CN206834163U - Adsorption mechanism - Google Patents
Adsorption mechanism Download PDFInfo
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- CN206834163U CN206834163U CN201720690027.7U CN201720690027U CN206834163U CN 206834163 U CN206834163 U CN 206834163U CN 201720690027 U CN201720690027 U CN 201720690027U CN 206834163 U CN206834163 U CN 206834163U
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- suction nozzle
- soup stick
- connecting portion
- main body
- adsorption mechanism
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Abstract
The utility model provides a kind of adsorption mechanism.The adsorption mechanism includes：Soup stick and suction nozzle；Soup stick includes soup stick main body, suction nozzle block and soup stick connecting portion；Suction nozzle includes suction nozzle connecting portion and suction nozzle head；Wherein, soup stick main body is connected with soup stick connecting portion, and suction nozzle block is between soup stick main body and soup stick connecting portion and coats a part for soup stick main body and a part for soup stick connecting portion；Suction nozzle is connected by suction nozzle connecting portion with the soup stick connecting portion.Adsorption mechanism provided by the utility model greatly improves the replacing efficiency of suction nozzle, reduces the use cost of suction nozzle.
Description
Technical field
The utility model embodiment is related to semiconductor applications, more particularly to a kind of adsorption mechanism.
Background technology
In semiconductor chip processing procedure, based on automation, quick, safe transport consideration, at present for semiconductor element
Conveying be all using with suction nozzle adsorption mechanism come move conveying.After general semiconductor element completes, it is necessary to this
Whether semiconductor element is tested, normal to understand the semiconductor element.And if to test semiconductor element, lead to
Often the semiconductor element, and carrier after carrier, test section, test before testing are adsorbed using the adsorption mechanism with suction nozzle
Between mobile conveying.
At present, used adsorption mechanism is mostly made up of soup stick and suction nozzle in the prior art, passes through the interior spiral shell of soup stick
Line is threadedly coupled with the external screw thread of suction nozzle to form adsorption mechanism.However, working as needs to convey various sizes of semiconductor element
During part, operating personnel must change the suction nozzle of different model to enable adsorption mechanism to convey various sizes of semiconductor in time
Element.For by soup stick and suction nozzle be threadedly coupled the adsorption mechanism of composition for, operating personnel must be by means of spanner etc.
Instrument could change the suction nozzle of different model.This mode of operation wastes time and energy, and greatly reduces in semiconductor chip processing procedure
Chip testing efficiency.In addition, the suction nozzle model at present used in manufacture of semiconductor is more, the design comparison of suction nozzle is complicated, makes
Cost is also higher.
Fig. 1 is the planar structure schematic diagram of an existing adsorption mechanism.As shown in figure 1, existing adsorption mechanism 10 includes soup stick
Main body 100, soup stick threaded joints 102, suction nozzle main body 104, nozzle head 106, hex(agonal)screw 108 and threaded connector 110.
Wherein, suction nozzle main body 104, nozzle head 106, hex(agonal)screw 108 and threaded connector 110 form a whole mouthpiece part.
Threaded connector 110 has external screw thread.Internal thread is provided with soup stick threaded joints 102, for outer with threaded connector 110
Screw thread is threadedly coupled.Pass through the elastic purpose for reaching replacing different model suction nozzle of screw thread.When needing to semiconductor element
When being conveyed, operating personnel select the suction nozzle of suitable types first, then need to turn hexagonal spiral shell using instruments such as spanners
Silk 108 is so that threaded connector 110 is threadedly coupled to soup stick threaded joints 102.When during semiconductor element test, half
When the size of conductor element changes and needs to change the suction nozzle of different model, operating personnel have to reuse spanner
Hex(agonal)screw 108 is turned so that threaded connector 110 separates with soup stick threaded joints 102, and utilizes spanner etc. Deng instrument
Instrument re-replaces upper new suction nozzle.It is not difficult to find out, current its suction nozzle replacing complex operation of existing adsorption mechanism, time-consuming takes
Power, this is flagrant for the manufacture of semiconductor for focusing on efficiency.In addition, used suction nozzle is set in the prior art
Meter is also more complicated, and its use cost also can be higher for manufacture of semiconductor accordingly.
Therefore, it is necessary to optimize the mounting means of suction nozzle to lift the efficiency of suction nozzle replacing and reduce the cost of suction nozzle.
Utility model content
The utility model is directed to the problems such as suction nozzle replacing efficiency in the prior art is low and suction nozzle cost is high, to adsorption mechanism
In soup stick and the connected mode of suction nozzle and the structure of suction nozzle be optimized, there is provided a kind of direct insertion adsorption mechanism,
The cost of suction nozzle is also reduced while the efficiency for improving suction nozzle replacing.
According to the embodiment of the utility model one, a kind of adsorption mechanism includes：Soup stick and suction nozzle；Soup stick includes soup stick master
Body, suction nozzle block and soup stick connecting portion；Suction nozzle includes suction nozzle connecting portion and suction nozzle head；Wherein, soup stick main body and soup stick
Connecting portion connects, and suction nozzle block is between soup stick main body and soup stick connecting portion and coats a part and soup stick for soup stick main body
A part for connecting portion；The suction nozzle is connected by suction nozzle connecting portion with the soup stick connecting portion.
According to another embodiment of the utility model, suction nozzle connecting portion is detachably connected with soup stick connecting portion；Use on suction nozzle head
In absorption semiconductor subassembly；The length of soup stick connecting portion is less than or equal to the length of suction nozzle connecting portion.Wherein, soup stick main body and suction
Mouth block is integrally formed, and is threadedly coupled or is connected together with soup stick connecting portion；Or soup stick main body and soup stick connecting portion are
Integrally formed, suction nozzle block coats a part for soup stick main body and a part for soup stick connecting portion in a welding manner；Or
Soup stick main body, soup stick connecting portion and suction nozzle block are integrally formed.
According to another embodiment of the utility model, soup stick connecting portion is configured to straight cutting mode and passes through suction nozzle with suction nozzle
Connecting portion connects.
Compared with prior art, the adsorption mechanism provided in the utility model embodiment by will in the prior art soup stick with
The thread connecting mode of suction nozzle be changed to it is direct insertion so that operating personnel can directly plug suction without the help of instruments such as spanners
Mouth, greatly improve the replacing efficiency of suction nozzle.In addition, by means of the change of soup stick in adsorption mechanism and the connected mode of suction nozzle,
So that the structure of suction nozzle also produces change.Compared with suction nozzle of the prior art, the nozzle structure in the utility model is simpler,
Use cost is also lower.
Brief description of the drawings
Fig. 1 is the planar structure schematic diagram of existing adsorption mechanism
Fig. 2 is the soup stick dimensional structure diagram according to the embodiment of the utility model one
Fig. 3 is the suction nozzle dimensional structure diagram according to the embodiment of the utility model one
Fig. 4 is the adsorption mechanism dimensional structure diagram according to the embodiment of the utility model one
Fig. 5 is the cross-sectional view of the adsorption mechanism according to Fig. 4
Embodiment
To be better understood from spirit of the present utility model, it is made below in conjunction with part preferred embodiment of the present utility model
Further illustrate.
Fig. 2 is the soup stick dimensional structure diagram according to the embodiment of the utility model one.As shown in Fig. 2 soup stick 20 includes
Soup stick main body 200, suction nozzle block 202 and soup stick connecting portion 204.Soup stick 20 is connected with vaccum-pumping equipment (not shown).Soup stick
Main body 200 is connected with soup stick connecting portion 204, and soup stick connecting portion 204 is used to be attached with suction nozzle (not shown).Suction nozzle block
202 between soup stick main body 200 and soup stick connecting portion 204 and coat a part and soup stick connecting portion for soup stick main body 200
204 part.The inside of soup stick main body 200 and soup stick connecting portion 204 is hollow structure so that when using vaccum-pumping equipment
When, air can pick up semiconductor element (not shown) via the hollow structure by suction nozzle (not shown).
It will be appreciated by those of skill in the art that the formation of soup stick connecting portion 204, soup stick main body 200 and suction nozzle block 202
There is no particular restriction for mode.According to one embodiment of the present utility model, soup stick main body 200 and suction nozzle block 202 be one into
Shape, then again with mode or snap fit connection the soup stick connecting portion 204 of threaded connection.According to it is of the present utility model another
Embodiment, soup stick main body 200 and soup stick connecting portion 204 are integrally formed, and suction nozzle block 202 coats soup stick in a welding manner
A part for main body 200 and a part for soup stick connecting portion 204.According to further embodiment of the present utility model, soup stick connects
Socket part 204, soup stick main body 200 and suction nozzle block three are integrally formed.
Fig. 3 is the suction nozzle dimensional structure diagram according to the embodiment of the utility model one.As shown in figure 3, suction nozzle 30 includes
Suction nozzle main body 300 and suction nozzle head 302.Suction nozzle head 302 is used to adsorb semiconductor element.With the suction nozzle phase of prior art
Than suction nozzle 30 of the present utility model is simple in construction, it is no longer necessary to additional threaded connector 110 and hexagonal spiral shell as shown in Figure 1
The silk structures such as 108, greatly reduce the manufacturing cost of suction nozzle.The inside of suction nozzle main body 300 is also hollow structure so that works as use
During vaccum-pumping equipment, air can pick up semiconductor element (not shown) via the hollow structure by suction nozzle head 302.
Fig. 4 is the adsorption mechanism dimensional structure diagram according to the embodiment of the utility model one.As shown in figure 3, Material sucking machine
Structure 40 includes soup stick main body 400, suction nozzle block 402, soup stick connecting portion 404, suction nozzle connecting portion 406 and suction nozzle head 408.Inhale
The connection of mouth connecting portion 406 and soup stick connecting portion 404 is to be detachably connected.Suction nozzle block 402 is used to prevent suction nozzle connecting portion 406
Excessive straight cutting enters soup stick connecting portion 404, while can also be connected in suction nozzle connecting portion 406 by straight cutting mode and soup stick connecting portion 404
When connecing, fully ensure that in pumped semiconductor element process, air will not be from suction nozzle connecting portion 406 and the straight cutting of soup stick connecting portion 404
The position of connection sheds, and improves the pull of vacuum of vaccum-pumping equipment (not shown).When needing to convey semiconductor element,
Operating personnel only need to pass through the suction nozzle of suitable types on the straight cutting of suction nozzle connecting portion 406 to soup stick connecting portion 404.Instead
It, when the size of semiconductor element changes and needs to change the suction nozzle of different model, operating personnel only need directly to pull up
Suction nozzle replaces the suction nozzle of new model again.
Fig. 5 is the cross-sectional view of the adsorption mechanism according to Fig. 4.As shown in figure 5, soup stick main body 400, suction nozzle
The inside of block 402 and soup stick connecting portion 404 is all hollow structure.Equally, the inside of suction nozzle connecting portion 406 is also hollow knot
Structure.Soup stick connecting portion 404 has an external diameter R, and the suction nozzle connecting portion 406 with hollow structure has an internal diameter r.Suction nozzle connecting portion
The 406 internal diameter r and external diameter R of soup stick connecting portion 404 is arranged such that suction nozzle connecting portion 406 can be by straight cutting mode and soup stick
Connecting portion 404 connects.It is less than or equal to the internal diameter of suction nozzle connecting portion 406 such as, but not limited to, the external diameter R of soup stick connecting portion 404
r。
When using the adsorption mechanism 40 of this new embodiment, soup stick main body 400 and vaccum-pumping equipment (not shown) are connected
Connect, because the inside of soup stick main body 400, suction nozzle block 402, soup stick connecting portion 404 and suction nozzle connecting portion 406 is all hollow knot
Structure, vaccum-pumping equipment (not shown) (can not show required semiconductor subassembly via suction nozzle head 408 via these hollow channels
Go out) pick up, and movement is transported to objective.In addition, for the ease of intuitively showing suction nozzle connecting portion 406 in the utility model
With the straight cutting connected mode of soup stick connecting portion 404, space is left between suction nozzle connecting portion 406 and suction nozzle block 402.But
In general, the length of soup stick connecting portion 404 should be less than or the length equal to suction nozzle connecting portion 406.That is, connect in suction nozzle
Space should not be reserved between socket part 406 and suction nozzle block 402.Because when the straight cutting of suction nozzle connecting portion 406 to soup stick connects
Portion 404 just can guarantee that in pumped semiconductor element process, air will not be from suction nozzle connecting portion when suction nozzle 402 position of block
406 positions being connected with the straight cutting of soup stick connecting portion 404 shed, and improve the pull of vacuum of vaccum-pumping equipment (not shown).
The complicated behaviour that must be changed manually with instruments such as spanners with operating personnel in prior art adsorption mechanism Renewal process
Compare, the adsorption mechanism disclosed in the utility model the connected mode of soup stick and suction nozzle is changed to it is direct insertion so that behaviour
Making personnel, easily directly the suction nozzle of various different models is changed in plug, greatly improves the replacing efficiency of suction nozzle.In addition, with showing
The suction nozzle model for having technical sophistication is compared with species, and the nozzle structure disclosed in the utility model is simple, and it is convenient to change, and drops significantly
The low cost of suction nozzle.
Technology contents and technical characterstic of the present utility model are had revealed that as above, but those skilled in the art still may be used
A variety of replacements and modification without departing substantially from the utility model spirit can be made based on teaching of the present utility model and announcement.Therefore, originally
The protection domain of utility model should be not limited to the content disclosed in embodiment, and should be replaced including various without departing substantially from of the present utility model
Change and modify, and covered by present patent application claims.
Claims (9)
1. a kind of adsorption mechanism, it is characterised in that the adsorption mechanism includes：
Soup stick, it includes soup stick main body, suction nozzle block and soup stick connecting portion；And
Suction nozzle, the suction nozzle include suction nozzle connecting portion and suction nozzle head；
Wherein, the soup stick main body is connected with the soup stick connecting portion, the suction nozzle block be located at the soup stick main body with it is described
Between soup stick connecting portion and coat a part for the soup stick main body and a part for the soup stick connecting portion；
Wherein, the suction nozzle is connected by suction nozzle connecting portion with the soup stick connecting portion.
2. adsorption mechanism according to claim 1, it is characterised in that：The suction nozzle connecting portion can with the soup stick connecting portion
Dismantling connection.
3. adsorption mechanism according to claim 1, it is characterised in that：The suction nozzle head is used to adsorb semiconductor subassembly.
4. adsorption mechanism according to claim 1, it is characterised in that：The length of the soup stick connecting portion is less than or equal to institute
State the length of suction nozzle connecting portion.
5. adsorption mechanism according to claim 1, it is characterised in that：The soup stick main body and the suction nozzle block are one
Shaping, and be threadedly coupled with the soup stick connecting portion.
6. adsorption mechanism according to claim 1, it is characterised in that：The soup stick main body and the suction nozzle block are one
Shaping, and be connected together with the soup stick connecting portion.
7. adsorption mechanism according to claim 1, it is characterised in that：The soup stick main body and the soup stick connecting portion are one
Body shaping, the suction nozzle block coats a part for soup stick main body and a part for soup stick connecting portion in a welding manner.
8. adsorption mechanism according to claim 1, it is characterised in that：The soup stick main body, the soup stick connecting portion and institute
It is integrally formed to state suction nozzle block.
9. adsorption mechanism according to claim 1, it is characterised in that：The soup stick connecting portion is configured to straight cutting side
Formula is connected with the suction nozzle by the suction nozzle connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720690027.7U CN206834163U (en) | 2017-06-14 | 2017-06-14 | Adsorption mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720690027.7U CN206834163U (en) | 2017-06-14 | 2017-06-14 | Adsorption mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206834163U true CN206834163U (en) | 2018-01-02 |
Family
ID=60775895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720690027.7U Active CN206834163U (en) | 2017-06-14 | 2017-06-14 | Adsorption mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206834163U (en) |
-
2017
- 2017-06-14 CN CN201720690027.7U patent/CN206834163U/en active Active
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