CN206819332U - A kind of high-speed processing apparatus - Google Patents
A kind of high-speed processing apparatus Download PDFInfo
- Publication number
- CN206819332U CN206819332U CN201720272601.7U CN201720272601U CN206819332U CN 206819332 U CN206819332 U CN 206819332U CN 201720272601 U CN201720272601 U CN 201720272601U CN 206819332 U CN206819332 U CN 206819332U
- Authority
- CN
- China
- Prior art keywords
- processing apparatus
- raid controller
- circuit board
- speed processing
- solid state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012545 processing Methods 0.000 title claims abstract description 24
- 239000007787 solid Substances 0.000 claims description 19
- 238000009825 accumulation Methods 0.000 claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 15
- 230000005540 biological transmission Effects 0.000 abstract description 7
- 230000002159 abnormal effect Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 238000012216 screening Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000006353 environmental stress Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of high-speed processing apparatus, including power module, flash chip, the RAID controller for also include memory module, being connected with memory module, the XMC connectors being connected with RAID controller, RAID controller are connected to be interacted in host data by PCIe interface with XMC connectors.Because this equipment uses XMC connectors, common connector can be overcome easily to occur releasing in vibration processes or loose contact phenomenon, cause system to occur the problem of abnormal in use.It is in addition, very fast using RAID controller, its support PCIe interface agreement, transmission speed.
Description
Technical field
Electronic technology field is the utility model is related to, more particularly to a kind of high-speed processing apparatus.
Background technology
Hard disk is the main storaging medium in computer system, and the physical interface of conventional hard has the PATA interfaces of 50 pins
With the SATA interface of 7+15 pins, the maximum bandwidths of PATA interfaces is 133MB/s, the maximum bandwidth of SATA interface for 6Gb/s about
For 600MB/s, interface standard that the limited speed of such hard disk uses in it is only suitable in business computer, at some
In high reliability occasion, such as radar data recorder, optical fiber recorder, the data bandwidth of front end input is up to several GB/s,
It is that can not meet the requirement in performance using conventional hard.
In addition, for some military industries, it is desirable to the resistance to shock of storage device will get well, according to《GJB1032-1990 electricity
Sub- Product environment stress screening method》Standard, Military Electronic Equipment are required to carry out 20-2000Hz vibration test.It is and traditional
Hard disk use PATA connectors or SATA connector, such connector can not ensure in electric property and stability, shake
Easily occur releasing during dynamic or loose contact phenomenon, cause system to occur exception in use.
As can be seen here, how to overcome transmission speed slow and antivibration effect difference to be that those skilled in the art are urgently to be resolved hurrily ask
Topic.
Utility model content
The purpose of this utility model is to provide a kind of high-speed processing apparatus, and for overcoming, transmission speed is slow and antivibration effect is poor
The shortcomings that.
In order to solve the above technical problems, the utility model provides a kind of high-speed processing apparatus, including, power module, flash memory
Chip, in addition to memory module, the RAID controller being connected with the memory module, the XMC that is connected with the RAID controller
Connector, the RAID controller are connected to be interacted in host data by PCIe interface with the XMC connectors.
Preferably, the memory module includes two layers of accumulation layer, and the accumulation layer includes multiple solid state hard discs, multiple
The solid state hard disc is connected by SATA interface with the RAID controller.
Preferably, it is provided with reinforcing member between the solid state hard disc.
Preferably, in addition to first circuit board and second circuit board, the XMC connectors are set with the RAID controller
On the first circuit board, the solid state hard disc positioned at the same accumulation layer is arranged on second circuit described in same
On plate, two second circuit boards are superimposed up and down, and second circuit board and the first circuit board positioned at bottom pass through grafting
Part is horizontally fixed on bottom plate, and superposed second circuit board passes through the intermediate connector that is arranged on the first circuit board
It is connected with the RAID controller.
Preferably, in addition to it is arranged at leading between the second circuit board on the top and the second circuit board of the bottom
Thermosphere.
Preferably, the heat-conducting layer has the opening for accommodating the intermediate connector, and multiple radiating grooves are distributed with.
Preferably, the power module is DC-DC power module.
Preferably, the flash chip is NorFlash.
High-speed processing apparatus provided by the utility model, including power module, flash chip, in addition to memory module,
The RAID controller being connected with memory module, the XMC connectors being connected with RAID controller, RAID controller pass through PCIe interface
It is connected with XMC connectors to be interacted in host data.Because this equipment uses XMC connectors, common connector can be overcome
Easily occur releasing in vibration processes or loose contact phenomenon, cause system to occur the problem of abnormal in use.
It is in addition, very fast using RAID controller, its support PCIe interface agreement, transmission speed.
Brief description of the drawings
In order to illustrate more clearly of the utility model embodiment, letter will be done to the required accompanying drawing used in embodiment below
Single introduction, it should be apparent that, drawings in the following description are only some embodiments of the utility model, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structure chart of high-speed processing apparatus provided by the utility model；
Fig. 2 is a kind of scheme of installation for high-speed processing apparatus that the utility model embodiment provides.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that described embodiment is only the utility model part of the embodiment, rather than all real
Apply example.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made, institute
The every other embodiment obtained, belongs to scope of protection of the utility model.
Core of the present utility model is to provide a kind of high-speed processing apparatus, and for overcoming, transmission speed is slow and antivibration effect is poor
The shortcomings that.
In order that those skilled in the art more fully understand the utility model, below in conjunction with the accompanying drawings and it is embodied
The utility model is described in further detail for mode.
Storage card uses the ASP-105885-01-MKT XMC connectors of samtec companies simultaneously, and the connector is reliable
Property and stability in terms of it is more stable, all components of storage card using technical grade and the device of temperatures above grade, with reference to
The design of air-cooled or conduction structure, disclosure satisfy that the military project application requirement of high-performance, reliability, high stability.
Fig. 1 is a kind of structure chart of high-speed processing apparatus provided by the utility model.As shown in figure 1, high-speed processing apparatus
Including power module 10, flash chip 11, memory module 12, the RAID controller 13 being connected with memory module 12 and RAID are controlled
The XMC connectors 14 that device 13 processed connects, RAID controller 13 are connected with host data by PCIe interface with XMC connectors 14
Interaction.
The front end of RAID controller 13 is PCIe interface, and the data interaction with main frame, rear end are realized by XMC connectors 14
For SATA interface (memory module 12 is solid state hard disc), the data interaction with memory module 12 is realized.RAID controller 13 can
The RAID0/1/10 redundant configurations pattern is supported simultaneously to support PCIe3.0 8X interfaces, and this mouthful can compatible two-way independence
PCIe3.0 4X.Existing interface standard is SATA protocol, and highest theoretical velocity is 6Gb/s, and after using PCIe interface, interface
Standard is PCIe protocol, and PCIe3.0 8x highests theoretical velocity is 8GB/s, and transmission speed is very fast.XMC connectors 14 set for storage
Standby be connected with main frame provides physical connection, and flash chip 11 is used for the firmware for depositing RAID controller, as a kind of preferable real
Mode is applied, flash chip 11 can select NorFlash.Power module 10 can select DC-DC power module, can fully carry
The service efficiency of high power supply.
Common connector easily occurs releasing during use environment is vibrated or the situation of loose contact, Wu Faman
Foot《GJB1032-1990 electronic product Environment Stress Screening Methods》In vibration screening test requirements document, the connection in the present embodiment
Device uses XMC connectors 14, and the connector can keep stable connection under vibration, ensures the work of system normal table
Make.As a preferred mode, XMC connectors 14 can use the ASP-105885-01-MKT XMC of samtec companies to connect
Device is connect, the connector is more stable in terms of reliability and stability.
Furthermore, it is contemplated that storage device is frequently used for industrial or military industry, therefore, in specific implementation, for other
For hardware, using technical grade (- 40-85 DEG C) and temperatures above grade, high-performance, reliability, high stability disclosure satisfy that
Military project application requirement.It should be noted that the contour structures and size design of the high-speed processing apparatus that the present embodiment provides can be with
With reference to VITA42.0 specifications, interface defines design reference VITA42.3 specifications, and the present embodiment repeats no more.
The high-speed processing apparatus that the present embodiment provides, including power module, flash chip, in addition to memory module, with depositing
The RAID controller of storage module connection, the XMC connectors that are connected with RAID controller, RAID controller by PCIe interface and
XMC connectors are connected to be interacted in host data.Because this equipment uses XMC connectors, common connector can be overcome to exist
Easily occur releasing in vibration processes or loose contact phenomenon, cause system to occur the problem of abnormal in use.Separately
Outside, it is very fast using RAID controller, its support PCIe interface agreement, transmission speed.
On the basis of above-described embodiment, as preferred embodiment, memory module 12 includes two layers of accumulation layer, storage
Layer includes multiple solid state hard discs, and multiple solid state hard discs are connected by SATA interface with RAID controller.
The storage device that computer uses earliest is HDD mechanical hard disks, and mechanical hard disk is traditional hard disk, mainly there is disk
Piece and motor and control section composition, running discs are in the state that runs at high speed, this due to mechanical hard disk
Working method determines that the operating environment requirements of mechanical hard disk are more stable, otherwise easily causes disc damage, traditional in addition
The speed of mechanical hard disk is relatively low, and with speed and the demand more and more higher of stability, increasing people is selected using another
Storage device, i.e. solid state hard disc, solid state hard disc use totally integrated chip design method, compared to mechanical hard disk on stability more
Add reliably, while also considerably beyond mechanical hard disk in speed.RAID controller, multi-disc solid state hard disc can be integrated into one admittedly
State hard disk, realize that capacity is double.In specific implementation, each layer of accumulation layer can include 4 solid state hard discs, this memory module 12
Comprising two layers of accumulation layer, therefore, include 8 solid state hard discs altogether.As preferable real-time mode, it is provided between solid state hard disc
Reinforcing member.In specific implementation, it can be reinforced using aluminium alloy structure, and be designed to wind-cooling heat dissipating form, the present embodiment
Repeat no more.
Fig. 2 is a kind of scheme of installation for high-speed processing apparatus that the utility model embodiment provides.In above-described embodiment
On the basis of, as preferred embodiment, in addition to first circuit board 3 and second circuit board, XMC connectors 14 and RAID is controlled
Device 13 processed is arranged on first circuit board 3, and the solid state hard disc positioned at same accumulation layer is arranged on same second circuit board,
Two second circuit boards are superimposed up and down, and second circuit board 4 and first circuit board 3 positioned at bottom are horizontally fixed on by plug connector
On bottom plate 5, superposed second circuit board 1 is controlled by the intermediate connector 15 and RAID being arranged on first circuit board 3
Device 13 connects.
By the way that two circuit boards are superimposed, enabling more fully using the space in z-axis, improve the close of storage device
Degree, be advantageous to save space.The generally use conductive structure of bottom plate 5 or heat-conducting, support can not only be played a part of, and
And need to radiate for solid state hard disc etc..
On the basis of above-described embodiment, as preferred embodiment, in addition to the second circuit board 1 on top is arranged at
Heat-conducting layer 2 between the second circuit board 4 of bottom.Heat-conducting layer 2 is conductive structure, has and accommodates opening for intermediate connector 15
Mouthful, and multiple radiating grooves are distributed with.
High-speed processing apparatus provided by the utility model is described in detail above.Each embodiment in specification
Described by the way of progressive, what each embodiment stressed is the difference with other embodiment, each embodiment
Between identical similar portion mutually referring to.For device disclosed in embodiment, due to its with embodiment disclosed in side
Method is corresponding, so description is fairly simple, related part is referring to method part illustration.It should be pointed out that for this technology
For the those of ordinary skill in field, on the premise of the utility model principle is not departed from, the utility model can also be carried out
Some improvement and modification, these are improved and modification is also fallen into the protection domain of the utility model claims.
It should also be noted that, in this manual, such as first and second or the like relational terms be used merely to by
One entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operation
Between any this actual relation or order be present.Moreover, term " comprising ", "comprising" or its any other variant meaning
Covering including for nonexcludability, so that process, method, article or equipment including a series of elements not only include that
A little key elements, but also the other element including being not expressly set out, or also include for this process, method, article or
The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", is not arranged
Except other identical element in the process including the key element, method, article or equipment being also present.
Claims (8)
1. a kind of high-speed processing apparatus, including, power module, flash chip, it is characterised in that also including memory module and institute
The RAID controller of memory module connection, the XMC connectors being connected with the RAID controller are stated, the RAID controller passes through
PCIe interface is connected to be interacted in host data with the XMC connectors.
2. high-speed processing apparatus according to claim 1, it is characterised in that the memory module includes two layers of accumulation layer,
The accumulation layer includes multiple solid state hard discs, and multiple solid state hard discs are connected by SATA interface with the RAID controller.
3. high-speed processing apparatus according to claim 2, it is characterised in that reinforcing is provided between the solid state hard disc
Part.
4. high-speed processing apparatus according to claim 2, it is characterised in that also including first circuit board and second circuit
Plate, the XMC connectors are arranged on the first circuit board with the RAID controller, positioned at the same accumulation layer
The solid state hard disc is arranged on described in same on second circuit board, and two second circuit boards are superimposed up and down, positioned at bottom
Second circuit board and the first circuit board be horizontally fixed on by plug connector on bottom plate, superposed second circuit board leads to
The intermediate connector being arranged on the first circuit board is crossed to be connected with the RAID controller.
5. high-speed processing apparatus according to claim 4, it is characterised in that also include the second electricity for being arranged at the top
Heat-conducting layer between road plate and the second circuit board of the bottom.
6. high-speed processing apparatus according to claim 5, it is characterised in that there is the heat-conducting layer receiving centre to connect
The opening of device is connect, and multiple radiating grooves are distributed with.
7. high-speed processing apparatus according to claim 1, it is characterised in that the power module is DC-DC power module.
8. high-speed processing apparatus according to claim 1, it is characterised in that the flash chip is NorFlash.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720272601.7U CN206819332U (en) | 2017-03-20 | 2017-03-20 | A kind of high-speed processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720272601.7U CN206819332U (en) | 2017-03-20 | 2017-03-20 | A kind of high-speed processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206819332U true CN206819332U (en) | 2017-12-29 |
Family
ID=60751331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720272601.7U Active CN206819332U (en) | 2017-03-20 | 2017-03-20 | A kind of high-speed processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206819332U (en) |
-
2017
- 2017-03-20 CN CN201720272601.7U patent/CN206819332U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203552155U (en) | Hard disc plug device based on PCIE slots | |
| US9009959B2 (en) | Method of assembling mass storage device for a computer system | |
| CN206249296U (en) | A kind of dual control storage server | |
| CN202870800U (en) | Embedded type high-capacity network storage control module | |
| JP2015507233A (en) | System and method for providing a dynamic electronic storage unit | |
| CN101540685A (en) | PCIe shared storage blade for blade server | |
| CN201237907Y (en) | Solid state RAID system with single disk structure | |
| US20120320518A1 (en) | Serial advanced technology attachment dimm | |
| CN206819332U (en) | A kind of high-speed processing apparatus | |
| CN102541473A (en) | Method for setting storage equipment of blade server and blade server by utilizing method | |
| CN105700817A (en) | Just Bunch of Discs JBOD apparatus | |
| CN201392523Y (en) | Computer mainboard interface conversion device | |
| CN116700445A (en) | Full flash ARM storage server based on distributed storage hardware architecture | |
| CN201489419U (en) | SAS back panel suitable for different interfaces | |
| CN101540686A (en) | PCIe switching device for blade server | |
| CN209674306U (en) | A kind of 4U storage server | |
| CN210837186U (en) | Hard disk expansion device, hard disk assembly and hard disk device | |
| CN107741831A (en) | A kind of method for automatically configuring RAID card for LSI RAID cards | |
| CN110209248A (en) | Support the high density 4U storage server of multiple U2 SSD extensions | |
| CN205620911U (en) | 2U links multistage JBOD high density storage server outward | |
| CN206258787U (en) | A kind of rack server and data center | |
| CN202049412U (en) | Storage server | |
| CN2807335Y (en) | External frame micro high speed data memory device | |
| CN201430599Y (en) | 10 Gb network memory | |
| CN110827865A (en) | Hard disk expansion device, hard disk assembly and hard disk device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |