CN206619452U

CN206619452U - Chip resistor substrate

Info

Publication number: CN206619452U
Application number: CN201720340560.0U
Authority: CN
Inventors: 邱基华; 童文欣
Original assignee: Chaozhou Three Circle Group Co Ltd
Current assignee: Chaozhou Three Circle Group Co Ltd
Priority date: 2017-03-31
Filing date: 2017-03-31
Publication date: 2017-11-07
Anticipated expiration: 2027-03-31

Abstract

A kind of chip resistor substrate, it is rectangle, chip resistor is respectively equipped with a plurality of slot segmentation with width along its length with substrate, a plurality of slot segmentation intersects vertically the chip resistor multiple base board units is divided into substrate, in the slot segmentation of length direction and the slot segmentation of width, the slot segmentation in one of direction is folding bar slot segmentation, and the slot segmentation in another direction is folding grain slot segmentation；The two ends of folding grain slot segmentation are with the edge of chip resistor substrate with interval, and the end of folding grain slot segmentation passes through perpendicular intersecting and is in outermost folding bar slot segmentation, and the two ends of folding bar slot segmentation are flushed with chip resistor with the edge of substrate.Folding grain slot segmentation and the edge of the substrate have spaced distance, it is thus eliminated that most of stress release, the problem of substrate that reducing stress release causes high-temperature calcination to be formed easily ftractures, and then enhance the intensity of substrate, the scrappage of high temperature sintering is reduced, production efficiency is improved.

Description

Chip resistor substrate

Technical field

The utility model is related to technical field of electronic components, more particularly to a kind of chip resistor substrate.

Background technology

At present, the chip resistor such as 1206W matrix shape ceramic substrate is ground with the production technology of substrate generally by powder Mill, slurrying, flow casting molding, punching press indentation, high temperature sintering, amendment, classification and inspection process are made.Wherein in punching press indentation technique In, ceramic green is stamped and formed out slot segmentation on its surface by diel, then must arrive surface by high-temperature calcination and be carved with necessarily The flaky pottery substrate of the slot segmentation of depth.The effect of this slot segmentation is mainly to form single substrate, is easy to after silk-screen printing point Granulate Chip-R.And the edge of ceramic green causes it to carry out high temperature sintering formation ceramic substrate due to the presence of slot segmentation When, the ceramic substrate that stress release is resulted in easily produces cracking, and then causes production process or follow-up screen printing swiped through Journey produces sliver, causes whole substrate to be scrapped, reduces production efficiency.

Utility model content

Based on this, it is necessary to provide a kind of scrappage for reducing high temperature sintering and improve the chip resistor use of production efficiency Substrate.

A kind of chip resistor substrate, it is rectangle, the chip resistor with substrate along its length with width side To a plurality of slot segmentation is respectively equipped with, a plurality of slot segmentation intersects vertically the chip resistor multiple bases is divided into substrate Slab element；In the slot segmentation of the slot segmentation of the length direction and the width, the slot segmentation in one of direction is folding Bar slot segmentation, the slot segmentation in another direction is folding grain slot segmentation；The two ends of the folding grain slot segmentation and the chip resistor There is interval with the edge of substrate, the end of the folding grain slot segmentation is intersected and in outermost folding bar point through perpendicular Groove is cut, the two ends of the folding bar slot segmentation are flushed with the chip resistor with the edge of substrate.

The chip resistor substrate, the two ends of folding bar slot segmentation are flushed with the edge of substrate, i.e. the two of folding bar slot segmentation End is through the two ends of chip resistor substrate, so that ensure subsequently can smooth folding bar, it is to avoid can not slitting or slitting produce compared with The problem of big burr.And it rolls over grain slot segmentation and edge has interval, it is thus eliminated that most of stress release, reduce in response to The problem of substrate that power release causes high-temperature calcination to be formed easily ftractures, and then the intensity of substrate is enhanced, reduce high temperature burning The scrappage of knot, improves acceptance rate and production efficiency.

In one of the embodiments, a plurality of slot segmentation is uniformly distributed, and the base board unit includes a long side and one Slot segmentation where short side, and the short side of the base board unit is the folding bar slot segmentation, the long side place of the base board unit Slot segmentation for it is described folding grain slot segmentation.

In one of the embodiments, the end of the folding grain slot segmentation is intersected and in outermost through perpendicular The length of folding bar slot segmentation is 1/2 of the short side dimension no more than the base board unit.

In one of the embodiments, the end of the folding grain slot segmentation is intersected and in outermost through perpendicular The length of folding bar slot segmentation is 1/6 of the short side dimension no more than the base board unit.

In one of the embodiments, the depth that grain slot segmentation is rolled over described in the depth ratio of the folding bar slot segmentation is big.

In one of the embodiments, the width of the folding bar slot segmentation is bigger than the width of the folding grain slot segmentation.

In one of the embodiments, the depth of the folding bar slot segmentation is the chip resistor substrate gross thickness 1/2~4/5, the width of the folding bar slot segmentation is 15~30 microns.

In one of the embodiments, the depth of the folding grain slot segmentation is the chip resistor substrate gross thickness 1/3~3/5, the width of the folding grain slot segmentation is 10~20 microns.

In one of the embodiments, the chip resistor is silicon carbide substrate, silicon nitride board, zirconium oxide with substrate Substrate or alundum (Al2O3) substrate.

Brief description of the drawings

Fig. 1 is the structure chart of the chip resistor substrate of an embodiment.

Embodiment

For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings State.Preferred embodiment of the present utility model is given in accompanying drawing.But, the utility model can come real in many different forms It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to public affairs of the present utility model The understanding for opening content is more thorough comprehensive.

It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.

Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model The implication that the technical staff in domain is generally understood that is identical.It is herein to be in term used in the description of the present utility model The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein "and/or" includes The arbitrary and all combination of one or more related Listed Items.

Reference picture 1, the chip resistor substrate 10 of the embodiment of the utility model one, it is rectangle.

Chip resistor is respectively equipped with a plurality of slot segmentation 110, a plurality of segmentation with substrate 10 with width along its length Groove 110 intersects vertically chip resistor substrate 10 being divided into multiple base board units 120.

It is noted that chip resistor with substrate 10 after follow-up silk-screen printing, be divided into granular Chip-R normal Flow is：First all slot segmentations 110 along its length or all slot segmentation 110 in the width direction by silk-screen printing it Chip resistor substrate 10 afterwards is converted into strip；Then slot segmentation 110 again in another direction is converted into granular.

In the slot segmentation of length direction and the slot segmentation of width, the slot segmentation in one of direction is folding bar slot segmentation 112, the slot segmentation in another direction is folding grain slot segmentation 114.Roll over two ends and the chip resistor substrate 10 of grain slot segmentation 114 Edge there is interval, and folding grain slot segmentation 114 end through perpendicular intersecting and in outermost folding bar slot segmentation 112.The two ends of folding bar slot segmentation 112 are flushed with chip resistor with the edge of substrate 10.That is the two ends of folding bar slot segmentation 112 are passed through The two ends of sheet assemble resistor substrate 10, so that ensure subsequently can smooth folding bar, it is to avoid can not slitting or slitting produce it is larger The problem of burr

Chip resistor substrate 10, it is rolled over grain slot segmentation 114 and has spaced distance with edge, it is thus eliminated that greatly Part stress release, the problem of substrate that reducing stress release causes high-temperature calcination to be formed easily ftractures, and then enhance The intensity of substrate, reduces the scrappage of high temperature sintering, improves acceptance rate and production efficiency.

Specifically, a plurality of slot segmentation 110 is uniformly distributed.That is on length direction of the chip resistor with substrate 10 A plurality of slot segmentation 110 be uniformly distributed, a plurality of slot segmentation 110 on width of the chip resistor with substrate 10 is also uniform Distribution；So obtained each base board unit 120 is identical.

More specifically, base board unit 120 includes a long side and a short side, according to the long side of base board unit 120 and short side institute Direction determine folding bar slot segmentation and folding grain slot segmentation.It is preferred that, the slot segmentation where the short side of base board unit 120 is folding bar Slot segmentation 112, the slot segmentation where the long side of base board unit 120 is folding grain slot segmentation 114.Folding grain during folding grain can be so avoided to divide Cut the too short bad operation of length of groove 114.

Specifically, the end of folding grain slot segmentation 114 is intersected and in outermost folding bar slot segmentation 112 through perpendicular Length be no more than base board unit 120 short side dimension 1/2.Most of stress release can be so eliminated, high temperature is reduced The scrappage of sintering.

It is furthermore preferred that the end of folding grain slot segmentation 114 is intersected and in outermost folding bar slot segmentation through perpendicular 112 length is 1/6 of the short side dimension no more than base board unit 120.The length that the end of folding grain slot segmentation 114 is passed through is herein In the range of can reduce the scrappage of high temperature sintering to greatest extent.Specifically in the present embodiment, the short side dimension of base board unit is 3.02mm, the end of folding grain slot segmentation 114 passes through length perpendicular intersecting and in outermost folding bar slot segmentation 112 For 0.5mm.

In another embodiment, the end of folding grain slot segmentation 114 is intersected and in outermost folding bar through perpendicular The length of slot segmentation 112 is the 1/3~1/2 of the short side dimension of base board unit 120.The length that the end of folding grain slot segmentation 114 is passed through Degree can also take into account folding grain slot segmentation 114 formation substrate list of the edge of chip resistor substrate 10 along the part within this range Member 120 so that a plurality of slot segmentation 110 intersects vertically whole chip resistor substrate 10 being divided into multiple base board units 120, I.e. the edge of chip resistor substrate 10 also can be along slot segmentation formation base board unit 120.

Specifically, the depth of the depth ratio folding grain slot segmentation 114 of folding bar slot segmentation 112 is big.The width of folding bar slot segmentation 112 Width than rolling over grain slot segmentation 114 is big.

Specifically in the present embodiment, the depth of folding bar slot segmentation 112 for the gross thickness of chip resistor substrate 10 1/2~ 4/5, the width of folding bar slot segmentation 112 is 15~30 microns.Specifically, the depth of folding grain slot segmentation 114 is used for chip resistor The 1/3~3/5 of the gross thickness of substrate 10, the width of folding grain slot segmentation 114 is 10~20 microns.

Specifically in the present embodiment, chip resistor substrate 10 is ceramic substrate.More specifically, chip resistor base Plate 10 is silicon carbide substrate, silicon nitride board, oxidation zirconia substrate or alundum (Al2O3) substrate.It is appreciated that corresponding substrate is It is made up of corresponding material.

Specifically, it can be formed when the slot segmentation 110 is processed using the high-temperature calcination after the blade cutting of former diel.It is right The blade by the marginal position of correspondence punching press chip resistor substrate 10 in former diel answered is removed, and controls blade Length.The chip resistor is low for the transformation difficulty of former diel with substrate 10, it is adaptable to the life of original production line Production.

Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, the scope of this specification record is all considered to be.

Embodiment described above only expresses several embodiments of the present utility model, and it describes more specific and detailed, But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that for the common skill of this area For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to Protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims

1. a kind of chip resistor substrate, it is characterised in that the chip resistor is rectangle with substrate, the plate resistor Device is respectively equipped with a plurality of slot segmentation with substrate with width along its length, and a plurality of slot segmentation intersects vertically described Formula resistor is divided into multiple base board units with substrate；The slot segmentation of the slot segmentation of the length direction and the width In, the slot segmentation in one of direction is folding bar slot segmentation, and the slot segmentation in another direction is folding grain slot segmentation；The folding grain point Cutting the two ends of groove and the edge of the chip resistor substrate has interval, and the end of the folding grain slot segmentation is passed through hangs down with it Side that is straight intersecting and being in outermost folding bar slot segmentation, the two ends of the folding bar slot segmentation and the chip resistor substrate Edge is flushed.

2. chip resistor substrate as claimed in claim 1, it is characterised in that a plurality of slot segmentation is uniformly distributed, institute Base board unit is stated including the slot segmentation where a long side and a short side, and the short side of the base board unit for the folding bar to split Groove, the slot segmentation where the long side of the base board unit is the folding grain slot segmentation.

3. chip resistor substrate as claimed in claim 2, it is characterised in that the end of the folding grain slot segmentation pass through with It intersects vertically and the length in outermost folding bar slot segmentation is 1/2 of the short side dimension no more than the base board unit.

4. chip resistor substrate as claimed in claim 3, it is characterised in that the end of the folding grain slot segmentation pass through with It intersects vertically and the length in outermost folding bar slot segmentation is 1/6 of the short side dimension no more than the base board unit.

5. the chip resistor substrate as described in any one of Claims 1 to 4, it is characterised in that the folding bar slot segmentation The depth that grain slot segmentation is rolled over described in depth ratio is big.

6. chip resistor substrate as claimed in claim 5, it is characterised in that the width of the folding bar slot segmentation is than described The width for rolling over grain slot segmentation is big.

7. chip resistor substrate as claimed in claim 6, it is characterised in that the depth of the folding bar slot segmentation is described Chip resistor is with the 1/2~4/5 of substrate gross thickness, and the width of the folding bar slot segmentation is 15~30 microns.

8. chip resistor substrate as claimed in claim 7, it is characterised in that the depth of the folding grain slot segmentation is described Chip resistor is with the 1/3~3/5 of substrate gross thickness, and the width of the folding grain slot segmentation is 10~20 microns.

9. the chip resistor substrate as described in any one of Claims 1 to 4, it is characterised in that the chip resistor is used Substrate is silicon carbide substrate, silicon nitride board, oxidation zirconia substrate or alundum (Al2O3) substrate.