CN206674290U - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
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- CN206674290U CN206674290U CN201621474890.0U CN201621474890U CN206674290U CN 206674290 U CN206674290 U CN 206674290U CN 201621474890 U CN201621474890 U CN 201621474890U CN 206674290 U CN206674290 U CN 206674290U
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Abstract
The utility model provides a kind of circuit board and electronic equipment that can suppress the transmission of noise in wiring conductor.Circuit board involved by the utility model is characterised by, including：Base material, the base material is in tabular and is in banding, and has pliability；And the 1st wiring conductor, 1st wiring conductor is in wire and is arranged at the base material to extend along the base material, the base material has the 1st section and the 2nd section adjacent to each other on the bearing of trend of base material extension, the 1st wiring conductor in 2nd section is compared with the 1st wiring conductor in the 1st section, positioned at the position of the side for the width for more leaning on the base material, in the 2nd section, when from the normal direction of the base material, the mountain broken line and paddy broken line more than at least one being provided with more than at least one intersected with the 1st wiring conductor.
Description
Technical field
A kind of circuit board and electronic equipment are the utility model is related to, more specifically, is related to a kind of include with flexible
The circuit board and electronic equipment of the base material of property.
Background technology
As the utility model on conventional circuit board, such as the known flexible flat having described in patent document 1
Cable.Figure 12 is the stereoscopic figure of the flexible flat cable 500 described in patent document 1.
Flexible flat cable 500 has multiple cored wires 501 and insulation division 503.Insulation division 503 is laminated by multiple dielectric films
Form, and be in banding.Multiple cored wires 501 are clipped between multiple dielectric films.In addition, insulation division 503 is provided with snake abdomen structural portion 551.
Thus, as shown in figure 12, flexible flat cable 500 can be bent in snake abdomen structural portion 551.
Prior art literature
Patent document
Patent document 1：Japanese Patent Laid-Open 6-36620 publications
Utility model content
Utility model technical problem to be solved
In flexible flat cable 500 described in patent document 1,551 easy passing noise of snake abdomen structural portion.Figure 13 is table
Show the figure of the cored wire 501 of snake abdomen structural portion 551.In addition, the structure beyond cored wire 501 is omitted in Figure 13.
As shown in figure 13, in snake abdomen structural portion 551, cored wire 501 is in snake.Therefore, in cored wire 501 formed with the hilltop and
Mountain valley.As one, 501a, the 501b when being set in the mountain valley of cored wire 501 will be formed.While 501a with while 501b it is relative.Therefore,
If such as produce noise in the 501a of side, the noise is easily transferred to side 501b.
Therefore, the purpose of this utility model is in a kind of wiring base for the transmission that can suppress noise in wiring conductor of offer
Plate and electronic equipment.
Technical scheme used by solution technical problem
Circuit board involved by an embodiment of the present utility model is characterised by, including：Base material, the base material are in
Tabular and be in banding, and there is pliability；And the 1st wiring conductor, the 1st wiring conductor is in wire and is arranged at the base material
To extend along the base material, the base material have the 1st section adjacent to each other on the bearing of trend of base material extension with
And the 2nd section, the 1st wiring conductor in the 2nd section is compared with the 1st wiring conductor in the 1st section, position
In the position of the side for the width for more leaning on the base material, in the 2nd section, from the normal direction of the base material
When, the mountain broken line and paddy broken line more than at least one that are provided with more than at least one intersected with the 1st wiring conductor.
Electronic equipment involved by an embodiment of the present utility model is characterised by, including the 1st circuit substrate, with
And the circuit board electrically connected with the 1st circuit board, the circuit board include：Base material, the base material is in tabular and is in
Banding, and there is pliability；And the 1st wiring conductor, the 1st wiring conductor is in wire and is arranged at the base material to cause along institute
Base material extension is stated, the base material has the 1st section and the 2nd section adjacent to each other on the bearing of trend of base material extension,
The 1st wiring conductor in 2nd section is compared with the 1st wiring conductor in the 1st section, positioned at more leaning on the base
The position of the side of the width of material, in the 2nd section, when from the normal direction of the base material, it is provided with and institute
Mountain broken line more than at least one of 1st wiring conductor intersection and paddy broken line more than at least one are stated, the 2nd section is from institute
When stating the normal direction observation of base material, bent in a manner of prominent to the side of the width.
The technique effect of utility model
According to the utility model, the transmission of noise in wiring conductor can be suppressed.
Brief description of the drawings
Fig. 1 is the stereoscopic figure of the circuit board 10 involved by an embodiment of the present utility model.
Fig. 2 is the exploded perspective view of Fig. 1 circuit board 10.
Fig. 3 A are the perspective views of the circuit board 10 of Fig. 1 from upside.
Fig. 3 B are connector 100a sectional structure charts.
Fig. 4 is the stereoscopic figure of the circuit board 10 when using.
Fig. 5 is the figure of the electronic equipment 200 using circuit board 10 from upside.
Fig. 6 is the process sectional view when forming paddy broken line L1, L3, L5 and mountain broken line L2, L4 on circuit board 10.
Fig. 7 A are the sectional structure charts at the A-A of Fig. 4 circuit board 10.
Fig. 7 B are the sectional structure charts at the B-B of Fig. 4 circuit board 10.
Fig. 7 C are the sectional structure charts at the C-C of Fig. 4 circuit board 10.
Fig. 7 D are the figures that circuit board 10a is overlooked from upside.
Fig. 8 is the figure that circuit board 10b is overlooked from upside.
Fig. 9 is the figure that circuit board 10c is overlooked from upside.
Figure 10 is the figure that circuit board 10d is overlooked from upside.
Figure 11 is the figure from front side circuit board 10e section A2.
Figure 12 is the stereoscopic figure of the flexible flat cable 500 described in patent document 1.
Figure 13 is the figure for the cored wire 501 for representing snake abdomen structural portion 551.
Embodiment
Below, for the circuit board involved by an embodiment of the present utility model and electronic equipment referring to the drawings
Illustrate.
(structure of circuit board)
Below, for the circuit board involved by an embodiment of the present utility model and electronic equipment referring to the drawings
Illustrate.Fig. 1 is the stereoscopic figure of the circuit board 10 involved by an embodiment of the present utility model.Fig. 2 is Fig. 1
Circuit board 10 exploded perspective view.Fig. 3 A are the perspective views of the circuit board 10 of Fig. 1 from upside.In Fig. 1 to Fig. 3 A,
The stacked direction of circuit board 10 is defined as above-below direction (one of the normal direction of base material).In addition, by circuit board 10
Long side direction be defined as left and right directions, the short side direction of circuit board 10 is defined as fore-and-aft direction.Above-below direction, right and left
To and fore-and-aft direction it is mutually orthogonal.
Circuit board 10 is, for example, the high-frequency signal transmission wire for being used to connect 2 high-frequency circuits in the electronic equipments such as mobile phone
Road or be digital signal transmission line road etc. for connecting 2 digital circuits.Circuit board 10 as shown in Figure 1 and Figure 2,
Have：Base material 12；Outside terminal 16a, 16b；Wiring conductor layer 20；Grounding conductor layer 22,24；Connecting conductor layer 30a~30c,
32a~32c；Via conductors v1~v14；And connector 100a, 100b.
Base material 12 is in tabular and is in banding, has pliability.Extend in the lateral direction when base material 12 is from upside,
And there is uniform width in the longitudinal direction.The direction (left and right directions in Fig. 1 and Fig. 2) that base material 12 is extended below claims
For bearing of trend, the direction orthogonal with bearing of trend during by from upside (fore-and-aft direction in Fig. 1 and Fig. 2) is referred to as width
Direction.
As shown in Fig. 2 base material 12 is by protective layer 14 and dielectric sheet material 18a~18c (one of multiple insulator layers
Example, dielectric sheet material 18a are one of the 2nd insulator layer, and dielectric sheet material 18b is one of the 1st insulator layer, dielectric piece
Material 18c is one of the 3rd insulator layer) layered product that stacks gradually and form from upside to downside (one of stacked direction).
Hereinafter, the interarea of base material 12 and dielectric sheet material 18a~18c upside is referred to as surface, by base material 12 and dielectric piece
The interarea of material 18a~18c downside is referred to as the back side.
Extend in the lateral direction when dielectric sheet material 18a~18c is from upside, and be in same shape with base material 12.
Dielectric sheet material 18a~18c material, which includes polyimides, liquid crystal polymer etc., has the thermoplastic resin of pliability.
As shown in Fig. 2 outside terminal 16a be provided in it is rectangular-shaped near the left end on dielectric sheet material 18a surface
Conductor layer.As shown in Fig. 2 outside terminal 16b rectangular-shaped leading of being provided near the right-hand member on dielectric sheet material 18a surface
Body layer.Outside terminal 16a, 16b are located at the center of dielectric sheet material 18a width.Outside terminal 16a, 16b are by silver, copper
It is made up of the less metal material of ratio resistance of principal component.In addition, outside terminal 16a, 16b surface implement it is gold-plated.
As shown in Fig. 2 wiring conductor layer 20 (one of the 1st wiring conductor) is disposed on existing in base material 12 and along base material 12
The conductor layer of the wire of left and right directions extension.In present embodiment, wiring conductor layer 20 is arranged on dielectric sheet material 18b surface
On.When from upside, the left end of wiring conductor layer 20 is located near dielectric sheet material 18b left side, and with outside terminal 16a
It is overlapping.When from upside, the right-hand member of wiring conductor layer 20 is located near dielectric sheet material 18b right side, and and outside terminal
16b is overlapping.Wiring conductor layer 20 is made up of silver, copper of the less metal material of ratio resistance of principal component.
Connecting conductor layer 30a~30c is disposed on the rectangular-shaped conductor near the left end on dielectric sheet material 18b surface
Layer.Connecting conductor layer 30a is located at rear side relative to the left end of wiring conductor layer 20.Connecting conductor layer 30b is relative to wiring conductor
The left end of layer 20 is located at left side.Connecting conductor layer 30c is located at front side relative to the left end of wiring conductor layer 20.Connecting conductor layer
30a~30c is made up of silver, copper of the less metal material of ratio resistance of principal component.
Connecting conductor layer 32a~32c is disposed on the rectangular-shaped conductor near the right-hand member on dielectric sheet material 18b surface
Layer.Connecting conductor layer 32a is located at rear side relative to the right-hand member of wiring conductor layer 20.Connecting conductor layer 32b is relative to wiring conductor
The right-hand member of layer 20 is located at right side.Connecting conductor layer 32c is located at front side relative to the right-hand member of wiring conductor layer 20.Connecting conductor layer
32a~32c is made up of silver, copper of the less metal material of ratio resistance of principal component.
As shown in Fig. 2 grounding conductor layer 22 (one of the 1st wiring conductor layer) is arranged at wiring conductor layer in base material 12
20 upside, it is the conductor layer of the banding extended along base material 12 in left and right directions.In present embodiment, grounding conductor layer 22 is set
In on dielectric sheet material 18a surface, and covering dielectric sheet material 18a substantially whole surface.When thus, from upside,
Grounding conductor layer 22 is overlapping with wiring conductor layer 20.Wherein, dielectric sheet material 18a be provided with as described above outside terminal 16a,
16b.Therefore, grounding conductor layer 22 is provided with 2 openings, and outside terminal 16a, 16b are located in this 2 openings, to cause
Short circuit does not occur for outside terminal 16a, 16b and grounding conductor layer 22.Grounding conductor layer 22 by silver, copper for principal component ratio resistance compared with
Small metal material is made.
As shown in Fig. 2 grounding conductor layer 24 (one of the 2nd wiring conductor) is arranged at wiring conductor layer 20 in base material 12
Downside, be the banding extended along base material 12 in left and right directions conductor layer.In present embodiment, grounding conductor layer 24 is arranged at
On dielectric sheet material 18c surface, and covering dielectric sheet material 18c substantially whole surface.It is grounded when thus, from upside
Conductor layer 24 is overlapping with wiring conductor layer 20.Grounding conductor layer 24 is by silver, the less metal material of ratio resistance that copper is principal component
It is made.
Here, as shown in Figure 3A, earth conductor 22,24 on the center and width of the base material 12 on width
Center is consistent.Hereinafter, the center line of the base material 12 on width and grounding conductor layer 22,24 is referred to as center line C1.
As described above, grounding conductor layer 22, wiring conductor layer 20 and grounding conductor layer 24 are configured successively, from upper and lower
The both sides in direction clip wiring conductor layer 20 via dielectric sheet material 18a, 18b by grounding conductor layer 22,24.That is, wiring conductor
Layer 20 and grounding conductor layer 22,24 form the strip lines configuration of three ply board type.
Via conductors v1 penetrates dielectric sheet material 18a in the vertical direction, and connects outside terminal 16a and wiring conductor layer
20 left end.Via conductors v2 penetrates dielectric sheet material 18a in the vertical direction, and connects outside terminal 16b and wiring conductor
The right-hand member of layer 20.
Via conductors v3~v5 penetrates dielectric sheet material 18a in the vertical direction respectively.Via conductors v6~v8 exists respectively
Dielectric sheet material 18b is penetrated on above-below direction.Via conductors v3 and via conductors v6 is a succession of so as to form by being connected with each other
Via conductors, connection grounding conductor layer 22, connecting conductor layer 30a and grounding conductor layer 24.Via conductors v4 is led with through hole
Body v7, so as to form a series of via conductors, connects grounding conductor layer 22, connecting conductor layer 30b and connect by being connected with each other
Earthed conductor layer 24.By being connected with each other so as to form a series of via conductors, connection connects via conductors v5 and via conductors v8
Earthed conductor layer 22, connecting conductor layer 30c and grounding conductor layer 24.
Via conductors v9~v11 penetrates dielectric sheet material 18a in the vertical direction respectively.Via conductors v12~v14 distinguishes
Dielectric sheet material 18b is penetrated in the vertical direction.Via conductors v9 and via conductors v12 forms a company by being connected with each other
The via conductors of string, connection grounding conductor layer 22, connecting conductor layer 32a and grounding conductor layer 24.Via conductors v10 and through hole
Conductor v13 by being connected with each other so as to form a series of via conductors, connection grounding conductor layer 22, connecting conductor layer 32b with
And grounding conductor layer 24.Via conductors v11 and via conductors v14 by being connected with each other so as to form a series of via conductors,
Connect grounding conductor layer 22, connecting conductor layer 32c and grounding conductor layer 24.
Via conductors v1~v14 as described above is made up of silver, copper of the less metal material of ratio resistance of principal component.
Protective layer 14 covers conductor layer 18a substantially whole surface.Thus, protective layer 14 covers grounding conductor layer 22.Its
In, opening Ha~Hd is provided near the left end of protective layer 14.Opening Ha is arranged on protective layer 14 when being from upside
The position overlapping with outside terminal 16a and the opening of rectangular shape.Outside terminal 16a is exposed to outside via opening Ha.In addition,
Opening Hb is the opening that rear side and rectangular shape are arranged at relative to opening Ha.Opening Hc is to be arranged at left side relative to opening Ha
And the opening of rectangular shape.Opening Hd is the opening that front side and rectangular shape are arranged at relative to opening Ha.Grounding conductor layer 22
Outside is exposed to via opening Hb~Hd, so as to play a part of as outside terminal.
In addition, opening He~Hh is provided near the right-hand member of protective layer 14.Opening He is arranged on when being from upside
The position overlapping with outside terminal 16b of protective layer 14 and the opening of rectangular shape.Outside terminal 16b is exposed to via opening He
It is outside.In addition, opening Hf is the opening that rear side and rectangular shape are arranged at relative to opening He.The Hg that is open is relative to opening He
It is arranged at the opening of right side and rectangular shape.Opening Hh is the opening that front side and rectangular shape are arranged at relative to opening He.Connect
Earthed conductor layer 22 is exposed to outside via opening Hf~Hh, so as to play a part of as outside terminal.Protective layer 14 for example by
The pliability resin composition of anticorrosive additive material as epoxy resin etc..
Connector 100a, 100b are separately mounted to left end and right-hand member on the surface of base material 12.Due to connector 100a,
100b structure is identical, therefore is illustrated below using connector 100a structure as example.Fig. 3 B are cuing open for connector 100a
Depending on structure chart.
Connector 100a is led as shown in Fig. 2 and Fig. 3 B by basal part 102, cylindrical portion 104, center conductor 106, outside
Body 108 and outside terminal 110a~110d are formed.The component of the tabular of rectangular shape when being from upside of basal part 102.
Cylindrical portion 104 is the cylindric component extended upward from the upper surface of basal part 102.Center conductor 106 is located at and cylinder
The overlapping position of the central shaft in portion 104, is terminal made of vertically extending metal.External conductor 108 is covering circle
Terminal made of the metal of the inner peripheral surface in cylinder portion 104.
Outside terminal 110a is disposed on the conductor of the central and rectangular shape of the lower surface of basal part 102.Outside terminal
110a is connected with center conductor 106.Outside terminal 110b is disposed on the conductor of the lower surface of basal part 102 and rectangular shape,
It is located at rear side relative to outside terminal 110a.Outside terminal 110c is disposed on the lower surface of basal part 102 and rectangular shape
Conductor, it is located at left side relative to outside terminal 110a.Outside terminal 110d is disposed on the lower surface of basal part 102 and rectangular
The conductor of shape, it is located at front side relative to outside terminal 110a.Outside terminal 110b~110d is connected with external conductor 108.
The connector 100a formed as described above is for example installed by solder, to cause outside terminal 110a and outside
Terminal 16a is attached, and grounding conductor layers 22 of the outside terminal 110b~110d respectively with exposing from opening Hb~Hd is connected
Connect.Thus, wiring conductor layer 20 is electrically connected with center conductor 106.In addition, grounding conductor layer 22,24 and external conductor 108
It is electrically connected.
In circuit board 10, wiring conductor layer 20 is not linear on the whole, and one part is than remainder positioned at more
The position of side rearward.It is described in detail below for the structure of wiring conductor layer 20.
Base material 12 has section A1 (one of the 1st section), section A2 (the one of the 2nd section as shown in Fig. 2 and Fig. 3 A
Example) and section A3 (one of the 1st section).Section A1~A3 is arranged in order from left side to right side.Thus, section A1 and section
A2 is adjacent to each other on bearing of trend (that is to say left and right directions), and section A2 and section A3 (that is to say right and left in bearing of trend
To) on it is adjacent to each other.Therefore, section A1 right-hand member is consistent with section A2 left end, section A2 right-hand member and section A3 left ends one
Cause.In addition, section A1 left end is consistent with the left end of wiring conductor layer 20.Section A3 right-hand member and the right-hand member of wiring conductor layer 20
Unanimously.
Wiring conductor layer 20 includes wiring portion 20a~20c.Wiring portion 20a is the wiring conductor layer 20 in the A1 of section.Wiring
Portion 20b is the wiring conductor layer 20 in the A2 of section.Wiring portion 20c is the wiring conductor layer 20 in the A3 of section.
When from upside, wiring portion 20a, 20c is located in the base material 12 on width and earth conductor 22,26
The heart.When i.e., from upside, the center line of base material 12 and earth conductor 22,26 on wiring portion 20a, 20c and width
C1 is overlapping.
When on the other hand, from upside, wiring portion 20b be located at than wiring portion 20a, 20c more posteriorly side (width
One of side) position.In more detail, wiring portion 20b left end is connected with wiring portion 20a right-hand member, the wiring portion 20b right side
End is connected with wiring portion 20c left end.Thus, wiring portion 20b both ends are located at the width of base material 12 and grounding conductor layer 22,26
Spend the center in direction.Wherein, wiring portion 20b more turns right more to rear side displacement since wiring portion 20b left end.Similarly,
Wiring portion 20b is since wiring portion 20b right-hand member, and more past left side is more to rear side displacement.Wherein, the wiring portion on left and right directions
20b center nearby near the side of dielectric sheet material 18b rear side, extends in the lateral direction.Thus, from upside
When, the center of base materials 12 and grounding conductor layer 22,26 of the wiring portion 20b compared with wiring portion 20a, 20c from the width direction
Deviate.
Known as described above, section A2 left end is started (to that is to say cloth to the position of rear side displacement from wiring conductor layer 20
Line portion 20b left end) determine.Similarly, section A2 right-hand member from wiring conductor layer 20 start to rear side displacement position (namely
It is wiring portion 20b right-hand member) determine.
In addition, when from upside, on section A2 dielectric sheet material 18b surface, before wiring conductor layer 20
Side (one of the opposite side of width), it is not provided with the conductor of interlayer connection conductor, the grounding conductor layer of via conductors etc. etc..
In addition, when from upside, leading beyond wiring conductor layer 20 is not provided with section A2 dielectric sheet material 18b surface
Body.When wherein, from upside, on section A2 dielectric sheet material 18a, 18c surface, in the front side of wiring conductor layer 20
It is provided with a part for grounding conductor layer 22,24.
In addition, when from upside, in section, A2 is provided with paddy the folding more than at least one intersected with wiring conductor layer 20
More than line L1, L3, L5 and at least one mountain broken line L2, L4.Paddy broken line L1, L3, L5 are to form mountain by the surface of base material 12
The broken line that the mode of paddy is bent.Mountain broken line L2, L4 are the broken lines for bending on the surface of base material 12 in a manner of forming the hilltop.This reality
Apply in mode, paddy broken line L1, L3, L5 and mountain broken line L2, L4 extend in the longitudinal direction.In addition, paddy broken line L1, mountain broken line
L3, paddy broken line L3, mountain broken line L4 and paddy broken line L5 are from left side to right side successively arranged at equal intervals.Thus, paddy broken line is rolled over mountain
Line is alternately arranged in the lateral direction.As a result, from front side when, section A2 is in zigzag manner, forms so-called snake abdomen
Structure.In addition, base material 12 is plastically deformed at paddy broken line L1, L3, L5 and mountain broken line L2, L4.Thus, section A2 can be with
Snake fu jie structure is not being maintained in the case of by external force.
Circuit board 10 is used as will be explained below.Fig. 4 is that the outward appearance of the circuit board 10 when using is stood
Body figure.Fig. 5 is the figure of the electronic equipment 200 using circuit board 10 from upside.
As shown in figure 4, when from upside, circuit board 10 bends to L-shaped and used.In more detail, base is connected up
Therefore the section A2 of plate 10 can be stretched due to forming snake fu jie structure.Therefore, external force is applied to circuit board 10, to cause
The interval of paddy broken line L1, mountain broken line L2, paddy broken line L3, mountain broken line L4 and paddy broken line L5 on front side of in the A2 of section are than in the A2 of section
The paddy broken line L1 of rear side, mountain broken line L2, paddy broken line L3, mountain broken line L4 and paddy broken line L5 it is interval smaller.More specifically, as schemed
Shown in 4, circuit board 10 is bent, to cause section A1 to extend in the lateral direction, and section A3 extends in the longitudinal direction.This
When, section A2 is bent in a manner of prominent to right lateral side (one of the side of width).In addition, circuit board 10 is with so
The state of bending is used for electronic equipment 200.
Electronic equipment 200 as shown in Figure 5 have circuit board 10, circuit substrate 202a, 202b, be mobile phone, game machine, can
Dress terminal etc..In addition, the housing for accommodating circuit board 10 and circuit substrate 202a, 202b is eliminated in Fig. 5.
Circuit substrate 202a (one of the 1st circuit substrate) is for example provided with the transtation mission circuit comprising antenna or receives electricity
Road.Circuit substrate 202b (one of the 2nd circuit substrate) is for example provided with power supply circuit.Circuit substrate 202b is relative to circuit base
Plate 202a is located at left rear side.In addition, the surface of circuit substrate 202a, 202b is respectively arranged with connector (not shown).
Circuit board 10 is bent as shown in Figure 4, and is used with positive and negative reverse state.That is, circuit board
10 surface is towards downside.In addition, connector 100a is connected with being arranged at circuit substrate 202a connector, connector 100b with
It is arranged at circuit substrate 202b connector connection.Thus, via the connector for being arranged at circuit substrate 202a, 202b, to even
Junctor 100a, 100b center conductor 106 are applied to the height for example with 2GHz frequencies transmitted between circuit substrate 202a, 202b
Frequency signal.In addition, via the connector for being arranged at circuit substrate 202a, 202b, to connector 100a, 100b external conductor
108 apply earthing potential.Thus, circuit substrate 202a and circuit substrate 202b are electrically connected by circuit board 10.In addition, cloth
2 circuit substrates 202a, 202b can not also be electrically connected by line substrate 10, for example, it is also possible to which circuit substrate will be arranged at
202a the 1st electric circuit is electrically connected with the 2nd electric circuit for being arranged at circuit substrate 202a.
(manufacture method of circuit board)
Illustrated below for the manufacture method reference picture 2 and Fig. 6 of circuit board 10.Fig. 6 is in circuit board 10
Process sectional view during upper formation paddy broken line L1, L3, L5 and mountain broken line L2, L4.Below with one circuit board 10 of making
Situation illustrates as example, is laminated and is cut actually by the dielectric sheet material to large area, can made simultaneously
Make multiple circuit boards 10.
First, dielectric sheet material 18a~18c is prepared, the dielectric sheet material is hot plastic formed with copper foil by whole surface
Property resin (such as liquid crystal polymer) composition.Dielectric sheet material 18a~18c copper foil surface is for example by implementing for antirust
It is zinc-plated to be smoothed.
Then, by photo-mask process, formed on dielectric sheet material 18a surface outside terminal 16a, 16b shown in Fig. 2 with
And grounding conductor layer 22.Specifically, on dielectric sheet material 18a copper foil printing with Fig. 2 shown in outside terminal 16a, 16b with
And the resist of the same shape of grounding conductor layer 22.Then, by implementing etching process to copper foil, removing is not covered by resist
The copper foil of the part of lid.Afterwards, resist is removed.Thus, outside as shown in Figure 2 is formed on dielectric sheet material 18a surface
Terminal 16a, 16b and grounding conductor layer 22.
Then, by photo-mask process, formed on dielectric sheet material 18b surface wiring conductor layer 20 shown in Fig. 2 and
Contact conductor layer 30a~30c, 32a~32c.In addition, formed by photo-mask process on dielectric sheet material 18c surface shown in Fig. 2
Grounding conductor layer 24.In addition, because when these photo-mask process are with forming outside terminal 16a, 16b and grounding conductor layer 22
Photo-mask process is identical, therefore omits the description.
Then, to dielectric sheet material 18a, 18b position for forming via conductors v1~v14, laser is irradiated from rear side
Beam, form through hole.Afterwards, conductive paste is filled to the through hole for being formed at dielectric sheet material 18a, 18b.
Then, dielectric sheet material 18a~18c is stacked gradually from upside to downside, to cause grounding conductor layer 22, wiring
Conductor layer 20 and grounding conductor layer 24 form strip lines configuration.Then, dielectric sheet material 18a~18c is implemented to heat
And pressurized treatments, dielectric sheet material 18a~18c is softened and is pressed, integration, and make to fill in through hole leads
Body slurry is solidified, and forms via conductors v1~v14.
Then, by coated with resins (resist) slurry, so as to form protective layer 14 on dielectric sheet material 18a.
Finally, as shown in fig. 6, by metal die T1, T2, paddy broken line L1, L3, L5 and mountain folding are formed on the base substrate 12
Line L2, L4.In more detail, metal die T1 has lower surface S1.Hilltop M1 that lower surface S1 protrudes formed with downward side and
Mountain valley V1, the V2 being recessed to upside.Hilltop M1 and mountain valley V1, V2 extend in the longitudinal direction.Metal die T2 has upper table
Face S2.The mountain valley V3 that upper surface S2 is recessed formed with the upwardly projecting hilltop M2, M3 and to downside.The hilltop M2, M3 and
Mountain valley V3 extends in the longitudinal direction.In addition, when from upside, mountain valley V1, hilltop M1 and mountain valley V2 respectively with hilltop M2,
Mountain valley V3 and hilltop M3 are consistent.
Heater (not shown) is provided with metal die T1, T2 as described above.Thus to metal die T1, T2
Heated.Then, base material 12 is clamped from above-below direction by metal pattern T1, T2 and pressurizeed.Thus, base material 12 is soft
Change, base material 12 is plastically deformed by hilltop M1~M3 and mountain valley V1~V3.As a result, in the section A2 of base material 12
Interior formation paddy broken line L1, L3, L5 and mountain broken line L2, L4.Process by the above obtains circuit board 10 as shown in Figure 1.
(effect)
According to the circuit board 10 formed as described above, the transmission of noise in wiring conductor layer 20 can be suppressed.It is more detailed
Carefully, Fig. 7 A are the sectional structure charts at the A-A of Fig. 4 circuit board 10.Fig. 7 B are at Fig. 4 B-B of circuit board 10
Sectional structure chart.Fig. 7 C are the sectional structure charts at the C-C of Fig. 4 circuit board 10.
As shown in Fig. 7 A to Fig. 7 C, base material 12 crawls in the A2 of section in circuit board 10.Wherein, as shown in figure 4, section
A2 is bent in a manner of prominent to right lateral side (one of the side of width).Therefore, as shown in Fig. 7 A to Fig. 7 C, according to line
The cycle of the different snakes in the position of cross direction changes.Specifically, the snake shown in Fig. 7 A of the sectional structure chart of most inner circumferential side
The capable cycle is most short, and the cycle of the snake shown in Fig. 7 C of the sectional structure chart of outermost the week side of boss is most long.Thus, shown in Fig. 7 C
The situation of opening position laying-out and wiring conductor layer 20 and the feelings in the opening position laying-out and wiring conductor layer 20 shown in Fig. 7 A and Fig. 7 B
Condition is compared, and wiring conductor layer 20 is less close.Therefore, in circuit board 10, wiring portion 20b is compared with wiring portion 20a, 20c, position
In the position for the rear side (one of width side) for more leaning on base material 12.As a result, it can suppress in wiring conductor layer 20
The transmission of noise.
In addition, according to circuit board 10, the free degree of design uprises.In more detail, it is flexible flat described in patent document 1
Horizontal line cable 500 has multiple cored wires 501.Moreover, in Figure 12, the snake cycle of the cored wire 501 of outermost the week side of boss is than remaining cored wire
501 snake cycle is longer.Therefore, the cored wire 501 of outermost the week side of boss is compared with remaining cored wire 501, it more difficult to passing noise.Wherein
As shown in figure 12, the cored wire 501 of the outermost the week side of boss in flexible flat cable 500 is always situated in the paper inboard of insulation division 503
Near side.Thus, in flexible flat cable 500, in order to suppress the transmission of noise, it is necessary to which cored wire 501 is configured in outer circumferential side, because
This generates restriction in the configuration of cored wire 501.
On the other hand, in circuit board 10, wiring portion 20b is compared with wiring portion 20a, 20c, after more base material 12 is leaned on
The position of side (one of the side of width).Thus, side of wiring portion 20a, 20c without the rear side always situated in base material 12
Near.Therefore, wiring portion 20a, 20c can configure the position on the side of the rear side of base material 12 other than around.As a result, according to
Circuit board 10, the free degree of design uprise.
In addition, in circuit board 10, noise intrusion wiring conductor layer 20 can be suppressed.In more detail, circuit board 10 is used for
During electronic equipment 200, circuit substrate, electronic unit etc. around circuit board 10 be present.This circuit substrate, electronic unit etc.
Can radiated noise.Thus it is preferred to wiring conductor layer 20 and circuit substrate, electronic unit etc. are kept off as far as possible.
Therefore, as shown in Figure 3A, when wiring portion 20a, 20c is from upside, in the base material 12 on width
The heart.Thus, even if circuit substrate, electronic unit etc. are close from the either side in the front side of base material 12 or rear side, seen from upside
Also can be with the width half of base material 12 apart from the close wiring conductor layer 20 such as suppression circuit substrate, electronic unit when examining.By
This, can suppress noise intrusion wiring conductor layer 20 in circuit board 10.In addition, being based on the reasons why same, can suppress to lead from wiring
The noise that body layer 20 radiates invades circuit substrate, electronic unit etc..
In addition, being based on the reasons why following, it can also suppress noise intrusion wiring conductor layer 20 in circuit board 10.In more detail
Ground, as shown in Figure 3A, when wiring portion 20a, 20c is from upside, in the grounding conductor layer 22,24 on width
The heart.Thus, even if noise invades from the either side of the front side of base material 12 or rear side, also easily it is grounded the suction of conductor layer 22,24
Receive.Thus, in circuit board 10, noise intrusion wiring conductor layer 20 can be suppressed.In addition, based on it is same the reasons why, can suppress from
Circuit substrate of the noise intrusion configuration around circuit board 10 that wiring conductor layer 20 radiates, electronic unit etc..
In addition, according to circuit board 10, paddy broken line L1, L3, L5 and mountain broken line L2, L4 can be easily formed.In more detail
Ground, because the conductor of the interlayer connection conductors such as via conductors, grounding conductor layer etc. is harder than dielectric sheet material 18b, therefore it can hinder
Hinder paddy broken line L1, L3, L5 and mountain broken line L2, L4 formation.Therefore, in circuit board 10, the A2 dielectric sheet material in section
The conductor being not provided with 18b surface beyond wiring conductor layer 20.That is, dielectric sheet material 18b be not provided with hindering paddy broken line L1,
The conductor that L3, L5 and mountain broken line L2, L4 are formed.Thus, according to circuit board 10, paddy broken line L1, L3, L5 can easily be formed
And mountain broken line L2, L4.
In addition, according to circuit board 10, section A2 is easily bent into L-shaped, V-shaped.In more detail, via conductors etc.
Interlayer connection conductor or grounding conductor layer etc. conductor it is harder than dielectric sheet material 18b.This conductor hinders base material 12 with such as
Cycle shorter mode of being crawled like that shown in Fig. 7 A bends zig zag.
But in order to section A2 be bent in a manner of prominent to right lateral side (one of width side), it is necessary to will
Base material 12 bend zig zag so that section A2 cycle for being crawled compared with section A2 outer circumferential side of inner circumferential side it is shorter.
Therefore, on section A2 dielectric sheet material 18b surface, the front side of wiring conductor layer 20 (width
One of opposite side), it is not provided with the conductor of interlayer connection conductor, the grounding conductor layer of via conductors etc. etc..That is, in dielectric piece
Material 18b is not provided with the conductor for hindering base material 12 significantly to bend zig zag in a manner of the cycle of crawling is shorter.As a result, root
According to circuit board 10, section A2 is easily bent into L-shaped, V-shaped.
(the 1st variation)
It is described with reference to the accompanying drawings below for the circuit board 10a involved by the 1st variation.Fig. 7 D are overlooked from upside
Circuit board 10a figure.In addition, not being the back side of the base material 12 from upside as shown in Figure 5 in Fig. 7 D, but seen from upside
Examine the surface of base material 12.In addition, circuit board 10a is the state being bent in Fig. 7 D.
The circuit board 10a this point that bent at 2 is different from circuit board 10.Hereinafter, using the distinctive points in
The heart illustrates for circuit board 10a.
Base material 12 has section A1~A5 as illustrated in fig. 7d.A1, A2, A4, A5, A3 are arranged in order in section.In addition, by section
Wiring conductor layer 20 in A1~A5 is respectively as wiring portion 20a~20e.When from upside, in section A5 formed with cloth
Paddy broken line L11, L13, L15 and mountain broken line L12, L14 that line portion 20e intersects.Section A5 with to front left side (width it is another
One of side) prominent mode bends.In addition, wiring portion 20e is located at than wiring portion 20c, 20d more by the another of width
The position of side.
The circuit board 10a formed as described above may also function as and the identical action effect of circuit board 10.
(the 2nd variation)
It is described with reference to the accompanying drawings below for the circuit board 10b involved by the 2nd variation.Fig. 8 is overlooked from upside
Circuit board 10b figure.In addition, circuit board 10b is the state not bent in Fig. 8.
On this point circuit board 10b sets jagged 150 at the A2 of section is different from circuit board 10.In more detail,
When from upside, on the base material at the A2 of section, the front side of wiring conductor layer 20 (one of the opposite side of width)
Set jagged 150.Because circuit board 10b other structures are identical with circuit board 10, omit the description.
The circuit board 10b formed as described above may also function as and the identical action effect of circuit board 10.
In addition, in circuit board 10b, jagged 150 are set in the section A2 of bending inner circumferential side.Thus, due to section
A2 width attenuates, therefore easily section A2 can be bent.
In addition, section A2 length is short enough compared with section A1, A3.Therefore, the length of breach 150 is also with section A2's
Length is similarly, short enough compared with section A1, A3.Therefore, for simplicity, by the center of the section A2 on width and width
The center of section A1, A2 on degree direction are considered as identical.That is, as shown in figure 8, the center line C1 of the base material 12 on width exists
Extend on left and right directions in straight line.
(the 3rd variation)
It is described with reference to the accompanying drawings below for the circuit board 10c involved by the 3rd variation.Fig. 9 is overlooked from upside
Circuit board 10c figure.In addition, in Fig. 9, circuit board 10c is the state not bent.
Circuit board 10c is different from circuit board 10 with baseplate part 300 to substitute section A1 on this point.Hereinafter,
Illustrated centered on the distinctive points for circuit board 10c.
In circuit board 10c, base material 12 has section A2 (one of the 2nd section) and section A3 (the one of the 1st section
Example), without section A1.In addition, the left end of base material 12 is attached with baseplate part 300.Baseplate part 300 is identical with base material 12,
It is laminated by 3 layers of dielectric sheet materials and is formed, rectangular shape.Baseplate part 300 is continuously connected with base material 12 and forms one.In base
The surface of plate portion 300 or back side installation semiconductor integrated circuit, electronic unit etc..In addition, the surface of baseplate part 300, the back side
And it is internally provided with circuit.Circuit board 10c as described above also bends section A2 to be used.
The circuit board 10c formed as described above may also function as and the identical action effect of circuit board 10.
(the 4th variation)
It is described with reference to the accompanying drawings below for the circuit board 10d involved by the 4th variation.Figure 10 is overlooked from upside
Circuit board 10d figure.In addition, circuit board 10d is the state not bent in Figure 10.
Circuit board 10d also has wiring conductor layer 21 (one of the 2nd wiring conductor) in addition to wiring conductor layer 20
It is different from circuit board 10 on this point.Hereinafter, illustrated centered on the distinctive points for circuit board 10d.
Wiring conductor layer 21 is arranged in base material 12 so that extend along base material 12, in present embodiment, to be provided in
The conductor layer of wire on dielectric sheet material 18b surface.Wiring conductor layer 21 and wiring conductor layer 20 are substantial parallel, are located at
The front side of wiring conductor layer 20.In addition, wiring conductor layer 21 includes wiring portion 21a~21c.Wiring portion 21a is in the A1 of section
Wiring conductor layer 21.Wiring portion 21b is the wiring conductor layer 21 in the A2 of section.Wiring portion 21c is the wiring conductor in the A3 of section
Layer 21.In addition, when from upside, wiring portion 21b be located at than wiring portion 21a, 21c more posteriorly side (side of width
One) position.That is, wiring conductor layer 21 and wiring conductor layer 20 are substantially in same shape.Further, from upside
When, paddy broken line L1, L3, L5 and mountain broken line L2, L4 intersect in the A2 of section with wiring conductor layer 21.
The circuit board 10d formed as described above may also function as and the identical action effect of circuit board 10.
(the 5th variation)
It is described with reference to the accompanying drawings below for the circuit board 10e involved by the 5th variation.Figure 11 is from front side
Circuit board 10e section A2 figure.
In circuit board 10, base material 12 is in snake to have angle in paddy broken line L1, L3, L5 and mountain broken line L2, L4.
On the other hand, in circuit board 10e, base material 12 is in snake not have in paddy broken line L1, L3, L5 and mountain broken line L2, L4
There is angle.Now, paddy broken line L1, L3, L5 refer to the lowest point that base material 12 is gently bent to form in a manner of downward side protrudes.This
Outside, mountain broken line L2, L4 refer to the mountain top that base material 12 is gently bent to form in a manner of upwardly projecting.
The circuit board 10e formed as described above may also function as and the identical action effect of circuit board 10.
In addition, in circuit board 10e, from front side when, base material 12 is in snake not having angle.Therefore, connect up
Conductor layer 20 from front side when also in snake not having angle.Therefore, can suppress wiring conductor layer 20 paddy broken line L1,
Break at L3, L5 and mountain broken line L2, L4.
(other embodiments)
Circuit board and electronic equipment involved by the utility model be not limited to the circuit board 10,10a~10e with
And electronic equipment 200, it can be changed in its main scope.
In addition, it can also be combined the structure of circuit board 10,10a~10e and electronic equipment 200.
In addition, wiring conductor layer 20 is set to be the signal wire for transmitting high-frequency signal etc., but it is alternatively in addition to signal wire
Power line, ground wire etc..
In addition, in circuit board 10,10a~10e and electronic equipment 200, grounding conductor layer 22,24 is not essential knot
Structure.Accordingly it is also possible to it is not provided with any one party in grounding conductor layer 22,24 both sides or grounding conductor layer 22,24.
In addition, the center of the base material 12 on the center and width of grounding conductor layer 22,24 on width also may be used
It is inconsistent.
In addition, formed with 3 paddy broken line L1, L3, L5 and 2 mountains broken line L2, L4 in circuit board 10,10a~10e,
But as long as the paddy broken line and the mountain broken line of at least more than 1 of at least more than 1 are set.
In addition, paddy broken line L1, L3, L5 and mountain broken line L2, L4 need not extend in the longitudinal direction, also can be relative to front and rear
Direction run-off the straight.For example, paddy broken line L1, mountain broken line L2, paddy broken line L3, mountain broken line L4 and paddy broken line L5 rear end interval
Also the front end than paddy broken line L1, mountain broken line L2, paddy broken line L3, mountain broken line L4 and paddy broken line L5 is spaced at greater.
In addition it is also possible to using the wiring conductor of round wires, flat wire to substitute wiring conductor layer 20,21.
In addition, base material 12 is laminated by 3 layers of dielectric sheet material 18a~18c and formed, but as long as by least 1 layer of sheet material structure
Into.
In addition, connector 100a, 100b are not essential structure.Can also be without using connector 100a, 100b, but outside
Portion terminal 16a, 16b and grounding conductor layer 22 are attached by the connection disc electrode of solder and circuit substrate.
In addition, wiring conductor layer 20 may also set up in the dielectric sheet material 18a back side.Similarly, grounding conductor layer 24
It may be disposed at the dielectric sheet material 18b back side.
Industrial practicality
As described above, the utility model is useful for circuit board and electronic equipment, can particularly suppress
The transmission of noise is excellent on this point in wiring conductor.
Label declaration
10,10a~10e：Circuit board
12：Base material
14：Protective layer
16a, 16b：Outside terminal
18a~18c：Dielectric sheet material
20,21：Wiring conductor layer
20a~20e, 21a~21c：Wiring portion
22,24：Grounding conductor layer
30a~30c, 32a~32c：Connecting conductor layer
100a, 100b：Connector
102：Basal part
104：Cylindrical portion
106：Center conductor
108：External conductor
110a~110d：Outside terminal
150：Breach
200：Electronic equipment
202a, 202b：Circuit substrate
300：Baseplate part
A1~A5：Section C1：Center line
L1, L3, L5：Paddy broken line
L2, L4：Mountain broken line
V1~v14：Via conductors
Claims (15)
- A kind of 1. circuit board, it is characterised in that including：Base material, the base material is in tabular and is in banding, and has pliability；And1st wiring conductor, the 1st wiring conductor is in wire and is arranged at the base material to extend along the base material,The base material has the 1st section and the 2nd section adjacent to each other on the bearing of trend of base material extension,The 1st wiring conductor in 2nd section is compared with the 1st wiring conductor in the 1st section, positioned at more leaning on The position of the side of the width of the base material,In the 2nd section, when from the normal direction of the base material, be provided with the 1st wiring conductor intersect to Paddy broken line more than few more than 1 mountain broken line and at least one.
- 2. circuit board as claimed in claim 1, it is characterised in thatAlso include the 1st grounding conductor layer, when the 1st grounding conductor layer is from the normal direction of the base material, with the 1st cloth Line conductor is overlapping.
- 3. circuit board as claimed in claim 2, it is characterised in thatThe base material be laminated in the stacking direction by multiple insulator layers comprising the 1st insulator layer and the 2nd insulator layer and Form,1st wiring conductor is provided in the conductor layer on the 1st insulator layer,1st grounding conductor layer is arranged on the 2nd insulator layer to extend along the base material.
- 4. circuit board as claimed in claim 2 or claim 3, it is characterised in thatWhen from the normal direction of the base material, in the 1st wiring conductor and the 1st section in the 2nd section The 1st wiring conductor compare, from the center deviation of the 1st grounding conductor layer on the width.
- 5. circuit board as claimed in claim 2 or claim 3, it is characterised in thatAlso include the 2nd grounding conductor layer, when the 2nd grounding conductor layer is from the normal direction of the base material, with the 1st cloth Line conductor is overlapping,1st grounding conductor layer, the 1st wiring conductor and the 2nd grounding conductor layer configure successively.
- 6. circuit board as claimed in claim 5, it is characterised in thatThe base material is being laminated by multiple insulator layers comprising the 1st insulator layer, the 2nd insulator layer and the 3rd insulator layer It is laminated and forms on direction,2nd insulator layer, the 1st insulator layer and the 3rd insulator layer stack gradually,1st wiring conductor is provided in the conductor layer on the 1st insulator layer,1st grounding conductor layer is arranged on the 2nd insulator layer to extend along the base material,2nd grounding conductor layer is arranged on the 3rd insulator layer to extend along the base material.
- 7. such as the circuit board any one of claims 1 to 3,6, it is characterised in thatThe base material includes the 1st insulator layer,1st wiring conductor is provided in the conductor layer on the 1st insulator layer,When from the normal direction of the base material, on the 1st insulator layer in the 2nd section, than the 1st cloth Line conductor more leans on the opposite side of the width, is not provided with conductor.
- 8. such as the circuit board any one of claims 1 to 3,6, it is characterised in thatThe base material includes the 1st insulator layer,1st wiring conductor is provided in the conductor layer on the 1st insulator layer,When from the normal direction of the base material, on the 1st insulator layer in the 2nd section, the described 1st is not provided with Conductor beyond wiring conductor.
- 9. such as the circuit board any one of claims 1 to 3,6, it is characterised in thatWhen from the normal direction of the base material, in the 1st wiring conductor and the 1st section in the 2nd section The 1st wiring conductor compare, from the center deviation of the base material on the width.
- 10. such as the circuit board any one of claims 1 to 3,6, it is characterised in thatWhen from the normal direction of the base material, on the base material in the 2nd section, led than the described 1st wiring Opposite side setting of the body more by the width is jagged.
- 11. such as the circuit board any one of claims 1 to 3,6, it is characterised in thatThe material of the base material contains thermoplastic resin,At paddy broken line more than the mountain broken line of described more than 1 and described at least one, the base material is plastically deformed.
- 12. such as the circuit board any one of claims 1 to 3,6, it is characterised in thatAlso including the 2nd wiring conductor, the 2nd wiring conductor is in wire and is arranged at the base material to extend along the base material,The 2nd wiring conductor in 2nd section is compared with the 2nd wiring conductor in the 1st section, positioned at more leaning on The position of the side of the width of the base material,Paddy broken line more than mountain broken line and described at least one more than described at least one is seen from the normal direction of the base material When examining, intersect in the 2nd section with the 2nd wiring conductor.
- 13. such as the circuit board any one of claims 1 to 3,6, it is characterised in thatIt is curved in a manner of prominent to the side of the width when 2nd section is from the normal direction of the base material It is bent.
- 14. a kind of electronic equipment, it is characterised in that including1st circuit substrate andThe circuit board electrically connected with the 1st circuit substrate,The circuit board includes：Base material, the base material is in tabular and is in banding, and has pliability；And1st wiring conductor, the 1st wiring conductor is in wire and is arranged at the base material to extend along the base material,The base material has the 1st section and the 2nd section adjacent to each other on the bearing of trend of base material extension,The 1st wiring conductor in 2nd section is compared with the 1st wiring conductor in the 1st section, positioned at more leaning on The position of the side of the width of the base material,In the 2nd section, when from the normal direction of the base material, be provided with the 1st wiring conductor intersect to Paddy broken line more than few more than 1 mountain broken line and at least one,It is curved in a manner of prominent to the side of the width when 2nd section is from the normal direction of the base material It is bent.
- 15. electronic equipment as claimed in claim 14, it is characterised in thatAlso include the 2nd circuit substrate,The circuit board electrically connects the 1st circuit substrate with the 2nd circuit substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016002513A JP6515817B2 (en) | 2016-01-08 | 2016-01-08 | Wiring board and electronic device |
| JP2016-002513 | 2016-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206674290U true CN206674290U (en) | 2017-11-24 |
Family
ID=59306300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621474890.0U Active CN206674290U (en) | 2016-01-08 | 2016-12-30 | Circuit board and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6515817B2 (en) |
| CN (1) | CN206674290U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7314793B2 (en) * | 2019-12-20 | 2023-07-26 | 株式会社オートネットワーク技術研究所 | Wiring material |
| CN112290198A (en) * | 2020-09-24 | 2021-01-29 | 中国科学院微电子研究所 | Deformable antenna and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596599A (en) * | 1982-07-05 | 1984-01-13 | 株式会社日立製作所 | Holding structure for flexible printed circuit board |
| JPH0636620A (en) * | 1992-07-14 | 1994-02-10 | Nec Gumma Ltd | Flexible flat cable |
| JP2004235321A (en) * | 2003-01-29 | 2004-08-19 | Seiko Epson Corp | Flexible substrate, manufacturing method of flexible board, electro-optical device and electronic equipment |
| JP2010040720A (en) * | 2008-08-04 | 2010-02-18 | Sharp Corp | Flexible printed wiring board, electronic apparatus module, and electronic information apparatus |
| JP6191991B2 (en) * | 2014-03-31 | 2017-09-06 | パナソニックＩｐマネジメント株式会社 | Stretchable flexible substrate and manufacturing method thereof |
| CN205985285U (en) * | 2014-06-04 | 2017-02-22 | 株式会社村田制作所 | Flexible base plate and electronic equipment |
-
2016
- 2016-01-08 JP JP2016002513A patent/JP6515817B2/en active Active
- 2016-12-30 CN CN201621474890.0U patent/CN206674290U/en active Active
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| Publication number | Publication date |
|---|---|
| JP2017123421A (en) | 2017-07-13 |
| JP6515817B2 (en) | 2019-05-22 |
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