CN206597437U - Semiconductor refrigerating drying machine - Google Patents
Semiconductor refrigerating drying machine Download PDFInfo
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- CN206597437U CN206597437U CN201720244017.0U CN201720244017U CN206597437U CN 206597437 U CN206597437 U CN 206597437U CN 201720244017 U CN201720244017 U CN 201720244017U CN 206597437 U CN206597437 U CN 206597437U
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Abstract
Semiconductor refrigerating drying machine, belongs to refrigeration technology field.The utility model includes frame, semiconductor chilling plate, radiator fan and AC DC exchanger, described semiconductor chilling plate is connected with AC DC exchanger, air-flow refrigeration inner chamber is formed in described frame inner chamber, described semiconductor chilling plate is arranged between frame internal chamber wall and air-flow refrigeration internal chamber wall, the chill surface of semiconductor chilling plate and air-flow refrigeration internal chamber wall corresponding matching, the heat delivery surface of semiconductor chilling plate simultaneously pass through described radiator fan with frame internal chamber wall corresponding matching and radiated；Described air-flow refrigeration inner chamber sets air inlet passage and refrigeration exit passageway, and the bottom of air-flow refrigeration inner chamber is provided with the automatic drain valve with automatic drainage function.The utility model is simple in construction, and production process is reduced, and maintenance rate is low, and small volume, Energy in use is low, and environmental protection.
Description
Technical field
The utility model belongs to refrigeration technology field, more particularly to a kind of semiconductor refrigerating drying machine.
Background technology
Existing compressor compresses refrigerant（Freon）Refrigeration is to provide refrigerating capacity by refrigeration system with air inlet to enter
Row heat exchange, while raw air is cooled, will condense into condensed water in its air containing a large amount of moisture content, then by gas and water
Part handles the moisture content in air from effect, reduction, and pure air is dried so as to obtain.But contracting machine compression refrigerant（Freon）
Energy consumption for cooling is high, pollution environmental protection, and compression refrigerant flows through copper pipe and carries out heat exchange, copper pipe welding, many welderings with hot saturation compressed air
Point easily leakage refrigerant, maintenance rate is high.Machine parts are more, and volume is big, noise is big.
Utility model content
The problem of existing for above-mentioned background technology, the utility model aims to provide a kind of production process and reduced, maintenance rate
It is low, small volume, the low semiconductor refrigerating drying machine of Energy in use.
Therefore, the utility model uses following technical scheme：Semiconductor refrigerating drying machine, it is characterized in that, including frame, half
Conductor cooling piece, radiator fan and AC DC exchanger, described semiconductor chilling plate are connected with AC DC exchanger, institute
Air-flow refrigeration inner chamber is formed in the frame inner chamber stated, described semiconductor chilling plate is arranged at frame internal chamber wall and air-flow refrigeration is interior
Between cavity wall, the chill surface of semiconductor chilling plate and air-flow freeze internal chamber wall corresponding matching, the heat delivery surface of semiconductor chilling plate with
Frame internal chamber wall corresponding matching is simultaneously radiated by described radiator fan；Described air-flow refrigeration inner chamber sets air inlet passage
With refrigeration exit passageway, the bottom of air-flow refrigeration inner chamber is provided with the automatic drain valve with automatic drainage function.
As the supplement to above-mentioned technical proposal and perfect, the utility model also includes following technical characteristic.
Described stream refrigeration inner chamber includes two parts, respectively refrigeration filtering inner chamber and refrigeration exit passageway inner chamber, described
Air inlet passage be arranged in refrigeration filtering inner chamber, described refrigeration exit passageway inner chamber is by outlet conduit and freezes
Inner chamber isolation is filtered, is isolated between the mouth of pipe of outlet conduit and the import of described air inlet passage by screen pack.
Described radiator fan is DC fan or ac fan, and DC fan is straight by described AC DC exchanger
Connect supply direct current.
Described semiconductor chilling plate quantity is multiple, and is divided into the surrounding of described stream refrigeration inner chamber, stream refrigeration
The lateral wall of chamber is square or circular, semiconductor chilling plate and stream refrigeration internal chamber wall that the stream refrigeration inner chamber being square passes through sheet
Recline, rounded stream refrigeration inner chamber is reclined by the semiconductor chilling plate of arc with stream refrigeration internal chamber wall, all semiconductors
Cooling piece is radiated by same radiator fan.
The utility model can reach following beneficial effect：The utility model utilizes two kinds of different conductor N type semiconductors, P
Type semiconductor built-up circuit, when being passed through direct current, endothermic effect is produced in joint A, exothermic effect is produced in joint B, thus
The low-temperature receiver of outside heat can be absorbed by being produced at A ends, and hot saturation compression air contact carries out heat exchange.Hot saturation compressed air
B ends are run into, the water holding capacity of rear hot saturation compressed air declines to the cold, is that gaseous state steam is changed into aqueous water originally.The liquid of generation
Water is flowed into the cavity of anti-backflow, and drying machine is discharged by automatic drain valve.The utility model is simple in construction, and production process subtracts
Few, maintenance rate is low, and small volume, Energy in use is low, and environmental protection.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Embodiment of the present utility model is described in detail below in conjunction with the accompanying drawings.
As shown in figure 1, the utility model includes frame 1, semiconductor chilling plate 2, radiator fan 4 and AC DC exchanger
5, semiconductor chilling plate 2 is connected with AC DC exchanger 5, and air-flow refrigeration inner chamber 3, semiconductor refrigerating are formed in the inner chamber of frame 1
Piece 2 is arranged between frame internal chamber wall and air-flow refrigeration internal chamber wall, chill surface and the air-flow refrigeration internal chamber wall of semiconductor chilling plate 2
Corresponding matching, the heat delivery surface of semiconductor chilling plate 2 is radiated with frame internal chamber wall corresponding matching and by radiator fan 4；Air-flow system
Cold inner chamber sets air inlet passage 6 and refrigeration exit passageway, and the bottom of air-flow refrigeration inner chamber 3, which is provided with, has automatic drainage function
Automatic drain valve.
It is further preferred that air-flow refrigeration inner chamber 3 includes two parts, respectively refrigeration filters inner chamber and refrigeration exit passageway
Inner chamber, air inlet passage 6 is arranged in refrigeration filtering inner chamber, and refrigeration exit passageway inner chamber is by outlet conduit 7 and freezes
Inner chamber isolation is filtered, is isolated between the mouth of pipe of outlet conduit 7 and the import of air inlet passage 6 by screen pack 8.
It is further preferred that radiator fan 4 is DC fan or ac fan, DC fan passes through AC DC exchanger
5 directly supply direct current.
It is further preferred that the quantity of semiconductor chilling plate 2 is multiple, and it is divided into the surrounding of air-flow refrigeration inner chamber 3, air-flow
The lateral wall of refrigeration inner chamber 3 is square or circular, the air-flow refrigeration inner chamber 3 being square by the semiconductor chilling plate 2 of sheet with
Air-flow refrigeration internal chamber wall reclines, semiconductor chilling plate 2 and air-flow the refrigeration inner chamber that rounded air-flow refrigeration inner chamber 3 passes through arc
Wall is reclined, and all semiconductor chilling plates 2 are radiated by same radiator fan 4.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the utility model spirit and scope are not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within the range of claimed the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (4)
1. semiconductor refrigerating drying machine, it is characterised in that：Including frame（1）, semiconductor chilling plate（2）, radiator fan（4）And friendship
Flow DC converter（5）, described semiconductor chilling plate（2）With AC DC exchanger（5）Connection, described frame（1）It is interior
Air-flow refrigeration inner chamber is formed in chamber（3）, described semiconductor chilling plate（2）It is arranged at frame internal chamber wall and air-flow refrigeration internal chamber wall
Between, semiconductor chilling plate（2）Chill surface and air-flow freeze internal chamber wall corresponding matching, semiconductor chilling plate（2）Heat delivery surface
With frame internal chamber wall corresponding matching and passing through described radiator fan（4）Radiating；Described air-flow refrigeration inner chamber sets air to enter
Enter passage（6）With refrigeration exit passageway, air-flow refrigeration inner chamber（3）Bottom be provided with automatic drainage function Auto-drainage
Valve.
2. semiconductor refrigerating drying machine according to claim 1, it is characterised in that：Described air-flow refrigeration inner chamber（3）Bag
Two parts are included, respectively refrigeration filtering inner chamber and refrigeration exit passageway inner chamber, described air inlet passage（6）It is arranged at refrigeration
Filter in inner chamber, described refrigeration exit passageway inner chamber passes through outlet conduit（7）Isolate with refrigeration filtering inner chamber, outlet conduit
（7）The mouth of pipe and described air inlet passage（6）Import between pass through screen pack（8）Isolation.
3. semiconductor refrigerating drying machine according to claim 2, it is characterised in that：Described radiator fan（4）For direct current
Fan or ac fan, DC fan pass through described AC DC exchanger（5）Directly supply direct current.
4. semiconductor refrigerating drying machine according to claim 3, it is characterised in that：Described semiconductor chilling plate（2）Number
Measure to be multiple, and be divided into described air-flow refrigeration inner chamber（3）Surrounding, air-flow refrigeration inner chamber（3）Lateral wall be square or
Circle, the air-flow refrigeration inner chamber being square（3）Pass through the semiconductor chilling plate of sheet（2）Reclined with air-flow refrigeration internal chamber wall, be in
Circular air-flow refrigeration inner chamber（3）Pass through the semiconductor chilling plate of arc（2）Reclined with air-flow refrigeration internal chamber wall, all partly leads
Body cooling piece（2）Pass through same radiator fan（4）Radiating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720244017.0U CN206597437U (en) | 2017-03-14 | 2017-03-14 | Semiconductor refrigerating drying machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720244017.0U CN206597437U (en) | 2017-03-14 | 2017-03-14 | Semiconductor refrigerating drying machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206597437U true CN206597437U (en) | 2017-10-31 |
Family
ID=60147624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720244017.0U Active CN206597437U (en) | 2017-03-14 | 2017-03-14 | Semiconductor refrigerating drying machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206597437U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106823704A (en) * | 2017-03-14 | 2017-06-13 | 临安汉克森过滤设备有限公司 | Semiconductor refrigerating drying machine |
-
2017
- 2017-03-14 CN CN201720244017.0U patent/CN206597437U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106823704A (en) * | 2017-03-14 | 2017-06-13 | 临安汉克森过滤设备有限公司 | Semiconductor refrigerating drying machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 310000, Zhejiang, Hangzhou province Ling'an City, Sichuan town, broad beach village Patentee after: Hangzhou Linan Hankson Filter Equipment Co., Ltd. Address before: 310000, Zhejiang, Hangzhou province Ling'an City, Sichuan town, broad beach village Patentee before: LINAN HANKISON FILTER EQUIPMENT CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |