CN206743643U - Flexible PCB, flexible circuit board assembly and terminal - Google Patents
Flexible PCB, flexible circuit board assembly and terminal Download PDFInfo
- Publication number
- CN206743643U CN206743643U CN201720437371.5U CN201720437371U CN206743643U CN 206743643 U CN206743643 U CN 206743643U CN 201720437371 U CN201720437371 U CN 201720437371U CN 206743643 U CN206743643 U CN 206743643U
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- Prior art keywords
- flexible pcb
- heat dissipating
- dissipating layer
- ground wire
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of flexible PCB, flexible circuit board assembly and terminal.The flexible PCB of the utility model embodiment includes substrate and the ground wire being at least partially disposed in substrate, and ground wire is exposed to the surface of substrate, and surface is provided with heat dissipating layer, heat dissipating layer and ground connection linear contact lay.In the flexible PCB of the utility model embodiment, flexible circuit board assembly and terminal, heat dissipating layer can pass to the heat of the heat of ground wire and flexible PCB other parts outside flexible PCB, so as to improve the heat effect of flexible PCB, the performance of flexible PCB and the electronic component being connected with flexible PCB ensure that.
Description
Technical field
It the utility model is related to electronic technology field, more particularly to a kind of flexible PCB, flexible circuit board assembly and end
End.
Background technology
In the related art, flexible PCB can be connected with electronic component to realize data transfer.However, current
The radiating effect of flexible PCB is poor, have impact on the performance of flexible PCB and the electronic component being connected with flexible PCB.
Utility model content
The utility model proposes a kind of flexible PCB, a kind of flexible circuit board assembly and a kind of terminal.
The flexible PCB of the utility model embodiment includes substrate and is at least partially disposed in the substrate
Ground wire, described to be grounded the surface for being exposed to the substrate, the surface is provided with heat dissipating layer, and the heat dissipating layer connects with described
Ground contact.
In some embodiments, the heat dissipating layer covering contacts the ground wire；Or
The ground wire partly contacts with the heat dissipating layer.
In some embodiments, the quantity of the ground wire is multiple that multiple ground wires are arranged at intervals, Duo Gesuo
Ground wire is stated to contact with the heat dissipating layer.
In some embodiments, the surface includes upper and lower surface,
The ground wire is exposed to the upper surface, and the upper surface is provided with the heat dissipating layer；Or
The ground wire is exposed to the lower surface, and the lower surface is provided with the heat dissipating layer；Or
The ground wire is exposed to the upper surface and the lower surface, and the upper surface and the lower surface are provided with
The heat dissipating layer.
In some embodiments, the thermal conductivity factor of the heat dissipating layer is more than 400W/mk.
In some embodiments, the heat dissipating layer is graphene layer.
In some embodiments, the thickness of the heat dissipating layer is 1nm-10nm.
In some embodiments, the heat dissipating layer is covered with the surface.
The flexible circuit board assembly of the utility model embodiment includes the flexible circuit described in any of the above embodiment
Plate.
The terminal of the utility model embodiment includes the flexible circuit board assembly of embodiment of above.
In the flexible PCB of the utility model embodiment, flexible circuit board assembly and terminal, heat dissipating layer will can connect
The heat of ground wire and the heat of flexible PCB other parts are passed to outside flexible PCB, so as to improve flexible PCB
Heat effect, it ensure that the performance of flexible PCB and the electronic component being connected with flexible PCB.
Brief description of the drawings
Of the present utility model above-mentioned and additional aspect and advantage will in the description from combination accompanying drawings below to embodiment
Become obvious and be readily appreciated that, wherein：
Fig. 1 is the schematic cross-section of the flexible PCB of the utility model embodiment；
Fig. 2 be Fig. 1 flexible PCB II-II to diagrammatic cross-section；
Fig. 3 is another schematic cross-section of the flexible PCB of the utility model embodiment；
Fig. 4 be Fig. 1 flexible PCB II-II to another diagrammatic cross-section；
Fig. 5 is another schematic cross-section of the flexible PCB of the utility model embodiment；
Fig. 6 is another schematic cross-section of the flexible PCB of the utility model embodiment；
Fig. 7 is the schematic cross-section of the flexible circuit board assembly of the utility model embodiment；
Fig. 8 is the floor map of the terminal of the utility model embodiment.
Main element symbol description：
Flexible PCB 100, substrate 10, surface 12, upper surface 122, lower surface 124, breach 14, ground wire 20, radiating
Layer 30, order wire 40；
Flexible circuit board assembly 102, electronic component 104；
Terminal 200.
Embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below
It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining the utility model, and it is not intended that to this practicality
New limitation.
In description of the present utility model, it is to be understood that term " length ", " width ", " thickness ", " on ", " under ",
The orientation or position relationship of the instruction such as "front", "rear", "left", "right", " top ", " bottom " " interior ", " outer " are based on shown in the drawings
Orientation or position relationship, it is for only for ease of description the utility model and simplifies description, rather than indicates or imply signified dress
Put or element there must be specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to the utility model
Limitation.In addition, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more spy
Sign.In description of the present utility model, unless otherwise indicated, " multiple " are meant that two or more.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly
Connection；Can be mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary,
It can be the connection of two element internals.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
Concrete meaning of the language in the utility model.
Refer to Fig. 1 and Fig. 2, (the Flexible Printed of flexible PCB 100 of the utility model embodiment
Circuit, FPC) include substrate 10 and ground wire 20.Ground wire 20 is at least partially disposed in substrate 10, the dew of ground wire 20
For the surface 12 of substrate 10, surface 12 is provided with heat dissipating layer 30, and heat dissipating layer 30 contacts with ground wire 20.
In the flexible PCB 100 of the utility model embodiment, heat dissipating layer 30 can will be grounded 20 heat and soft
The heat of the property other parts of circuit board 100 is passed to outside flexible PCB 100, so as to improve the heat of flexible PCB 100
Effect, it ensure that the performance of flexible PCB 100 and the electronic component being connected with flexible PCB 100.
For example, after flexible PCB 100 distributes heat in time, it is ensured that the data transfer of flexible PCB 100
Speed, and ensure flexible PCB 100 transmit data stability.
Specifically, substrate 10 can be made up of the thin slice of flexibility, and the material of thin slice is, for example, PET (Polyethylene
Terephthalate, polyethylene terephthalate).Further, substrate 10 can be to be laminated by two panels or more thin slice
The bilayer or sandwich construction of formation, wherein, ground wire 20 is folded in two plate sheets.
Ground wire 20 is used to be connected with ground terminal, and ground wire 20 does not have communication function.It is appreciated that also set up in substrate 10
There is the order wire 40 for communication, order wire 40 there can be the function of data transfer or conduction.Ground wire 20 can be by conduction material
Material is made, for example, the material of ground wire 20 is copper or gold.
Referring to Fig. 3, breach 14 can be formed on substrate 10 so that ground wire 20 is exposed to outside substrate 10, so that
20 surfaces 12 for being exposed to substrate 10 must be grounded.
It should be noted that heat dissipating layer 30 can be with being grounded 20 and contacting：
1. the covering contact of heat dissipating layer 30 ground wire 20, as shown in Figure 1；Or
2. ground wire 20 partly contacts with heat dissipating layer 30, as shown in Figure 3.
In this way, the concrete form of heat dissipating layer 30 can be set according to actual conditions, so as to improve the suitable of flexible PCB 100
The property used.
The shape of ground wire 20 can be strip, or the shape such as bulk, be not limited thereto.
Referring to Fig. 4, in some embodiments, the quantity for being grounded 20 is multiple, and multiple ground wires 20 are arranged at intervals,
Multiple ground wires 20 contact with heat dissipating layer 30.
Multiple ground wires 20 can cause flexible PCB 100 to have multiple earth points, so as to the convenient connection of ground wire 20
To the ground terminal of diverse location.
In some embodiments, surface 12 includes upper surface 122 and lower surface 124, and ground wire 20 is exposed to upper surface
122, upper surface 122 is provided with heat dissipating layer 30, such as shown in Fig. 5.
It should be noted that in this embodiment, although ground wire 20 is not exposed to lower surface 124, following table
Face 124 can also be provided with heat dissipating layer 30, to improve the radiating effect of flexible PCB 100.
In some embodiments, ground wire 20 is exposed to lower surface 124, and lower surface 124 is provided with heat dissipating layer 30, such as
Shown in Fig. 6.
It should be noted that in this embodiment, although ground wire 20 is not exposed to upper surface 122, upper table
Face 122 can also be provided with heat dissipating layer 30, to improve the radiating effect of flexible PCB 100.
In some embodiments, ground wire 20 is exposed to upper surface 122 and lower surface 124, upper surface 122 and lower surface
124 are provided with heat dissipating layer 30, such as shown in Fig. 1 and Fig. 3.
In some embodiments, the thermal conductivity factor of heat dissipating layer 30 is more than 400W/mk.
For example, the thermal conductivity factor of heat dissipating layer 30 be 500W/mk, 1500W/mk, 2000W/mk, 2500W/mk,
3000W/mk, 4000W/mk etc., it can so improve the rate of heat dispation of flexible PCB 100.
In some embodiments, heat dissipating layer 30 is graphene layer.
Graphene (Graphene) is a kind of cellular flat film formed by carbon atom with sp2 hybrid forms, is one
Kind only has the quasi- two-dimensional material of an atomic layer level thickness, also referred to as monoatomic layer graphite.Graphene has good heat conductivility,
Its thermal conductivity factor can reach 4000W/mk.Therefore, graphene layer causes flexible PCB 100 to have preferably as heat dissipating layer 30
Radiating effect.
Certainly, in other embodiments, heat dissipating layer 30 can be other heat dissipating layers, such as carbon fiber heat dissipating layer or carbon are answered
Condensation material heat dissipating layer.
In some embodiments, the thickness of heat dissipating layer 30 is 1nm-10nm.
For example, the thickness of heat dissipating layer 30 is 1nm, 2nm, 3nm, 5nm, 7nm, 8nm, 9nm equidimension.
In this way, the thickness of heat dissipating layer 30 is easily formed, in addition, heat dissipating layer 30 in above thickness range, is ensureing flexibility
During the radiating effect of circuit board 100 so that the thinner thickness of flexible PCB 100.
In some embodiments, heat dissipating layer 30 is covered with surface 12.The area of dissipation of heat dissipating layer 30 can so be increased,
So as to improve the heat-sinking capability of flexible PCB 100.In addition, heat dissipating layer 30 can cover leading in flexible PCB 100
Believe line 40, so as to prevent the signal of order wire 40 from radiating, avoid data transfer distortion.
Referring to Fig. 7, the flexible circuit board assembly 102 of the utility model embodiment include electronic component 104 and with
The flexible PCB 100 of upper any embodiment, flexible PCB 100 connect electronic component 104.
In the flexible circuit board assembly 102 of the utility model embodiment, heat dissipating layer 30 can be by the heat of ground wire 20
Passed to the heat of the other parts of flexible PCB 100 outside flexible PCB 100, so as to improve flexible PCB 100
Heat effect, it ensure that the performance of flexible PCB 100 and electronic component 104.
Specifically, electronic component 104 is, for example, display screen, fingerprint chip, receiver, the first-class parts of shooting.Electronics
Parts 104 can realize data transfer by flexible PCB 100 with the main circuit board of electronic installation, corresponding so as to realize
Function.
Referring to Fig. 8, the terminal 200 of the utility model embodiment includes the flexible PCB of any of the above embodiment
Component 102.
In the terminal 200 of the utility model embodiment, heat dissipating layer 30 can be by the heat of ground wire and flexible PCB 100
The heat of other parts is passed to outside flexible PCB 100, so as to improve the heat effect of flexible PCB 100, ensure that
The performance of flexible PCB 100 and electronic component, and then ensure the stability using process of terminal 200.
Include, but are not limited to be configured to via wired line as " terminal " as used herein (or being " communication terminal ")
Road connection (such as via PSTN (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection,
And/or another data connection/network) and/or via (for example, for cellular network, WLAN (WLAN), such as
The digital TV network of DVB-H networks, satellite network, AM-FM broadcasting transmitter, and/or another communication terminal) wirelessly connect
The device of mouth reception/transmission signal of communication.Be configured to by the terminal of radio interface communication can be referred to as " wireless terminal ",
" wireless communication terminal " and/or " mobile terminal ".The example of terminal includes, but are not limited to satellite or cell phone；Can group
Close cellular radio telephone and PCS Personal Communications System (PCS) terminal of data processing, fax and its communication ability；Can be with
Including radio telephone, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or global location
The PDA of system (GPS) receiver；And conventional laptop and/or palmtop receiver or including radiotelephone transceiver
Other electronic installations.
In the utility model embodiment, the terminal 200 can various can obtain data and to the number from outside
Equipment according to being handled, or, the terminal 200 can be it is various be built-in with battery, and electric current can be obtained from outside to this
The equipment that battery is charged, for example, mobile phone, tablet personal computer, computing device or device for display of message etc..
The terminal that the utility model is applicable is introduced by taking mobile phone as an example.In the utility model embodiment, hand
Machine can include radio circuit, memory, input block, Wireless Fidelity (WiFi, wireless fidelity) module, sensing
The parts such as device, voicefrequency circuit, processor, projecting cell, shooting unit, battery.
Radio circuit can be used for receive and send messages or communication process in, the reception and transmission of signal, especially, by base station
After downlink information receives, processor processing is given；In addition, the up data of mobile phone are sent to base station.Generally, radio circuit includes
But it is not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier, duplexer etc..In addition, radio frequency electrical
Road can also be communicated by radio communication with network and other equipment.Above-mentioned radio communication can use any communication standard or association
View, including but not limited to global system for mobile communications (GSM, Global System for Mobile communication),
General packet radio service (GPRS, General Packet Radio Service), CDMA (CDMA, Code
Division Multiple Access), WCDMA (WCDMA, Wideband Code Division Multiple
Access), Long Term Evolution (LTE, Long Term Evolution), Email, Short Message Service (SMS, Short
Messaging Service) etc..
Memory can be used for storage software program and module, and processor is stored in the software program of memory by operation
And module, so as to perform the various function application of mobile phone and data processing.Memory can mainly include storing program area and
Storage data field, wherein, storing program area can storage program area, the application program needed at least one function (such as broadcast by sound
Playing function, image player function etc.) etc.；Storage data field can store uses created data (such as audio number according to mobile phone
According to, phone directory etc.) etc..In addition, memory can include high-speed random access memory, non-volatile memories can also be included
Device, for example, at least a disk memory, flush memory device or other volatile solid-state parts.
Input block can be used for the numeral or character information for receiving input, and the user of generation and mobile phone sets and work(
Relevant key signals can be controlled.Specifically, input block may include contact panel and other input equipments.Contact panel,
Referred to as touch-screen, collecting touch operation of the user on or near it, (for example user is any suitable using finger, stylus etc.
The operation of object or annex on contact panel or near contact panel), and driven accordingly according to formula set in advance
Attachment means.Optionally, contact panel may include both touch detecting apparatus and touch controller.Wherein, touch detection
Device detects the touch orientation of user, and detects the signal that touch operation is brought, and transmits a signal to touch controller；Touch control
Device processed receives touch information from touch detecting apparatus, and is converted into contact coordinate, then gives processor, and can receiving area
Manage the order that device is sent and performed.It is furthermore, it is possible to a variety of using resistance-type, condenser type, infrared ray and surface acoustic wave etc.
Type realizes contact panel.Except contact panel, input block can also include other input equipments.Specifically, other are inputted
Equipment can include but is not limited to physical keyboard, function key (such as volume control button, switch key etc.), trace ball, mouse,
One or more in action bars etc..
In addition, mobile phone may also include at least one sensor, such as attitude transducer, optical sensor and other sensings
Device.
Specifically, attitude transducer is referred to as motion sensor, also, as one kind of the motion sensor, can
To enumerate gravity sensor, cantilevered shifter is made using elastic sensing element in gravity sensor, and using the sensitive member of elasticity
Energy-stored spring made of part drives electric contact, so as to realizing the change that Gravity changer is converted into electric signal.
As the another kind of motion sensor, accelerometer sensor can be enumerated, accelerometer sensor can detect all directions
Upper (generally three axles) acceleration magnitude, can detect that size and the direction of gravity, available for identification mobile phone posture when static
(for example pedometer, struck using (such as horizontal/vertical screen switching, dependent game, magnetometer pose calibrating), Vibration identification correlation function
Hit) etc..
In the utility model embodiment, motion sensor listed above can be used as the aftermentioned " posture of acquisition
Parameter " element, but this is not limited to, other sensors that can obtain " attitude parameter " each fall within protection of the present utility model
In the range of, for example, gyroscope etc., also, the operation principle of the gyroscope and data handling procedure can be similar to prior art,
Here, in order to avoid repeating, description is omitted.
In addition, in the utility model embodiment, as sensor, can also configure barometer, hygrometer, thermometer and
The other sensors such as infrared ray sensor, will not be repeated here.
Optical sensor may include ambient light sensor and proximity transducer, wherein, ambient light sensor can be according to ambient light
The light and shade of line adjusts the brightness of display panel, proximity transducer can when mobile phone is moved in one's ear, close display panel and/or
Backlight.
Voicefrequency circuit, loudspeaker and microphone can provide the COBBAIF between user and mobile phone.Voicefrequency circuit will can connect
Electric signal after the voice data conversion received, is transferred to loudspeaker, and voice signal output is converted to by loudspeaker；The opposing party
The voice signal of collection is converted to electric signal by face, microphone, is converted to voice data after being received by voicefrequency circuit, then by audio
After the processing of data output processing device, through radio circuit to be sent to such as another mobile phone, or voice data exported to storage
Device is further to handle.
WiFi belongs to short range wireless transmission technology, mobile phone can help user to send and receive e-mail by WiFi module,
Browse webpage and access streaming video etc., it has provided the user wireless broadband internet and accessed.
Processor is the control centre of mobile phone, using various interfaces and the various pieces of connection whole mobile phone, is passed through
Operation performs the software program and/or module being stored in memory, and calls the data being stored in memory, performs
The various functions and processing data of mobile phone, so as to carry out integral monitoring to mobile phone.Optionally, processor may include one or more
Processing unit；Preferably, processor can integrate application processor and modem processor, wherein, application processor is mainly located
Operating system, user interface and application program etc. are managed, modem processor mainly handles radio communication.
It is understood that above-mentioned modem processor can not also be integrated into processor.
In the description of this specification, reference term " some embodiments ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means to combine the tool that the embodiment or example describe
Body characteristicses, structure, material or feature are contained at least one embodiment or example of the present utility model.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Sign, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.
While there has been shown and described that embodiment of the present utility model, one of ordinary skill in the art can manage
Solution：A variety of to the progress of these embodiments can change in the case where not departing from principle and objective of the present utility model, change,
Replace and modification, the scope of the utility model are limited by claim and its equivalent.
Claims (10)
- A kind of 1. flexible PCB, it is characterised in that including：Substrate；WithThe ground wire being at least partially disposed in the substrate, it is described to be grounded the surface for being exposed to the substrate, the table Face is provided with heat dissipating layer, the heat dissipating layer and the ground connection linear contact lay.
- 2. flexible PCB as claimed in claim 1, it is characterised in that the heat dissipating layer covering contacts the ground wire；OrThe ground wire partly contacts with the heat dissipating layer.
- 3. flexible PCB as claimed in claim 1, it is characterised in that the quantity of the ground wire is multiple described to be multiple Ground wire is arranged at intervals, and multiple ground wires contact with the heat dissipating layer.
- 4. flexible PCB as claimed in claim 1, it is characterised in that the surface includes upper and lower surface,The ground wire is exposed to the upper surface, and the upper surface is provided with the heat dissipating layer；OrThe ground wire is exposed to the lower surface, and the lower surface is provided with the heat dissipating layer；OrThe ground wire is exposed to the upper surface and the lower surface, and the upper surface and the lower surface are provided with described Heat dissipating layer.
- 5. flexible PCB as claimed in claim 1, it is characterised in that the thermal conductivity factor of the heat dissipating layer is more than 400W/m k。
- 6. flexible PCB as claimed in claim 1, it is characterised in that the heat dissipating layer is graphene layer.
- 7. flexible PCB as claimed in claim 1, it is characterised in that the thickness of the heat dissipating layer is 1nm-10nm.
- 8. flexible PCB as claimed in claim 1, it is characterised in that the heat dissipating layer is covered with the surface.
- A kind of 9. flexible circuit board assembly, it is characterised in that including：Flexible PCB described in claim 1-8 any one.
- 10. a kind of terminal, it is characterised in that including the flexible circuit board assembly described in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720437371.5U CN206743643U (en) | 2017-04-24 | 2017-04-24 | Flexible PCB, flexible circuit board assembly and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720437371.5U CN206743643U (en) | 2017-04-24 | 2017-04-24 | Flexible PCB, flexible circuit board assembly and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206743643U true CN206743643U (en) | 2017-12-12 |
Family
ID=60561874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720437371.5U Expired - Fee Related CN206743643U (en) | 2017-04-24 | 2017-04-24 | Flexible PCB, flexible circuit board assembly and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206743643U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3850922A4 (en) * | 2018-10-19 | 2021-11-17 | Samsung Electronics Co., Ltd. | Circuit board assembly and electronic device including the same |
-
2017
- 2017-04-24 CN CN201720437371.5U patent/CN206743643U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3850922A4 (en) * | 2018-10-19 | 2021-11-17 | Samsung Electronics Co., Ltd. | Circuit board assembly and electronic device including the same |
| US11677132B2 (en) | 2018-10-19 | 2023-06-13 | Samsung Electronics Co., Ltd | Circuit board assembly and electronic device including the same |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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Granted publication date: 20171212 |