CN206611650U - Circuit board encapsulating die - Google Patents
Circuit board encapsulating die Download PDFInfo
- Publication number
- CN206611650U CN206611650U CN201720296242.9U CN201720296242U CN206611650U CN 206611650 U CN206611650 U CN 206611650U CN 201720296242 U CN201720296242 U CN 201720296242U CN 206611650 U CN206611650 U CN 206611650U
- Authority
- CN
- China
- Prior art keywords
- pallet
- circuit board
- cylinder
- clip
- encapsulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The utility model discloses a kind of circuit board encapsulating die, including a U-shaped pallet, a cylinder with certain altitude is placed inside pallet, the outer wall of cylinder and the inwall of pallet fit together, also there is clip that one is made up of plastic elastic plate, that two ends are annular shape, the clip has certain thickness.Circuit board section is placed between the annulus of clip, due to the effect of elastic force, circuit board section nature, without tilting, is then placed within pallet into vertical direction, cylinder is inserted into pallet, i.e. can be with encapsulating, glue is transparent adhesive tape, separates cylinder and pallet after drying, and takes out the circuit board section after encapsulating, circuit board section inside cylindric transparent colloid, can now be polished.
Description
【Technical field】
The utility model is related to mould, specifically a kind of circuit board encapsulating die.
【Background technology】
In circuit boring manufacture field, in order to which inspection institute processes the quality in hole, it is necessary to which the hole of circuit board is ground off typically,
Single circuit board can not be ground, it is necessary to will together be ground after circuit board encapsulating.
【Utility model content】
The utility model provides a kind of circuit board encapsulating die, easily can carry out encapsulating to circuit board.
The utility model solve its technical problem use technical scheme be:
There is provided and one is placed inside a kind of circuit board encapsulating die, including a U-shaped pallet, pallet with certain altitude
Cylinder, the outer wall of cylinder and the inwall of pallet fit together, also with one be made up of plastic elastic plate, two ends be annular shape
Clip, the clip has certain thickness.
It is used as further program of the utility model:The top edge of the pallet stretches out the first flange, the cylinder
Top edge stretches out the second flange.
The beneficial effects of the utility model are:Due to circuit board encapsulating die of the present utility model, including a U-shaped support
A cylinder with certain altitude is placed inside disk, pallet, the outer wall of cylinder and the inwall of pallet fit together, also had
Clip that one is made up of plastic elastic plate, that two ends are annular shape, the clip has certain thickness, circuit board is cut into slices and placed
Between the annulus of clip, due to the effect of elastic force, circuit board section nature, without tilting, is then placed within into vertical direction
In pallet, cylinder is inserted into pallet, you can with encapsulating, glue is transparent adhesive tape, cylinder and pallet are separated after drying, taken out after encapsulating
Circuit board section, circuit board section can be polished now inside cylindric transparent colloid.
The top edge of pallet stretches out the first flange, and the top edge of cylinder stretches out the second flange, and two flanges are used for will
Conveniently exerted oneself when cylinder and pallet separation.
【Brief description of the drawings】
Fig. 1 is the utility model section of structure;
Fig. 2 is clip schematic diagram;
Fig. 3 is Fig. 1 A direction views;
Fig. 4 is to be put into supporting spring and cylinder schematic diagram after circuit board section is clamped by clip;
The utility model is described further below in conjunction with the accompanying drawings:
【Embodiment】
The utility model structure refers to Fig. 1 to Fig. 4:
The utility model provides a kind of circuit board encapsulating die, including a U-shaped pallet 1, and the inside of pallet 1 places one
Cylinder 2 with certain altitude, the outer wall of cylinder 2 and the inwall of pallet 1 fit together, and are also made up with one of plastic elastic plate
, two ends be circular clip 3, the clip 3 has certain thickness.
The top edge of pallet 1 stretches out the first flange 4, and the top edge of cylinder stretches out the second flange 5, and two flanges are used for
Conveniently exerted oneself when cylinder and pallet are separated..
Circuit board section 6 is placed between the annulus of clip, due to the effect of elastic force, circuit board section 6 is natural into perpendicular
Nogata is then placed within pallet to without tilting, and cylinder is inserted into pallet, you can with encapsulating, and glue is transparent adhesive tape, after drying
Cylinder and pallet are separated, the circuit board section after encapsulating is taken out, circuit board is cut into slices now inside cylindric transparent colloid, can
To be polished.
It is obvious to a person skilled in the art that this patent is not limited to the details of above-mentioned one exemplary embodiment, Er Qie
Without departing substantially from this patent spirit or essential attributes in the case of, this patent can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of this patent is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the claim involved by limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It may be appreciated other embodiment.
Claims (2)
1. a kind of circuit board encapsulating die, it is characterised in that:Placing one including a U-shaped pallet, inside pallet has one
Determine the cylinder of height, the outer wall of cylinder and the inwall of pallet fit together, also with one be made up of plastic elastic plate, two ends be
Circular clip, the clip has certain thickness.
2. a kind of circuit board encapsulating die according to claim 1, it is characterised in that:The top edge of the pallet is stretched out
First flange, the top edge of the cylinder stretches out the second flange.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720296242.9U CN206611650U (en) | 2017-03-24 | 2017-03-24 | Circuit board encapsulating die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720296242.9U CN206611650U (en) | 2017-03-24 | 2017-03-24 | Circuit board encapsulating die |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206611650U true CN206611650U (en) | 2017-11-03 |
Family
ID=60171793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720296242.9U Expired - Fee Related CN206611650U (en) | 2017-03-24 | 2017-03-24 | Circuit board encapsulating die |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206611650U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111551123A (en) * | 2020-04-30 | 2020-08-18 | 铜陵精达里亚特种漆包线有限公司 | Method for detecting coating uniformity of paint film of enameled wire |
-
2017
- 2017-03-24 CN CN201720296242.9U patent/CN206611650U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111551123A (en) * | 2020-04-30 | 2020-08-18 | 铜陵精达里亚特种漆包线有限公司 | Method for detecting coating uniformity of paint film of enameled wire |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171103 Termination date: 20180324 |