CN206517670U - A kind of pcb board layout structure of scattered thermal source for liquid crystal display - Google Patents
A kind of pcb board layout structure of scattered thermal source for liquid crystal display Download PDFInfo
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- CN206517670U CN206517670U CN201720191966.7U CN201720191966U CN206517670U CN 206517670 U CN206517670 U CN 206517670U CN 201720191966 U CN201720191966 U CN 201720191966U CN 206517670 U CN206517670 U CN 206517670U
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Abstract
The utility model discloses a kind of pcb board layout structure of the scattered thermal source for liquid crystal display, including：Radio-frequency module, TFlash cards, fast mold filling block, system module, WIFI module, LED circuit, MIPI modules；System module includes CPU module, power management module, loudspeaker power amplifier module, EMMC modules, DDR3 modules；The TFlash cards, fast mold filling block are located at pcb board side, and radio-frequency module, system module, WIFI module, LED circuit, MIPI modules are sequentially provided with towards opposite side；The region back side of radio-frequency module, power management module, CPU module on pcb board is using leakage copper design；The system module is isolated with radio-frequency module layout；Radio-frequency module is respectively further from MIPI modules, WIFI module and set.The pcb board layout structure that the utility model is provided, sensitive components interfere few the characteristics of, with preferable practicality good with heat dissipation design.
Description
Technical field
The utility model is related to a kind of pcb board, more particularly to a kind of pcb board layout of scattered thermal source for liquid crystal display is tied
Structure.
Background technology
The pcb board of available liquid crystal screen driving, as liquid crystal display use time is lengthened, the heat accumulated on pcb board is excessive, no
Easily disperse；And each sensing element is often produced and interfered on pcb board, using effect is influenceed.
Therefore, the prior art is defective, it is necessary to improve.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art there is provided a kind of pcb board layout structure of scattered thermal source.
The technical solution of the utility model is as follows：
A kind of pcb board layout structure of scattered thermal source for liquid crystal display, including：
Radio-frequency module, TFlash cards, fast mold filling block, system module, WIFI module, LED circuit, MIPI modules；
The system module includes CPU module, power management module, loudspeaker power amplifier module, EMMC modules, DDR3 modules；
The TFlash cards, fast mold filling block be located at pcb board side, towards opposite side be sequentially provided with radio-frequency module, system module,
WIFI module, LED circuit, MIPI modules；
The region back side of the radio-frequency module, power management module, CPU module on pcb board is using leakage copper design；
The system module is isolated with radio-frequency module layout；
The radio-frequency module is respectively further from MIPI modules, WIFI module and set.
It is preferred that the radio-frequency module model WCN3660B, including RF transceiver WTR4905, PA1 module
SKY77643-21, PA2/SW module SKY77916-21, SW1 module SKY13418-485LF.
It is preferred that the fast mold filling block model SMB1357.
The pcb board layout structure provided using such scheme, the utility model, sensitive member device good with heat dissipation design
The characteristics of part interferes few, with preferable practicality.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
The utility model provides a kind of pcb board layout structure of scattered thermal source for liquid crystal display, including：
Radio-frequency module 1, TFlash cards 2, fast mold filling block 3, system module 4, WIFI module 5, LED circuit 6, MIPI modules 7；
The system module 4 include CPU module 41, power management module 42, loudspeaker power amplifier module 43, EMMC modules 44,
DDR3 modules 45；
The TFlash cards 2, fast mold filling block 3 are located at pcb board side, and radio-frequency module 1, system mould are sequentially provided with towards opposite side
Block 4, WIFI module 5, LED circuit 6, MIPI modules 7；
The region back side of the radio-frequency module 1, power management module 42, CPU module 41 on pcb board is set using leakage copper
Meter；
The system module 4 is isolated with the layout of radio-frequency module 1；
The radio-frequency module 1 is respectively further from MIPI modules 7, WIFI module 5 and set.
The model WCN3660B of radio-frequency module 1, including RF transceiver WTR4905 11, PA1 modules SKY77643-
21 12, PA2/SW modules SKY77916-21 13, SW1 modules SKY13418-485LF 14.
The model SMB1357 of fast mold filling block 3.
Operation principle of the present utility model：
The application programs such as software are stored in EMMC modules 44, by the reading order of CPU module 41, are sent to DDR3 modules 45,
Performed by DDR3 modules 45, machine operation；Other grade peripheral operations, are also first to be read by CPU module 41, are sent to DDR3 and hold
OK.Specifically, the function of each module is as follows：
(1), radio-frequency module
A), main collection transmitting TX：Have CPU produce signal pass through RF transceiver 11 (Transceiver), then by PA1 with
PA2/SW carries out signal amplification, unified to be launched again by primary antenna by PA2/SW；
B), receive RX points of main collection to receive and secondary reception：Main collection, which receives signal, has primary antenna to be arrived by PA2/SW
Transceiver is by CPU processing；Diversity reception signal passes through SW1 until Transceiver by secondary antenna, then by CPU processing.
(2), WIFI module
A), launch：Signal is sent by CPU, then by WIFI module processing, by frequency divider (WIFI, bluetooth, the tunnels of GPS tri-),
Sent again by antenna；
B), receive：Received by antenna and pass through frequency divider, by WIFI module, then by CPU processing.
(3), charging module
USB charges：USB is first detected, then carries out 5V charge protocol detections, then detects that 9V fills agreement soon, according to external adapter
Device determines to be charged with 5V or 9V again.
(4), TF card modules
Clock, data, order control pin, to ensure the read-write of data；Pin is detected to detect whether TF cards insert.
(5), loudspeaker power amplifier module
The audio-frequency function carried using power supply chip, walks earphone speaker passages, and external power amplifier carries out secondary amplification, comes
Realize external voice.
(6), LED module
Using an easy DC-DC circuit (routine techniques), supply voltage is risen by FREQUENCY CONTROL
Pressure conversion reaches the voltage (being calculated according to the LED numbers and LED current size of screen) needed for LED backlight, carries out backlight lightening.
In the utility model, components' placement design has the characteristics that：
(a), thermal source is designed, and the chip of radio-frequency module 1, power management module 42, CPU module 41 containing heating, is main
Thermal source device is wanted, PCB needs scattered thermal source to be laid out design in layout, and at the corresponding heat source region back side using leakage copper
Mode radiates, and enables the system to work at normal temperatures；
(b), system module is isolated with radio-frequency module layout, and analog circuit is isolated with digital circuit in layout, is kept away
Exempt from the sensitive signals such as radio frequency to be disturbed by EMC；
(c), the LCD display stand at existing LCD display sheet frame edge is fixed, and then causes MIPI lines
(connector of MIPI modules) long to cause electromagnetic interference, the sensitive signal such as all radio frequencies must away from MIPI signal wires,
So as to which radio frequency layout just must be away from MIPI in plate, it is the cleaner region of whole plate, distance that radio-frequency module present position, which is exactly,
The distance of MIPI lines is also distant；
(d), WIFI module 5 is laid out at a distance with radio-frequency module 1, and the operating frequency range of WIFI2.4G transmitting-receiving frequency range is
The FDD up frequency point ranges of B7 are 2500-2570MHZ, TDD B38 frequency models in 2.4-2.4835GHZ, radio-frequency transmissions frequency range
It is 2570-2620MHZ to enclose, and TDD B41 frequency point ranges are 2496-2690MZH.WIFI2.4G transmitting-receiving frequency and the hair of radio frequency
Radio frequency point is in close scope, so two modules must be laid out at a distance, in pcb board WIFI module and radio-frequency module
Respectively in the left and right of system module, and isolated respectively with radome.
To sum up, the pcb board layout structure that the utility model is provided, good with heat dissipation design, sensitive components is mutually dry
The characteristics of disturbing few, with preferable practicality.
Preferred embodiment of the present utility model is these are only, the utility model is not limited to, it is all in this practicality
Any modifications, equivalent substitutions and improvements made within new spirit and principle etc., should be included in guarantor of the present utility model
Within the scope of shield.
Claims (3)
1. a kind of pcb board layout structure of scattered thermal source for liquid crystal display, it is characterised in that including：
Radio-frequency module, TFlash cards, fast mold filling block, system module, WIFI module, LED circuit, MIPI modules；
The system module includes CPU module, power management module, loudspeaker power amplifier module, EMMC modules, DDR3 modules；
The TFlash cards, fast mold filling block are located at pcb board side, and radio-frequency module, system module, WIFI are sequentially provided with towards opposite side
Module, LED circuit, MIPI modules；
The region back side of the radio-frequency module, power management module, CPU module on pcb board is using leakage copper design；
The system module is isolated with radio-frequency module layout；
The radio-frequency module is respectively further from MIPI modules, WIFI module and set.
2. pcb board layout structure according to claim 1, it is characterised in that the radio-frequency module model WCN3660B,
Including RF transceiver WTR4905, PA1 module SKY77643-21, PA2/SW module SKY77916-21, SW1 module
SKY13418-485LF。
3. pcb board layout structure according to claim 1, it is characterised in that the fast mold filling block model SMB1357.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720191966.7U CN206517670U (en) | 2017-02-28 | 2017-02-28 | A kind of pcb board layout structure of scattered thermal source for liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720191966.7U CN206517670U (en) | 2017-02-28 | 2017-02-28 | A kind of pcb board layout structure of scattered thermal source for liquid crystal display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206517670U true CN206517670U (en) | 2017-09-22 |
Family
ID=59869370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720191966.7U Active CN206517670U (en) | 2017-02-28 | 2017-02-28 | A kind of pcb board layout structure of scattered thermal source for liquid crystal display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206517670U (en) |
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2017
- 2017-02-28 CN CN201720191966.7U patent/CN206517670U/en active Active
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