CN206745174U - Cooking utensil - Google Patents
Cooking utensil Download PDFInfo
- Publication number
- CN206745174U CN206745174U CN201621396854.7U CN201621396854U CN206745174U CN 206745174 U CN206745174 U CN 206745174U CN 201621396854 U CN201621396854 U CN 201621396854U CN 206745174 U CN206745174 U CN 206745174U
- Authority
- CN
- China
- Prior art keywords
- cooling
- pot
- cooking apparatus
- pot cover
- cooling tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010411 cooking Methods 0.000 title claims abstract description 51
- 238000001816 cooling Methods 0.000 claims abstract description 97
- 239000002826 coolant Substances 0.000 claims abstract description 41
- 235000013305 food Nutrition 0.000 claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims abstract description 26
- 238000005057 refrigeration Methods 0.000 claims abstract description 22
- 230000008520 organization Effects 0.000 claims description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 235000012054 meals Nutrition 0.000 claims 1
- 235000013547 stew Nutrition 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 6
- 238000010276 construction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 230000006837 decompression Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cookers (AREA)
Abstract
The utility model provides a cooking utensil, include: the pot body comprises an outer shell and an inner pot arranged in the outer shell, and the inner pot is used for containing food to be cooked; the pot cover is covered on the pot body; cooling device, cooling device including the storage structure that has coolant, with the cooling tube of storage structure intercommunication and carry out refrigerated semiconductor refrigeration chip to coolant, the storage structure sets up between shell and interior pot, and the cooling tube setting is on the pot cover, and when the pot cover needs the cooling, coolant in the storage structure gets into and cools off the pot cover in the cooling tube. The technical scheme of the utility model the longer problem consuming time of cooking utensil cooling uncap among the prior art has been solved effectively.
Description
Technical field
Cooking apparatus is the utility model is related to, in particular to a kind of improvement of the type of cooling of cooking apparatus.
Background technology
Electric pressure cooking saucepan is everybody very familiar kitchen appliance, but has high temperature and high pressure steam in pot after the completion of cooking, and is used
Family can not open pot cover at once, particularly when boiled in pot oiliness food or congee group food when.If electric pressure cooking saucepan using dissipating naturally
Heat cooling, its decrease temperature and pressure time are longer.In order that reduction of blood pressure in high-speed in pot, Rapid opening takes food after the completion of realizing culinary art,
It is generally necessary to user, which opens steam discharge tube passage, carries out steam discharge decompression.Pressure limiting valve side can be pushed aside using manual by opening steam discharge tube passage
Formula, it can also be depressured by magnetic valve mode automatic exhausting.But when interior pot cooking fluid food, using both the above
During steam discharge decompression mode carries out steam discharge, slop is easily taken out of simultaneously by high steam.High-temperature steam easily scalds user,
Slop is also easy to produce dirty, is influenceed by dirty residue is discharged, cold steam valve function can fail, the long-term dirty or even hair that can go bad
It is smelly.
In order to overcome the disadvantages mentioned above of direct steam discharge decompression, in the prior art using the decrease temperature and pressure side of water cooling pot cover
Method.By installing aqueduct on pot cover, the cooling water in aqueduct is set to carry out cold and hot exchange with high-temperature metal pot cover.In order to carry
The heat exchanger effectiveness of high aqueduct and pot cover, is generally welded on pot cover surface by aqueduct.Such a decrease temperature and pressure method first cools down
Metal pot cover in itself, makes pot cover produce the temperature difference with high-temperature steam in pot, further passes the heat of high-temperature steam by pot cover
Pass cooling water.The above method needs food in cooling down high-temperature metal pot cover simultaneously and pot, and not only required cooling water is more, can make
It is big into cooking apparatus volume.Meanwhile cool time is relatively long, more than more than 30 minutes, the effect of Rapid opening is not reached.
Utility model content
Main purpose of the present utility model is to provide a kind of cooking apparatus, cold to solve cooking apparatus of the prior art
But uncap the problem of time-consuming longer.
To achieve these goals, the utility model provides a kind of cooking apparatus, including：Pot, including shell and set
Put the interior pot in shell, interior pot is holding cooked food；Pot cover, lid are located in pot；Cooling device, cooling device bag
Include the storage organization with cooling medium, the cooling tube connected with storage organization and the semiconductor cooled down to cooling medium
Refrigerating chip, storage organization are arranged between shell and interior pot, and cooling tube is arranged on pot cover, when pot cover needs cooling, are deposited
Cooling medium in storage structure enters in cooling tube and pot cover is cooled down.
Using the technical solution of the utility model, before cooking apparatus terminates culinary art, semiconductor refrigeration chip starts to depositing
Cooling medium in storage structure is freezed, and after the completion of the food cooking in pot, semiconductor refrigeration chip will storage
Cooling medium in structure is cooled to relatively low temperature from room temperature.It is cold when user needs to cool down the food in pot
But the cooling medium after cools down after entering cooling tube to pot cover, and pot cover carries out heat exchange with the food in pot so that
The temperature of food after the completion of being cooked in pot reduces.In above process, semiconductor refrigeration chip is carried out cold to cooling medium
But so that the cooling medium into cooling tube is in relatively low temperature all the time, so as to accelerate cooling device to having been cooked in pot
Into the cooling of rear food, the purpose of Rapid opening is realized.
Further, semiconductor refrigeration chip is sticked on the outer wall of storage organization.
Further, cooling device also includes the fan for semiconductor refrigeration chip radiating.
Further, cooling device also includes pump, and pump is arranged between storage organization and cooling tube, so that cooling medium exists
Circulated between storage organization and cooling tube.
Further, connecting tube is provided between storage organization and cooling tube, pump is arranged in connecting tube.
Further, cooling tube is arranged on pot cover towards on the inner surface of pot.
Further, cooling medium is water or freon.
Further, cooling tube, which includes inlet pipe, outlet pipe and the intervalve being arranged between inlet pipe and outlet pipe, intervalve, includes
Multiple sides, each side are in arcs of recesses.
Further, cooking apparatus is electric pressure cooking saucepan or electric cooker.
Brief description of the drawings
The Figure of description for forming the part of the application is used for providing further understanding to of the present utility model, this practicality
New schematic description and description is used to explain the utility model, does not form to improper restriction of the present utility model.
In the accompanying drawings：
Fig. 1 shows the structural representation of the embodiment according to cooking apparatus of the present utility model；And
Fig. 2 shows the structural representation of the cooling tube in Fig. 1.
Wherein, above-mentioned accompanying drawing marks including the following drawings：
10th, pot；11st, shell；20th, pot cover；30th, cooling device；31st, storage organization；32nd, cooling tube；33rd, semiconductor system
Cold core piece；34th, fan；35th, pump；36th, connecting tube.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.The description only actually at least one exemplary embodiment is illustrative to be never used as to this practicality below
New and its application or any restrictions used.Based on the embodiment in the utility model, those of ordinary skill in the art are not having
There is the every other embodiment made and obtained under the premise of creative work, belong to the scope of the utility model protection.
It should be noted that term used herein above is merely to describe embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in this manual using term "comprising" and/or " bag
Include " when, it indicates existing characteristics, step, operation, device, component and/or combinations thereof.
Unless specifically stated otherwise, the part and positioned opposite, the digital table of step otherwise illustrated in these embodiments
Up to the unlimited the scope of the utility model processed of formula and numerical value.Simultaneously, it should be appreciated that each shown in accompanying drawing for the ease of description
The size of individual part is not to be drawn according to the proportionate relationship of reality.For skill known to person of ordinary skill in the relevant
Art, method and apparatus may be not discussed in detail, but in the appropriate case, technology, method and apparatus, which should be considered as authorizing, to be said
A part for bright book.In shown here and discussion all examples, any occurrence should be construed as merely exemplary,
Not as limitation.Therefore, the other examples of exemplary embodiment can have different values.It should be noted that：Similar mark
Number and letter similar terms is represented in following accompanying drawing, therefore, once be defined in a certain Xiang Yi accompanying drawing, then subsequent
It need not be further discussed in accompanying drawing.
Fig. 1 shows the structural representation of the embodiment according to cooking apparatus of the present utility model, and Fig. 2 is shown in Fig. 1
Cooling tube structural representation.As depicted in figs. 1 and 2, the cooking apparatus of the present embodiment includes pot 10, pot cover 20 and cooling
Device 30.Wherein, pot 10 includes shell 11 and the interior pot that is arranged in shell 11, and interior pot is holding cooked food.Pot
The lid of lid 20 is located in pot 10.Cooling device 30 includes the storage organization 31 with cooling medium, connected with storage organization 31
Cooling tube 32 and the semiconductor refrigeration chip 33 cooled down to cooling medium, storage organization 31 are arranged on shell 11 and interior pot
Between, cooling tube 32 is arranged on pot cover 20, and when pot cover 20 needs cooling, the cooling medium in storage organization 31 enters to cold
But pot cover 20 is cooled down in pipe 32.
Using the technical solution of the utility model, before cooking apparatus terminates culinary art, semiconductor refrigeration chip 33 starts pair
Cooling medium in storage organization 31 is freezed, and after the completion of the food cooking in pot 10, semiconductor refrigeration chip 33 is
Through the cooling medium in storage organization 31 is cooled into relatively low temperature from room temperature.When user needs to enter the food in pot 10
During row cooling, the cooling medium after cooling cools down after entering cooling tube 32 to pot cover 20, pot cover 20 and the food in pot 10
Thing carries out heat exchange so that the temperature of the food after the completion of being cooked in pot 10 reduces.In above process, semiconductor refrigerating
Chip 33 cools down to cooling medium so that the cooling medium into cooling tube 32 is in relatively low temperature all the time, so as to add
Cooling of the fast cooling device 30 to food after the completion of being cooked in pot 10, realize the purpose of Rapid opening.
Semiconductor refrigeration chip have can continuously work, without pollution sources, work when do not shake noise, service life grow
And be installed the features such as easy.In addition, the cooling time of semiconductor semiconductor refrigeration chip is very fast, it is possible to achieve quick cooling, leads to
In terms of being commonly applied to military, medical treatment, laboratory installation and some special purpose devices.
As shown in figure 1, in the cooking apparatus of the present embodiment, semiconductor refrigeration chip 33 is sticked in the outer of storage organization 31
On wall.The above-mentioned setting of semiconductor refrigeration chip 33 can realize in storage organization 31 cooling medium it is sufficiently cool, so as to
The cooling effectiveness of cooling device is improved, shortens cooking apparatus and completes uncapping the time after cooking.
As shown in figure 1, in the cooking apparatus of the present embodiment, cooling device 30 also includes dissipating for semiconductor refrigeration chip 33
The fan 34 of heat.Semiconductor refrigeration chip 33 is heat transfer instrument, when it carries out cooling work, because heat can turn from one end
The other end is moved on to, hot and cold side is formed so as to produce the temperature difference, cooling behaviour is carried out to the cooling medium in storage organization 31 using cold end
Make.In above process, when hot and cold side reaches certain temperature difference, and the calorie value of two kinds of heat transfers is equal, a balance can be reached
Point, now the temperature of hot and cold side will not continue to change, in order to reach lower chilling temperature, can take the initiative radiating
Mode reduces the temperature in hot junction.Fan 34 is set to be mainly used to the hot-side heat dissipation to semiconductor refrigeration chip 33, then cold end (is sticked
One end on the outer wall of storage organization 31) temperature can also decline accordingly, reach lower chilling temperature, it is cold so as to improve
But the refrigerating efficiency of device 30.
It should be noted that for the structure not limited to this of refrigerating chip radiating, fin can also be used.
As shown in figure 1, in the cooking apparatus of the present embodiment, cooling device 30 also includes pump 35, and pump 35 is arranged on storage
Between structure 31 and cooling tube 32, so that cooling medium circulates between storage organization 31 and cooling tube 32.When user needs to make
When being cooled down with cooling device 30 to the food after the completion of culinary art, the cooling medium in storage organization 31 is pumped by pump 35
Into cooling tube 32, the cooling medium in cooling tube 32 cools down to pot cover 20, so as to realize to the food after the completion of culinary art
The purpose cooled down, shorten cooking apparatus and uncap the time.
As shown in figure 1, in the cooking apparatus of the present embodiment, connecting tube is provided between storage organization 31 and cooling tube 32
36, pump 35 is arranged in connecting tube 36.Specifically, pump 35 is connected by connecting tube 36 with one end of cooling tube 32.Above-mentioned knot
The structure of structure is simple, easily assembling.
As shown in figure 1, in the cooking apparatus of the present embodiment, cooling tube 32 is arranged on interior table of the pot cover 20 towards pot 10
On face.When user needs to use cooling device 30 to cool down the food after the completion of culinary art, the cooling in cooling tube 32 is situated between
Confrontation pot cover 20 is cooled down so that pot cover 20 is cooled towards the inner surface of pot 10.In above process, pot cover 20 and pot
The exchange of heat is realized in body 10, so as to which the food that culinary art is completed in pot 10 be cooled down, realizes Rapid opening.
In the cooking apparatus of the present embodiment, cooling medium is water or freon.Cooling device 30 can be to storage organization
Cooling medium in 31 carries out cooling down operation, so cooling medium can select water, or freon.Certainly, it is used as this
The technical staff in field instructs, as long as can realize that heat exchange, the medium of transmission heat can be used as cooling and be situated between by convection type
Matter.
As depicted in figs. 1 and 2, cooling tube 32 includes inlet pipe, outlet pipe and the intervalve being arranged between inlet pipe and outlet pipe, in
Between pipe include multiple sides, each side is in arcs of recesses.During cooling device 30 cools down to pot cover 20, cooling medium passes through
Inlet pipe cools down from storage organization 31 into cooling tube 32 to pot cover 20, is tied after completing heat exchange by outlet pipe into storage
Structure 31, cooling medium cool down from inlet pipe into cooling tube 32 to pot cover 20 again after being cooled down by semiconductor refrigeration chip 33,
So cooling of the cooling tube 32 to pot cover is realized in circulation, so as to accelerate the cooling of the food after the completion of being cooked in pot 10.Specifically
Ground, pot cover 20 is cooled down by intervalve.The said structure of intervalve can increase cooling of the cooling medium to pot cover 20
Area, so as to improve the cooling effectiveness of cooling device 30, shorten uncapping the time for cooking apparatus, improve Consumer's Experience.
In the cooking apparatus of the present embodiment, cooling tube 32 is welded to connect with pot cover 20.Be welded to connect be connected firmly,
The advantages that stable, reliable, while the process of processing and assembling can be simplified so that the connection of cooling tube 32 and pot cover 20 is more held
Easily.
In the present embodiment, cooking apparatus is electric pressure cooking saucepan.Certainly, in other embodiments, cooking apparatus can also be
The structures such as electric cooker.
As can be seen from the above description, the utility model the above embodiments realize following technique effect：
Before cooking apparatus terminates culinary art, semiconductor refrigeration chip starts to the cooling medium system in storage organization
Cold, after the completion of the food cooking in pot, semiconductor refrigeration chip is cold from room temperature by the cooling medium in storage organization
But relatively low temperature is arrived.When user needs to cool down the food in pot, the cooling medium after cooling enters cooling tube
Pot cover is cooled down afterwards, the food in pot cover and pot carries out heat exchange so that food after the completion of being cooked in pot
Temperature reduces.In above process, semiconductor refrigeration chip cools down to cooling medium so that the cooling into cooling tube is situated between
Matter is in relatively low temperature all the time, and so as to accelerate cooling of the cooling device to food after the completion of being cooked in pot, realization is quickly opened
The purpose of lid.
In description of the present utility model, it is to be understood that the noun of locality such as " forward and backward, upper and lower, left and right ", " horizontal,
Vertically, vertically, it is horizontal " and " pushing up, bottom " etc. indicated by orientation or position relationship be normally based on orientation or position shown in the drawings
Relation is put, description the utility model is for only for ease of and simplifies description, in the case where not making opposite explanation, these nouns of locality
Do not indicate that and imply that the device of meaning or element there must be specific orientation or with specific azimuth configuration and operation, because
This is it is not intended that limitation to scope of protection of the utility model；The noun of locality " inside and outside " refers to the wheel relative to each part in itself
Wide is inside and outside.
For the ease of description, space relative terms can be used herein, as " ... on ", " ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be appreciated that space relative terms are intended to comprising the orientation except device described in figure
Outside different azimuth in use or operation.For example, if the device in accompanying drawing is squeezed, it is described as " in other devices
It will be positioned as " under other devices or construction after the device of part or construction top " or " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " can include " ... top " and
" in ... lower section " two kinds of orientation.The device can also other different modes positioning (being rotated by 90 ° or in other orientation), and
And respective explanations are made to the relative description in space used herein above.
Furthermore, it is necessary to explanation, limits parts, it is only for be easy to using the word such as " first ", " second "
Corresponding parts to be distinguished, do not have Stated otherwise such as, above-mentioned word does not have particular meaning, therefore it is not intended that to this
The limitation of utility model protection scope.
Preferred embodiment of the present utility model is these are only, is not limited to the utility model, for this area
Technical staff for, the utility model can have various modifications and variations.It is all within the spirit and principles of the utility model,
Any modification, equivalent substitution and improvements made etc., should be included within the scope of protection of the utility model.
Claims (10)
- A kind of 1. cooking apparatus, it is characterised in that including：Pot (10), including shell (11) and the interior pot that is arranged in the shell (11), the interior pot are cooked to hold Food；Pot cover (20), lid are located in the pot (10)；Cooling device (30), the cooling device (30) include the storage organization (31) with cooling medium, tied with the storage The cooling tube (32) of structure (31) connection and the semiconductor refrigeration chip (33) cooled down to the cooling medium, the storage Structure (31) is arranged between the shell (11) and the interior pot, and the cooling tube (32) is arranged on the pot cover (20), When the pot cover (20) needs cooling, it is right in the cooling tube (32) that the cooling medium in the storage organization (31) enters to The pot cover (20) is cooled down.
- 2. cooking apparatus according to claim 1, it is characterised in that the semiconductor refrigeration chip (33) is sticked described On the outer wall of storage organization (31).
- 3. cooking apparatus according to claim 1, it is characterised in that the cooling device (30) also includes partly leading to be described The fan (34) of body refrigerating chip (33) radiating.
- 4. cooking apparatus according to claim 1, it is characterised in that the cooling device (30) also includes pump (35), institute State pump (35) to be arranged between the storage organization (31) and the cooling tube (32), so that the cooling medium is in the storage Circulated between structure (31) and the cooling tube (32).
- 5. cooking apparatus according to claim 4, it is characterised in that the storage organization (31) and the cooling tube (32) Between be provided with connecting tube (36), the pump (35) is arranged in the connecting tube (36).
- 6. cooking apparatus according to claim 1, it is characterised in that the cooling tube (32) is arranged on the pot cover (20) Towards on the inner surface of the pot (10).
- 7. cooking apparatus according to claim 1, it is characterised in that the cooling medium is water or freon.
- 8. cooking apparatus according to claim 1, it is characterised in that the cooling tube (32) includes inlet pipe, outlet pipe and set The intervalve between the inlet pipe and the outlet pipe is put, the intervalve includes multiple sides, and each side is in arcs of recesses.
- 9. cooking apparatus according to claim 1, it is characterised in that the cooling tube (32) is welded with the pot cover (20) Connection.
- 10. cooking apparatus according to claim 1, it is characterised in that the cooking apparatus is electric pressure cooking saucepan or electric meal Stew.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621396854.7U CN206745174U (en) | 2016-12-19 | 2016-12-19 | Cooking utensil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621396854.7U CN206745174U (en) | 2016-12-19 | 2016-12-19 | Cooking utensil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206745174U true CN206745174U (en) | 2017-12-15 |
Family
ID=60607831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621396854.7U Expired - Fee Related CN206745174U (en) | 2016-12-19 | 2016-12-19 | Cooking utensil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206745174U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114305067A (en) * | 2020-09-30 | 2022-04-12 | 广东美的生活电器制造有限公司 | Cooking apparatus, control method of cooking apparatus, and storage medium |
-
2016
- 2016-12-19 CN CN201621396854.7U patent/CN206745174U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114305067A (en) * | 2020-09-30 | 2022-04-12 | 广东美的生活电器制造有限公司 | Cooking apparatus, control method of cooking apparatus, and storage medium |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171215 |