind of preferred scheme, in the cooling device in a kind of described cavity blow mold, described heat conduction Heat-conducting glue is perfused with gap between mold insert and heat conduction mold insert placement hole.
As a kind of preferred scheme, in the cooling device in a kind of described cavity blow mold, the heat conduction material The thermal conductivity factor of material is more than 300W/ (mK).
As a kind of preferred scheme, in the cooling device in a kind of described cavity blow mold, described heat conduction The preferred red copper of material.
As a kind of preferred scheme, in the cooling device in a kind of described cavity blow mold, the heat conduction edge Vertical range between the bottom of part placement hole and cooling duct is less than vertical between the bottom and cooling duct of the die cavity Distance.
The beneficial effects of the utility model are:The utility model by opening up heat conduction mold insert placement hole in die cavity both sides, and The heat conduction mold insert that thermal conductivity factor is higher than die ontology is provided with heat conduction mold insert placement hole so that the heat in die cavity can be more Discharge soon, improve the quality of finished product.In addition, by being filled in the gap between heat conduction mold insert and heat conduction mold insert placement hole Note heat-conducting glue (being usually silica gel) so that the radiating of die cavity is more unobstructed, and radiating effect is more obvious.
Brief description of the drawings
Fig. 1 is the structural representation of the cooling device in cavity blow mold described in background technology.
Reference in Fig. 1 is:1st, die ontology, 2, cooling duct, 3, die cavity.
Fig. 2 is the structural representation of the cooling device in cavity blow mold described in the utility model.
Reference in Fig. 2 is:1st, die ontology, 2, cooling duct, 3, die cavity, 4, red copper mold insert, 5, heat conductive silica gel.
Embodiment
Below in conjunction with the accompanying drawings 2, the cooling device in a kind of cavity blow mold described in the utility model is described in detail Specific embodiment.
As shown in Fig. 2 the cooling device in cavity blow mold described in the utility model, including:Die ontology 1, Die ontology 1 is provided through the cooling duct 2 of die ontology 1 in arragement direction of the lower section of die cavity 3 along die cavity 3, described Die ontology 1 heat conduction mold insert placement hole is respectively arranged with the both sides of each die cavity 3, be inlaid with heat conduction mold insert placement hole by Heat conduction mold insert made of red copper is red copper mold insert 4, is irrigated in the gap between red copper mold insert 4 and described heat conduction mold insert placement hole There is heat conductive silica gel 5;Vertical range between the bottom and cooling duct 2 of the heat conduction mold insert placement hole is less than the die cavity 3 Vertical range between bottom and cooling duct 2 so that red copper mold insert 4 is as close to cooling duct 2.
In practical application, the Heat Conduction Material can be metal thermal conductive material or alloy heat conduction material or other Nonmetallic heat conductive material, as long as its thermal conductivity factor is more than 300W/ (mK).
During actual use, cooling water constantly flows through cooling duct 2, and die cavity 3 is conducted to die ontology 1 and red copper mold insert Heat on 4 is taken away.
In summary, preferred embodiment only of the present utility model, not it is used for limiting the utility model implementation Scope, the equivalent change that all shape, construction, feature and spirit according to described in the utility model claims scope is made is with repairing Decorations, all should be included in right of the present utility model.

Claims (5)

1. the cooling device in a kind of cavity blow mold, including:Die ontology, die ontology is in the lower section of die cavity along type The arragement direction of chamber is provided through the cooling duct of die ontology, it is characterised in that:Described die ontology is in each die cavity Both sides be respectively arranged with heat conduction mold insert resettlement groove, be inlaid with heat conduction mold insert placement hole be made from a material that be thermally conductive heat conduction edge Part.
2. the cooling device in cavity blow mold as claimed in claim 1, it is characterised in that:Described heat conduction mold insert with Heat-conducting glue is perfused with gap between heat conduction mold insert placement hole.
3. the cooling device in cavity blow mold as claimed in claim 1, it is characterised in that:The Heat Conduction Material is led Hot coefficient is more than 300W/ (mK).
4. the cooling device in cavity blow mold as claimed in claim 3, it is characterised in that:Described Heat Conduction Material is excellent Select red copper.
5. the cooling device in cavity blow mold as claimed in claim 1, it is characterised in that:The heat conduction mold insert placement Vertical range between the bottom and cooling duct in hole is less than the vertical range between the bottom and cooling duct of the die cavity.
CN201720557193.XU 2017-05-18 2017-05-18 A kind of cooling device in cavity blow mold Active CN206870352U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720557193.XU CN206870352U (en) 2017-05-18 2017-05-18 A kind of cooling device in cavity blow mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720557193.XU CN206870352U (en) 2017-05-18 2017-05-18 A kind of cooling device in cavity blow mold

Publications (1)

Publication Number Publication Date
CN206870352U true CN206870352U (en) 2018-01-12

Family

ID=61340340

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720557193.XU Active CN206870352U (en) 2017-05-18 2017-05-18 A kind of cooling device in cavity blow mold

Country Status (1)

Country Link
CN (1) CN206870352U (en)

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