CN206506776U - A kind of plate of material of FR 4 - Google Patents

A kind of plate of material of FR 4 Download PDF

Info

Publication number
CN206506776U
CN206506776U CN201720258113.0U CN201720258113U CN206506776U CN 206506776 U CN206506776 U CN 206506776U CN 201720258113 U CN201720258113 U CN 201720258113U CN 206506776 U CN206506776 U CN 206506776U
Authority
CN
China
Prior art keywords
substrate
plate
union thimble
cushion
interior union
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720258113.0U
Other languages
Chinese (zh)
Inventor
曹广山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan City Wide Magnetic Electronics Co Ltd
Original Assignee
Dongguan City Wide Magnetic Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan City Wide Magnetic Electronics Co Ltd filed Critical Dongguan City Wide Magnetic Electronics Co Ltd
Priority to CN201720258113.0U priority Critical patent/CN206506776U/en
Application granted granted Critical
Publication of CN206506776U publication Critical patent/CN206506776U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of plate of material of FR 4, including substrate, the plate of material is to be combined by heat-insulating layer, cushion, adhesive layer and substrate in the presence of epoxy phenolics material slurry, interior union thimble is installed on the substrate, the interior union thimble is to be embedded in by embedding groove in substrate, the middle position of the interior union thimble is provided with endoporus, adhesive layer is installed above the interior union thimble, it is provided with above the adhesive layer above cushion, the cushion and heat-insulating layer is installed.The utility model is the jointing material as whole plate of material by epoxy phenolics, whole plate of material is set to be filled with epoxy phenolics, according to the material property of epoxy phenolics, insulation and the heat-proof quality of plate of material can be substantially increased, and union thimble in dismountable is installed on substrate, the winding displacement facilitated by interior union thimble in substrate is connected up, and it is used as circuit board substrate.

Description

A kind of FR-4 plate of material
Technical field
The utility model is related to plate of material field, specifically a kind of FR-4 plate of material.
Background technology
FR-4 is a kind of code name of flame resistant material grade, representative to mean that resin material must be able to by fired state A kind of material specification of enough self-extinguish, it is not a kind of title material, but a kind of material rate, therefore general circuit at present FR-4 grade materials used in plate just have very many species, but majority is added with the epoxy resin of so-called four function The composite that filler and glass fibre are made, FR-4 epoxy glass cloth laminated boards are different according to the purposes used, OK Industry is commonly referred to as:FR-4Epoxy Glass Cloth, insulation board, epoxy plate, epoxy resin board, brominated epoxy resin plate, FR- 4th, glass mat, glass-fiber-plate, FR-4 stiffening plates, FPC stiffening plates, stiffening plate for flexible circuit board, FR-4 epoxy resin boards, fire-retardant Insulation board, FR-4 laminated plates, epoxy plate, FR-4 tabula rasas, FR-4 glass-fiber-plates, epoxy resin bonded fiber, epoxy glass cloth laminated board, line Road plate drilling liner plate.
There is many weak points in the plate of material of current stage, for example, the flexible poor performance of the use of plate of material, it is impossible to one Plate is used, and winding displacement wiring is inconvenient.
Utility model content
The purpose of this utility model is to provide a kind of FR-4 plate of material, to solve the use of plate of material of the prior art Flexible poor performance, it is impossible to which a plate is used, the problem of winding displacement wiring is inconvenient.
To achieve the above object, the utility model provides following technical scheme:A kind of FR- plate of material, including substrate, it is described Plate of material is to be combined by heat-insulating layer, cushion, adhesive layer and substrate in the presence of epoxy phenolics material slurry Form, interior union thimble is installed, the interior union thimble is to be embedded in by embedding groove in substrate on the substrate, in the interior union thimble Between be provided with to be provided with above adhesive layer, the adhesive layer above endoporus, the interior union thimble at position cushion be installed, Heat-insulating layer is installed above the cushion.
It is preferred that, the heat-insulating layer, cushion, adhesive layer and substrate are viscous by epoxy phenolics jointing material Conjunction is formed.
It is preferred that, the height of the interior union thimble is identical with the thickness of substrate.
It is preferred that, the interior union thimble is set to the interior union thimble that insulate.
Compared with prior art, the beneficial effects of the utility model are:The utility model is by epoxy phenolics As the jointing material of whole plate of material, whole plate of material is set to be filled with epoxy phenolics, according to the material of epoxy phenolics Expect performance, insulation and the heat-proof quality of plate of material can be substantially increased, and union thimble in dismountable is installed on substrate, pass through Interior union thimble facilitates the winding displacement wiring in substrate, and when it is used as circuit board substrate, and being dismantled, this device is It can be used as the baffle plate of partiting thermal insulation, the feature of device is significantly increased by such a design.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of substrate of the present utility model;
Fig. 3 is the structural representation of interior union thimble of the present utility model.
In figure:1- plate of material, 2- heat-insulating layers, 3- cushions, 4- adhesive layers, 5- substrates, union thimble in 6-, 7- endoporus, 8- embedding grooves.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.
Refer in Fig. 1~3, the utility model embodiment, a kind of FR-4 plate of material, including substrate 5, plate of material 1 be by Heat-insulating layer 2, cushion 3, adhesive layer 4 and substrate 5 are combined in the presence of epoxy phenolics material slurry, base Interior union thimble 6 is installed, substrate 5 is the soleplate of composition material plate 1 on plate 5, interior union thimble 6 is used for inlaying on the substrate 5, for making When making circuit board, winding displacement wiring is facilitated to use, interior union thimble 6 is to be embedded in by embedding groove 8 in substrate 5, the interposition of interior union thimble 6 The place of putting is provided with endoporus 7, and the top of interior union thimble 6 is provided with adhesive layer 4, and adhesive layer 4 is used for fitting on the substrate 5, adhesive layer 4 Top is provided with cushion 3, and cushion 3 can increase the impact resistant capability of plate of material 1, and the top of cushion 3 is provided with heat-insulated Insulating barrier 2, heat-insulating layer 2 can lead to for heat-insulated and insulation, heat-insulating layer 2, cushion 3, adhesive layer 4 and substrate 5 Cross epoxy phenolics jointing material to be bonded, the height of interior union thimble 6 is identical with the thickness of substrate 5, interior union thimble 6 is set For union thimble in insulation.
Operation principle of the present utility model is:The equipment when in use, is embedded in interior union thimble 6, then by wire rod to substrate 5 Connected up by endoporus 7, then invaded bubble in the slurry that epoxy phenolics is manufactured, then bonded on the substrate 5 Upper bonding layer 4, then one layer of cushion 3 is bonded on adhesive layer 4, one layer of heat-insulating layer 2 is then bonded on cushion 3 again, Then it is molded again under the processing of hot press.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and And in the case of without departing substantially from spirit or essential attributes of the present utility model, can realize that this practicality is new in other specific forms Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation Involved claim.

Claims (4)

1. a kind of FR-4 plate of material, including substrate (5), it is characterised in that:The plate of material (1) is by heat-insulating layer (2), delayed Rush layer (3), adhesive layer (4) and substrate (5) to combine in the presence of epoxy phenolics material slurry, the substrate (5) interior union thimble (6) is installed, the interior union thimble (6) is to be embedded in by embedding groove (8) in substrate (5), the interior union thimble on (6) middle position is provided with above endoporus (7), the interior union thimble (6) and is provided with adhesive layer (4), the adhesive layer (4) Top be provided with above cushion (3), the cushion (3) heat-insulating layer (2) be installed.
2. a kind of FR-4 plate of material according to claim 1, it is characterised in that:The heat-insulating layer (2), cushion (3), adhesive layer (4) and substrate (5) are bonded by epoxy phenolics jointing material.
3. a kind of FR-4 plate of material according to claim 1, it is characterised in that:The height and substrate of the interior union thimble (6) (5) thickness is identical.
4. a kind of FR-4 plate of material according to claim 1, it is characterised in that:The interior union thimble (6) is set in insulation Union thimble.
CN201720258113.0U 2017-03-16 2017-03-16 A kind of plate of material of FR 4 Expired - Fee Related CN206506776U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720258113.0U CN206506776U (en) 2017-03-16 2017-03-16 A kind of plate of material of FR 4

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720258113.0U CN206506776U (en) 2017-03-16 2017-03-16 A kind of plate of material of FR 4

Publications (1)

Publication Number Publication Date
CN206506776U true CN206506776U (en) 2017-09-19

Family

ID=59832956

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720258113.0U Expired - Fee Related CN206506776U (en) 2017-03-16 2017-03-16 A kind of plate of material of FR 4

Country Status (1)

Country Link
CN (1) CN206506776U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI655888B (en) * 2017-09-21 2019-04-01 采悅科技股份有限公司 Circuit board alignment hot pressing cushion setting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI655888B (en) * 2017-09-21 2019-04-01 采悅科技股份有限公司 Circuit board alignment hot pressing cushion setting method

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170919

Termination date: 20190316