CN206584901U - Semiconductor package installation magazine width and length adjustment mechanism - Google Patents
Semiconductor package installation magazine width and length adjustment mechanism Download PDFInfo
- Publication number
- CN206584901U CN206584901U CN201720343345.6U CN201720343345U CN206584901U CN 206584901 U CN206584901 U CN 206584901U CN 201720343345 U CN201720343345 U CN 201720343345U CN 206584901 U CN206584901 U CN 206584901U
- Authority
- CN
- China
- Prior art keywords
- magazine
- optical axis
- blend stop
- main body
- housed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model belongs to a kind of semiconductor package installation magazine width and length adjustment mechanism, including the left blend stop of magazine（1）, and the right blend stop of magazine（4）, it is characterised in that in the left blend stop of magazine（1）With the right blend stop of magazine（4）Between be respectively provided with external part regulating part（2）With main body secured adjusted part（5）, in main body secured adjusted part（5）It is upper that optical axis latch segment is housed（12）With two optical axises（10）；In optical axis（10）It is upper that fixed block is housed（11）With optical axis latch segment（12）；In preceding limit stop bar（3）Lower end be equipped with spring pressure roller（8）, centre is equipped with front apron regulating part（6）, in front apron regulating part（6）It is upper that two width adjusting optical axises are housed（7）, in front apron regulating part（6）Right-hand member equipped with right pin（14）, right pin（14）With main body secured adjusted part（5）Connection, and equipped with an optical axis latch segment（12）.The utility model magazine compact conformation, saves space, adjusts, changes convenient and swift.
Description
Technical field
The utility model belongs to the part of semiconductor package installation, more particularly to a kind of semiconductor package installation magazine width and length
Spend governor motion.
Background technology
The effect of semiconductor package installation magazine width and length adjustment mechanism is that the magazine that will be equipped with lead frame is fixed,
To ensure that other work being capable of stable operation.The mechanism used at present is fixed using cylinder, is adjusted by multiple components of machine
Suitable to size, the weak point of this method is that position adjustments are inconvenient, and complicated in mechanical structure, space-consuming is big.
The content of the invention
It is an object of the invention to overcome above-mentioned technical deficiency there is provided one kind is simple and compact for structure, space, regulation side are saved
Just, the semiconductor package installation magazine width and length adjustment mechanism of magazine simple and fast are changed.
The utility model solves the technical scheme that is used of technical problem:A kind of semiconductor package installation magazine width and length
Spend governor motion, including the left blend stop of magazine, and the right blend stop of magazine, it is characterised in that between the left blend stop of magazine and the right blend stop of magazine
External part regulating part and main body secured adjusted part are respectively provided with, optical axis latch segment and two light are housed on main body secured adjusted part
Axle；Fixed block and optical axis latch segment are housed on optical axis；Spring pressure roller is housed in the lower end of preceding limit stop bar, centre is equipped with front apron
Regulating part, equipped with two width adjusting optical axises on front apron regulating part, width adjusting optical axis is connected with main body secured adjusted part,
One right pin is housed in the right-hand member of front apron regulating part, right pin is connected with main body secured adjusted part, and equipped with an optical axis
Latch segment；Magazine detection sensor is housed in the bottom of the left blend stop of magazine.
The beneficial effects of the utility model are：The utility model magazine compact conformation, saves space, and regulation, replacing are convenient
Fast.
Brief description of the drawings
Below in conjunction with accompanying drawing, illustrated with embodiment.
Fig. 1 is the front view of semiconductor package installation magazine width and length adjustment mechanism；
Fig. 2 is Fig. 1 top view；
Fig. 3 is Fig. 1 left side view.
In figure：The left blend stop of 1- magazines；2- external part regulating parts；Limit stop bar before 3-；The right blend stop of 4- magazines；5- main bodys, which are fixed, to be adjusted
Save part；6- front apron regulating parts；7- width adjusting optical axises；8- spring pressure rollers；9- magazine detection sensors；10- optical axises；11- consolidates
Determine block；12- optical axis latch segments；13- magazines.
Embodiment
Embodiment, referring to the drawings, a kind of semiconductor package installation magazine width and length adjustment mechanism, including the left blend stop of magazine
1, and the right blend stop 4 of magazine, it is characterised in that it is respectively provided with external part regulating part 2 between the left blend stop 1 of magazine and the right blend stop 4 of magazine
With main body secured adjusted part 5, optical axis latch segment 12 and two optical axises 10 are housed on main body secured adjusted part 5；On optical axis 10
Equipped with fixed block 11 and optical axis latch segment 12；Spring pressure roller 8 is housed in the lower end of preceding limit stop bar 3, centre is equipped with front apron regulation
Part 6, equipped with two width adjusting optical axises 7 on front apron regulating part 6, width adjusting optical axis 7 connects with main body secured adjusted part 5
Connect, and equipped with an optical axis latch segment 12；Magazine detection sensor 9 is housed in the bottom of the left blend stop 1 of magazine.
The course of work or operating procedure of the utility model：Front is changed by the extension elongation of width adjusting optical axis 7
The amount of moving integrally of plate regulating part 6, it is locked with light shaft locking block 12 after adjustment to adapt to the width of different magazines 13.Pass through regulation
The extension elongation of external part regulating part 2, it is locked with light shaft locking block 12 after having adjusted to adapt to the length dimension of magazine 13, prevent
Shift in position.Apply pressure with the supply package 13 of spring pressure roller 8, fix magazine 13, you can work.The effect of sensor 9 is
Detection magazine 13 whether there is, and to one signal feedback of control system of complete machine, is started working when having magazine 13, no magazine 13 etc.
Treat discharging box 13.
Claims (1)
1. a kind of semiconductor package installation magazine width and length adjustment mechanism, including the left blend stop of magazine（1）, and the right blend stop of magazine
（4）, it is characterised in that in the left blend stop of magazine（1）With the right blend stop of magazine（4）Between be respectively provided with external part regulating part（2）And main body
Secured adjusted part（5）, in main body secured adjusted part（5）It is upper that optical axis latch segment is housed（12）With two optical axises（10）；In optical axis
（10）It is upper that fixed block is housed（11）With optical axis latch segment（12）；In preceding limit stop bar（3）Lower end be equipped with spring pressure roller（8）, it is middle
Equipped with front apron regulating part（6）, in front apron regulating part（6）It is upper that two width adjusting optical axises are housed（7）, width adjusting optical axis
（7）With main body secured adjusted part（5）Connection, in front apron regulating part（6）Right-hand member equipped with right pin（14）, right pin
（14）With main body secured adjusted part（5）Connection, and equipped with an optical axis latch segment（12）；In the left blend stop of magazine（1）Bottom dress
There is magazine detection sensor（9）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720343345.6U CN206584901U (en) | 2017-04-02 | 2017-04-02 | Semiconductor package installation magazine width and length adjustment mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720343345.6U CN206584901U (en) | 2017-04-02 | 2017-04-02 | Semiconductor package installation magazine width and length adjustment mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206584901U true CN206584901U (en) | 2017-10-24 |
Family
ID=60092554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720343345.6U Expired - Fee Related CN206584901U (en) | 2017-04-02 | 2017-04-02 | Semiconductor package installation magazine width and length adjustment mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206584901U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108942774A (en) * | 2018-07-16 | 2018-12-07 | 精技电子（南通）有限公司 | A kind of magazine fast adjuster and the quick change method to different size magazines |
| CN112589410A (en) * | 2020-12-29 | 2021-04-02 | 邦迪智能科技(上海)有限公司 | Automatic flat wire feeding material box device |
-
2017
- 2017-04-02 CN CN201720343345.6U patent/CN206584901U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108942774A (en) * | 2018-07-16 | 2018-12-07 | 精技电子（南通）有限公司 | A kind of magazine fast adjuster and the quick change method to different size magazines |
| CN112589410A (en) * | 2020-12-29 | 2021-04-02 | 邦迪智能科技(上海)有限公司 | Automatic flat wire feeding material box device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171024 Termination date: 20190402 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |