CN206622750U - Laser processing device - Google Patents

Abstract

The utility model provides a kind of laser processing device, the maximization of energy restraining device, while the structure of light-gathering optics side is moved relative to workpiece.Laser processing device (200) possesses：Device frame (210), the supporting table (230) for being installed on device frame and supporting workpiece (1), the laser focusing portion (400) for being installed on the laser output section (300) of device frame, being installed in a manner of it can be moved relative to laser output section (300) device frame.Laser output section has the laser oscillator for projecting laser.Laser focusing portion has：Modulate the simultaneously reflective slms of reflection laser, a pair of lens for making laser form the both sides telecentric optical system in imaging relations relative to the condenser lens unit of workpiece (1) optically focused, the reflecting surface (410a) of composition reflective slms and the entrance pupil face of condenser lens unit.

Description

Laser processing device

Technical field

It the utility model is related to laser processing device.

Background technology

A kind of laser processing device is recorded in patent document 1, it possesses the maintaining body of holding workpiece and to being held in The laser radiation mechanism of the workpiece irradiation laser of maintaining body.In the laser radiation mechanism of the laser processing device, will from swash Optical generator is configured in 1 basket to each structure configured on the laser optical path of collector lens, and the basket is fixed on perpendicular Erect the wall portion for the base station for being placed in laser processing device.

Prior art literature

Patent document

Patent document 1：No. 5456510 publications of Japanese Patent No.

Utility model problem to be solved

In laser processing device as described above, make the structure phase that laser is carried out to the light-gathering optics side of optically focused sometimes Moved for workpiece.On the other hand, even if in this case, the maximization of restraining device is also of crucial importance.

Utility model content

The purpose of this utility model is, there is provided a kind of laser processing device, can be made simultaneously with the maximization of restraining device The structure of light-gathering optics side moves relative to workpiece.

For solving the scheme of problem

The utility model provides a kind of laser processing device, possesses：Device frame；Supporting part, it is installed on device frame And support workpiece；Laser output section, it is installed on device frame；Laser focusing portion, it is with relative to laser output section The mode that can be moved is installed on device frame, and laser output section has the LASER Light Source for projecting laser, and laser focusing portion has： Reflective slms, it is modulated and reflection laser；Light-gathering optics, it makes laser be carried out relative to workpiece Optically focused；Imaging optical system, it forms the entrance pupil face of the reflecting surface of reflective slms and light-gathering optics Both sides telecentric optical system in imaging relations.

In the laser processing device, there is reflective slms, light-gathering optics and imaging optical system Laser focusing portion can move relative to the laser output section with LASER Light Source.Thus, for example, with making to be configured at from sharp The situation about moving integrally of each structure on radiant to the laser optical path of light-gathering optics is compared, and can become mobile pair The laser focusing portion lightweight of elephant, the mechanism miniaturization of laser focusing portion movement can be used in.Moreover, reflective spatial light Modulator, light-gathering optics and imaging optical system are used as and integrally moved, and maintain mutual position relationship, therefore, Can be by the picture (laser modulated in reflective slms of the laser in the reflecting surface of reflective slms Picture) accurately pass as (imaging) in the entrance pupil face of light-gathering optics.Therefore, can according to the laser processing device With the maximization of restraining device, while the structure of light-gathering optics side is set to be moved relative to workpiece.

In laser processing device of the present utility model, laser can also be with laser focusing from the injection direction of laser output section The moving direction in portion is consistent.Thus, even if laser focusing portion moves relative to laser output section, can also suppress to laser The position of the incident laser of light collecting part changes.

In laser processing device of the present utility model, laser output section, which can also also have, puts down the laser of laser parallelization Row portion.Thus, even if laser focusing portion moves relative to laser output section, can also suppress to be incident in swashing for laser focusing portion The diameter of light changes.In addition, if laser complete directional light, such as even if laser are not changed into using laser parallelization portion Slightly there is extended corner, laser parallelization can also be made in reflective slms.

In laser processing device of the present utility model, laser focusing portion can also also have basket, and the basket will be from reflection The light path that type spatial light modulator reaches the laser of light-gathering optics via imaging optical system is set in inside, is set in basket Have the light incident section in from the laser light incident that laser output section is projected to basket.Thus, it is possible to consistently maintain from reflection-type Spatial light modulator reaches the state of the laser optical path of light-gathering optics via imaging optical system, while makes laser focusing portion Moved relative to laser output section.

In laser processing device of the present utility model, laser focusing portion can also also have a speculum, the speculum with The mode relative with light incident section is configured in basket on the moving direction in laser focusing portion, and speculum will be incident from light incident section Laser in basket is reflected to reflective slms.Thus, it is possible to make to be incident to laser from laser output section The laser of light collecting part is incident in reflective slms with desired angle.

In laser processing device of the present utility model, supporting part can also be to hang down along the moving direction with laser focusing portion The moveable mode of straight plane is installed on device frame.Thus, it is possible to make the focal point position of laser relative to workpiece In desired position, and on the direction parallel with the plane of the moving direction perpendicular to laser focusing portion, to processing object Thing scanning laser.

In laser processing device of the present utility model, supporting part can also be installed on device frame via the first travel mechanism On, laser focusing portion is installed on device frame via the second travel mechanism.Thus, it is possible to it is reliably carried out supporting part and laser The respective movement of light collecting part.

Utility model effect

According to the utility model, the maximization for being capable of restraining device can be provided, while makes the knot of light-gathering optics side The laser processing device that structure moves relative to workpiece.

Brief description of the drawings

Fig. 1 is the summary construction diagram for forming the laser processing device in modification region；

Fig. 2 is the plan for the workpiece for turning into the object for forming modification region；

Fig. 3 is the profile along the III-III lines of Fig. 2 workpiece；

Fig. 4 is the plan of the workpiece after Laser Processing；

Fig. 5 is the profile along the V-V lines of Fig. 4 workpiece；

Fig. 6 is the profile along the line VI -- VI of Fig. 4 workpiece；

Fig. 7 is the stereogram of the laser processing device of embodiment；

Fig. 8 is mounted to the stereogram of the workpiece of the supporting table of Fig. 7 laser processing device；

Fig. 9 is the profile along the laser output section of Fig. 7 ZX planes；

Figure 10 is the partial perspective view of the laser output section and laser focusing portion in Fig. 7 laser processing device；

Figure 11 is the profile along the laser focusing portion of Fig. 7 X/Y plane；

Figure 12 is the profile along the laser focusing portion of Figure 11 XII-XII lines；

Figure 13 is the profile along the laser focusing portion of Figure 12 XIII-XIII lines；

Figure 14 is the optical configuration of the wavelength Slab element of λ in the laser output section for represent Fig. 9/2 and polarization plate unit The figure of relation；

Figure 15 is the figure of the direction of polarized light in the wavelength Slab element of λ/2 for the laser output section for representing Fig. 9；

Figure 16 is the figure of the direction of polarized light in the polarization plate unit for the laser output section for representing Fig. 9；

Figure 17 is reflective slms, 4f lens units and collector lens in the laser focusing portion for represent Figure 11 The figure of the optical configuration relation of unit；

Figure 18 is the figure of the movement of conjugate point caused by the movement for the 4f lens units for representing Figure 17；

Figure 19 is the wavelength Slab element of λ/2 of integration and the stereogram of polarization plate unit；

Figure 20 is along the wavelength Slab element of λ/2 of Figure 19 ZX planes and the profile of polarization plate unit.

Symbol description

1 ... workpiece, 200 ... laser processing devices, 210 ... device frames, 220 ... first travel mechanisms, 230 ... Supporting table (supporting part), 240 ... second travel mechanisms, 300 ... laser output sections (laser output device), 301 ... installation pedestals, 310 ... laser oscillators (LASER Light Source), 320 ... shutters, 330 ... λ/2 wavelength Slab element (output adjustment portion, direction of polarized light Adjustment portion), 331 ... supports (first support), the wavelength plate of 332 ... λ/2,340 ... polarization plate units (output adjustment portion, polarization Light direction adjustment portion), 341 ... supports (second support), 342 ... polarization plates (polarised light part), 343 ... Light path correction plates (Light path correction part), 350 ... beam expanders (laser parallelization portion), 360 ... mirror units, (the first reflection of 362 ... speculums Mirror), 363 ... speculums (the second speculum), 400 ... laser focusing portions, 401 ... baskets, 401a ... light incident section, 401c ... end Portion, 401d ... ends, 401e ... sides, 402 ... speculums, 403 ... dichroscopes (speculum), 410 ... reflective spatial light Modulator, 410a ... reflectings surface, 421 ... supports, 422 ... lens (the first lens combination, imaging optical system), 423 ... lens (the second lens combination, imaging optical system), 430 ... condenser lens units (light-gathering optics), 440 ... drive mechanisms, 450 ... distance measuring sensors (first sensor, second sensor), XL ... axis, L ... laser.

Embodiment

Hereinafter, with reference to the accompanying drawings of embodiment of the present utility model.In addition, same or equivalent part is marked in the various figures Identical symbol is noted, and the repetitive description thereof will be omitted.

In the laser processing device (aftermentioned) of embodiment, by the way that laser focusing in workpiece, is cut along predetermined Broken string, modification region is formed on workpiece.Therefore, first, 1~Fig. 6 of reference picture illustrates the formation for modifying region.

As shown in figure 1, laser processing device 100 possesses：Pulsed oscillation laser L LASER Light Source 101, changed with 90 ° and swashed The dichroscope 103 that the mode in the direction of light L optical axis (light path) configures, the optically focused lens for making laser L progress optically focused 105.In addition, laser processing device 100 is also equipped with：For supporting the processing pair irradiated by optically focused with the laser L of the optically focused of lens 105 Supporting table 107 as thing 1, for making objective table 111 that supporting table 107 moves, wide in order to adjust laser L output or pulse Degree, impulse waveform etc. and control LASER Light Source 101 LASER Light Source control unit 102, control objective table 111 movement objective table Control unit 115.

In laser processing device 100, the laser L projected from LASER Light Source 101 utilizes dichroscope 103 by the side of its optical axis Change to carrying out 90 °, and the inside for the workpiece 1 being positioned in supporting table 107 is concentrated on using optically focused lens 105. At the same time, move objective table 111, workpiece 1 is relatively moved relative to laser L along predetermined cutting line 5. Thus, workpiece 1 will be formed at along the modification region of predetermined cutting line 5.In addition, here, in order that laser L carries out phase It is to property mobile, and objective table 111 is moved, but can also move optically focused lens 105, or can also move their both sides It is dynamic.

As workpiece 1, can be used comprising the semiconductor substrate formed by semi-conducting material or by piezoelectric shape Into piezoelectric substrate etc. tabular part (for example, substrate, chip etc.).As shown in Fig. 2 it is set with workpiece 1 Predetermined cutting line 5 for cutting off processing object 1.Predetermined cutting line 5 is the imaginary line linearly extended.In workpiece 1 be internally formed modification region in the case of, as shown in figure 3, making focal point (spot position) P alignment workpiece 1 In the state of inside, make laser L along predetermined cutting line 5 (that is, along Fig. 2 arrow A directions) relativity mobile.Thus, As shown in Fig. 4, Fig. 5 and Fig. 6, modification region 7 is formed on workpiece 1 along predetermined cutting line 5, along predetermined cutting line The 5 modification regions 7 formed turn into cut-out starting area 8.

Focal point P is the position that laser L carries out optically focused.Predetermined cutting line 5 is not limited to linear or curve-like, Can also be both three-dimensional shapes of combination or the shape specified of coordinate.Predetermined cutting line 5 is not limited to imaginary line, also may be used To be the line actually drawn on the surface 3 of workpiece 1.Modification region 7 is continuously formed sometimes, is also interrupted landform sometimes Into.Modification region 7 can be column-shaped or point-like, in a word, as long as modification region 7 is at least formed on workpiece 1 Inside.In addition, forming cracking to modify region 7 for starting point sometimes, cracking and modification region 7 can also be in workpieces Expose 1 outer surface (surface 3, the back side or outer peripheral face).Laser entrance face when forming modification region 7 is not limited to processing object The surface 3 of thing 1 or the back side of workpiece 1.

In addition, workpiece 1 be internally formed modification region 7 in the case of, laser L transmission workpiece 1, and And particularly absorbed near the focal point P inside workpiece 1.Thus, modification area is formed on workpiece 1 Domain 7 (that is, absorbed inside type laser machines).In this case, on the surface 3 of workpiece 1, laser L is hardly inhaled Receive, therefore, the surface 3 of workpiece 1 will not melt.On the other hand, modification area is formed on the surface 3 of workpiece 1 In the case of domain 7, laser L is particularly absorbed near the focal point P positioned at surface 3, is melted and is removed from surface 3, and Form the removing unit such as hole or groove (Laser Processing of Surface absorption type).

Modification region 7 refers to that density, refractive index, mechanical strength and other physical characteristics turn into and different shape around The region of state.As modification region 7, such as with：Melt process region (refers to re-solidified region, melting after temporarily melting Region in state and from least any region in the region that melting carries out in re-solidified state), slit region, insulation it is broken Error area, variations in refractive index region etc., also there is the region for mixing these regions.As modification region 7, also there is processing pair As thing 1 material in, modify the density in region 7 region that is changed or formed with crystalline substance compared with the density in non-modification region The region of lattice defect.In the case where the material of workpiece 1 is monocrystalline silicon, it is close that modification region 7 is referred to as high dislocation Spend region.

Melt process region, variations in refractive index region, the density progress compared with the density in non-modification region for modifying region 7 The region changed and the region formed with lattice defect are sometimes in the inside in these regions or modification region 7 and non-modification region Interface on also in bag cracking (rupture, micro-crack).The cracking of interior bag is formed to the entire surface in modification region 7 or sometimes only sometimes Form a part or form some.Workpiece 1 includes the substrate being made up of the crystalline material with crystalline texture.Example As workpiece 1 is included by gallium nitride (GaN), silicon (Si), carborundum (SiC), LiTaO₃And sapphire (Al₂O₃) at least The substrate that any one is formed.In other words, workpiece 1 includes such as gallium nitride base board, silicon substrate, SiC substrate, LiTaO₃ Substrate or sapphire substrate.Crystalline material can also be anisotropy crystallization and isotropism crystallization it is any.In addition, processing Object 1 can also include the substrate being made up of the amorphous material with non-crystalline structure (non crystalline structure), can also include Such as glass substrate.

In embodiment, by forming multiple modification points (cutter trade) along predetermined cutting line 5, modification area can be formed Domain 7.In this case, by concentrating multiple modification points and as modification region 7.Modification point is by 1 pulse of pulse laser Transmitting (the i.e. laser irradiation of 1 pulse：Laser emission) formed modification part.As modification point, crackle point, melting can be enumerated Process points or variations in refractive index point mix modification point of at least one in them etc..For modifying point, cutting for requirement is considered Disconnected precision, the desired flatness of section, the thickness of workpiece 1, species, crystal orientation etc., can by its size or Caused cracking suitable length control.Can be modification region with modification point along predetermined cutting line 5 in addition, in embodiment 7 are formed.

[laser processing device of embodiment]

Then, the laser processing device of embodiment is illustrated.In the following description, by direction mutually orthogonal in horizontal plane X-direction and Y direction are set to, and vertical direction is set to Z-direction.

[overall structure of laser processing device]

As shown in fig. 7, laser processing device 200 possesses：Device frame 210, the first travel mechanism 220, supporting table (support Portion) the 230, second travel mechanism 240.Laser processing device 200 is also equipped with：Laser output section (laser output device) 300, laser Light collecting part 400, control unit 500.

First travel mechanism 220 is installed on device frame 210.First travel mechanism 220 has：First track element 221, Second track element 222, movable base 223.First track element 221 is installed on device frame 210.In the first track element A pair of tracks 221a, 221b extended along Y direction is provided with 221.Second track element 222 is with removable along Y direction Dynamic mode, it is installed on a pair of tracks 221a, 221b of the first track element 221.It is provided with second track element 222 along X A pair of tracks 222a, 222b of direction of principal axis extension.Movable base 223 by along X-direction it is moveable in a manner of, be installed on second A pair of tracks 222a, 222b of track element 222.Movable base 223 can be entered line centered on the axis parallel with Z-direction Row rotation.

Supporting table 230 is installed on movable base 223.Supporting table 230 supports workpiece 1.Workpiece 1 is for example The face side for the substrate being made up of semi-conducting materials such as silicon is rectangularly formed with multiple function element (light such as photodiode The light-emitting components such as element, laser diode or the circuit element etc. formed as circuit).Workpiece 1 is supported in support During platform 230, as shown in figure 8, (more in the surface 1a that such as workpiece 1 is attached on the film 12 of the framework 11 of ring-type opening The face of individual function element side).Supporting table 230 keeps framework 11 using fixture, and utilizes vacuum work disk adsorbed film 12, by This, supports workpiece 1.In supporting table 230, in workpiece 1, by the multiple predetermined cutting line 5a being parallel to each other and The multiple predetermined cutting line 5b being parallel to each other are set to clathrate in a manner of by between adjacent function element.

As shown in fig. 7, supporting table 230 is in the first travel mechanism 220 by being acted the second track element 222, And moved along Y direction.In addition, supporting table 230 is in the first travel mechanism 220 by being acted movable base 223, And moved along X-direction.In addition, supporting table 230 is in the first travel mechanism 220 by being acted movable base 223, And line is rotated centered on the axis parallel with Z-direction.So, supporting table 230 is with can be along X-direction and Y-axis Direction is mobile and line rotatably, is installed on device frame 210 centered on the axis parallel with Z-direction.

Laser output section 300 is installed on device frame 210.Installed via the second travel mechanism 240 in laser focusing portion 400 In on device frame 210.Laser focusing portion 400 is acted by the second travel mechanism 240, and is moved along Z-direction.This Sample, laser focusing portion 400 are installed on device frame in a manner of it can be moved relative to laser output section 300 along Z-direction 210。

Control unit 500 is by CPU (Central Processing Unit), ROM (Read Only Memory) and RAM (Random Access Memory) etc. is formed.Control unit 500 controls the action in 200 each portion of laser processing device.

As one, in laser processing device 200, as follows along each predetermined cutting line 5a, 5b (reference picture 8) in processing pair Modification region is internally formed as thing 1.

First, in a manner of the back side 1b (reference picture 8) of workpiece 1 turns into laser entrance face, workpiece 1 Support in supporting table 230, and each predetermined cutting line 5a of workpiece 1 is consistent with the direction parallel to X-direction.Connect , with laser L focal point be located in the inside of workpiece 1 from the laser entrance face of workpiece 1 leave regulation away from From position mode, move laser focusing portion 400 using the second travel mechanism 240.Then, processing object is consistently maintained The distance of the laser entrance face of thing 1 and laser L focal point, while make laser L focal point along each predetermined cutting line 5a phases It is to property mobile.Thus, along each predetermined cutting line 5a, modification region is internally formed in workpiece 1.

At the end of the formation along each predetermined cutting line 5a modification region, make support using the first travel mechanism 220 Platform 230 rotates, and each predetermined cutting line 5b of workpiece 1 is consistent with the direction parallel to X-direction.Then, with laser L's Focal point is located at the side for the position for leaving predetermined distance in the inside of workpiece 1 from the laser entrance face of workpiece 1 Formula, move laser focusing portion 400 using the second travel mechanism 240.Then, consistently the laser of workpiece 1 is maintained to enter Penetrate the distance of face and laser L focal point, while along each predetermined cutting line 5b, make laser L focal point relativity it is mobile. Thus, along each predetermined cutting line 5b, modification region is internally formed in workpiece 1.

So, in laser processing device 200, the direction parallel with X-direction is set to machine direction (laser L scanning Direction).In addition, moved and along each predetermined cutting line along the relativity of each predetermined cutting line 5a laser L focal point Being moved through of the relativity of 5b laser L focal point makes supporting table 230 along X-direction using the first travel mechanism 220 Move and implement.In addition, movement and each predetermined cutting line of the relativity of the focal point of laser L between each predetermined cutting line 5a Being moved through of the relativity of the focal point of laser L between 5b makes supporting table 230 along Y-axis side using the first travel mechanism 220 Implement to movement.

As shown in figure 9, laser output section 300 has：Installation pedestal 301, cover 302, multiple speculums 303,304.Laser Output section 300 also has：The wavelength Slab element of laser oscillator (LASER Light Source) 310, shutter 320, λ/2 (output adjustment portion, polarization Light direction adjustment portion) 330, polarization plate unit (output adjustment portion, direction of polarized light adjustment portion) 340, (laser is parallel for beam expander Change portion) 350, mirror unit 360.

Installation pedestal 301 is supported by：Multiple speculums 303,304, laser oscillator 310, shutter 320, the wavelength plate list of λ/2 Member 330, polarization plate unit 340, beam expander 350 and mirror unit 360.Multiple speculums 303,304, laser oscillator 310th, the wavelength Slab element 330 of shutter 320, λ/2, polarization plate unit 340, beam expander 350 and mirror unit 360 are installed on On the interarea 301a for filling pedestal 301.Installation pedestal 301 is the part of tabular, can be filled relative to device frame 210 (reference picture 7) Unload.Laser output section 300 is installed on device frame 210 via installation pedestal 301.That is, laser output section 300 is relative to device Framework 210 can load and unload.

Cover 302 covered on the interarea 301a of installation pedestal 301 multiple speculums 303,304, it is laser oscillator 310, fast Door 320, the wavelength Slab element 330 of λ/2, polarization plate unit 340, beam expander 350 and mirror unit 360.Cover 302 is relative to peace Dress pedestal 301 can load and unload.

Laser oscillator 310 makes the laser L of rectilinearly polarized light carry out impulse hunting along X-direction.From laser oscillator The 310 laser L projected wavelength is contained in 500~550nm, 1000~1150nm or 1300~1400nm any wavelength band. The laser L of 500~550nm wavelength band is applied to for example relative to the absorbed inside type laser for the substrate being made up of sapphire add Work.The laser L of 1000~1150nm and 1300~1400nm each wavelength band is applied to for example relative to the substrate being made up of silicon Absorbed inside type Laser Processing.The laser L projected from laser oscillator 310 direction of polarized light is for example to be put down with Y direction Capable direction.The laser L projected from laser oscillator 310 is reflected by speculum 303, and enters along Y direction to shutter 320 Penetrate.

In laser oscillator 310, unlatching/closing of following switched laser L output.Shaken forming laser by Solid State Laser In the case of swinging device 310, by switching the Q-switch in resonator, ((electrooptics is adjusted by AOM (sound equipment optical modulator), EOM Device processed) etc.) unlatching/closing, unlatching/closing of switched laser L output at high speed.Swashed in laser oscillator 310 by optical fiber In the case that light device is formed, pass through the output of switching composition seed laser, the semiconductor laser of laser amplifier (exciting use) Unlatching/closing, and unlatching/closing of switched laser L output at high speed.External modulation member is used in laser oscillator 310 In the case of part, switched by the unlatching/closing for switching the external modulation element (AOM, EOM etc.) outside resonator, and it is high Unlatching/closing of fast ground switched laser L output.

Shutter 320 is opened and closed laser L light path by mechanical mechanism.Laser L opens from the output of laser output section 300 The switching opened/closed as described above, is implemented by unlatching/closing of the output of the laser L in switched laser oscillator 310, but By setting shutter 320, it can prevent such as laser L from not projected with not being intended to from laser output section 300.Pass through the laser L of shutter 320 Reflected by speculum 304, and it is incident successively along X-direction to the wavelength Slab element 330 of λ/2 and polarization plate unit 340.

The wavelength Slab element 330 of λ/2 and polarization plate unit 340 are adjusted as the output of adjustment laser L output (luminous intensity) It is whole to play a role.In addition, λ/2 direction of polarized light as adjustment laser L of wavelength Slab element 330 and polarization plate unit 340 Direction of polarized light adjustment portion play a role.Carry out in detail to them is aftermentioned.Pass sequentially through the wavelength Slab element 330 of λ/2 and partially Shake light plate unit 340 laser L it is incident along X-direction to beam expander 350.

Beam expander 350 adjusts laser L diameter, while makes laser L parallelizations.By the laser L of beam expander 350 along X Direction of principal axis is incident to mirror unit 360.

Mirror unit 360 has support pedestal 361 and multiple speculums 362,363.Support pedestal 361 is supported by multiple Speculum 362,363.Pedestal 361 is supported so that along X-direction and Y direction installation can be installed in a manner of position adjustment Pedestal 301.Speculum (the first speculum) 362 will be reflected by the laser L of beam expander 350 to Y direction.Speculum 362 with Its reflecting surface can be installed on support pedestal 361 around the mode that angle adjustment is for example carried out around the axis parallel with Z axis.Reflection Mirror (the second speculum) 363 reflects the laser L reflected from speculum 362 to Z-direction.Speculum 363 can with its reflecting surface In a manner of carrying out angle adjustment around for example parallel with X-axis axis and position adjustment can be carried out along Y direction, it is installed on Support pedestal 361.The laser L reflected by speculum 363 supports the opening 361a of pedestal 361 by being formed at, along Z-direction It is incident to laser focusing portion 400 (reference picture 7).That is, gather with laser in the laser L projected by laser output section 300 injection direction The moving direction in light portion 400 is consistent.As described above, each speculum 362,363 has the mechanism for the angle for being used to adjust reflecting surface.Instead Penetrate in mirror unit 360, by implement support pedestal 361 relative to the position adjustment of installation pedestal 301, speculum 363 relative to The angle adjustment of the position adjustment of pedestal 361 and the reflecting surface of each speculum 362,363 is supported, is projected from laser output section 300 Laser L optical axis position and angle it is consistent relative to laser focusing portion 400.That is, multiple speculums 362,363 are to be used to adjust The structure of the whole laser L projected from laser output section 300 optical axis.

As shown in Figure 10, laser focusing portion 400 has basket 401.Basket 401 is presented using Y direction as long side direction The shape of rectangular-shape.Second travel mechanism 240 (reference picture 11 and figure are installed on the side 401e of a side of basket 401 13).On basket 401, it is provided with a manner of relative with the opening 361a of mirror unit 360 in the Z-axis direction cylindric Light incident section 401a.The laser L that light incident section 401a makes to project from laser output section 300 is incident into basket 401.Speculum list 360 and light incident section 401a of member is separated from each other makes laser focusing portion 400 be moved along Z-direction using the second travel mechanism 240 The distance that Shi Buhui contacts with each other.

As shown in FIG. 11 and 12, laser focusing portion 400 has speculum 402 and dichroscope 403.Laser focusing portion 400 also have：Reflective slms 410,4f lens units 420, condenser lens unit (light-gathering optics) 430, Drive mechanism 440, a pair of distance measuring sensors (first sensor and second sensor) 450.

Speculum 402 is installed on the bottom surface of basket 401 in a manner of relative with light incident section 401a in the Z-axis direction 401b.Speculum 402 is anti-to the direction parallel with X/Y plane by the laser L being incident in via light incident section 401a in basket 401 Penetrate.Laser L using the parallelization of beam expander 350 of laser output section 300 is incident along Z-direction to speculum 402.That is, swash Light L is incident along Z-direction to speculum 402 as directional light.Therefore, gather laser even with the second travel mechanism 240 Light portion 400 moves along Z-direction, also consistently maintains the state along Z-direction to the incident laser L of speculum 402.By The laser L that speculum 402 reflects is incident to reflective slms 410.

Reflective slms 410 are installed on Y direction in the state of reflecting surface 410a is interior towards basket 401 On basket 401 end 401c.Reflective slms 410 are such as reflective liquid crystal (LCOS：Liquid Crystalon Silicon) spatial light modulator (SLM：Spatial Light Modulator), laser L is modulated, simultaneously Laser L is reflected to Y direction.The laser L for being modulated and being reflected from reflective slms 410 is along Y direction to 4f Lens unit 420 is incident.Here, in the plane parallel with X/Y plane, the laser incident to reflective slms 410 The angle [alpha] that L optical axis and the laser L projected from reflective slms 410 optical axis are formed forms acute angle (for example, 10 ~60 °).That is, laser L is in reflective slms 410 along X/Y plane with acute angle deflection.This is because, suppress to swash Light L incidence angle and angle of reflection simultaneously suppress the reduction of diffraction efficiency, and give full play to the property of reflective slms 410 Energy.In addition, in reflective slms 410, for example, the very thin thickness for having used the optical modulation layer of liquid crystal is several μm~number Ten μm or so, therefore, it is possible to judge that it is substantially identical to inject outgoing plane for the light of reflecting surface 410a and optical modulation layer.

4f lens units 420 have：Support 421, the side of reflective slms 410 lens (the first lens combination, Imaging optical system) 422, lens (the second lens combination, imaging optical system) 423, the slit portion of the side of condenser lens unit 430 Part 424.Support 421 keeps a pair of lens 422,423 and slit part 424.Support 421 consistently maintains the light along laser L The mutual position relationship of a pair of lens 422,423 and slit part 424 on the direction of axle.A pair of lens 422,423 are formed The reflecting surface 410a of the reflective slms 410 and entrance pupil face 430a of condenser lens unit 430 is in imaging and closed The both sides telecentric optical system of system.Thus, the picture (reflection of the laser L on the reflecting surface 410a of reflective slms 410 The laser L modulated in type spatial light modulator 410 picture) condenser lens unit 430 entrance pupil face 430a upload as (into Picture).Formed with slit 424a on slit part 424.Slit 424a is between lens 422 and lens 423 and lens 422 Near focus face.By unwanted part in reflective slms 410 are modulated and are reflected laser L by slit part 424 cut-offs.It is incident along Y direction to dichroscope 403 by the laser L of 4f lens units 420.

Dichroscope 403 makes laser L major part (for example, 95~99.5%) be reflected to Z-direction, and makes laser L's A part of (for example, 0.5~5%) transmits along Y direction.Laser L it is most of in dichroscope 403 along ZX planes with Right angle reflects.It is incident along Z-direction to condenser lens unit 430 from the laser L that dichroscope 403 reflects.

Condenser lens unit 430 is installed on the end 401d (ends of the basket 401 in Y direction via drive mechanism 440 The end of 401c opposite side).Condenser lens unit 430 has support 431 and multiple lens 432.Support 431 keeps multiple Mirror 432.Multiple lens 432 make laser L carry out optically focused relative to the workpiece 1 (reference picture 7) for being supported in supporting table 230. Drive mechanism 440 makes condenser lens unit 430 be moved along Z-direction by the driving force of piezoelectric element.

A pair of distance measuring sensors 450 are installed in a manner of being located at the both sides of condenser lens unit 430 in the X-axis direction The end 401d of basket 401.Each distance measuring sensor 450 to be supported in supporting table 230 workpiece 1 (reference picture 7) swash Light entrance face projects the light (for example, laser) of ranging, and detects the light for the ranging reflected by the laser entrance face, thus, Obtain the displacement data of the laser entrance face of workpiece 1.In addition, distance measuring sensor 450 can use range of triangle mode, The sensor of confocal laser point mode, the confocal point mode of white, spectral interference mode, astigmatism mode etc..

In laser processing device 200, as described above, the direction parallel with X-direction is set into machine direction, and (laser L's sweeps Retouch direction).Therefore, when laser L focal point is moved along each predetermined cutting line 5a, 5b relativity, a pair of rangings sensing To the relativity of condenser lens unit 430 leading distance measuring sensor 450 is taken along each predetermined cutting line 5a, 5b in device 450 Workpiece 1 laser entrance face displacement data.Moreover, consistently to maintain the laser entrance face of workpiece 1 With the mode of the distance of laser L focal point, drive mechanism 440 makes to gather based on the displacement data obtained by distance measuring sensor 450 Optical lens unit 430 moves along Z-direction.

Laser focusing portion 400 has：Beam splitter 461, a pair of lens 462,463, laser L intensity distribution monitoring are taken the photograph As first 464.The laser L for having transmitted dichroscope 403 is divided into reflex components and transmitted component by beam splitter 461.By beam splitter 461 The laser L of reflection is incident successively along Z-direction to a pair of lens 462,463 and camera 464.A pair of lens 462,463 structures The shooting face of entrance pupil face 430a and camera 464 into condenser lens unit 430 are in the both sides telecentricity light of imaging relations System.Thus, the picture of the laser L on the entrance pupil face 430a of condenser lens unit 430 is on the shooting face of camera 464 Pass as (imaging).As described above, the laser L's on the entrance pupil face 430a of condenser lens unit 430 seems in reflective spatial The laser L modulated in optical modulator 410 picture.Therefore, in laser processing device 200, by the shooting knot for monitoring camera 464 Fruit, the operating state of reflective slms 410 can be grasped.

In addition, laser focusing portion 400 has：Beam splitter 471, lens 472, laser L optical axis position monitoring shooting First 473.The laser L for having transmitted beam splitter 461 is divided into reflex components and transmitted component by beam splitter 471.Reflected by beam splitter 471 Laser L it is incident successively along Z-direction to lens 472 and camera 473.Lens 472 make the laser L of incidence in camera Optically focused on 473 shooting face.In laser processing device 200,473 respective shooting result of camera 464 and camera is monitored, together When in mirror unit 360, pass through and implement position adjustment of the support pedestal 361 relative to installation pedestal 301, speculum 363 Relative to angle adjustment (reference picture 9 and the figure of the position adjustment and the reflecting surface of each speculum 362,363 for supporting pedestal 361 10) (laser is relative to condenser lens unit for the deviation that, can correct to the incident laser L of condenser lens unit 430 optical axis The position of 430 intensity distribution deviate and laser L relative to the optical axis of condenser lens unit 430 angle deviating).

Multiple beam splitters 461,471 are configured in the cylinder 404 extended from the end 401d of basket 401 along Y direction. A pair of lens 462,463 are configured in the cylinder 405 stood up along Z-direction on cylinder 404, and camera 464 configures In the end of cylinder 405.Lens 472 are configured in the cylinder 406 stood up along Z-direction on cylinder 404, camera 473 are configured at the end of cylinder 406.Cylinder 405 and cylinder 406 mutually and are set in the Y-axis direction.In addition, beam splitter is transmitted 471 laser L can also be located at the absorption such as damper of the end of cylinder 404, or can also be utilized in suitable purposes.

As shown in FIG. 12 and 13, laser focusing portion 400 has：It is visible light source 481, multiple lens 482, graticule 483, anti- Penetrate mirror 484, half-reflecting mirror 485, beam splitter 486, lens 487, observation camera 488.Visible light source 481 is penetrated along Z-direction Go out visible ray V.Multiple lens 482 make the visible ray V parallelizations projected from visible light source 481.Graticule 483 assigns to visible ray V Graduation mark.Speculum 484 will be reflected from the visible ray V of multiple parallelizations of lens 482 to X-direction.Half-reflecting mirror 485 will be by anti- The visible ray V for penetrating the reflection of mirror 484 is divided into reflex components and transmitted component.By the visible ray V that half-reflecting mirror 485 reflects along Z axis Direction transmitting beam splitter 486 and dichroscope 403, and via condenser lens unit 430 successively, to being supported in supporting table 230 Workpiece 1 (reference picture 7) is irradiated.

The visible ray V for being irradiated in workpiece 1 is reflected by the laser entrance face of workpiece 1, via collector lens Unit 430 is incident to dichroscope 403, and transmits dichroscope 403 along Z-direction.Beam splitter 486 will transmit dichroic The visible ray V of mirror 403 is divided into reflex components and transmitted component.The visible ray V transmission half-reflecting mirrors 485 of beam splitter 486 have been transmitted, It is and incident successively along Z-direction to lens 487 and observation camera 488.Lens 487 take the photograph the visible ray V of incidence in observation As carrying out optically focused on first 488 shooting face.In laser processing device 200, by observing the shooting result of camera 488, The state of workpiece 1 can be grasped.

Speculum 484, half-reflecting mirror 485 and beam splitter 486 are configured at the support installed on the end 401d of basket 401 In 407.Multiple lens 482 and graticule 483 are configured in the cylinder 408 stood up along Z-direction on support 407, can See that light source 481 is configured at the end of cylinder 408.Lens 487 are configured at the cylinder stood up along Z-direction on support 407 In body 409, observation camera 488 is configured at the end of cylinder 409.Cylinder 408 and cylinder 409 mutually and are set in the X-axis direction. In addition, along X-direction the visible ray V of half-reflecting mirror 485 is transmitted and has been reflected in the X-axis direction from beam splitter 486 Light V can also absorb with the damper for the wall portion for being located at support 407 respectively etc., or be utilized in suitable purposes.

In laser processing device 200, it is assumed that have the exchange of laser output section 300.This is because, according to workpiece 1 Specification, processing conditions etc., the wavelength suitable for the laser L of processing is different.Therefore, the laser L of injection wavelength is prepared mutually not Same multiple laser output sections 300.Here, the wavelength for the laser L for preparing to project is contained in 500~550nm wavelength band Laser output section 300, the laser L projected wavelength be contained in laser output section 300 in 1000~1150nm wavelength band and The laser L of injection wavelength is contained in the laser output section 300 in 1300~1400nm wavelength band.

On the other hand, in laser processing device 200, the exchange in laser focusing portion 400 is not assumed that.This is because, laser Light collecting part 400 is corresponding with multiple wavelength (corresponding with mutual discontinuous multiple wavelength bands).Specifically, speculum 402, reflection Type spatial light modulator 410, a pair of lens 422 of 4f lens units 420,423, dichroscope 403 and condenser lens unit 430 grade of lens 432 corresponds to multiple wavelength.Here, laser focusing portion 400 and 500~550nm, 1000~1150nm and 1300 ~1400nm wavelength band is corresponding.This is achieved by the following procedure, i.e. electricity as defined in each structure coating in laser focusing portion 400 is situated between Matter multilayer film etc., in a manner of meeting desired optical property, each structure in design laser focusing portion 400.In addition, laser exports In portion 300, the wavelength Slab element 330 of λ/2 has the wavelength plate of λ/2, and polarization plate unit 340 has polarization plate.The wavelength plate of λ/2 and Polarization plate is the optical element for having wavelength dependency.Therefore, the wavelength Slab element 330 of λ/2 and the conduct of polarization plate unit 340 Each different structure of wavelength band is located at laser output section 300.

[laser optical path and direction of polarized light in laser processing device]

In laser processing device 200, the laser L of optically focused polarization is carried out to the workpiece 1 for being supported in supporting table 230 Light direction is as shown in figure 11, is the direction parallel with X-direction, and consistent with machine direction (laser L scanning direction). This, in reflective slms 410, laser L is reflected as P polarization light.This is because, adjusted in reflective spatial light The optical modulation layer of device 410 processed use liquid crystal in the case of, in order to liquid crystal molecule with comprising to reflective slms 410 The face that the plane of the optical axis for the laser L that injection is projected is parallel is tilted, and during the orientation liquid crystal, inhibiting the rotation in partial wave face In the state of to laser L implementing phases modulate (for example, referring to No. 3878758 publication of patent).On the other hand, dichroscope In 403, laser L is reflected as S-polarization light.This is because, compared with laser L is carried out into reflection as P polarization light, will swash Light L carries out reflecting this side as S-polarization light, for making the multilayer dielectric film corresponding with multiple wavelength of dichroscope 403 Number reduction etc. is applied, the design of dichroscope 403 becomes easy.

Therefore, in laser focusing portion 400, from speculum 402 via reflective slms 410 and 4f lens units The light path of 420 arrival dichroscopes 403 is set in a manner of along X/Y plane, and reaches collector lens list from dichroscope 403 The light path of member 430 is set in a manner of along Z-direction.

As shown in figure 9, in laser output section 300, laser L light path with along X-direction or Y direction (with interarea Plane parallel 301a) mode set.Specifically, the light path of speculum 303, Yi Jicong are reached from laser oscillator 310 Speculum 304 reaches the light of mirror unit 360 via the wavelength Slab element 330 of λ/2, polarization plate unit 340 and beam expander 350 Road is set in a manner of along X-direction, reaches the light path and speculum of speculum 304 via shutter 320 from speculum 303 The light path for reaching speculum 363 in unit 360 from speculum 362 is set in a manner of along Y direction.

Here, the laser L to be advanced along Z-direction from laser output section 300 to laser focusing portion 400 is as shown in figure 11, Reflected using speculum 402 to the direction parallel with X/Y plane, and it is incident to reflective slms 410.Now, with XY In in the parallel plane of plane, the laser L incident to reflective slms 410 optical axis and adjusted from reflective spatial light It is angle [alpha] that the optical axis for the laser L that device 410 processed projects, which forms acute angle,.On the other hand, as described above, in laser output section 300, laser L Light path set in a manner of along X-direction or Y direction.

Therefore, in laser output section 300, it is necessary to not only using the wavelength Slab element 330 of λ/2 and polarization plate unit 340 as The output adjustment portion of adjustment laser L output plays a role, but also the polarised light side of the direction of polarized light as adjustment laser L Played a role to adjustment portion.

[the wavelength Slab element of λ/2 and polarization plate unit]

As shown in figure 14, the wavelength Slab element 330 of λ/2 has the wavelength plate 332 of support (first support) 331 and λ/2.Support 331 by the wavelength plate 332 of λ/2 can in a manner of line is rotated centered on axis (first axle) XL parallel with X-direction, Keep the wavelength plate 332 of λ/2.The wavelength plate 332 of λ/2 is in direction of polarized light relative to its optic axis (for example, fast axles) tilt angle theta And in the case of incident laser L, line makes the θ of the direction of polarized light anglec of rotation 2 and projects laser L (reference pictures centered on axis X L 15)。

Polarization plate unit 340 has：Support (second support) 341, polarization plate (polarised light part) 342, light path are repaiied Positive plate (Light path correction part) 343.Support 341 can be with axis (second axis) with polarization plate 342 and Light path correction plate 343 The mode that line is rotated integrally centered on XL, keep polarization plate 342 and Light path correction plate 343.The light of polarization plate 342 enters Penetrate face and light emergence face tilts predetermined angular (for example, Brewster's angle).Polarization plate 342 makes in the case of incident laser L The laser L consistent with the polarizing axis of polarization plate 342 P polarization light composition transmission, and reflect or absorb laser L S-polarization Light composition (reference picture 16).Light entrance face and light of the light entrance face and light emergence face of Light path correction plate 343 to polarization plate 342 The opposite inclination of outgoing plane is oblique.Light path correction plate 343 makes to leave the light of the laser L on axis X L by transmission-polarizing tabula rasa 342 Axle is back on axis X L.

As described above, in laser focusing portion 400, in the plane parallel with X/Y plane in, to reflective slms 410 Incident laser L optical axis and the laser L projected from reflective slms 410 optical axis form the angle as acute angle Spend α (reference picture 11).On the other hand, in laser output section 300, laser L light path is with along the side of X-direction or Y direction Formula sets (reference picture 9).

Therefore, in polarization plate unit 340, line makes polarization plate 342 and Light path correction plate 343 1 centered on axis X L Body rotates, and as shown in figure 16, makes the polarizing axis of polarization plate 342 relative to the direction tilt angle alpha parallel with Y direction. Thus, the laser L projected from polarization plate unit 340 direction of polarized light is relative to the direction inclination angle parallel with Y direction Spend α.As a result, in reflective slms 410, laser L is reflected as P polarization light, and in dichroscope In 403, laser L is reflected as S-polarization light, and the laser L's of the optically focused of workpiece 1 to being supported in supporting table 230 is inclined The light direction that shakes turns into the direction parallel with X-direction.

In addition, as shown in figure 16, adjust the direction of polarized light to the incident laser L of polarization plate unit 340, and adjust from The luminous intensity for the laser L that polarization plate unit 340 projects.The laser L incident to polarization plate unit 340 direction of polarized light Adjustment is by being implemented as follows, i.e. and in the wavelength Slab element 330 of λ/2, line rotates the wavelength plate 332 of λ/2 centered on axis X L, And as shown in figure 15, the optic axis of the adjustment wavelength plate 332 of λ/2 is relative to the polarised light to the incident laser L of λ/2 wavelength plate 332 The angle in direction (for example, direction parallel with Y direction).

As more than, in laser output section 300, the wavelength Slab element 330 of λ/2 and polarization plate unit 340 serve not only as adjusting The output adjustment portion of laser L output plays a role (in above-mentioned example, output attenuatoin portion), but also as adjustment laser L The direction of polarized light adjustment portion of direction of polarized light play a role.

[4f lens units]

As described above, a pair of lens 422,423 of 4f lens units 420 form the reflection of reflective slms 410 The face 410a and entrance pupil face 430a of condenser lens unit 430 is in the both sides telecentric optical system of imaging relations.It is specific and Speech, as shown in figure 17, the lens 422 of the side of reflective slms 410 and the reflecting surface of reflective slms 410 The distance of light path between 410a turns into the first focal length f1 of lens 422, the He of lens 423 of the side of condenser lens unit 430 The distance of light path between the entrance pupil face 430a of condenser lens unit 430 turns into the second focal length f2 of lens 423, thoroughly The distance of light path between mirror 422 and lens 423 is as the first focal length f1 and the second focal length f2 and (that is, f1+ f2).The light path in the light path of condenser lens unit 430 between a pair of lens 422,423 is reached from reflective slms 410 For a straight line.

In laser processing device 200, from the laser L's on the reflecting surface 410a of increase reflective slms 410 From the viewpoint of effective diameter, the multiplying power M of both sides telecentric optical system meets 0.5 ＜ M ＜ 1 (reduction system).Reflective spatial The effective diameter of laser L on the reflecting surface 410a of optical modulator 410 is bigger, more with the phase pattern modulation laser L of fine. It is more excellent from the viewpoint of elongated from suppression reflective slms 410 to the laser L of condenser lens unit 430 light path Elect 0.6≤M≤0.95 as.Here, (the multiplying power M of both sides telecentric optical system)=(entrance pupil face of condenser lens unit 430 The size of picture on 430a)/(size of the object on the reflecting surface 410a of reflective slms 410).In laser plus In the case that frock puts 200, the multiplying power M of both sides telecentric optical system, the first focal length f1 of lens 422 and lens 423 Second focal length f2 meets M=f2/f1.

In addition, the viewpoint of the effective diameter from the laser L on the reflecting surface 410a for reducing reflective slms 410 From the point of view of, the multiplying power M of both sides telecentric optical system can also meet 1 ＜ M ＜ 2 (amplification system).Reflective slms 410 Reflecting surface 410a on laser L effective diameter it is smaller, the multiplying power of beam expander 350 (reference picture 9) is smaller, with X/Y plane In in parallel plane, the laser L incident to reflective slms 410 optical axis and from reflective spatial light modulation The angle [alpha] (reference picture 11) that the optical axis for the laser L that device 410 projects is formed diminishes.From suppress reflective slms 410 to Up to the laser L of condenser lens unit 430 light path it is elongated from the viewpoint of, more preferably 1.05≤M≤1.7.

In 4f lens units 420, the multiplying power M of both sides telecentric optical system is not 1, therefore, as shown in figure 18, when a pair it is saturating Mirror 422,423 along optical axis move when, the side of condenser lens unit 430 conjugate point movement.Specifically, in (the contractings of multiplying power M ＜ 1 Mini system) in the case of, a pair of lens 422,423 along the side of optical axis direction condenser lens unit 430 move when, condenser lens unit The conjugate point of 430 sides moves to the opposite side of reflective slms 410.On the other hand, in (the amplification systems of multiplying power M ＞ 1 System) in the case of, a pair of lens 422,423 along the side of optical axis direction reflective slms 410 move when, collector lens list The conjugate point of first 430 sides moves to the opposite side of reflective slms 410.Thus, in such as condenser lens unit 430 Installation site produce deviation in the case of, make the conjugate point of the side of condenser lens unit 430 and the incidence of condenser lens unit 430 Pupil plane 430a position alignments.In 4f lens units 420, as shown in figure 11, the multiple elongated hole 421a shapes extended along Y direction Into in the bottom wall of support 421, using the screw tightening via each elongated hole 421a, support 421 is fixed on to the bottom surface of basket 401 401b.Thus, along the position adjustment of a pair of lens 422,423 on the direction of optical axis by adjusting support along Y direction 421 implement relative to the bottom surface 401b of basket 401 fixed position.

[functions and effects]

Laser processing device 200 possesses：Device frame 210, it is installed on device frame 210 and supports workpiece 1 Supporting table 230, the laser output section 300 for being installed on device frame 210, by relative to laser output section 300 it is moveable in a manner of It is installed on the laser focusing portion 400 of device frame 210.Laser output section 300 has the laser oscillator 310 for projecting laser L.Swash Light light collecting part 400 has：Modulate and reflection laser L reflective slms 410, by laser L relative to processing object Thing 1 carries out the condenser lens unit 430 of optically focused, forms the reflecting surface 410a and collector lens of reflective slms 410 The entrance pupil face 430a of unit 430 is in a pair of lens 422,423 of the both sides telecentric optical system of imaging relations.

In laser processing device 200, there are reflective slms 410, condenser lens unit 430 and a pair of lens 422nd, 423 laser focusing portion 400 can move relative to the laser output section 300 with laser oscillator 310.Therefore, example Such as, the entirety of each structure in the light path with making to be configured at the laser L that condenser lens unit 430 is reached from laser oscillator 310 Mobile situation is compared, and can become the lightweight of laser focusing portion 400 of mobile object, can be used in laser focusing portion Second travel mechanism 240 of 400 movements minimizes.Moreover, reflective slms 410, condenser lens unit 430 and one It is mobile as one to lens 422,423, mutual position relationship can be maintained, therefore, can be by reflective slms The picture of laser L on 410 reflecting surface 410a accurately passes picture to the entrance pupil face 430a of condenser lens unit 430.Cause This, can be with the maximization of restraining device according to laser processing device 200, while makes the structure of the side of condenser lens unit 430 relative Moved in workpiece 1.

In laser processing device 200, laser L is from the injection direction (Z-direction) of laser output section 300 and laser focusing portion 400 moving direction (Z-direction) is consistent.Thus, even if laser focusing portion 400 moves relative to laser output section 300, also may be used To suppress to change to the incident laser L in laser focusing portion 400 position.

In laser processing device 200, laser output section 300 also has the beam expander 350 for making laser L parallelizations.Thus, i.e., Laser focusing portion 400 is moved relative to laser output section 300, can also suppress to the incident laser L's in laser focusing portion 400 Diameter changes.In addition, laser L is not changed into complete directional light even with beam expander 350, such as laser L somewhat has expansion Angle is opened up, laser L parallelizations can also be made in reflective slms 410.

In laser processing device 200, laser focusing portion 400 also has will be from reflective slms 410 via one The light path that lens 422,423 are reached with the laser L of condenser lens unit 430 is set in the basket 401 of inside, in basket 401 Provided with the laser L for making to project from the laser output section 300 light incident section 401as incident into basket 401.Thus, it is possible to consistently Maintain the light via the laser L of a pair of arrival condenser lens units 430 of lens 422,423 from reflective slms 410 The state on road, while laser focusing portion 400 is moved relative to laser output section 300.

In laser processing device 200, laser focusing portion 400 also has with the moving direction (Z axis in laser focusing portion 400 Direction) on the mode relative with light incident section 401a be configured at speculum 402 in basket 401, speculum 402 makes incident from light The laser L that portion 401a is incident in basket 401 reflects to reflective slms 410.Thus, it is possible to make to export from laser The laser L that portion 300 is incident in laser focusing portion 400 is incident in reflective slms 410 with desired angle.

In laser processing device 200, supporting table 230 is with vertical along the moving direction (Z-direction) with laser focusing portion 400 The moveable mode of straight plane (X/Y plane) is installed on device frame 210.Thus, laser L focal point position can not only be made In relative to 1 desired position of workpiece, can also be put down in the plane with the moving direction perpendicular to laser focusing portion 400 On capable direction, to the scanning laser L of workpiece 1.

In laser processing device 200, supporting table 230 is installed on device frame 210 via the first travel mechanism 220, Laser focusing portion 400 is installed on device frame 210 via the second travel mechanism 240.Thus, it is possible to it is reliably carried out supporting table 230 and the 400 respective movement of laser focusing portion.

In addition, laser processing device 200 possesses：Device frame 210, it is installed on device frame 210 and support processing object The supporting table 230 of thing 1, relative to device frame 210 removably laser output section 300, be installed on the laser of device frame 210 Light collecting part 400.Laser output section 300 has：Project the wavelength of the λ of the output of laser L laser oscillator 310, adjustment laser L/2 Slab element 330 and polarization plate unit 340.Laser focusing portion 400 has：Modulate and reflection laser L reflective spatial light is adjusted Device 410 processed, laser L is carried out the condenser lens unit 430 of optically focused relative to workpiece 1, form reflective spatial light and adjust The reflecting surface 410a of the device 410 processed and entrance pupil face 430a of condenser lens unit 430 is in the both sides telecentricity light of imaging relations A pair of lens 422,423 of system.

It is and saturating with reflective slms 410, condenser lens unit 430 and a pair in laser processing device 200 The split of laser focusing portion 400 of mirror 422,423, there is the wavelength Slab element 330 of laser oscillator 310 and λ/2 and polarised light The laser output section 300 of Slab element 340 can load and unload relative to device frame 210.Therefore, the specification according to workpiece 1, Processing conditions etc., in the case of the wavelength difference suitable for the laser L of processing, it can unify to exchange and project with it is expected swashing for wavelength Light L laser oscillator 310 and the wavelength Slab element 330 of λ/2 and polarization plate unit 340 with wavelength dependency.Cause This, according to laser processing device 200, can use the mutually different multiple laser oscillators 310 of laser L wavelength.

In laser processing device 200, laser output section 300 also has the wavelength plate list of support laser oscillator 310 and λ/2 Member 330 and polarization plate unit 340 and removably installation pedestal 301, laser output section 300 pass through relative to device frame 210 Device frame 210 is installed on by installation pedestal 301.Thus, it is possible to laser output section 300 is easily loaded and unloaded to device frame 210.

In laser processing device 200, laser output section 300 also has to be used to adjust swashs from what laser output section 300 was projected The speculum 362,363 of light L optical axis.Thus, such as when installing laser output section 300 to device frame 210, can adjust The position of the laser L incident to laser focusing portion 400 optical axis and angle.

In laser processing device 200, the wavelength Slab element 330 of λ/2 and polarization plate unit 340 adjust laser L polarised light Direction.Thus, such as when installing laser output section 300 to device frame 210, can adjust incident to laser focusing portion 400 Laser L direction of polarized light so that adjust from laser focusing portion 400 project laser L direction of polarized light.

In laser processing device 200, the wavelength Slab element 330 of λ/2 and polarization plate unit 340 include the wavelength plate 332 of λ/2 and Polarization plate 342.Thus, it is possible to by the wavelength plate 332 of the λ with wavelength dependency/2 and polarization plate 342 and laser oscillator 310 unified exchanges.

In laser processing device 200, laser output section 300 also has adjustment laser L diameter simultaneously by laser L parallelizations Beam expander 350.Thus, such as in the case of laser focusing portion 400 is moved relative to laser output section 300, The state to the incident laser L in laser focusing portion 400 can consistently be maintained.

In laser processing device 200, reflective slms 410, condenser lens unit 430 and a pair of lens 422, 423 corresponding 500~550nm, 1000~1150nm and 1300~1400nm wavelength band.Thus, it is possible to each wavelength band will be projected Laser L laser output section 300 be installed on laser processing device 200.In addition, the laser L of 500~550nm wavelength band is fitted Laser machined for the absorbed inside type for example relative to the substrate being made up of sapphire.1000~1150nm and 1300~ The laser L of 1400nm each wavelength band is applied to for example laser machine relative to the absorbed inside type for the substrate being made up of silicon.

In addition, laser processing device 200 possesses：The supporting table 230 for supporting workpiece 1, the laser for projecting laser L shake Swing device 310, modulation and reflection laser L reflective slms 410, laser L is gathered relative to workpiece 1 The condenser lens unit 430 of light, the reflecting surface 410a for forming reflective slms 410 and condenser lens unit 430 Entrance pupil face 430a is in a pair of lens 422,423 of the both sides telecentric optical system of imaging relations.From reflective spatial light (that is, from reflection in the laser L of the arrival condenser lens unit 430 of modulator 410 light path, at least through a pair of lens 422,423 The lens 422 of the side of type spatial light modulator 410 reach the lens 423 of the side of condenser lens unit 430) laser L light path be one Straight line.The multiplying power M of both sides telecentric optical system meets 0.5 ＜ M ＜ 1 or 1 ＜ M ＜ 2.In addition, in laser processing device 200, two The multiplying power M of side telecentric optical system, the first focal length f1 of lens 422 and lens 423 the second focal length f2 meet M= f2/f1。

In laser processing device 200, the multiplying power M of both sides telecentric optical system is not 1.Thus, when a pair of lens 422,423 When being moved along optical axis, the conjugate point of the side of condenser lens unit 430 moves.Specifically, (reduced in multiplying power M ＜ 1 System) in the case of, a pair of lens 422,423 along the side of optical axis direction condenser lens unit 430 move when, condenser lens unit The conjugate point of 430 sides moves to the opposite side of reflective slms 410.On the other hand, in (the amplification systems of multiplying power M ＞ 1 System) in the case of, a pair of lens 422,423 along the side of optical axis direction reflective slms 410 move when, collector lens list The conjugate point of first 430 sides moves to the opposite side of reflective slms 410.Thus, for example in condenser lens unit 430 Installation site produce deviation in the case of, the conjugate point of the side of condenser lens unit 430 and condenser lens unit 430 can be made Entrance pupil face 430a position alignments.Moreover, it is saturating at least to reach optically focused from the lens 422 of the side of reflective slms 410 The laser L of the lens 423 of the side of mirror unit 430 light path is a straight line, therefore, can make a pair of lens 422, lens 423 along Optical axis easily moves.Therefore, can be by the reflecting surface 410a of reflective slms 410 according to laser processing device 200 On laser L picture easily and highly accurately pass picture to the entrance pupil face 430a of condenser lens unit 430.

In addition, by being set to 0.5 ＜ M ＜ 1, can increase on the reflecting surface 410a of reflective slms 410 Laser L effective diameter, and can be with the phase pattern modulation laser L of fine.On the other hand, can by being set to 1 ＜ M ＜ 2 To reduce the effective diameter of the laser L on the reflecting surface 410a of reflective slms 410, and can reduce to reflection-type The incident laser L of spatial light modulator 410 optical axis and the laser L projected from reflective slms 410 optical axis institute Into angle [alpha].Suppress laser L and suppress diffraction efficiency relative to the incidence angle and angle of reflection of reflective slms 410 Reduction and to give full play in the performances of reflective slms 410 be very important.

In laser processing device 200, even if multiplying power M meets 0.6≤M≤0.95.Thus, it is possible to maintain above-mentioned 0.5 The effect realized in the case of ＜ M ＜ 1, while more reliably suppress to reach collector lens from reflective slms 410 The laser L of unit 430 light path is elongated.

In laser processing device 200, multiplying power M can also meet 1.05≤M≤1.7.It is set to above-mentioned thus, it is possible to maintain 1 ＜ M ＜ 2 in the case of the effect realized, while more reliably suppress to reach optically focused from reflective slms 410 saturating The laser L of mirror unit 430 light path is elongated.

In laser processing device 200, a pair of lens 422,423 are held in support 421, support 421 consistently maintains edge The mutual position relationship of a pair of lens 422,423 on the direction of laser L optical axis, and is adjusted by the position of support 421 The whole position adjustment implemented along a pair of lens 422,423 on the direction (Y direction) of laser L optical axis.It is thus, it is possible to permanent Surely the mutual position relationship of a pair of lens 422,423 is maintained, while to easily and reliably implements a pair of lens 422,423 Position adjustment (and then position adjustment of conjugate point).

In addition, laser processing device 200 possesses：The supporting table 230 for supporting workpiece 1, the laser for projecting laser L shake Swing device 310, modulation and reflection laser L reflective slms 410, laser L is gathered relative to workpiece 1 The condenser lens unit 430 of light, the reflecting surface 410a for forming reflective slms 410 and condenser lens unit 430 Entrance pupil face 430a be in the both sides telecentric optical system of imaging relations a pair of lens 422,423, make to have passed through a pair it is saturating The dichroscope 403 that the laser L of mirror 422,423 reflects to condenser lens unit 430.Reflective slms 410 will swash Light L (includes the plane and XY for the light path that reflective slms 410 are injected with the laser L projected along defined plane The parallel plane of plane) and with acute angle deflection.Two are reached from reflective slms 410 via a pair of lens 422,423 Set to the laser L of Look mirror 403 light path in a manner of along the plane.Condenser lens unit 430 is reached from dichroscope 403 Laser L light path set in a manner of along the direction (Z-direction) with the level-crossing.

In laser processing device 200, from reflective slms 410 via a pair of lens 422,423 reach two to The laser L of Look mirror 403 light path is set in a manner of along defined plane, and condenser lens unit is reached from dichroscope 403 430 laser L light path is set in a manner of along the direction with the level-crossing.Thus, it is possible to make such as laser L as P Polarised light reflects in reflective slms 410 and laser L is reflected as S-polarization light in speculum.This will reflect The picture of laser L on the reflecting surface 410a of type spatial light modulator 410 is high to the entrance pupil face 430a of condenser lens unit 430 Pass to precision as being above very important.In addition, reflective slms 410 by laser L with acute angle deflection.Suppress laser L is suppressing the reduction of diffraction efficiency and given full play to anti-relative to the incidence angle and angle of reflection of reflective slms 410 It is very important in the performance of emitting spatial light modulator 410.In accordance with the above, can be with according to laser processing device 200 By the picture of the laser L on the reflecting surface 410a of reflective slms 410 to the entrance pupil face of condenser lens unit 430 Picture is accurately passed on 430a.

In laser processing device 200, from dichroscope 403 reach condenser lens unit 430 laser L light path with along The mode in the direction orthogonal with above-mentioned plane (plane parallel with X/Y plane) is set, and dichroscope 403 is by laser L with right angle Reflection.Thus, it is possible to the light for the laser L that condenser lens unit 430 is reached from reflective slms 410 is handled with right angle Road.

In laser processing device 200, the laser L for having passed through a pair of lens 422,423 is reflected to condenser lens unit 430 Speculum be dichroscope 403.Thus, it is possible to the part for the laser L for having transmitted dichroscope 403 is used for various use On the way.

In laser processing device 200, reflective slms 410 are reflected laser L as P polarization light, and two Reflected to Look mirror 403 using laser L as S-polarization light.Thus, it is possible to the reflecting surface by reflective slms 410 The picture of laser L on 410a accurately passes picture to the entrance pupil face 430a of condenser lens unit 430.

Laser processing device 200, which is also equipped with being configured at from laser oscillator 310, reaches reflective slms 410 In laser L light path, and adjust the wavelength Slab element 330 of the λ of laser L direction of polarized light/2 and polarization plate unit 340.By This, reflective slms 410 possess laser L with the function of acute angle deflection, and can adjust laser L polarised light side To, therefore, can with right angle handle from laser oscillator 310 reach reflective slms 410 laser L light path.

In addition, laser processing device 200 possesses：The supporting table 230 for supporting workpiece 1, the laser for projecting laser L shake Swing device 310, modulation and reflection laser L reflective slms 410, laser L is gathered relative to workpiece 1 The condenser lens unit 430 of light, the reflecting surface 410a for forming reflective slms 410 and condenser lens unit 430 Entrance pupil face 430a be in the both sides telecentric optical system of imaging relations a pair of lens 422,423, make to have passed through a pair it is saturating Dichroscope 403 that the laser L of mirror 422,423 reflects to condenser lens unit 430, the laser light incident for obtaining workpiece 1 The distance measuring sensor 450 of one side of the displacement data in face.The laser L of condenser lens unit 430 light is reached from dichroscope 403 Road is set in a manner of (Z-direction) along a first direction.From reflective slms 410 via a pair of lens 422, 423 reach the laser L of dichroscope 403 light path in a manner of along the second direction (Y direction) vertical with first direction Setting.The distance measuring sensor 450 of one side is configured on the third direction (X-direction) vertical with first direction and second direction The side of condenser lens unit 430.

In laser processing device 200, with relative to condenser lens unit 430, the relativity of distance measuring sensor 450 of a side Leading mode, to the scanning laser L of workpiece 1, thus, it is possible to obtain processing pair before laser L is irradiated to the position As thing 1 any part in laser entrance face displacement data.Thus, it is possible to for example consistently to maintain workpiece 1 Laser entrance face and laser L focal point distance mode, to the scanning laser L of workpiece 1.In addition, the survey of a side Reach the laser L of condenser lens unit 430 light path from reflective slms 410 relative to configuration away from sensor 450 Plane (plane parallel with YZ planes) be configured at side.That is, relative to poly- from the arrival of reflective slms 410 Each structure configured in the laser L of optical lens unit 430 light path, expeditiously configure the distance measuring sensor 450 of a side.Cause This, can be with the maximization of restraining device according to laser processing device 200, while obtains the laser entrance face of workpiece 1 Displacement data.

In laser processing device 200, the laser L for having passed through a pair of lens 422,423 is reflected to condenser lens unit 430 Speculum be dichroscope 403.Thus, it is possible to the part for the laser L for having transmitted dichroscope 403 is used for various use On the way.

In laser processing device 200, dichroscope 403 is reflected laser L as S-polarization light.Thus, by along Third direction (X-direction) can make laser L scanning direction and laser L polarised light to the scanning laser L of workpiece 1 Direction is consistent with each other.For example, along predetermined cutting line workpiece 1 be internally formed modification region in the case of, lead to It is consistent with each other to cross the direction of polarized light of the scanning direction for making laser L and laser L, can expeditiously form modification region.

Laser processing device 200 is also equipped with：At least support reflective slms 410, condenser lens unit 430, A pair of lens 422,423, the basket 401 of the distance measuring sensor 450 of the side of dichroscope 403 and one；(Z axis side along a first direction To) make basket 401 move the second travel mechanism 240.The distance measuring sensor 450 of the side of condenser lens unit 430 and one is installed on The end 401d of basket 401 in second direction (Y direction).Second travel mechanism 240 is installed on third direction (X-direction) On basket 401 a side side 401e.Thus, it is possible to the maximization of restraining device, while make reflective spatial light modulation Device 410, condenser lens unit 430, a pair of lens 422,423, the distance measuring sensor 450 of the side of dichroscope 403 and one are used as one Body moves.

Laser processing device 200 is also equipped with the driving for along a first direction (Z-direction) moving condenser lens unit 430 Mechanism 440.Condenser lens unit 430 is via drive mechanism 440, the end for the basket 401 being installed in second direction (Y direction) Portion 401d.Thus, for example, can be consistently to maintain the distance of the laser entrance face of workpiece 1 and laser L focal point Mode, move condenser lens unit 430.

In laser processing device 200, reflective slms 410 are installed on the basket in second direction (Y direction) The end 401c of body 401.Thus, it is possible to each structure is expeditiously configured to basket 401.

Laser processing device 200 is also equipped with obtaining the opposing party's of the displacement data of the laser entrance face of workpiece 1 Distance measuring sensor 450.The distance measuring sensor 450 of the opposing party is configured at condenser lens unit 430 on third direction (X-direction) Opposite side.Thus, with relative to condenser lens unit 430, the leading mode in the relativity of distance measuring sensor 450 of side ground, During to 1 scanning laser L of workpiece, the distance measuring sensor 450 of a side can be used to obtain the displacement data of laser entrance face. On the other hand, with relative to condenser lens unit 430, the leading mode in the relativity of distance measuring sensor 450 of the opposing party ground, pair plus During 1 scanning laser L of work object, the distance measuring sensor 450 of the opposing party can be used to obtain the displacement data of laser entrance face.Separately Outside, the distance measuring sensor 450 of a side reaches condenser lens unit 430 relative to configuration from reflective slms 410 The plane (plane parallel with YZ planes) of laser L light path is configured at side, and the distance measuring sensor 450 of the opposing party is relative to this Planar configuration is in opposite side.Thus, it is possible to reach condenser lens unit 430 to being configured at from reflective slms 410 Laser L light path on each structure, expeditiously configure a pair of distance measuring sensors 450.

In addition, laser output section 300 possesses：Project laser L laser oscillator 310；Adjustment is penetrated from laser oscillator 310 The wavelength Slab element 330 of the λ of the laser L gone out output/2 and polarization plate unit 340；To pass through the wavelength Slab element 330 of λ/2 and The mirror unit 360 that the laser L of polarization plate unit 340 projects to outside；With being configured with the ripple of laser oscillator 310, λ/2 The interarea 301a of long Slab element 330 and polarization plate unit 340 and mirror unit 360 installation pedestal 301.Shaken from laser Swing device 310 reached via the wavelength Slab element 330 of λ/2 and polarization plate unit 340 mirror unit 360 laser L light path with Set along the mode of the plane parallel with interarea 301a.Mirror unit 360 has the reflection for the optical axis for being used to adjust laser L Mirror 362,363, laser L is projected along the direction (Z-direction) with the level-crossing to outside.

In laser output section 300, by laser oscillator 310, the wavelength Slab element 330 of λ/2 and polarization plate unit 340 and Mirror unit 360 is configured on the interarea 301a of installation pedestal 301.Thus, the device frame to laser processing device 200 is passed through Frame 210 loads and unloads installation pedestal 301, can easily load and unload laser output section 300 to laser processing device 200.In addition, from laser Oscillator 310 reaches the laser L of mirror unit 360 light path via the wavelength Slab element 330 of λ/2 and polarization plate unit 340 Set in a manner of along the plane parallel with the interarea 301a of installation pedestal 301, mirror unit 360 will along with the plane Laser L is projected in the direction of intersection to outside.Thus, such as in the case where laser L injection direction is along vertical direction, swash Light output part 300 is thinned, and therefore, can easily load and unload laser output section 300 relative to laser processing device 200.In addition, Mirror unit 360 has the speculum 362,363 for the optical axis for being used to adjust laser L.Thus, to laser processing device 200 Device frame 210 when installing laser output section 300, the position of the optical axis to the incident laser L in laser focusing portion 400 can be adjusted Put and angle.More than, laser output section 300 can easily load and unload relative to laser processing device 200.

In laser output section 300, mirror unit 360 will swash along the direction orthogonal with the plane parallel to interarea 301a Light L projects to outside.Thus, it is possible to make the adjustment facilitation of the optical axis of the laser L in mirror unit 360.

In laser output section 300, the wavelength Slab element 330 of λ/2 and polarization plate unit 340 are adjusted from laser oscillator 310 The laser L of injection direction of polarized light.Thus, laser output section is being installed to the device frame 210 of laser processing device 200 When 300, the direction of polarized light to the incident laser L in laser focusing portion 400 can be adjusted and then adjusted from laser focusing portion 400 The laser L of injection direction of polarized light.

In laser output section 300, the wavelength Slab element 330 of λ/2 and polarization plate unit 340 have：From laser oscillator 310 The laser L of injection is along the wavelength plate 332 of λ incident axis X L (axis parallel with interarea 301a)/2；So that axis X L to be set to Center line, the wavelength plate 332 of λ/2 rotatably keep the support 331 of the wavelength plate 332 of λ/2；The wavelength plate 332 of λ/2 is passed through Polarization plates 342 of the laser L along axis X L incidences；So that axis X L is set into center line polarization plate 342 rotatably, Keep the support 341 of polarization plate 342.Thus, it is possible to the laser L projected with easy structural adjustment from laser oscillator 310 Output and direction of polarized light.In addition, possess the wavelength Slab element 330 of this λ/2 and polarization plate list by laser output section 300 Member 340, the wavelength plate 332 of λ/2 and polarization plate of the wavelength for corresponding to the laser L projected from laser oscillator 310 can be used 342。

Laser output section 300 is also equipped with Light path correction plate 343, the Light path correction plate 343 so that axis X L is set into center line, The mode that can be rotated integrally with polarization plate 342 is held in support 341, and transmission-polarizing tabula rasa 342, thus, will leave axle The optical axis of laser L on line XL is back to the Light path correction plate 343 on axis X L.Thus, it is possible to correct transmission-polarizing tabula rasa 342 The deviation of caused laser L light path.

In laser output section 300, axis that axis and polarization plate 342 that the wavelength plate 332 of λ/2 is rotated are rotated For axis X L, and it is consistent with each other.That is, the wavelength plate 332 of λ/2 and polarization plate 342 line can be carried out centered on same axis X L Rotation.Thus, it is possible to realize summary and the miniaturization of laser output section 300.

In laser output section 300, mirror unit 360 has support pedestal 361 and speculum 362,363, and branch support group Seat 361 is installed on installation pedestal 301 in a manner of it can carry out position adjustment, and speculum 362 is can carry out angle adjustment Mode is installed on support pedestal 361, passed through the laser L of the wavelength Slab element 330 of λ/2 and polarization plate unit 340 along with master Direction reflection parallel face 301a, and speculum 363 is installed on support pedestal 361 in a manner of it can carry out angle adjustment, will The laser L reflected by speculum 362 is reflected along the direction intersected with interarea 301a.Thus, to laser processing device When 200 device frame 210 installs laser output section 300, it can more precisely adjust and swash to laser focusing portion 400 is incident The position of light L optical axis and angle.Moreover, by the way that support pedestal 361 is carried out into position adjustment relative to installation pedestal 301, can So that speculum 362,363 is easily carried out into position adjustment with one.

Laser output section 300, which is also equipped with being configured at from the wavelength Slab element 330 of λ/2 and polarization plate unit 340, reaches reflection In the laser L of mirror unit 360 light path, adjustment laser L diameter simultaneously makes the beam expander 350 of laser L parallelizations.Thus, even if In the case of being moved in laser focusing portion 400 relative to laser output section 300, can also consistently it maintain to laser focusing portion 400 incident laser L state.

Laser output section 300, which is also equipped with being configured at from laser oscillator 310, reaches the wavelength Slab element 330 of λ/2 and polarised light In the laser L of Slab element 340 light path and opening and closing laser L light path shutter 320.Thus, it is possible to pass through laser oscillator 310 In laser L output unlatching/closing switching, implement laser L from unlatching/closing of the output of laser output section 300 Switching.In addition, using shutter 320, can prevent from for example not projecting laser L with not being intended to from laser output section 300.

[variation]

Embodiment of the present utility model is this concludes the description of, but the utility model is not limited to above-mentioned embodiment.

For example, as shown in FIG. 19 and 20, the wavelength Slab element 330 of λ/2 and the one of polarization plate unit 340 can also be made Change.In this case, keep the support 331 of the wavelength plate 332 of λ/2 by by axis X L be set to center line it is rotatable in a manner of, peace On the end face of a side loaded on framework 370.The support 341 of polarization plate 342 and Light path correction plate 343 is kept so that axis X L to be made Centered on the mode that is rotated of line, be installed on the end face of the opposing party of framework 370.Framework 370 is installed on installation pedestal 301 Interarea 301a.In addition, it is provided with the damper for the S-polarization light composition for absorbing the laser L reflected by polarization plate 342 in support 341 344。

Alternatively, it is also possible to set the polarised light part beyond polarization plate 342 in polarization plate unit 340.As one, Polarization plate 342 and Light path correction plate 343 can also be replaced using cubic polarised light part.Cubic polarised light part The part for the shape that rectangular-shape is presented, and in the part mutually relative side be set to light entrance face and light emergence face and The part of layer with polarization plate function is set in-between.

In addition, λ/2 the axis that rotates of wavelength plate 332 can also be mutually internally inconsistent with the axis that polarization plate 342 rotates.

In addition, laser output section 300 has the reflection for the optical axis for being used to adjust the laser L projected from laser output section 300 Mirror 362,363, but as long as the speculum for the optical axis for being used to adjust the laser L projected from laser output section 300 with least one is Can.

In addition, the reflecting surface 410a of reflective slms 410 and the entrance pupil face of condenser lens unit 430 The imaging optical system that 430a forms the both sides telecentric optical system in imaging relations is not limited to a pair of lens 422,423, Can also be comprising the side of reflective slms 410 the first lens combination (for example, cemented lens, the lens of more than 3 Deng) and the side of condenser lens unit 430 the system of the second lens combination (for example, cemented lens, the lens of more than 3 etc.) etc..

In addition, in laser focusing portion 400, the laser L of a pair of lens 422,423 will have been passed through to condenser lens unit 430 The speculum of reflection is dichroscope 403, but the speculum can also be total reflection speculum.

In addition, condenser lens unit 430 and a pair of distance measuring sensors 450 are installed on the end of the basket 401 in Y direction 401d, but as long as the center than the basket 401 in Y direction is more installed by end 401d sides.Reflective spatial Optical modulator 410 is installed on the end 401c of the basket 401 in Y direction, but as long as than in the basket 401 in Y direction More installed by end 401c sides heart position.In addition, distance measuring sensor 450 can also only be configured in the X-axis direction it is poly- The side of optical lens unit 430.

In addition, laser processing device of the present utility model is not limited to be internally formed modification region in workpiece 1 Device or implement ablation etc., the device of other Laser Processings.

Claims (11)

1. A kind of 1. laser processing device, it is characterised in that

   Possess：

   Device frame；

   Supporting part, it is installed on described device framework and support workpiece；

   Laser output section, it is installed on described device framework；

   Laser focusing portion, it is installed on described device framework in a manner of it can be moved relative to the laser output section,

   The laser output section has the LASER Light Source for projecting laser,

   The laser focusing portion has：

   Reflective slms, it is modulated and reflects the laser；

   Light-gathering optics, it makes the laser carry out optically focused relative to the workpiece；And

   Imaging optical system, it forms the incidence of the reflecting surface and the light-gathering optics of the reflective slms Pupil plane is in the both sides telecentric optical system of imaging relations.
2. 2. laser processing device as claimed in claim 1, it is characterised in that

   The laser is consistent with the moving direction in the laser focusing portion from the injection direction of the laser output section.
3. 3. laser processing device as claimed in claim 2, it is characterised in that

   The laser output section also has the laser parallelization portion for making the laser parallelization.
4. 4. such as laser processing device according to any one of claims 1 to 3, it is characterised in that

   The laser focusing portion also has basket, and the basket will be from the reflective slms via the image optics The light path that system reaches the laser of the light-gathering optics is set in inside,

   The light incident section being provided with the basket in the laser light incident to the basket that will be projected from the laser output section.
5. 5. laser processing device as claimed in claim 4, it is characterised in that

   The laser focusing portion also has a speculum, the speculum with the moving direction in the laser focusing portion with the light The relative mode in incident section is configured in the basket,

   The speculum adjusts the laser being incident to from the smooth incident section in the basket to the reflective spatial light Device processed is reflected.
6. 6. such as laser processing device according to any one of claims 1 to 3, it is characterised in that

   The supporting part is installed in a manner of it can be moved along the plane vertical with the moving direction in the laser focusing portion Described device framework.
7. 7. laser processing device as claimed in claim 4, it is characterised in that

   The supporting part is installed in a manner of it can be moved along the plane vertical with the moving direction in the laser focusing portion Described device framework.
8. 8. laser processing device as claimed in claim 5, it is characterised in that

   The supporting part is installed in a manner of it can be moved along the plane vertical with the moving direction in the laser focusing portion Described device framework.
9. 9. laser processing device as claimed in claim 6, it is characterised in that

   The supporting part is installed on described device framework via the first travel mechanism,

   The laser focusing portion is installed on described device framework via the second travel mechanism.
10. 10. laser processing device as claimed in claim 7, it is characterised in that

    The supporting part is installed on described device framework via the first travel mechanism,

    The laser focusing portion is installed on described device framework via the second travel mechanism.
11. 11. laser processing device as claimed in claim 8, it is characterised in that

    The supporting part is installed on described device framework via the first travel mechanism,

    The laser focusing portion is installed on described device framework via the second travel mechanism.