CN206857217U - A kind of smart tray - Google Patents
A kind of smart tray Download PDFInfo
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- CN206857217U CN206857217U CN201720379629.0U CN201720379629U CN206857217U CN 206857217 U CN206857217 U CN 206857217U CN 201720379629 U CN201720379629 U CN 201720379629U CN 206857217 U CN206857217 U CN 206857217U
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Abstract
The utility model discloses a kind of smart tray, it includes tray body, the tray body is built-in with MCU processing units, RFID card reading units, WIFI transmission units, SPI memory, power subsystem, antenna matching unit, charhing unit, and the MCU processing units are connected with RFID card reading units, SPI memory, power subsystem, antenna matching unit, charhing unit respectively.The utility model can realize the Data Collection for process of being sold goods to salesman, analyze the sale action and standard process degree of salesman, the diligent degree of salesman and luxury goods jewelry by frequency on probation.
Description
Technical field
The utility model belongs to luxury goods jewelry retail management technical field, and in particular to a kind of smart tray.
Background technology
The sale of existing luxury goods jewelry is all to use traditional approach, and salesman unlocks from by sales counter, takes out luxury goods jewelry
After be placed on so that customer tries in common pallet, management level can not understand the species currently tried on, can not also understand salesman's
Working condition.
Utility model content
In view of this, main purpose of the present utility model is to provide a kind of smart tray.
To reach above-mentioned purpose, what the technical solution of the utility model was realized in：
The utility model embodiment provides a kind of smart tray, it is characterised in that it includes tray body, the pallet sheet
It is equipped with MCU processing units, RFID card reading units, WIFI transmission units, SPI memory, power subsystem, antenna match list in vivo
Member, charhing unit, the MCU processing units respectively with RFID card reading units, SPI memory, power subsystem, antenna match list
Member, charhing unit connection.
In such scheme, the SPI memory includes the first chip U1, first resistor R1, second resistance R2, the first electric capacity
C1, the first chip U1 the 1st, 2 ends connect MCU processing units, the 1st end also connects power subsystem, the 3rd end through first resistor R1
Connect power subsystem through second resistance R2, the 4th end ground connection, the 5th, 6 ends connect MCU processing units respectively, the 7th, 8 ends connect power supply altogether all the way
Unit, another way are grounded through the first electric capacity C1.
In such scheme, the WIFI transmission units include the second chip U2, the 5th resistance R5, the second electric capacity C2, the 3rd
Electric capacity C3, the 9th electric capacity C9, the 12nd electric capacity C12, the first triode Q1, the second chip U2 the 3rd, 8 ends connect first altogether
The triode Q1 first via, the 15th end ground connection；The first via of the first triode Q1 connects the 3rd electric capacity C3 of parallel connection, the 12nd
Electric capacity C12 one end, the 3rd electric capacity C3, the 12nd electric capacity C12 other end ground connection, the second tunnel connects power subsystem and connect simultaneously
9th electric capacity C9 of connection, the second electric capacity C2 one end, the 9th electric capacity C9, the second electric capacity C2 other end ground connection, the 3rd tunnel
Connect MCU processing units 101；The second road of the first triode Q1 and the indirect 5th resistance R5 on the 3rd tunnel.
In such scheme, the antenna matching unit includes the 3rd chip U3, the first crystal oscillator Y1, the 14th electric capacity C14, the
15 electric capacity C15, the 19th electric capacity C19, the 20th electric capacity C20, the 11st resistance R11, the 18th electric capacity C18, the tenth resistance
R10, the 24th electric capacity C24, the first induction coil L1, the second induction coil L2, the 26th electric capacity C26, the 27th electricity
Hold C27, the 28th electric capacity C28, the 29th electric capacity C29, the 31st electric capacity C31, the first relay J1, the second relay
J2, end the first crystal oscillator Y1 of the 3rd chip U3 the 1st are connected with the 32nd end, the 9th, 12,23 ends ground connection, the 13rd, 21,22,24
Termination MCU processing units the 101, the 6th, 10,11,25 connect power subsystem, and the 5th, 7 ends are respectively through the first induction coil L1, the second sense
Coil L2 is answered to meet the first relay J1, the second relay J2, the resistance R11 of the 29th end the 11st, the 18th electric capacity C18 are connected to
Between one induction coil L1 and the first relay J1, the resistance R10 of the 30th end the tenth be connected to the 29th end and the 11st resistance R11 it
Between, earth terminal is connected between the 29th end and the 11st resistance R11 through the 24th electric capacity C24；The both ends of the first crystal oscillator Y1
Grounded the 14th electric capacity C14, the 15th electric capacity C15 are met respectively；The first induction coil L1 and the first relay J1
Between, between the second induction coil L2 and the second relay J2 be connected to the 12nd electric capacity C28, the 30th electric capacity C30 respectively, and
It is parallel with the 26th electric capacity C26 and the 27th electric capacity, the 29th electric capacity C29 and the 31st electric capacity of concatenation of concatenation
C31。
In such scheme, the MCU processing units include fifth chip U5, the 5th electric capacity C5, the tenth electric capacity C10, second
Crystal oscillator Y2, the 6th electric capacity C6, the 11st electric capacity C11, the 16th electric capacity C16, the 17th electric capacity C17, the 9th resistance R9, described
Five chip U5 the 1st, 48 ends connect power subsystem 105 altogether and connect the 5th electric capacity C5 and the tenth electric capacity C10 of parallel connection one end, the
5th, 6 ends respectively through the 16th electric capacity C16, the 17th electric capacity C17 be grounded and the 5th, 6 ends indirect second crystal oscillator Y2, the 10th, 11
Connect USB units, the 23rd, 24 ends be grounded and connect respectively power subsystem 105 and between the two parallel connection the 11st electric capacity C11 and the 6th
Electric capacity C6, the resistance R9 of the 27th end the 9th are grounded；The other end ground connection of the 5th electric capacity C5 and the tenth electric capacity C10.
In such scheme, the power subsystem includes the 6th chip U6, the 7th chip U7, the 7th electric capacity C7, the 8th electric capacity
C8, the 13rd electric capacity C13, the 21st electric capacity C21, the 22nd electric capacity C22, the 25th electric capacity C25, the 3rd induction coil
L3, the first diode D1, the 12nd resistance R12, the 13rd resistance R13, the 3rd E3, the 4th E4, the 1st of the 6th chip U6 the
End connects the 7th chip U7 VIN ends through C13 and the 8th end altogether, and the 4th end is connected to the 1st end and the 7th core through the 12nd resistance R12 all the way
Between piece U7 VIN ends and the 12nd resistance R12 places of connecing export VDD5V, and another way connects through the 13rd resistance R13
Ground, the 6th end ground connection, the 7th termination power VCC, parallel connection the 7th electric capacity C7 and the 21st electric capacity C21 successively between the 6th, 7 ends；Institute
State the indirect 3rd induction coil L3 at the 6th chip U6 the 1st end and the 7th chip U7 VIN ends, the 3rd induction coil L3
One the first diode D1 being grounded, the other end the 3rd E3 of parallel connection, the 22nd electric capacity C22, the 8th electric capacity C8 successively
And the 3rd E3, the 22nd electric capacity C22, the 8th electric capacity C8 are grounded altogether；The VOUT ends output of the 7th chip U7
VDD3.3V, and parallel connection the 4th E4, the 25th electric capacity C25, the 4th E4, the 25th electric capacity C25 are grounded altogether successively.
In such scheme, the charhing unit include fourth chip U4, the first filter capacitor E1, the second filter capacitor E2,
4th electric capacity C4, the 23rd electric capacity C23, the first Transient Suppression Diode TVS1, the first indicator lamp LED1, the second indicator lamp
LED2, the first lithium battery PS1,3rd resistor R3, the 4th resistance R4, the 6th resistance R6, the 7th resistance R7, the 8th resistance R8, institute
Fourth chip U4 the 1st the 7th resistance R7 of termination is stated, the 2nd the 6th resistance R6 of termination, the 3rd end ground connection, the 5th terminates the first lithium battery
PS1 the 1st end, the resistance R4 of the 6th end the 4th meet the second indicator lamp LED2, and the 7th end connects the first indicator lamp through 3rd resistor R3
LED1, the 8th the 8th resistance R8 of termination；3rd end, the 6th resistance R6, the 7th resistance R7, the first indicator lamp LED1, second refer to
Show that lamp LED2, the 8th resistance R8 connect USB units jointly, between the 3rd end, the 6th resistance R6, the 7th resistance R7 and USB unit
The 23rd electric capacity C23 is met, the first filter capacitor E1, first indicator lamp are parallel with the 23rd electric capacity C23
The first grounded Transient Suppression Diode is connected between LED1, the second indicator lamp LED2, the 8th resistance R8 and USB unit
TVS1；4th electric capacity C4 in parallel, the second filter capacitor E2 successively between 5th end and the first lithium battery PS1 the 1st end, institute
State the 4th electric capacity C4, the second filter capacitor E2 other end connects the first lithium battery PS1 the 2nd end all the way, be grounded all the way.
In such scheme, the USB units include the 8th chip J3, the 1st termination+12V of the 8th chip J3 and
Connect and state MCU processing units, the 2nd, 3 ends meet MCU respectively and state MCU processing units, the 4th end ground connection.
Compared with prior art, the utility model can realize the Data Collection for process of being sold goods to salesman, analyze salesman's
Sale action and standard process degree, the diligent degree of salesman and luxury goods jewelry are by frequency on probation.
Brief description of the drawings
Fig. 1 is that the utility model embodiment also provides a kind of structural representation of smart tray；
Fig. 2 is the connection block diagram that the utility model embodiment also provides a kind of smart tray；
Fig. 3 is the circuit diagram that the utility model embodiment also provides SPI memory in a kind of smart tray；
Fig. 4 is the circuit diagram that the utility model embodiment also provides WIFI transmission units in a kind of smart tray；
Fig. 5 is the circuit diagram that the utility model embodiment also provides antenna matching unit in a kind of smart tray；
Fig. 6 is the circuit diagram that the utility model embodiment also provides MCU processing units in a kind of smart tray；
Fig. 7 is the circuit diagram that the utility model embodiment also provides power subsystem in a kind of smart tray；
Fig. 8 is the circuit diagram that the utility model embodiment also provides charhing unit in a kind of smart tray；
Fig. 9 is the circuit diagram that the utility model embodiment also provides USB units in a kind of smart tray.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining
The utility model, it is not used to limit the utility model.
The utility model embodiment provides a kind of smart tray, and as shown in Figure 1, 2, it includes tray body 1, the pallet
Body 1 is built-in with MCU processing units 101, RFID card reading units 102, WIFI transmission units 103, SPI memory 104, power supply list
Member 105, antenna matching unit 106, charhing unit 107, the MCU processing units 101 respectively with RFID card reading units 102, SPI
Memory 104, power subsystem 105, antenna matching unit 106, charhing unit 107 connect.
As shown in figure 3, the SPI memory 104 includes the first chip U1, first resistor R1, second resistance R2, the first electricity
Hold C1, the first chip U1 the 1st, 2 ends connect MCU processing units 101, the 1st end also connects power subsystem through first resistor R1
105, the 3rd end connects power subsystem 105 through second resistance R2, the 4th end ground connection, the 5th, 6 ends connect MCU processing units 101 respectively, the 7th,
8 ends connect power subsystem 105 altogether all the way, and another way is grounded through the first electric capacity C1.
As shown in figure 4, the WIFI transmission units 103 include the second chip U2, the 5th resistance R5, the second electric capacity C2, the
Three electric capacity C3, the 9th electric capacity C9, the 12nd electric capacity C12, the first triode Q1, the second chip U2 the 3rd, 8 ends connect altogether
The one triode Q1 first via, the 15th end ground connection；The first via of the first triode Q1 meets the 3rd electric capacity C3 of parallel connection, the tenth
Two electric capacity C12 one end, the 3rd electric capacity C3, the 12nd electric capacity C12 other end ground connection, the second tunnel connects power subsystem 105
With the one end for meeting the 9th electric capacity C9 in parallel, the second electric capacity C2, the 9th electric capacity C9, the second electric capacity C2 other end are grounded,
3rd tunnel connects MCU processing units 101；The second road of the first triode Q1 and the indirect 5th resistance R5 on the 3rd tunnel.
As shown in figure 5, the antenna matching unit 106 include the 3rd chip U3, the first crystal oscillator Y1, the 14th electric capacity C14,
15th electric capacity C15, the 19th electric capacity C19, the 20th electric capacity C20, the 11st resistance R11, the 18th electric capacity C18, the tenth electricity
Hinder R10, the 24th electric capacity C24, the first induction coil L1, the second induction coil L2, the 26th electric capacity C26, the 27th
Electric capacity C27, the 28th electric capacity C28, the 29th electric capacity C29, the 31st electric capacity C31, the first relay J1, the second relay
Device J2, end the first crystal oscillator Y1 of the 3rd chip U3 the 1st are connected with the 32nd end, the 9th, 12,23 ends ground connection, the 13rd, 21,22,
24 termination MCU processing units the 101, the 6th, 10,11,25 connect power subsystem 105, and the 5th, 7 ends are respectively through the first induction coil L1, the
Two induction coil L2 meet the first relay J1, the second relay J2, and the resistance R11 of the 29th end the 11st, the 18th electric capacity C18 connect
Between the first induction coil L1 and the first relay J1, the resistance R10 of the 30th end the tenth is connected to the 29th end and the 11st resistance
Between R11, earth terminal is connected between the 29th end and the 11st resistance R11 through the 24th electric capacity C24；The first crystal oscillator Y1's
Both ends meet grounded the 14th electric capacity C14, the 15th electric capacity C15 respectively；The first induction coil L1 and the first relay
The 12nd electric capacity C28, the 30th electric capacity C30 are connected to respectively between device J1, between the second induction coil L2 and the second relay J2,
And it is parallel with the 26th electric capacity C26 and the 27th electric capacity, the 29th electric capacity C29 and the 31st of concatenation of concatenation
Electric capacity C31.
As shown in fig. 6, the MCU processing units 101 include fifth chip U5, the 5th electric capacity C5, the tenth electric capacity C10, the
Two crystal oscillator Y2, the 6th electric capacity C6, the 11st electric capacity C11, the 16th electric capacity C16, the 17th electric capacity C17, the 9th resistance R9, it is described
Fifth chip U5 the 1st, 48 ends connect altogether power subsystem 105 and connect parallel connection the 5th electric capacity C5 and the tenth electric capacity C10 one end,
5th, 6 ends respectively through the 16th electric capacity C16, the 17th electric capacity C17 be grounded and the 5th, 6 ends indirect second crystal oscillator Y2, the 10th,
11 connect USB units, the 23rd, 24 ends be grounded and connect respectively power subsystem 105 and between the two the 11st electric capacity C11 of parallel connection and
Six electric capacity C6, the resistance R9 of the 27th end the 9th are grounded；The other end ground connection of the 5th electric capacity C5 and the tenth electric capacity C10.
As shown in fig. 7, the power subsystem 105 includes the 6th chip U6, the 7th chip U7, the 7th electric capacity C7, the 8th electricity
Hold C8, the 13rd electric capacity C13, the 21st electric capacity C21, the 22nd electric capacity C22, the 25th electric capacity C25, the 3rd line of induction
L3, the first diode D1, the 12nd resistance R12, the 13rd resistance R13, the 3rd E3, the 4th E4 are enclosed, the 6th chip U6's
1st end connects the 7th chip U7 VIN ends through C13 and the 8th end altogether, and the 4th end is connected to the 1st end and through the 12nd resistance R12 all the way
Between seven chip U7 VIN ends and the 12nd resistance R12 places of connecing export VDD5V, and another way is through the 13rd resistance R13
Ground connection, the 6th end ground connection, the 7th termination power VCC, parallel connection the 7th electric capacity C7 and the 21st electric capacity C21 successively between the 6th, 7 ends；
The 1st end of the 6th chip U6 and the indirect 3rd induction coil L3 at the 7th chip U7 VIN ends, the 3rd induction coil
L3 mono- terminates the first diode D1 being grounded, the other end the 3rd E3 of parallel connection, the 22nd electric capacity C22, the 8th electric capacity successively
C8 and the 3rd E3, the 22nd electric capacity C22, the 8th electric capacity C8 are grounded altogether；The VOUT ends output of the 7th chip U7
VDD3.3V, and parallel connection the 4th E4, the 25th electric capacity C25, the 4th E4, the 25th electric capacity C25 are grounded altogether successively.
As shown in figure 8, the charhing unit 107 includes fourth chip U4, the first filter capacitor E1, the second filter capacitor
E2, the 4th electric capacity C4, the 23rd electric capacity C23, the first Transient Suppression Diode TVS1, the first indicator lamp LED1, the second instruction
Lamp LED2, the first lithium battery PS1,3rd resistor R3, the 4th resistance R4, the 6th resistance R6, the 7th resistance R7, the 8th resistance R8,
The 1st the 7th resistance R7 of termination of the fourth chip U4, the 2nd the 6th resistance R6 of termination, the 3rd end ground connection, the 5th terminates the first lithium electricity
Pond PS1 the 1st end, the resistance R4 of the 6th end the 4th meet the second indicator lamp LED2, and the 7th end connects the first indicator lamp through 3rd resistor R3
LED1, the 8th the 8th resistance R8 of termination；3rd end, the 6th resistance R6, the 7th resistance R7, the first indicator lamp LED1, second refer to
Show that lamp LED2, the 8th resistance R8 connect USB units jointly, between the 3rd end, the 6th resistance R6, the 7th resistance R7 and USB unit
The 23rd electric capacity C23 is met, the first filter capacitor E1, first indicator lamp are parallel with the 23rd electric capacity C23
The first grounded Transient Suppression Diode is connected between LED1, the second indicator lamp LED2, the 8th resistance R8 and USB unit
TVS1；4th electric capacity C4 in parallel, the second filter capacitor E2 successively between 5th end and the first lithium battery PS1 the 1st end, institute
State the 4th electric capacity C4, the second filter capacitor E2 other end connects the first lithium battery PS1 the 2nd end all the way, be grounded all the way.
As shown in figure 9, the USB units include the 8th chip J3, the 1st termination+12V of the 8th chip J3 and connect
State MCU processing units the 101, the 2nd, 3 ends meet MCU and state MCU processing units 101, the 4th end ground connection respectively.
The course of work of the present utility model is：
Step 101：Salesman wears the luxury goods jewelry that the ring with RFID label tag carries RFID label tag by least one
It is placed on smart tray.
Step 102：When at least one luxury goods jewelry with RFID label tag is placed into smart tray, the intelligence support
The information of all luxury goods jewelry currently placed and the information of salesman are sent to server by disk, the server receive and
Preserve information；
Specifically, the smart tray is sending information and the salesman of all luxury goods jewelry currently placed to server
Information while, the information of the smart tray itself is also sent to the server.
The information of the luxury goods jewelry refers to product IDs, and the corresponding product IDs of each product；
The information of the smart tray refers to smart tray ID, and the corresponding smart tray ID of each smart tray；
The information of the salesman refers to salesman ID, and the corresponding salesman ID of each salesman；
The ID will not repeat to be respectively provided with uniqueness.
According to receiving, the time receives the server and following sheet form preserves information.
| Time | Pallet ID | Salesman ID |
For example, when progressively the product to be tried on client is put into smart tray to salesman, smart tray recognizes first
The RFID label tag of product, push self ID, salesman ID, product IDs to server, by that analogy, can at most be put into more than 4 and produce
Product；Data format is as follows：
| Time | Pallet ID | Salesman ID | Product 1ID | |||
| Time | Pallet ID | Salesman ID | Product 1ID | Product 2ID | ||
| Time | Pallet ID | Salesman ID | Product 1ID | Product 2ID | Product 3ID | |
| Time | Pallet ID | Salesman ID | Product 1ID | Product 2ID | Product 3ID | Product 4ID |
Step 103：When the luxury goods jewelry quantity in the smart tray changes, the smart tray again ought
The information of all luxury goods jewelry and the information of salesman of preceding placement are sent to server；
Specifically, when a luxury goods jewelry with RFID label tag is placed into smart tray, the smart tray will
The information of the luxury goods jewelry, the information of salesman and the smart tray information of itself are sent to server, the server
Receive and preserve information；When the luxury goods jewelry in the smart tray is reduced, the smart tray is by remaining luxury
The information of product jewelry, the information of salesman and the smart tray information of itself are sent to server.
Step 104：The server receive information and with last time preserve information contrasted, according to comparing result
Determine that certain part luxury goods jewelry is tried and/or operated on the salesman tried on.
Specifically, the server is according to the information of remaining luxury goods jewelry in the currently received smart tray, with
The information that last time preserves is contrasted, it is determined that the information of certain the part luxury goods jewelry lacked, it is determined that the part luxury goods jewelry
Tried on.
For example, when salesman takes out a product and tried on to client, the smart tray detects that label is reduced, and is pushed away secondary
Send data, it is assumed that customer requirement tries product 3 on, then the data format pushed is as follows：
| Time | Pallet ID | Salesman ID | Product 1ID | Product 2ID | Product 4ID |
When customer requirement, which is changed, tries product on, salesman may require that client returns product 3, for example further take out product 2 to visitor
Family is tried on, then the data format pushed is as follows：
| Time | Pallet ID | Salesman ID | Product 1ID | Product 2ID | Product 3ID | Product 4ID |
| Time | Pallet ID | Salesman ID | Product 1ID | Product 2ID | Product 3ID |
The server will escape to time difference for reentering before and after smart tray according to product 3 and calculate what client tried on
Time, the time that other products are tried on is calculated by that analogy, enter back into pallet as fruit product repeatedly leaves, then can extrapolate
Carry out this wheel and try the number that the product is tried on.
When all products are returned to smart tray, epicycle product tries end on, and product progressively will be put back to sales counter by salesman,
The data then pushed are as follows：
| Time | Pallet ID | Salesman ID | Product 1ID | Product 2ID | Product 3ID | Product 4ID |
| Time | Pallet ID | Salesman ID | Product 1ID | Product 2ID | Product 3ID | |
| Time | Pallet ID | Salesman ID | Product 1ID | Product 2ID | ||
| Time | Pallet ID | Salesman ID | Product 1ID | |||
| Time | Pallet ID | Salesman ID | ||||
| Time | Pallet ID |
Step 105：The number that the number and/or salesman's operation that the server is tried on to every luxury goods jewelry are tried on
Be marked and count, for it is determined that every luxury goods jewelry try frequency on and/or frequency is tried in salesman's operation on.
Specifically, after it is determined that certain part luxury goods jewelry is tried on once, to the luxury goods jewelry, count is incremented, equally
, after certain salesman provides for client once tries service on, count is incremented for the service to the salesman, in such manner, it is possible in a certain week
Phase or random time check the preferable luxury goods jewelry of welcome degree, and the salesman that service frequency is higher.
It is described above, preferred embodiment only of the present utility model, it is not intended to limit protection of the present utility model
Scope.
Claims (8)
- A kind of 1. smart tray, it is characterised in that it includes tray body, the tray body be built-in with MCU processing units, RFID card reading units, WIFI transmission units, SPI memory, power subsystem, antenna matching unit, charhing unit, at the MCU Reason unit is connected with RFID card reading units, SPI memory, power subsystem, antenna matching unit, charhing unit respectively.
- A kind of 2. smart tray according to claim 1, it is characterised in that the SPI memory include the first chip U1, First resistor R1, second resistance R2, the 1st of the first electric capacity C1, the first chip U1 the, 2 ends connect MCU processing units, the 1st end Also power subsystem is connect through first resistor R1, the 3rd end connects power subsystem through second resistance R2, the 4th end ground connection, and the 5th, 6 ends connect respectively MCU processing units, the 7th, 8 ends connect power subsystem altogether all the way, another way is grounded through the first electric capacity C1.
- 3. a kind of smart tray according to claim 1 or 2, it is characterised in that the WIFI transmission units include second Chip U2, the 5th resistance R5, the second electric capacity C2, the 3rd electric capacity C3, the 9th electric capacity C9, the 12nd electric capacity C12, the first triode Q1, the second chip U2 the 3rd, 8 ends connect the first triode Q1 first via, the 15th end ground connection altogether；First triode The Q1 first via meets the 3rd electric capacity C3 of parallel connection, the 12nd electric capacity C12 one end, the 3rd electric capacity C3, the 12nd electric capacity C12 The other end ground connection, the second tunnel connect power subsystem and connect parallel connection the 9th electric capacity C9, the second electric capacity C2 one end, it is described 9th electricity Hold C9, the second electric capacity C2 other end ground connection, the 3rd tunnel connects MCU processing units 101；The second road of the first triode Q1 and The indirect 5th resistance R5 on the 3rd tunnel.
- 4. a kind of smart tray according to claim 3, it is characterised in that the antenna matching unit includes the 3rd chip U3, the first crystal oscillator Y1, the 14th electric capacity C14, the 15th electric capacity C15, the 19th electric capacity C19, the 20th electric capacity C20, the 11st Resistance R11, the 18th electric capacity C18, the tenth resistance R10, the 24th electric capacity C24, the first induction coil L1, the second induction coil L2, the 26th electric capacity C26, the 27th electric capacity C27, the 28th electric capacity C28, the 29th electric capacity C29, the 31st electricity Hold C31, the first relay J1, the second relay J2, end the first crystal oscillator Y1 of the 3rd chip U3 the 1st are connected with the 32nd end, 9th, 12,23 ends ground connection, the 13rd, 21,22,24 termination MCU processing units the 101, the 6th, 10,11,25 connect power subsystem, the 5th, 7 End connects the first relay J1, the second relay J2, the 29th end the tenth through the first induction coil L1, the second induction coil L2 respectively One resistance R11, the 18th electric capacity C18 are connected between the first induction coil L1 and the first relay J1, the resistance of the 30th end the tenth R10 is connected between the 29th end and the 11st resistance R11, and earth terminal is connected to the 29th end and the 11st electricity through the 24th electric capacity C24 Between resistance R11；The both ends of the first crystal oscillator Y1 meet grounded the 14th electric capacity C14, the 15th electric capacity C15 respectively；Institute State between the first induction coil L1 and the first relay J1, be connected between the second induction coil L2 and the second relay J2 respectively 12 electric capacity C28, the 30th electric capacity C30, and it is parallel with the 26th electric capacity C26 and the 27th electric capacity, concatenation of concatenation The 29th electric capacity C29 and the 31st electric capacity C31.
- 5. a kind of smart tray according to claim 4, it is characterised in that the MCU processing units include fifth chip U5, the 5th electric capacity C5, the tenth electric capacity C10, the second crystal oscillator Y2, the 6th electric capacity C6, the 11st electric capacity C11, the 16th electric capacity C16, 17th electric capacity C17, the 9th resistance R9, the fifth chip U5 the 1st, 48 ends connect altogether power subsystem 105 and connect parallel connection 5th electric capacity C5 and the tenth electric capacity C10 one end, the 5th, 6 ends respectively through the 16th electric capacity C16, the 17th electric capacity C17 ground connection simultaneously And the indirect second crystal oscillator Y2 at the 5th, 6 ends, the 10th, 11 connect USB units, the 23rd, 24 ends be grounded and connect power subsystem 105 simultaneously respectively And parallel connection the 11st electric capacity C11 and the 6th electric capacity C6, the resistance R9 of the 27th end the 9th are grounded between the two；The 5th electric capacity C5 It is grounded with the tenth electric capacity C10 other end.
- A kind of 6. smart tray according to claim 5, it is characterised in that the power subsystem include the 6th chip U6, 7th chip U7, the 7th electric capacity C7, the 8th electric capacity C8, the 13rd electric capacity C13, the 21st electric capacity C21, the 22nd electric capacity C22, the 25th electric capacity C25, the 3rd induction coil L3, the first diode D1, the 12nd resistance R12, the 13rd resistance R13, 3rd E3, the 4th E4, the 1st end of the 6th chip U6 connect the 7th chip U7 VIN ends, the 4th end one through C13 and the 8th end altogether The resistance R12 of Lu Jing 12 are connected between the 1st end and the 7th chip U7 VIN ends and the 12nd resistance R12 meets place VDD5V is exported, another way is grounded through the 13rd resistance R13, the 6th end ground connection, the 7th termination power VCC, between the 6th, 7 ends successively Parallel connection the 7th electric capacity C7 and the 21st electric capacity C21；Between the 1st end of the 6th chip U6 and the 7th chip U7 VIN ends Meet the 3rd induction coil L3, the 3rd induction coil L3 mono- terminates the first diode D1 being grounded, and the other end is successively simultaneously Join the 3rd E3, the 22nd electric capacity C22, the 8th electric capacity C8 and the 3rd E3, the 22nd electric capacity C22, the 8th electric capacity C8 Ground connection altogether；The VOUT ends output VDD3.3V of the 7th chip U7, and parallel connection the 4th E4, the 25th electric capacity C25 successively, 4th E4, the 25th electric capacity C25 are grounded altogether.
- A kind of 7. smart tray according to claim 6, it is characterised in that the charhing unit include fourth chip U4, First filter capacitor E1, the second filter capacitor E2, the 4th electric capacity C4, the 23rd electric capacity C23, the first Transient Suppression Diode TVS1, the first indicator lamp LED1, the second indicator lamp LED2, the first lithium battery PS1,3rd resistor R3, the 4th resistance R4, the 6th electricity Hinder R6, the 7th resistance R7, the 8th resistance R8, the fourth chip U4 the 1st the 7th resistance R7 of termination, the 2nd the 6th resistance of termination R6, the 3rd end ground connection, the 5th the first lithium battery PS1 of termination the 1st end, the resistance R4 of the 6th end the 4th meet the second indicator lamp LED2, the 7 ends meet the first indicator lamp LED1, the 8th the 8th resistance R8 of termination through 3rd resistor R3；3rd end, the 6th resistance R6, the 7th electricity Resistance R7, the first indicator lamp LED1, the second indicator lamp LED2, the 8th resistance R8 connect USB units, the 3rd end, the 6th resistance jointly The first filter is parallel with R6, the 7th resistance R7 and USB unit indirect 23rd electric capacity C23, the 23rd electric capacity C23 Ripple electric capacity E1, is connected between the first indicator lamp LED1, the second indicator lamp LED2, the 8th resistance R8 and USB unit and has connect The first Transient Suppression Diode TVS1 on ground；Between 5th end and the first lithium battery PS1 the 1st end successively it is in parallel 4th electricity Hold C4, the second filter capacitor E2, the 4th electric capacity C4, the second filter capacitor E2 other end meet the first lithium battery PS1 all the way The 2nd end, be grounded all the way.
- 8. a kind of smart tray according to claim 7, it is characterised in that the USB units include the 8th chip J3, institute State the 8th chip J3 the 1st termination+12V and connect and state MCU processing units, the 2nd, 3 ends meet MCU respectively and state MCU processing units, 4 ends are grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720379629.0U CN206857217U (en) | 2017-04-12 | 2017-04-12 | A kind of smart tray |
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| CN201720379629.0U CN206857217U (en) | 2017-04-12 | 2017-04-12 | A kind of smart tray |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107203792A (en) * | 2017-04-12 | 2017-09-26 | 刘超 | The management method and its smart tray of luxury goods jewelry |
| CN108974550A (en) * | 2018-09-07 | 2018-12-11 | 深圳好多银科技有限公司 | It can identify the Sheng goods pallet of codeword value |
-
2017
- 2017-04-12 CN CN201720379629.0U patent/CN206857217U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107203792A (en) * | 2017-04-12 | 2017-09-26 | 刘超 | The management method and its smart tray of luxury goods jewelry |
| CN108974550A (en) * | 2018-09-07 | 2018-12-11 | 深圳好多银科技有限公司 | It can identify the Sheng goods pallet of codeword value |
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Effective date of registration: 20191029 Address after: 2702-27a04, Jinzhan jewelry Plaza, Shuibei 1st Road, Cuizhu street, Luohu District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Haoyiduo Technology Co., Ltd Address before: 518000 Luohu business center, 2028 Shennan East Road, Dongmen street, Shenzhen, Guangdong, Luohu District 2064 Patentee before: Liu Chao |