CN206601595U - Electric monitoring platform based on multiprocessor - Google Patents

Electric monitoring platform based on multiprocessor Download PDF

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Publication number
CN206601595U
CN206601595U CN201720263383.0U CN201720263383U CN206601595U CN 206601595 U CN206601595 U CN 206601595U CN 201720263383 U CN201720263383 U CN 201720263383U CN 206601595 U CN206601595 U CN 206601595U
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China
Prior art keywords
module
multiprocessor
series
launchpad
monitoring platform
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Expired - Fee Related
Application number
CN201720263383.0U
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Chinese (zh)
Inventor
胡仁杰
张旭东
郑磊
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Southeast University
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Southeast University
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Priority to CN201720263383.0U priority Critical patent/CN206601595U/en
Application granted granted Critical
Publication of CN206601595U publication Critical patent/CN206601595U/en
Expired - Fee Related legal-status Critical Current
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Abstract

The utility model is related to a kind of electric monitoring platform based on multiprocessor, including mainboard, processor module, Digital Analog Hybrid Circuits module;The mainboard includes the Digital Analog Hybrid Circuits module interface of power management submodule, communication submodule, PWM control submodules, man-machine interaction submodule, the processor module interface of IDC dual-in-line forms and the socket types of FX 8;The processor module is used using ARM TM4C129 Series of MCU or MSP430/432 series monolithics as the Launchpad development boards of core;The integrated FPGA of Digital Analog Hybrid Circuits module and modulus, D/A converter module, and with high-speed data acquisition with producing function.The characteristics of the utility model is to be based on multiprocessor, takes into account a variety of different observing and controlling demands, modularized design is integrated with the functions such as measurement, control, communication, display.

Description

Electric monitoring platform based on multiprocessor
Technical field
The utility model is related to a kind of monitoring platform, specifically refers to a kind of electric observing and controlling based on multiprocessor and puts down Platform.
Background technology
Existing embedded system monitoring platform, mainly using single plate structure, by processor processor, memory, communication mould Block, data measurement module, control module, human-computer interaction module etc. are integrated on one piece of circuit board, flexibility during use, logical It is restricted with property.The device is by the way of processor processor is directly integrated on mainboard, it is impossible to should according to different Different types of controller is selected with occasion and user's request;While the only integrated single-processor of the device, without FPGA and mould In the case of number, D/A converter module, growth data and address bus and the function of offer high-speed data processing, it is difficult to take into account height The data acquisition demand of the difference index such as precision, high-speed, and above-mentioned functions are for a practical, general electric survey Control platform often indispensable.
Utility model content
The purpose of this utility model is to overcome the weak point in above-mentioned background technology to be based on multiprocessor there is provided one kind Electric monitoring platform, its processor module, Digital Analog Hybrid Circuits module use the installation side directly plugged by socket Formula, opening and flexibility with hardware construction.Processor module uses the Launchpad systems using different controllers as core Row development board, can select the processor of difference in functionality according to different user demands.The integrated FPGA of Digital Analog Hybrid Circuits module and mould Number, D/A converter module, for high-speed data processing and address and the data/address bus of extensible processor, lead in order to constitute one Electric monitoring platform.
To reach above-mentioned purpose, the method that the utility model is used is:
A kind of electric monitoring platform based on multiprocessor, includes mainboard, processor module, Digital Analog Hybrid Circuits mould Block;The mainboard integrated communication submodule, PWM control submodules, man-machine interaction submodule and power management submodule;The place Reason device module is used using ARM-TM4C129 Series of MCU or MSP430/432 series monolithics as the Launchpad of core Development board, and be arranged on by IDC dual-in-lines socket on mainboard;The integrated FPGA of Digital Analog Hybrid Circuits module and modulus, D/A converter module, with high-speed data acquisition with producing function, and is arranged on by the socket of FX-8 models in straight cutting form On mainboard;Remaining submodule is directly integrated on mainboard.
40 pin IDC dual-in-lines of the processor module interface compatibility using MSP430/432 series monolithics as core The Launchpad development boards of interface standard, and the 80 pin IDC biserials by core of ARM-TM4C129 Series of MCU are straight The Launchpad development boards of interface standard, and can by multigroup wire jumper above-mentioned two series Launchpad development boards it Between switch over selection.
The wire jumper is by using correct jumper cap short circuit mode, when processor module is used with MSP430/432 series When single-chip microcomputer is the Launchpad development boards of core, processor bus is connected to main board bus;When processor module use with When ARM-TM4C129 Series of MCU is the Launchpad development boards of core, processor bus is respectively connecting to mainboard total The bus of line and the integrated FPGA of Digital Analog Hybrid Circuits module.
The processor module uses the 80 pin interface standards using ARM-TM4C129 Series of MCU as core During Launchpad development boards, the integrated FPGA of Digital Analog Hybrid Circuits module data, address, controlling bus are connected to processor The Peripheral Interface EPI buses of module.
The Digital Analog Hybrid Circuits module has the function such as high-speed data acquisition and generation, includes sampling rate 500Msps Dual channel high speed DAC D/A converting circuits, sampling rate 200Msps high-speed ADC analog to digital conversion circuit, support difference and list Hold the ADC prime modulate circuits of two kinds of power-supplying forms of two kinds of analog signal input forms and single, double power supply;The high-speed digital-analog, Analog-digital converter interface bus is connected with FPGA terminals in a parallel fashion.
The power management submodule is respectively processor module, Digital Analog Hybrid Circuits module, the different voltages of mainboard offer The numeral or analog DC power supply of grade.
The communication submodule includes Ethernet interface, RS232 interfaces, USB interface.
The PWM control submodules provide frequency Pulse Width adjustable pwm signal of 8 tunnels through isolation drive, may be connected directly to External motor drive control circuit.
The man-machine interaction submodule includes 4*4 matrix keyboards, LCDs, USB interface;The USB interface connection To the FPGA terminals that Digital Analog Hybrid Circuits module is integrated.
Beneficial effect:
Compared with prior art, the utility model has advantages below:Processor module, Digital Analog Hybrid Circuits module are used The mounting means plugged by socket, with hardware flexibility, processor module can be selected at different type according to user's request Device is managed, versatility is stronger, the design based on multiprocessor takes into account the different observing and controlling demands such as high accuracy, high-speed, with work( Can integrality.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is processor module interface diagram of the present utility model;
Fig. 3 is Digital Analog Hybrid Circuits modular structure schematic diagram of the present utility model;
Fig. 4 is man-machine interaction sub-modular structure schematic diagram of the present utility model;
Fig. 5 is power management sub-modular structure schematic diagram of the present utility model.
Embodiment
The technical scheme provided below with reference to specific embodiment the utility model is described in detail, it should be understood that following Embodiment is merely to illustrate the utility model rather than limits scope of the present utility model.
As shown in figure 1, the electric monitoring platform based on multiprocessor, including:Processor module, Digital Analog Hybrid Circuits Module, power management submodule, communication submodule, man-machine interaction submodule, PWM control submodules.
Processor module is used using ARM-TM4C129 Series of MCU or MSP430/432 series monolithics as core Launchpad development boards.For example by core of ARM TM4C1294 microcontrollers, the Launchpad of 80 pin interface standards opens Send out plate and by core of MSP432P401R single-chip microcomputers, the Launchpad development boards of 40 pin interface standards.
As shown in Fig. 2 being integrated with four groups of IDC dual-in-lines of compatible above two Launchpad interface standards on mainboard Socket(20 pins), i.e. IDC dual-in-lines socket 101, IDC dual-in-lines socket 102, IDC dual-in-lines socket 201 and IDC Dual-in-line socket 202, and according to different Launchpad development board types, select different by multigroup pin wire jumper of L-shaped four Processor bus type of attachment.
When processor module uses the Launchpad development boards using ARM-TM4C129 Series of MCU as core, lead to Cross 301 pin of L-shaped corner wire jumper and 302 pin short circuits, 303 pin and 304 pin short circuits, can be by processor Peripheral Interface EPI buses FPGA terminals are connected to, processor data, address and controlling bus are connected to mainboard data, address and controlling bus.Processor Module can the FPGA integrated with Digital Analog Hybrid Circuits module simultaneously, and the integrated submodule of mainboard enters row data communication, control etc. Operation.
When processor module uses the Launchpad development boards using MSP430/432 series monolithics as core, pass through 301 pin of wire jumper and 303 pin short circuits, 302 pin and 304 pin are hanging, processor data, address and controlling bus can be connected to Mainboard data, address and controlling bus.The processor module submodule integrated with mainboard enters the behaviour such as row data communication, control Make.
As shown in figure 3, Digital Analog Hybrid Circuits module include FX8 sockets 101, FX8 sockets 102, SMA interfaces J201, J202, J203, J204, J301, J302, J305, high-speed DAC change-over circuit 205, signal conditioning circuit 303, high-speed ADC change-over circuit 304, external power interface 306, FPGA401.
Digital Analog Hybrid Circuits module is arranged on mainboard by way of FX8 sockets 101, FX8 sockets 102 are with straight cutting. FPGA is Artix-7 Series FPGA chips, and part FPGA buses are connected to the Peripheral Interface EPI buses of processor module(Work as place When managing device for ARM-TM4C129 Series Controllers), part FPGA terminals are connected to the USB interface of man-machine interaction submodule, in addition Each 16 tunnel of I/O interface of 1.8V, 3.3V voltage class is drawn respectively(PMOD interfaces).
High-speed DAC change-over circuit 205 uses dual channel high speed DAC chip DAC3162, sampling rate 500Msps, FPGA401 is connected with DAC buses using parallel mode, and DAC sampling clocks are provided by FPGA.DAC outputs support difference and single-ended Both of which.
High-speed ADC change-over circuit 304 uses single channel high-speed ADC chip ADS4128, and sampling rate 200Msps, data connect Mouth is connected to FPGA using parallel mode.ADS4128 sampling clocks may be selected by the onboard clock sources of FPGA(100MHZ)Or it is external Clock source is provided.
Signal conditioning circuit 303 uses high speed operation amplifier LMH6554, supports that difference, single-ended two kinds of analog signals are defeated Enter form, support two kinds of power-supplying forms of single dual power supply ,+5V single ended power supplies can be both provided by board mounted power, can also pass through external electricity Source interface 306 provides both-end positive-negative power.
As shown in figure 4, man-machine interaction submodule includes USB interface 101, liquid crystal display 102, matrix keyboard 103;VGA The controlling bus of interface 101 is connected to FPGA terminals, and liquid crystal display 102 uses 12864 liquid crystal displays, and matrix keyboard 103 is adopted With 4*4 key-press matrix keyboards, the controlling bus of liquid crystal display and matrix keyboard is connected to processor module bus.
As shown in figure 5, power management submodule includes D/C power socket 101, power-switching circuit 102, Power convert electricity Road 103, power-switching circuit 104.The power supply that D/C power socket 101 turns 12V/3.5A specifications by 220V power frequency ACs is fitted Orchestration provides 12V constant voltage dc sources to mainboard.Power-switching circuit 102 uses switching mode integrated voltage-stabilized chip LM2596 to number Mould hybrid circuit module provides 5V/1.5A constant voltage dc source.Power-switching circuit 103 uses switching mode integrated voltage-stabilized chip LM2596 provides 5V/0.5A constant voltage dc source to processor module.Power-switching circuit 104 is adjusted using low drop voltage Device LM1117 provides 3.3V/0.5A constant voltage dc source to the integrated digital circuit of mainboard.
Technological means disclosed in the utility model scheme is not limited only to the technological means disclosed in above-mentioned embodiment, also Including being combined constituted technical scheme by above technical characteristic.

Claims (8)

1. a kind of electric monitoring platform based on multiprocessor, it is characterised in that include mainboard, processor module, digital-to-analogue Hybrid circuit module, communication submodule, PWM control submodules, man-machine interaction submodule and power management submodule;The processing Device module uses Launchpad series exploitation plates, and is arranged on by socket on mainboard;The Digital Analog Hybrid Circuits module is integrated FPGA and modulus, D/A converter module, with high-speed data acquisition with producing function, and are arranged on mainboard in straight cutting form; Described communication submodule, PWM control submodules, man-machine interaction submodule and power management submodule is directly integrated in mainboard On.
2. the electric monitoring platform according to claim 1 based on multiprocessor, it is characterised in that:Described processing The Launchpad of the compatible 40 pin IDC dual-in-line interface standards by core of MSP430/432 series monolithics of device module Series exploitation plate, and 80 pin IDC dual-in-line interface standards by core of ARM-TM4C129 Series of MCU Launchpad series exploitation plates, and can be cut by multigroup wire jumper between the Launchpad development boards of above-mentioned two series Change selection.
3. the electric monitoring platform according to claim 2 based on multiprocessor, it is characterised in that:Work as processor die When block uses the Launchpad development boards using MSP430/432 series monolithics as core, it is total that processor bus is connected to mainboard Line;When processor module uses the Launchpad development boards using ARM-TM4C129 Series of MCU as core, processor Bus is respectively connecting to main board bus and the integrated FPGA of Digital Analog Hybrid Circuits module bus.
4. the electric monitoring platform according to claim 2 based on multiprocessor, it is characterised in that:Work as processor die When block uses the Launchpad development boards using ARM-TM4C129 Series of MCU as core, Digital Analog Hybrid Circuits module is integrated FPGA and modulus, the data of D/A converter module, address, controlling bus be connected to processor module Peripheral Interface EPI it is total Line.
5. the electric monitoring platform according to claim 1 based on multiprocessor, it is characterised in that:The digital-to-analogue is mixed Circuit module is closed to be arranged on mainboard in straight cutting form by the socket of FX-8 models.
6. the electric monitoring platform according to claim 1 based on multiprocessor, it is characterised in that:Communication Module includes Ethernet interface, RS232 interfaces, USB interface.
7. the electric monitoring platform according to claim 1 based on multiprocessor, it is characterised in that:The PWM controls System module provides frequency Pulse Width adjustable pwm signal of 8 tunnels through isolation drive, may be connected directly to external motor drive control electricity Road.
8. the electric monitoring platform according to claim 1 based on multiprocessor, it is characterised in that:The man-machine friendship Mutual submodule includes 4*4 matrix keyboards, LCDs, USB interface;The USB interface is connected to Digital Analog Hybrid Circuits module Integrated FPGA terminals.
CN201720263383.0U 2017-03-17 2017-03-17 Electric monitoring platform based on multiprocessor Expired - Fee Related CN206601595U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720263383.0U CN206601595U (en) 2017-03-17 2017-03-17 Electric monitoring platform based on multiprocessor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720263383.0U CN206601595U (en) 2017-03-17 2017-03-17 Electric monitoring platform based on multiprocessor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110085106A (en) * 2019-04-17 2019-08-02 武汉光驰教育科技股份有限公司 Engineering and experimental system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110085106A (en) * 2019-04-17 2019-08-02 武汉光驰教育科技股份有限公司 Engineering and experimental system

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20171031

Termination date: 20200317