CN206798179U - A kind of packing pallet for circuit board substrate - Google Patents
A kind of packing pallet for circuit board substrate Download PDFInfo
- Publication number
- CN206798179U CN206798179U CN201720454848.0U CN201720454848U CN206798179U CN 206798179 U CN206798179 U CN 206798179U CN 201720454848 U CN201720454848 U CN 201720454848U CN 206798179 U CN206798179 U CN 206798179U
- Authority
- CN
- China
- Prior art keywords
- splicer
- clasp
- becket bridle
- contraction pole
- bale ties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Packaging Frangible Articles (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The utility model discloses a kind of packing pallet for circuit board substrate, including tray body, in addition to splicer, contraction pole, becket bridle, bale ties and clasp；The splicer is located at tray body side side, and contraction pole bottom connects with splicer, and becket bridle is located at contraction pole top, and bale ties one end connects with becket bridle；Clasp is located at tray body opposite side side and position is corresponding with splicer.The packing support holder structure that the utility model is used for circuit board substrate is simple, easy to use, laborsaving, simple and convenient quickly can tie up kinds of goods and pallet firmly.
Description
Technical field
It the utility model is related to board production technical field, more particularly to a kind of packing support for circuit board substrate
Disk.
Background technology
In circuit board substrate production process, usage amount is increasing during pallet during packing, will will be moulded during packing every time
Adhesive tape is gruelling to be tied up from tray bottom through opposite, is operated time-consuming.
Utility model content
Purpose of utility model：To overcome the shortcomings of the existing technology, the utility model purport is used for circuit board substrate in offer one kind
Packing pallet.
Technical scheme：In order to solve the above technical problems, the utility model adopts the following technical scheme that：
A kind of packing pallet for circuit board substrate, including tray body, in addition to splicer, contraction pole, becket bridle, beat
Bag rope and clasp；The splicer is located at tray body side side, and contraction pole bottom connects with splicer, and becket bridle is located at contraction
Bar top, bale ties one end connect with becket bridle；Clasp is located at tray body opposite side side and position is corresponding with splicer.
Operation principle：The utility model is used for the packing pallet of circuit board substrate, by adjusting contraction pole height during use
Becket bridle is higher than product most significant end, then bale ties is connected through product with clasp, make bale ties product of tying tight prevent product from falling
Fall.
The splicer includes the first splicer and the second splicer, and contraction pole includes the first contraction pole and second and shunk
Bar, becket bridle include the first becket bridle and the second becket bridle, and bale ties includes the first bale ties and the second bale ties, and clasp is buckled including first
Ring and the second clasp；First splicer and the second splicer are located at tray body side side, the first contraction pole bottom and first
Splicer connects, and the first becket bridle is located at the first contraction pole top, and first bale ties one end connects with the first becket bridle, the second contraction pole
Bottom connects with the second splicer, and the second becket bridle is located at the second contraction pole top, and the second bale ties top connects with the second becket bridle；
It is corresponding with the first splicer that first clasp and the second clasp are located at tray body opposite side side and the first clasp position, and
Two clasp positions second are corresponding with splicer.Can be tied tight product by two bale ties, improve product placement stability.
First splicer and the second clasp are located at tray body side side, and the first contraction pole bottom is be hinged with first
Device connects, and the first becket bridle is located at the first contraction pole top, and first bale ties one end connects with the first becket bridle；First clasp and second
Splicer is located at tray body opposite side side, and the second contraction pole bottom connects with the second splicer, and the second becket bridle is located at second
Contraction pole top, the second bale ties top connect with the second becket bridle；First clasp position is corresponding with the first splicer, the second button
Ring position second is corresponding with splicer.By the way that two contraction poles are oppositely arranged two bale ties can be made to tie tight product, improve production
Product stable in placement.
First splicer and the second splicer are located at tray body side side, and the first clasp and the second clasp are located at
Tray body opposite side side, the first clasp position is corresponding with the second splicer, the second clasp position first and splicer phase
It is corresponding；Two bale ties can be made to intersect product of tying tight, improve product placement stability.
It is preferred that the bale ties is plastic ties.
A kind of application method of packing pallet for circuit board substrate, comprises the following steps：
1), by product block pattern row pattern in tray body, highly adjusted according to product and shrink pole length, produce becket bridle height
Product；
2), bale ties is connected above product through tray body with clasp；
3), dragging tight bale ties makes the extruding of bale ties to product generation from top to bottom；
4) bale ties, is fastened on clasp.
The first bale ties and the second bale ties are passed through into tray body, the first packing above product in the step 2)
Rope connects with the first clasp, and the second bale ties connects with the second clasp.Can be tied tight product by two bale ties, improve product pendulum
Put stability.
The first bale ties is passed through from tray body side in the step 2) and connected above product with the first clasp；Second
Bale ties passes through from tray body opposite side to connect above product with the second clasp.Two can be made by the way that two contraction poles are oppositely arranged
Root bale ties is tied tight product, improves product placement stability.
First clasp position is corresponding with the second splicer, and the second clasp position first is corresponding with splicer；The step
It is rapid 2) in the first bale ties and the second bale ties intersect tray body, the first bale ties and the first clasp phase passed through above product
Connect, the second bale ties connects with the second clasp.Two bale ties can be made to intersect product of tying tight, improve product placement stability.
The NM technology of the utility model is prior art.
Beneficial effect：The packing support holder structure that the utility model is used for circuit board substrate is simple, easy to use, laborsaving, energy
It is simple and convenient quickly to tie up kinds of goods and pallet firmly.
Brief description of the drawings
Fig. 1 is the packing tray structure diagram that the utility model is used for circuit board substrate；
Fig. 2 is the structural representation of the utility model embodiment 2；
Fig. 3 is the structural representation of the utility model embodiment 3；
Fig. 4 is the structural representation of the utility model embodiment 4；
In figure, 1 it is tray body, 2 is the first contraction pole, 3 is the first splicer, 4 is the first becket bridle, 5 is the first packing
Rope, 6 be the first clasp, 7 be the second contraction pole, 8 be the second becket bridle, 9 be the second splicer, 10 be the second clasp, 11 be second
Bale ties.
Embodiment
In order to more fully understand the utility model, content of the present utility model is furtherd elucidate with reference to embodiment, but
Content of the present utility model is not limited solely to the following examples.
Embodiment 1
As shown in figure 1, a kind of packing pallet for circuit board substrate, including tray body, in addition to splicer, contraction
Bar, becket bridle, bale ties and clasp；The splicer is located at tray body side side, and contraction pole bottom connects with splicer, rope
Ring is located at contraction pole top, and bale ties one end connects with becket bridle；Clasp is located at tray body opposite side side and position is with being hinged
Device is corresponding；Bale ties is plastic ties.
The application method of the above-mentioned packing pallet for circuit board substrate, comprises the following steps：
1), by product block pattern row pattern in tray body, highly adjusted according to product and shrink pole length, produce becket bridle height
Product；
2), bale ties is connected above product through tray body with clasp；
3), dragging tight bale ties makes the extruding of bale ties to product generation from top to bottom；
4) bale ties, is fastened on clasp.
The utility model is used for the packing pallet of circuit board substrate, is highly higher than becket bridle by adjusting contraction pole during use
Product most significant end, then bale ties is connected through product with clasp, bale ties product of tying tight is set to prevent product from dropping.This practicality is new
The packing support holder structure that type is used for circuit board substrate is simple, easy to use, laborsaving, simple and convenient quickly can tie kinds of goods and pallet
Fasten solid.
Embodiment 2
It is substantially the same manner as Example 1, except that：It is hinged as shown in Fig. 2 splicer includes the first splicer and second
Device, contraction pole include the first contraction pole and the second contraction pole, and becket bridle includes the first becket bridle and the second becket bridle, and bale ties includes first
Bale ties and the second bale ties, clasp include the first clasp and the second clasp；First splicer and the second splicer are located at pallet
Body side side, the first contraction pole bottom connect with the first splicer, and the first becket bridle is located at the first contraction pole top, first dozen
Bag rope one end connects with the first becket bridle, and the second contraction pole bottom connects with the second splicer, and the second becket bridle is located at the second contraction pole
Top, the second bale ties top connect with the second becket bridle；First clasp and the second clasp be located at tray body opposite side side and
First clasp position is corresponding with the first splicer, and the second clasp position second is corresponding with splicer.
The application method of the above-mentioned packing pallet for circuit board substrate, packs the first bale ties and second in step 2)
Rope passes through tray body above product, and the first bale ties connects with the first clasp, and the second bale ties connects with the second clasp.
Embodiment 3
It is substantially the same manner as Example 2, except that：As shown in figure 3, the first splicer and the second clasp are located at pallet sheet
Body side side, the first contraction pole bottom connect with the first splicer, and the first becket bridle is located at the first contraction pole top, the first packing
Rope one end connects with the first becket bridle；First clasp and the second splicer are located at tray body opposite side side, the second contraction pole bottom
End connects with the second splicer, and the second becket bridle is located at the second contraction pole top, and the second bale ties top connects with the second becket bridle；The
One clasp position is corresponding with the first splicer, and the second clasp position second is corresponding with splicer.
The application method of the above-mentioned packing pallet for circuit board substrate, by the first bale ties from tray body in step 2)
Side connects through product top with the first clasp；Second bale ties is passed through from tray body opposite side and buckled above product with second
Ring connects.By the way that two contraction poles are oppositely arranged two bale ties can be made to tie tight product, improve product placement stability.
Embodiment 4
It is substantially the same manner as Example 2, except that：As shown in figure 4, the first splicer and the second splicer are located at pallet
Body side side, the first clasp and the second clasp are located at tray body opposite side side, and the first clasp position is be hinged with second
Device is corresponding, and the second clasp position first is corresponding with splicer.
The application method of the above-mentioned packing pallet for circuit board substrate, the first bale ties and the second bale ties in step 2)
Intersection passes through tray body above product, and the first bale ties connects with the first clasp, and the second bale ties connects with the second clasp.
Two bale ties can be made to intersect product of tying tight, improve product placement stability.
It the above is only preferred embodiment of the present utility model, it should be pointed out that：For the ordinary skill people of the art
For member, on the premise of the utility model principle is not departed from, each facility locations can also be adjusted, these adjustment also should
It is considered as the scope of protection of the utility model.
Claims (5)
1. a kind of packing pallet for circuit board substrate, including tray body, it is characterised in that：Also include splicer, shrink
Bar, becket bridle, bale ties and clasp；The splicer is located at tray body side side, and contraction pole bottom connects with splicer, rope
Ring is located at contraction pole top, and bale ties one end connects with becket bridle；Clasp is located at tray body opposite side side and position is with being hinged
Device is corresponding.
2. it is used for the packing pallet of circuit board substrate as claimed in claim 1, it is characterised in that：The splicer includes first
Splicer and the second splicer, contraction pole include the first contraction pole and the second contraction pole, and becket bridle includes the first becket bridle and the second rope
Ring, bale ties include the first bale ties and the second bale ties, and clasp includes the first clasp and the second clasp；First splicer and
Two splicers are located at tray body side side, and the first contraction pole bottom connects with the first splicer, and the first becket bridle is located at first
Contraction pole top, first bale ties one end connect with the first becket bridle, and the second contraction pole bottom connects with the second splicer, the second rope
Ring is located at the second contraction pole top, and the second bale ties top connects with the second becket bridle；First clasp and the second clasp are located at pallet
Body opposite side side and the first clasp position is corresponding with the first splicer, the second clasp position second is relative with splicer
Should.
3. it is used for the packing pallet of circuit board substrate as claimed in claim 2, it is characterised in that：First splicer and
Two clasps are located at tray body side side, and the first contraction pole bottom connects with the first splicer, and the first becket bridle is located at the first receipts
Contracting bar top, first bale ties one end connect with the first becket bridle；First clasp and the second splicer are located at tray body opposite side
Side, the second contraction pole bottom connect with the second splicer, and the second becket bridle is located at the second contraction pole top, the second bale ties top
Connect with the second becket bridle；First clasp position is corresponding with the first splicer, and the second clasp position second is corresponding with splicer.
4. it is used for the packing pallet of circuit board substrate as claimed in claim 2, it is characterised in that：First splicer and
Two splicers are located at tray body side side, and the first clasp and the second clasp are located at tray body opposite side side, the first button
Ring position is corresponding with the second splicer, and the second clasp position first is corresponding with splicer.
5. the packing pallet for circuit board substrate as described in claim 1-4 any one, it is characterised in that：The packing
Restrict as plastic ties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720454848.0U CN206798179U (en) | 2017-04-27 | 2017-04-27 | A kind of packing pallet for circuit board substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720454848.0U CN206798179U (en) | 2017-04-27 | 2017-04-27 | A kind of packing pallet for circuit board substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206798179U true CN206798179U (en) | 2017-12-26 |
Family
ID=60738388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720454848.0U Expired - Fee Related CN206798179U (en) | 2017-04-27 | 2017-04-27 | A kind of packing pallet for circuit board substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206798179U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106966050A (en) * | 2017-04-27 | 2017-07-21 | 南京市罗奇泰克电子有限公司 | A kind of packing pallet and its application method for circuit board substrate |
-
2017
- 2017-04-27 CN CN201720454848.0U patent/CN206798179U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106966050A (en) * | 2017-04-27 | 2017-07-21 | 南京市罗奇泰克电子有限公司 | A kind of packing pallet and its application method for circuit board substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171226 Termination date: 20210427 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |