CN206783786U - Electrolytic copper foil and electric assembly using same - Google Patents
Electrolytic copper foil and electric assembly using same Download PDFInfo
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- CN206783786U CN206783786U CN201720265805.8U CN201720265805U CN206783786U CN 206783786 U CN206783786 U CN 206783786U CN 201720265805 U CN201720265805 U CN 201720265805U CN 206783786 U CN206783786 U CN 206783786U
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 166
- 239000011889 copper foil Substances 0.000 title claims abstract description 148
- 239000011888 foil Substances 0.000 claims abstract description 51
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 239000010949 copper Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 9
- 238000011282 treatment Methods 0.000 claims description 6
- 208000000260 Warts Diseases 0.000 claims description 5
- 238000013021 overheating Methods 0.000 claims description 5
- 201000010153 skin papilloma Diseases 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 3
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 claims 1
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000003792 electrolyte Substances 0.000 description 32
- 239000000654 additive Substances 0.000 description 21
- 230000000996 additive effect Effects 0.000 description 21
- 238000000034 method Methods 0.000 description 20
- 239000013078 crystal Substances 0.000 description 13
- 238000012545 processing Methods 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 6
- 229910001431 copper ion Inorganic materials 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 6
- 102000004169 proteins and genes Human genes 0.000 description 6
- 108090000623 proteins and genes Proteins 0.000 description 6
- 241000370738 Chlorion Species 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- -1 tertiary amine compounds Chemical class 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 150000004676 glycans Chemical class 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229920001282 polysaccharide Polymers 0.000 description 2
- 239000005017 polysaccharide Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- QMMFVYPAHWMCMS-UHFFFAOYSA-N Dimethyl sulfide Chemical compound CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 description 1
- 239000002000 Electrolyte additive Substances 0.000 description 1
- 238000006424 Flood reaction Methods 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Abstract
The utility model discloses an electrolytic copper foil and use its electric subassembly. The electrolytic copper foil has a sheet-shaped raw foil layer and a coarse structure on one side of the raw foil layer, wherein the coarse structure is a plurality of granular protrusions formed on the surface of the raw foil layer, the initial grain size of the raw foil layer is between 0.1 and 10 mu m, and the elongation difference between before and after the electrolytic copper foil is subjected to heat treatment is reduced along with the increase of the initial grain size of the raw foil layer, wherein the initial grains of the raw foil layer have regrowth property under the heat treatment of less than 180 ℃. The electrolytic copper foil provided by the utility model has low roughness and special mechanical property, and can be applied to electrical components.
Description
Technical field
It the utility model is related to a kind of electrolytic copper foil and apply its electric component, have more particularly to one kind low coarse
The electrolytic copper foil of degree and apply its electric component.
Background technology
In recent years, because the packing density of printing distributing board improves constantly and miniaturization so that reduce device interior
Volume turns into problem.In order to the fine circuitry in response to wire densification, it is necessary to copper foil using low rugosity.
In patent document 1 (Japanese Patent Laid-Open 2005-154815 publications), there is provided a kind of electrolytic copper foil manufacture cupric electrolysis
The manufacture method of liquid and electrolytic copper foil using copper electrolyte, substantially without managing for the molecular weight by protein etc. and concentration
Under the yield change of caused isolation paper tinsel, and mountain (bump) form and dimension that can obtain isolating paper tinsel mat surface is neat, low coarse
The copper foil of degree, its announcement have that " electrolytic copper foil manufacture copper electrolyte is characterized in the number for the protein being contained in the copper electrolyte
Average molecular weight (Mn) is 1000~2300, and concentration is 2ppm~4.5ppm.Copper ion (Cu in copper electrolyte2+) concentration is
60g/L~100g/L.The free SO of copper electrolyte4 2-Concentration is 60g/L~250g/L.Chlorion (the Cl of copper electrolyte-) concentration
It is 0.5ppm~2.0ppm.」.
However, in the copper electrolyte of patent document 1, include protein, copper ion, free sulfate ion and chlorine from
Son, and the number-average molecular weight (Mn) of protein must be controlled 1000~2300, therefore it is complex in processing procedure management.
In addition, in traditional processing procedure, the electrolytic copper foil with low rugosity is produced, glue must be added in copper electrolyte
(such as:SPS, tertiary amine compounds etc.), protein and high molecular polysaccharide (such as:HEC etc.) additive, to make electrolytic copper foil
10 mean roughness (Rz) are reduced to 2.0 μm.
Prepared because the concentration of additive is difficult to detect, therefore in a manner of above-mentioned processing procedure with low roughness electrolytic copper foil
The managerial difficulty of processing procedure can be caused.And in the fabrication process, the accumulation of additive needs to remove by substantial amounts of active carbon filtration,
And then increase the doubt in terms of managerial degree of difficulty, environmental protection and the consideration in terms of cost.If however, not in copper electrolyte
Using additive, the roughness of prepared electrolytic copper foil can be significantly increased.
Utility model content
Technical problem to be solved in the utility model is that providing one kind in view of the shortcomings of the prior art has special machine
Tool property electrolytic copper foil, with applied to different electric components.
In order to solve above-mentioned technical problem, a wherein technical scheme is to provide a kind of electricity used by the utility model
Solve copper foil, its have a foil layer in the form of sheets and one positioned at the wherein side of foil layer coarse structure, wherein, coarse structure
For multiple multiple graininess projections for being formed at foil layer surface, the Initial Grain Size of foil layer is between 0.1 to 10 μm, and electricity
It with elongation difference is afterwards reduced with the increase of the Initial Grain Size of foil layer that copper foil is solved through Overheating Treatment before,
Wherein, the initial grain of foil layer has growth again in the case where the heat treatment is less than or equal to 180 DEG C.
Preferably, the heating-up temperature of heat treatment is between 125 DEG C to 180 DEG C.
Preferably, the thickness of the electrolytic copper foil is between 6 to 400 μm.
Preferably, the thickness of the electrolytic copper foil is between 6 to 70 μm, and the initial grain of the foil layer is big
It is small between 0.1 to 5 μm.
Preferably, the electrolytic copper foil has an initial elongation rate before passing through the heat treatment, and the electrolytic copper foil passes through
With elongation after a heat treatment after the heat treatment, and elongation is more than the initial elongation rate after the heat treatment.
Preferably, the thickness of the electrolytic copper foil is between 70 to 210 μm, and the initial grain of the foil layer
Size is between 5 to 10 μm.
Preferably, the initial elongation rate of the electrolytic copper foil is between 5 to 30.
In order to solve above-mentioned technical problem, a wherein technical scheme is to provide a kind of electricity used by the utility model
Pneumatic module, it includes a base material and at least one line layer on base material, wherein, the line layer is described cathode copper
Paper tinsel either electrolytic copper foil is formed by etching.
Preferably, electric component is rigid printed circuit board, flexible printed wiring board or battery component.
The beneficial effects of the utility model are, can when making the electrolytic copper foil that the utility model embodiment is provided
Additive amount in copper electrolyte is reduced to below 1ppm, or even can be completely without using the addition of any organic or inorganic
Agent, but 10 mean roughness (Rz) of the mat surface of electrolytic copper foil can still be less than 2.0 μm.In addition, with prior art prepared by
Electrolytic copper foil compare, the crystal grain in the electrolytic copper foil of the utility model embodiment be heat-treated be less than 180 DEG C at a temperature of i.e. have
There is again growth (regrowth), so as to influence the engineering properties after electrolytic copper foil heating, such as:Elongation.
Therefore, can be according to the difference of application field, so that electrolytic copper foil has difference in the utility model embodiment
Crystallite dimension, to adjust the engineering properties of electrolytic copper foil.
Feature of the present utility model and technology contents are further understood that to be enabled, are referred to below in connection with the utility model
Detailed description and accompanying drawing, but the accompanying drawing provided only provide with reference to and explanation use, not be used for the utility model is subject to
Limiter.
Brief description of the drawings
Fig. 1 is the schematic diagram of the utility model wherein process apparatus of the electrolytic copper foil of an embodiment.
Fig. 2A is the partial enlarged drawing of the utility model wherein electrolytic copper foil of an embodiment.
Fig. 2 B are the partial enlarged drawing of the electrolytic copper foil of another embodiment of the utility model.
Fig. 3 be the utility model embodiment electrolytic copper foil before the heat treatment with elongation difference afterwards and crystal grain chi
Very little graph of a relation.
Fig. 4 is photo of the electrolytic copper foil in sweep electron microscope (SEM) of embodiment 5.
Fig. 5 is photo of the electrolytic copper foil in sweep electron microscope (SEM) of reference examples 1.
Fig. 6 is the partial cutaway schematic of electric component of the present utility model.
Embodiment
It is that the implementation about " electrolytic copper foil " disclosed in the utility model is illustrated by particular specific embodiment below
Mode.The electrolytic copper foil of the utility model embodiment can be used for the current collector of battery and for printed circuit board (PCB) (printed
Circuit board, PCB) or flexible printed wiring board (FPC).
Fig. 1 is refer to, shows the schematic diagram of the process apparatus of the electrolytic copper foil of the utility model embodiment.As shown in figure 1,
The process apparatus 1 of electrolytic copper foil comprises at least an electrolytic cell 10, a positive plate 11, a cathode wheel 12 and a retracting unit 13.
Electrolytic cell 10 can include copper ion (Cu to contain electrolyte L in wherein electrolyte L2+), sulfate ion
(SO4 2-) and chlorion (Cl-).In one embodiment, the additive level in electrolyte L is no more than 1ppm.Foregoing addition
Agent can be organic or inorganic additive, such as：Ox glue, protein and high molecular polysaccharide (HEC), sodium polydithio-dipropyl sulfonate
(SPS), additive known to tertiary amine compounds, thio propane sulfonic acid sodium (MPS) etc..In another embodiment, in electrolyte L
Any additive is not included completely.
In addition, specifically, in the utility model embodiment, copper ion (Cu is included in electrolyte L2+), sulphur
Acid and chlorion (Cl-), wherein copper ion concentration is 50 to 90g/L, and sulfuric acid concentration is 50 to 120g/L, and chlorine ion concentration
No more than 1.5ppm.Chlorine ion concentration in electrolyte L is no more than 1.5ppm, with electrolyte L have low concentration additive or
Person is under conditions of not including additive completely, obtains the electrolytic copper foil that roughness is no more than 2 μm.
Positive plate 11 is arranged in electrolytic cell 10, and is electrically connected to the cathode output end of a power supply device 2.Anode
Plate 11 is to be coated in titanium plate by iridium or its oxide and formed.Cathode wheel 12 is then partly arranged in electrolytic cell 10, and position
Above positive plate 11.In addition, cathode wheel 12 is electrically connected to the cathode output end of power supply device 2.It is new in this practicality
In type embodiment, cathode wheel 12 is titanium roller.
When subjected to electrolysis, electrolyte L, which is flowed into electrolytic cell 10, floods positive plate 11, and is immersed in part cathode wheel 12
In electrolyte L.Power supply device 2 exports direct current to positive plate 11 and cathode wheel 12, separates out the copper ion in electrolyte L
And electrolytic copper foil 3 is formed on the curved surface of cathode wheel 12.Then, the electrolytic copper foil 3 of precipitation can be by the surface of cathode wheel 12
Peel off, and continuously wound by furling unit 13, to carry out successive process.
Fig. 2A is refer to, shows the partial enlarged drawing of the electrolytic copper foil of the utility model embodiment.In a manner of above-mentioned processing procedure
Prepared electrolytic copper foil 3 includes the foil layer 30 one in the form of sheets, and foil layer 30 simultaneously has one first side 3a, and with the first side 3a
The second relative side 3b, wherein the first side 3a refers in electrolytic process, the one of electrolytic copper foil 3 and the contact of the surface of cathode wheel 12
Side.Usual foil layer 30 is to depend on the roughness on the surface of cathode wheel 12 in the first side 3a roughness, therefore the first side 3a
Roughness is more fixed.Compared to the first side 3a, foil layer 30 the second side 3b roughness then with electrolyte L composition and
Electrolyte L flow is relevant.Foil layer 30 is typically smaller than the roughness in the second side 3b in the first side 3a roughness.In other words
Say, the first side 3a of foil layer 30 surface is relatively smooth, and the second side 3b surface is more coarse.
Accordingly, in the utility model embodiment, electrolytic copper foil 3 also includes a coarse structure 300 for being located at the second side 3b.
Coarse structure 300 is for example formed at multiple graininess projections on the surface of foil layer 30, but coarse structure 300 does not make foil layer
30 the second side 3b 10 mean roughness more than 2 μm.In other words, ten average roughness of the foil layer 30 in the second side 3b
Degree is no more than 2 μm, such as between 0.9 μm to 1.9 μm.
As it was previously stated, in electrolyte L used in the utility model embodiment, additive concentration is no more than 1ppm,
And chlorine ion concentration is also no more than 1.5ppm.By actual measurement, second of the foil layer 30 prepared by aforementioned electrolyte L is utilized
Side 3b 10 mean roughness (Rz) are no more than 2.0 μm.
In addition, pass through focused ion beam and electron beam microscopic system (Focused ion beam and electron
Beam system FIB/SEM) electrolytic copper foil 3 of the utility model embodiment is analyzed, the initial grain of foil layer 30
Size is between 0.1 μm to 10 μm.It should be noted that the Initial Grain Size of foil layer 30 can be first with electrolytic copper foil 3
Beginning elongation is relevant.Specifically, the initial elongation rate of electrolytic copper foil 3 can increase as the Initial Grain Size of foil layer 30 increases
Add.Therefore, the Initial Grain Size of foil layer 30 can according to different applicable cases, be adjusted.
Fig. 2 B are refer to, show the partial enlarged drawing of the electrolytic copper foil of another embodiment of the utility model.In another implementation
In example, electrolytic copper foil 3 can be surface-treated and the successive process such as cutting forming, and form the electrolytic copper foil of the present embodiment
3’.Surface treatment can adjust adhesion (adhesion), heat resistance or the corrosion resistance of electrolytic copper foil 3, and it is e.g. heat-resisting
And one of anti-chemical treatment, chromate (chromate) processing, silane (silane) coupling processing and combinations thereof, can be by this area
Technical staff selects according to the actual requirements.
Accordingly, in the present embodiment, electrolytic copper foil 3 ' includes all one's life layers of foil 30 and the copper wart layer on foil layer 30
31.The Initial Grain Size of foil layer 30 can be identical with previous embodiment.In the present embodiment, copper wart layer 31 is to be covered in foil layer
30 the second side 3b, and the thickness of copper wart layer 31 can be between 0.1 to 3 μm.In addition, the initial of the electrolytic copper foil 3 ' of the present embodiment stretches
Long rate equally can be relevant with the Initial Grain Size of foil layer 30.
The thickness T ' of electrolytic copper foil 3 ' in thickness T and Fig. 2 B of electrolytic copper foil 3 in above-mentioned Fig. 2A can be between 6 μm
To between 400 μm, depending on practical application request.As thickness T, T of electrolytic copper foil 3,3 ' ' it is relatively thin when, usually require that electrolysis
The hardness of copper foil 3 ' is harder.Therefore, in one embodiment, as thickness T, T of electrolytic copper foil 3,3 ' ' it is the foil between 6 to 70 μm
The Initial Grain Size of layer 30 can be between 0.1 μm to 5 μm.In that case, the initial elongation rate of electrolytic copper foil 3,3 ' is between 1
To between 20.
On the contrary, when the thickness T of electrolytic copper foil 3,3 ' is thicker, usually require that the hardness of electrolytic copper foil 3,3 ' is softer, and
With larger elongation.In another embodiment, as thickness T, T of electrolytic copper foil 3,3 ' ' it is the life between 70 μm to 210 μm
The Initial Grain Size of layers of foil 30 can be between 5 μm to 10 μm.In that case, the initial elongation rate of electrolytic copper foil 3,3 ' is to be situated between
Between 5 to 30.
In addition, the electrolytic copper foil 3 ' of the utility model embodiment is before being heat-treated, be heat-treated after life
The crystallite dimension of layers of foil 30 can be varied from, so as to cause electrolytic copper foil 3,3 ' before the heat treatment can with engineering properties afterwards
Difference can be understood.
For example, it is assumed that the Initial Grain Size of electrolytic copper foil is 0.1 μm to 0.2 μm, at a temperature of a crystal grain-growth
After heating, the crystallite dimension of foil layer 30 is grown up again, that is, can over time be increased and be increased, until reaching a stable chi
It is very little, about 8 μm to 10 μm.
It should be noted that in existing electrolytic copper foil processing procedure, the additive containing rather high concentration in electrolyte.But
It is the element in additive, such as：When carbon, nitrogen, sulphur are largely remained in electrolytic copper foil, the crystal boundary (grain of crystal grain can be limited
Boundary), so as to limiting to the crystal grain-growth of electrolytic copper foil.Therefore, existing electrolytic copper foil needs to be heated at least 180
DEG C, even at higher temperature, the crystallite dimension of existing electrolytic copper foil just can gradually increase.
In comparison, when preparing electrolytic copper foil 3,3 ' of the utility model embodiment, comprise only in electrolyte and add on a small quantity
Add agent, even wholly without additive, can be greatly decreased and remain between crystal grain, limit the element of crystal boundary.Therefore, this practicality is new
The crystal grain of the foil layer 30 of the electrolytic copper foil 3,3 ' of type embodiment can continue to grow up in relative low temperature.Foregoing crystal grain-growth temperature
As long as 125 DEG C, you can make crystal grain-growth (grain growth) in electrolytic copper foil 3,3 ', so that the elongation of electrolytic copper foil 3,3 '
Rate increase.
Accordingly, before being heat-treated, electrolytic copper foil 3,3 ' has an initial elongation rate.After Overheating Treatment,
Electrolytic copper foil 3,3 ' has elongation after a heat treatment.Generally after Overheating Treatment, the crystallite dimension meeting of electrolytic copper foil 3,3 '
More than Initial Grain Size, therefore elongation can also be more than initial elongation rate after heat treatment.
If it is noted that the Initial Grain Size of the foil layer 30 of electrolytic copper foil 3,3 ' stable dimensions of convergence one,
Such as：Between 8 μm to 10 μm, even if then after Overheating Treatment, the limited extent of the crystal grain-growth of electrolytic copper foil, and after heat treatment
Therefore elongation can be also limited compared to the increasing degree of initial elongation rate.
Refer to Fig. 3, be the utility model embodiment electrolytic copper foil before the heat treatment with elongation difference afterwards
With the trend graph of a relation of Initial Grain Size.As shown in figure 3, transverse axis is Initial Grain Size, and the longitudinal axis is elongation difference, its
Middle elongation difference is the difference after heat treatment between elongation and initial elongation rate.The electrolytic copper foil of the utility model embodiment
It can be reduced before the heat treatment with elongation difference afterwards as Initial Grain Size increases.
It refer to table 1 below.Table 1 shows the electrolytic copper foil of the utility model difference embodiment and the electrolysis of different reference examples
Copper foil process conditions, surface roughness and engineering properties.
As shown in table 1, in the process conditions of the utility model embodiment 1~3, any add all is not added in the electrolytic solution
Add agent, and chlorine ion concentration is 1ppm.
25 DEG C to 125 DEG C of terms used herein " before heat treatment " expression, that is, less than the initial grain for making electrolytic copper foil
Growth temperature again.Foregoing " growth temperature again " refers to be heat-treated 1 hour, and the initial grain in electrolytic copper foil starts into
Long minimum temperature.Elongation represents electrolytic copper foil being about to the distance of elongation divided by the initial length institute of electrolytic copper foil before rupturing
Obtained value.
Table 1
The electrolytic copper foil of embodiment 1~3 is both less than 2 μm in 10 mean roughness of mat surface.In addition, embodiment 1~3
Electrolytic copper foil initial elongation rate all be more than 3%, for example, being between 4% to 14%.And elongation is reachable after being heat-treated
To more than 25%, for example, being between 25% to 34%.That is, the elongation after heat treatment can be the 1.5 of initial elongation rate
To 6.5 times.Foregoing heat treatment temperature is processed with 180 DEG C, 1 hour.
It is noted that when preparing the electrolytic copper foil of embodiment 1, used electrolyte temperature is 65 DEG C, higher than preparation
40 DEG C of electrolyte temperature during the electrolytic copper foil of embodiment 3.Therefore, the Initial Grain Size meeting in the electrolytic copper foil of embodiment 1
Initial elongation rate more than the Initial Grain Size in the electrolytic copper foil of embodiment 3, and the electrolytic copper foil of embodiment 1 can be more than in fact
Apply the initial elongation rate of the electrolytic copper foil of example 3.
But the difference (27.9) before the heat treatment of the electrolytic copper foil of embodiment 3 with elongation afterwards, hence it is evident that more than reality
The electrolytic copper foil of example 1 difference (11.6) with elongation afterwards before the heat treatment is applied, is the electrolytic copper foil because embodiment 3
The reason for amplitude of crystallite dimension growth is larger.
Table 1 is continued referring to, when preparing the electrolytic copper foil of embodiment 4 and embodiment 5, adds 1ppm's in electrolyte
Additive, and the about 1ppm of the chlorine ion concentration in electrolyte.In addition, when preparing the electrolytic copper foil of reference examples 1 and reference examples 2,
1ppm additive, and the about 5ppm of the chlorine ion concentration in electrolyte are added in electrolyte.
It can also be seen that, the electrolytic copper foil of embodiment 4 and embodiment 5 is averaged in 10 points of the roughness of mat surface by table 1
Roughness is also both less than 2 μm.In comparison, reference examples 1 and 10 mean roughness of the electrolytic copper foil of reference examples 2 then significantly increase
Add to 5.2 μm and 3.4 μm.Fig. 4 and Fig. 5 is refer to, shows the electrolytic copper foil of embodiment 5 and the cathode copper of reference examples 1 respectively
Photo of the paper tinsel in sweep electron microscope (SEM).From SEM images, it is also seen that the surface of the electrolytic copper foil of embodiment 5
Roughness is actually lower than the surface roughness of reference examples 1.
Found by actual test, as long as the concentration of chlorion is no more than 1.5ppm, even if the additive in electrolyte is dense
Degree lowers, and not even containing additive, 10 mean roughness of electrolytic copper foil is less than less than 2 μm.
In addition, pass through X-ray (X-ray) diffraction analysis, in the X-ray difraction spectrum of the second side of electrolytic copper foil, this practicality
The electrolytic copper foil of new embodiment all has (111), (200) and (220) crystallization whether before heat treatment or after heat treatment
Face.
The electrolytic copper foil of the utility model embodiment can be applied to the electric component of different field.Fig. 6 is refer to, display is originally
The diagrammatic cross-section of the electric component of utility model embodiment.Such as battery component, coil type of electric component 4 engages automatically
(TAB) adhesive tape, rigid printed circuit board (PCB), flexible printed wiring board (FPC) and its homologue, but the utility model is not
It is limited to this.In one embodiment, electrolytic copper foil can be as the anode current collector of battery component, and wherein battery component can be one
Primary cell (primary battery) or secondary cell, such as：Lithium ion battery, lithium macromolecule battery, lithium air (air) electricity
Pond etc. and available for any battery in this area.
In another embodiment, electric component 4 includes base material 40 and the line layer 41 being formed on base material 40, wherein base
Material 40 is, for example, insulating substrate, and it is directly above-mentioned electrolytic copper foil 3,3 ' that line layer 41, which can be, or above-mentioned cathode copper
Paper tinsel 3,3 ' is by etching formed circuit.Due to making electric component, e.g. in the processing procedure of flexible printed wiring board, meeting
Need to flexible printed wiring board heat, and the utility model the elongation of electrolytic copper foil after heat treatment is provided can be than initial
Elongation is bigger.It should be noted that flexible printed wiring board needs repeatedly to be bent or bent in use, therefore soft print
Line layer on printed circuit board is possible to be broken after multiple bending.
Because the electrolytic copper foil of the utility model embodiment has elongation after larger heat treatment, therefore this practicality of application is new
The electrolytic copper foil of type embodiment makes the line layer of flexible printed wiring board, can reduce flexible printed wiring board and is repeatedly bending
The probability of circuit fault rupture afterwards, and be advantageous to be lifted life-span and the quality of flexible printed wiring board.
In summary, the beneficial effects of the utility model are, in the electrolysis that making the utility model embodiment is provided
During copper foil, the additive amount in copper electrolyte can be reduced to below 1ppm, or even can be completely without using any organic or nothing
The additive of machine, the difficulty of processing procedure management can be not only reduced, is also beneficial to environmental protection.But in the processing procedure bar for reducing or omitting additive
10 mean roughness (Rz) of prepared electrolytic copper foil can still be less than 2.0 μm under part.
In addition, being compared with the electrolytic copper foil of prior art, the crystal grain of the electrolytic copper foil of the utility model embodiment is passing through
After 180 DEG C of heat treatments, you can grow up (regrowth) again, so as to improve elongation after electrolytic copper foil heating.Therefore, in this practicality
, can be according to the difference of application field, so that electrolytic copper foil has different crystallite dimensions, to adjust electrolysis in new embodiment
The engineering properties of copper foil.
It the foregoing is only preferable possible embodiments of the present utility model, non-therefore limitation claim of the present utility model
Protection domain, therefore the equivalence techniques change done such as with the utility model specification and accompanying drawing content is both contained in this
In the scope of the claims of utility model.
Claims (13)
1. a kind of electrolytic copper foil, it is characterised in that the electrolytic copper foil has a foil layer in the form of sheets and one is located at foil layer
Wherein side coarse structure, wherein, the coarse structure is multiple multiple graininess for being formed at the foil layer surface
Projection, the Initial Grain Size of the foil layer between 0.1 to 10 μm, and the electrolytic copper foil through before Overheating Treatment with afterwards
Elongation difference be to be reduced with the increase of the Initial Grain Size of the foil layer, wherein, the foil layer
The initial grain has growth again in the case where the heat treatment is equal to or less than 180 DEG C.
2. electrolytic copper foil as claimed in claim 1, it is characterised in that the foil layer has one first side and with described the
One second relative side of side, and the coarse structure is located on second side, and the foil layer is in the coarse of the first side
Degree is more than roughness of the foil layer in the first side.
3. electrolytic copper foil as claimed in claim 1, it is characterised in that the heating-up temperature of the heat treatment be between 125 DEG C extremely
Between 180 DEG C.
4. electrolytic copper foil as claimed in claim 1, it is characterised in that the thickness of the electrolytic copper foil between 6 to 400 μm it
Between.
5. electrolytic copper foil as claimed in claim 1, it is characterised in that the thickness of the electrolytic copper foil between 6 to 70 μm,
And the initial grain size of the foil layer is between 0.1 to 5 μm.
6. electrolytic copper foil as claimed in claim 5, it is characterised in that the electrolytic copper foil has one before passing through the heat treatment
Initial elongation rate, the electrolytic copper foil has elongation after a heat treatment after the heat treatment, and is stretched after the heat treatment
Long rate is more than the initial elongation rate.
7. electrolytic copper foil as claimed in claim 1, it is characterised in that the thickness of the electrolytic copper foil between 70 to 210 μm it
Between, and the initial grain size of the foil layer is between 5 to 10 μm.
8. electrolytic copper foil as claimed in claim 7, it is characterised in that the initial elongation rate of the electrolytic copper foil is between 5 to 30
Between.
9. electrolytic copper foil as claimed in claim 1, it is characterised in that the electrolytic copper foil still further comprises：One bronze medal wart layer,
On the foil layer, the thickness of the copper wart layer is ranged approximately between 0.1 to 3 μm.
10. a kind of electric component, it is characterised in that the electric component includes a base material and at least one on the base material
Line layer, wherein, the line layer is one of them the electrolytic copper foil of claim 1 to 9.
11. electric component as claimed in claim 10, it is characterised in that the electric component is rigid printed circuit board, soft
Property printed circuit board (PCB) or battery component.
12. a kind of electric component, it is characterised in that the electric component includes a base material and at least one on the base material
Line layer, wherein, the line layer by claim 1 to 9 one of them the electrolytic copper foil by etching formed.
13. electric component as claimed in claim 12, it is characterised in that the electric component is rigid printed circuit board, soft
Property printed circuit board (PCB) or battery component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106202792U TWM543879U (en) | 2017-02-24 | 2017-02-24 | Electrolysis copper foil and electric component using the same |
| TW106202792 | 2017-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206783786U true CN206783786U (en) | 2017-12-22 |
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ID=59688901
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720265805.8U Active CN206783786U (en) | 2017-02-24 | 2017-03-17 | Electrolytic copper foil and electric assembly using same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN206783786U (en) |
| TW (1) | TWM543879U (en) |
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2017
- 2017-02-24 TW TW106202792U patent/TWM543879U/en unknown
- 2017-03-17 CN CN201720265805.8U patent/CN206783786U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM543879U (en) | 2017-06-21 |
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