CN206671240U - A kind of oxygen sensor used in vehicle chip containing ceramic binder - Google Patents
A kind of oxygen sensor used in vehicle chip containing ceramic binder Download PDFInfo
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- CN206671240U CN206671240U CN201720286498.1U CN201720286498U CN206671240U CN 206671240 U CN206671240 U CN 206671240U CN 201720286498 U CN201720286498 U CN 201720286498U CN 206671240 U CN206671240 U CN 206671240U
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Abstract
It the utility model is related to a kind of oxygen sensor used in vehicle chip containing ceramic binder, it is characterised in that：First layer substrate, second layer substrate is overrided to form from top to bottom with third layer substrate, working electrode is printed on the top surface of first layer substrate, electrode protecting layer covers on the working electrode (s, electrode print is in the front end of first layer substrate bottom surface in work, border between second layer substrate and third layer substrate is filled with ceramic binder, heating electrode is arranged between second layer substrate and third layer substrate, heat insulating barrier on top of electrodes covering heating electrode, heating electrode base is lined with insulating barrier under heating electrode, which obviate zirconium oxide substrate and heater insulation layer it is heterogeneous caused by laminate delamination splitting phenomenon caused by difficulty is entered, improve the mechanical performance and heat shock resistance and the ability of vibrations of chip, extend service life.
Description
Technical field
A kind of oxygen sensor used in vehicle chip containing ceramic binder is the utility model is related to, belongs to motor vehicle exhaust emission technology
Field.
Background technology
With the fast development of auto industry, automobile pollution problem has had a strong impact on our daily life.Automobile
Hydrocarbon caused by discharge（CH）, carbon monoxide（CO）And nitrogen oxides（NOx）It is the main source of air pollution, to people
The health hazard of body is very big.The emission problem of motor vehicle has been to be concerned by more and more people, each for the above-mentioned environmental problem world
State has all put into effect further strict Abgasgesetz.In order to effectively control pollutant emission, motor vehicle generally use Electronic Control list
The closed-loop feedback control system of member, ternary catalyzing unit and lambda sensor, to reach the purpose of purification exhaust.Ternary catalyzing unit front end
Lambda sensor is converted into electric signal and feeds back to electronic control unit by the detection to oxygen concentration in gas extraction system（ECU）, can
To adjust air and quality of fuel ratio in engine.Only when air-fuel ratio is in ideal zone（14.7:1）When neighbouring, it could arrive
The purpose discharged up to optimal energy-conservation and contaminant restraining.Meanwhile the lambda sensor of ternary catalyzing unit rear end can also play inspection
Survey ternary catalyzing unit whether the effect of normal work.
Oxygen sensor chip is typically made up of solid electrolyte substrate and noble metal electrode.Oxidation as solid electrolyte
Because of it, excellent oxygen ion conduction characteristic is the current industrial most widely used chip base material of lambda sensor to zirconium at high temperature.
Oxygen is on noble metal electrode by catalysis generation oxonium ion O2-, oxonium ion O2-Pass through zirconium oxide substrate transport to opposite side electricity again
On extremely, electrode loop is formed, so as to which oxygen concentration signals are converted into electric signal.Because the lambda sensor operating time phase is in
In the higher blast pipe of temperature, inclement condition, the external force effect of frequent heat-shock vibrations etc., so the machine of ceramic component chip
Tool performance is most important.Patent CN201420171332.1 reports a kind of lamination sheet type oxygen sensor chip structure.The sensing
Device includes inductive layer, lower floor is provided with oxygen reference channel layer and zone of heating.Zone of heating adds to chip when lambda sensor works
Heat, in order to avoid electrical breakdown, insulating barrier must be introduced in the upper and lower surface of heating electrode.In order to preferably make working electrode be heated
Uniformly, then the area for heating electrode is sufficiently large, it is desirable to which the safe distance at the edge of insulating barrier and zirconium oxide substrate is sufficiently small.But
Heterogeneous due to insulating barrier and zirconium oxide substrate, they can not be fused into one well during static pressure so that base after sintering
The ability of cracking and lamination, chip heat shock resistance and vibrations is generally occurred between piece, working life is short.
The content of the invention
The purpose of this utility model is to provide a kind of oxygen sensor used in vehicle chip containing ceramic binder, which obviates oxidation
Zirconium base bottom and heater insulation layer it is heterogeneous caused by laminate delamination splitting phenomenon caused by difficulty is entered, improve the machine of chip
Tool performance and heat shock resistance and the ability of vibrations, extend service life.
What the technical solution of the utility model was realized in：A kind of oxygen sensor used in vehicle chip containing ceramic binder,
By electrode protecting layer, working electrode, first layer substrate, work in electrode, second layer substrate, ceramic binder, heating electrode on
Insulating barrier, third layer substrate, the positive pin of heating electrode, heating electrode bear pin, work under insulating barrier, heating electrode, heating electrode
Electrode pin forms in work；It is characterized in that：First layer substrate, second layer substrate and third layer substrate laminate from top to bottom and
Into working electrode is printed on the top surface of first layer substrate, and electrode protecting layer covers on the working electrode (s, and electrode print exists in work
The front end of first layer substrate bottom surface, the electrode cable of electrode passes through and first layer base from the through hole of first layer substrate rear end in work
Electrode pin connects in the work of piece top surface rear end；Border between second layer substrate and third layer substrate is filled with ceramic bond
Agent, heating electrode are arranged between second layer substrate and third layer substrate, insulating barrier on heating top of electrodes covering heating electrode,
Heating electrode base is lined with insulating barrier under heating electrode, heats insulating barrier on electrode, insulating barrier and second layer base under heating electrode
There is 0.6 mm safe distance between piece, third layer substrate edge, heat the heating wires of electrode from third layer substrate rear end
Through hole passes through to be born pin and is connected with the positive pin of heating electrode of third layer substrate bottom surface rear end, heating electrode.
Insulating barrier under described heating electrode, heating electrode, on heating electrode insulating barrier thickness 5um ~ 30um it
Between.
The thickness of described ceramic binder is 15um ~ 80um.
Good effect of the present utility model is that it is efficiently solved because yttria-stabilized zirconia substrate and heater
The difference of insulating barrier property gives the difficulty brought of overlapping, while shrinkage factor is different when sintering, generally occurred between substrate cracking and point
The problem of layer phenomenon.The mechanical performance and heat shock resistance and the ability of vibrations of chip are effectively improved, extends service life.
Brief description of the drawings
Fig. 1 is structure chart of the present utility model.
Embodiment
The utility model is described further below in conjunction with the accompanying drawings：It is as shown in figure 1, a kind of containing the automobile-used of ceramic binder
Oxygen sensor chip, by electrode 4, second layer substrate 5, ceramics in electrode protecting layer 1, working electrode 2, first layer substrate 3, work
Adhesive 6, heat insulating barrier 9, third layer substrate 10 under insulating barrier 7 on electrode, heating electrode 8, heating electrode, heating electrode just
Pin 11, heating electrode bear pin 12, work in electrode pin 13 form；It is characterized in that：First layer substrate 3, second layer base
Piece 5 is overrided to form from top to bottom with third layer substrate 10, and working electrode 2 is printed on the top surface of first layer substrate 3, electrode protecting layer
1 is covered on working electrode 2, and electrode 4 is printed on the front end of the bottom surface of first layer substrate 3 in work, and the electrode of electrode 4 is led in work
Line is passed through from the through hole of the rear end of first layer substrate 3 and is connected with electrode pin 13 in the work of the top surface rear end of first layer substrate 3；Second
Border between layer substrate 5 and third layer substrate 10 is filled with ceramic binder 6, and heating electrode 8 is arranged in the He of second layer substrate 5
Between third layer substrate 10, insulating barrier 7 on the top covering heating electrode of heating electrode 8, heating electrode 8 bottom is lined with heating electrode
Lower insulating barrier 9, heat insulating barrier 7 on electrode, insulating barrier 9 and second layer substrate 5 under heating electrode, the edge of third layer substrate 10 it
Between have 0.6 mm safe distance, the heating wires of heating electrode 8 are passed through from the through hole of the rear end of third layer substrate 10 and third layer
The positive pin 11 of heating electrode, the heating electrode of the bottom surface rear end of substrate 10 are born pin 12 and connected.
Insulating barrier under described heating electrode, heating electrode, on heating electrode insulating barrier thickness 5um ~ 30um it
Between.
The thickness of described ceramic binder is 15um ~ 80um.
Claims (3)
- A kind of 1. oxygen sensor used in vehicle chip containing ceramic binder, by electrode protecting layer, working electrode, first layer substrate, work Electrode in work, second layer substrate, ceramic binder, insulating barrier under insulating barrier, heating electrode, heating electrode on heating electrode, the Three layers of substrate, the positive pin of heating electrode, heating electrode bear pin, electrode pin composition in work；It is characterized in that：First layer base Piece, second layer substrate and third layer substrate are overrided to form from top to bottom, and working electrode is printed on the top surface of first layer substrate, electrode Protective layer covers on the working electrode (s, the electrode of electrode print electrode in the front end of first layer substrate bottom surface, work in work Wire is passed through from the through hole of first layer substrate rear end and is connected with electrode pin in the work of first layer substrate top surface rear end；The second layer Border between substrate and third layer substrate is filled with ceramic binder, and heating electrode is arranged in second layer substrate and third layer base Between piece, insulating barrier on heating top of electrodes covering heating electrode, heating electrode base is lined with insulating barrier under heating electrode, heating Insulating barrier on electrode, have between insulating barrier and second layer substrate, third layer substrate edge under heating electrode 0.6 mm safety away from From heating the heating wires of electrode from the through hole of third layer substrate rear end through the heating electrode with third layer substrate bottom surface rear end Positive pin, heating electrode bear pin connection.
- 2. according to a kind of oxygen sensor used in vehicle chip containing ceramic binder described in claim 1, it is characterised in that described Heating electrode under insulating barrier, heating electrode, heating electrode on insulating barrier thickness between 5um ~ 30um.
- 3. according to a kind of oxygen sensor used in vehicle chip containing ceramic binder described in claim 1, it is characterised in that described The thickness of ceramic binder be 15um ~ 80um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720286498.1U CN206671240U (en) | 2017-03-23 | 2017-03-23 | A kind of oxygen sensor used in vehicle chip containing ceramic binder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720286498.1U CN206671240U (en) | 2017-03-23 | 2017-03-23 | A kind of oxygen sensor used in vehicle chip containing ceramic binder |
Publications (1)
| Publication Number | Publication Date |
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| CN206671240U true CN206671240U (en) | 2017-11-24 |
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| CN201720286498.1U Active CN206671240U (en) | 2017-03-23 | 2017-03-23 | A kind of oxygen sensor used in vehicle chip containing ceramic binder |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109363248A (en) * | 2018-11-29 | 2019-02-22 | 深圳麦克韦尔股份有限公司 | Electronic cigarette and its atomising device and multilayered structure orient drain atomization core |
-
2017
- 2017-03-23 CN CN201720286498.1U patent/CN206671240U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109363248A (en) * | 2018-11-29 | 2019-02-22 | 深圳麦克韦尔股份有限公司 | Electronic cigarette and its atomising device and multilayered structure orient drain atomization core |
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