CN206497833U - Pin configuration and its lead shaped device - Google Patents
Pin configuration and its lead shaped device Download PDFInfo
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- CN206497833U CN206497833U CN201621371559.6U CN201621371559U CN206497833U CN 206497833 U CN206497833 U CN 206497833U CN 201621371559 U CN201621371559 U CN 201621371559U CN 206497833 U CN206497833 U CN 206497833U
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- punch die
- pin configuration
- connecting portion
- bracing piece
- standing part
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Abstract
A kind of pin configuration, including capacitor body and two leads for being arranged on capacitor body bottom, lead includes connecting portion and standing part, and one end of connecting portion is stretched into, the other end connected with the electrode of capacitor and standing part in capacitor body and is connected, and standing part is vertically arranged with connecting portion；Standing part is horizontally disposed with.Pin configuration of the present utility model does not need seat board just to stand stably, and standing part is provided with inner bracing piece and outer support bar, such a pin configuration has 4 support bars to be supported, its intensity is high, so it ensure that highly stable when capacitor is stood, be not in because lead is just deformed and caused the phenomenon of astasia by collision rift and the stress on every support bar is highly uniform.
Description
Technical field
The utility model is related to a kind of aluminium electrolutic capacitor, more particularly to a kind of pin configuration.
Background technology
Pin configuration is a kind of light weight, thickness of thin, the new electronic component of small volume, compact conformation, small volume,
It is widely used in the high each electronic product of precision.Existing patch capacitor production technology is in traditional aluminium electrolutic capacitor
The parts such as seat board are added on the basis of manufacture craft, while adding the correlation steps such as seat board shaping.
Its feature：First, patch capacitor and bottom plate are dead with soldering, and electric capacity bottom and bottom plate are tightly pasted extremely, are not had completely
There is any gap；Second, circuit back does not have any solder joint, so as to cause short-circuit possibility without any.And on the other hand,
It is all higher than plug-in unit electric capacity in terms of element or production technology cost that patch capacitor is selected, and due to works such as welding
Skill so that capacitor element is difficult to dismounting and change, this have impact on the maintainability and sustainability of electronic product.
Utility model content
The technical problems to be solved in the utility model is to overcome the deficiencies in the prior art there is provided a kind of production cost is low, no
Need the pin configuration and its lead shaped device of seat board.
In order to solve the above technical problems, the utility model proposes technical scheme be：A kind of pin configuration, including connecting portion
And standing part, one end of the connecting portion stretch into be connected in capacitor body with the electrode of capacitor, the other end and standing part company
Connect, the standing part is vertically arranged with connecting portion；The standing part is horizontally disposed with.
In the utility model, connecting portion is vertical, is so all compared when being riveted on electrode and lead is molded
It is more convenient.
Above-mentioned pin configuration, it is preferred that the standing part includes inner bracing piece and outer support bar, the inner bracing piece connects
It is connected on connecting portion, is connected between the inner bracing piece and outer support bar by curved portions, the inner bracing piece, curved portions and outer
Support bar is u-shaped to be arranged and in same horizontal plane.
In the utility model, the inner bracing piece on two leads extends after being connected on connecting portion along same direction,
It so ensure that two leads of capacitor are symmetrical, the uniform force on such lead and attractive in appearance.
Above-mentioned pin configuration, it is preferred that the connecting portion and curved portions include irony internal layer, copper middle level and tin matter
Outer layer, by mass fraction, its irony internal layer accounts for 67.55%-74.84%, and copper middle level accounts for 18.83%-19.76%, tin matter outer layer
Account for 5.43%-13.52%；The inner bracing piece and inner bracing piece also include irony internal layer, copper middle level and tin matter outer layer, by matter
Its accounting of amount fraction is respectively 79.94%-83.7%, 10.39%-10.87%, 5.46%-9.67%.In the utility model,
The connecting portion and curved portions of lead are lower than the iron content of inner bracing piece and outer support bar, and its copper content will height.The company of lead
The scope of the tensile strength of socket part and curved portions exists：380-450N/mm2, and the tensile strength of inner bracing piece and inner bracing piece
Scope is in 450-550N/mm2；Connecting portion and curved portions ratio inner bracing piece and outer support bar are softer as can be seen here, are more prone into
Type, is not easy stress cutting occur among the process of shaping.
Above-mentioned pin configuration, it is preferred that the angle between the inner bracing piece and outer support bar is 0-45 degree.
Above-mentioned pin configuration, it is preferred that the connecting portion and standing part are integrally formed.
A kind of lead shaped device of pin configuration, including material carrier platform, separately the first punch die, bar and the second punch die；It is described
First punch die and material carrier platform are oppositely arranged, and first punch die includes flat-die and perpendicular mould, and perpendicular mould is arranged on the both sides of flat-die, flat-die
Arranged with perpendicular mould in concave shape；The both sides for separating bar are respectively arranged with second punch die；Second punch die is arranged on
The lower section of baffle plate, and the second punch die and the first punch die be arranged in approximately the same plane, the inner side and first of second punch die
The external side parallel of the perpendicular mould of punch die, and the second punch die inner side outside.
The lead shaped device of above-mentioned pin configuration, it is preferred that the head for separating bar is in isosceles trapezoid or waits
Lumbar triangle shape, so when two leads are separated, the power suffered by two leads is identical, and its separated angle is also
It is identical.
The lead shaped device of above-mentioned pin configuration, it is preferred that the contact site of the perpendicular mould and the second punch die and lead
It is provided with chamfering.Prevent the curved portions of lead when bending from being cut or scratch by the right angle on perpendicular mould and the second punch die.
The lead shaped device of pin configuration of the present utility model, after capacitor is fixed on material carrier platform, mobile the
One punch die, under the limitation of baffle plate, lead is bent with the movement of the first punch die, and the lead after bending is located at the first punch die
It is parallel between the lead and the perpendicular mould of the first punch die after bending in the ideal situation on flat-die；According to the angle of inner bracing piece
Degree, can set the distance between the lead after bending and perpendicular mould inner side.After the bending of connecting portion is completed, bar is moved apart,
Using separated club head isosceles trapezoid or isosceles triangle by two leads separate and with the chamfer contact on the inside of perpendicular mould,
Now lead is parallel with the chamfering on the inside of perpendicular mould；Here angle of the angle preferably with isosceles trapezoid hypotenuse of the chamfering on the inside of mould is erected
Or the angle of isosceles triangle hypotenuse is identical.So that after two leads are separated, separating bar and stopping movement；Now the second punch die is opened
Begin to move, lead is bent along perpendicular mould under the drive of the second punch die, lead, which is located at, to be erected between mould and the second punch die, is finally completed
The shaping of lead；It can be adjusted between lead outer support bar and inner bracing piece by adjustment perpendicular the distance between mould and the second punch die
Angle.
Compared with prior art, the utility model has the advantage of：Pin configuration of the present utility model does not need seat board just
Can be stood stabilization, and standing part is provided with inner bracing piece and outer support bar, and such a pin configuration has 4 support bars to enter
Row support, its intensity is high, so ensure that highly stable when capacitor is stood, and the stress on every support bar is non-
It is often uniform, be not in because lead is just deformed and caused the phenomenon of astasia by collision rift.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the utility model pin configuration.
Fig. 2 is the positive structure diagram of the utility model pin configuration.
Fig. 3 is the present invention looks up structural representation of the utility model pin configuration.
Fig. 4 is the positive structure diagram of the utility model lead shaped device.
Fig. 5 is the mplifying structure schematic diagram at A in Fig. 4.
Fig. 6 is the overlooking the structure diagram of the utility model lead shaped device.
Fig. 7 is the mplifying structure schematic diagram at B in Fig. 6.
Fig. 8 is the structural representation of the first punch die in the utility model.
Marginal data
1st, capacitor body；2nd, lead；3rd, connecting portion；4th, inner bracing piece；5th, outer support bar；6th, curved portions；7th, material carrier platform；
8th, bar is separated；9th, the second punch die；10th, baffle plate；11st, flat-die；12nd, mould is erected；13rd, the first punch die.
Embodiment
For the ease of understanding the utility model, below in conjunction with Figure of description and preferred embodiment to the utility model
Work more comprehensively, is meticulously described, but protection domain of the present utility model is not limited to embodiment in detail below.
It should be strongly noted that when a certain element, to be described as " be fixed on, be fixed in, be connected to or be communicated in " another
When on element, it can be directly fixed, affixed, connection or connect on another element or by connecting in the middle of other
Fitting is indirectly fixed, affixed, connection or connection are on another element.
Unless otherwise defined, the implication that all technical terms used hereinafter are generally understood that with those skilled in the art
It is identical.Technical term used herein is intended merely to describe the purpose of specific embodiment, is not intended to and limits this practicality
New protection domain.
Embodiment 1
A kind of pin configuration as shown in Figure 1-Figure 3, it is applied to SMD aluminium electrolutic capacitor, SMD aluminium electroloysis electricity
Container includes capacitor body 1 and is arranged on two leads 2 of capacitor body bottom, and lead 2 includes integrally formed connection
Portion 3 and standing part, one end of connecting portion 3 stretch into be connected in capacitor body 1 with the electrode of capacitor, the other end and standing part company
Connect, standing part is vertically arranged with connecting portion 3；Standing part is horizontally disposed with.
In the present embodiment, standing part includes inner bracing piece 4 and outer support bar 5, and inner bracing piece 4 is connected on connecting portion 3, interior
Connected between support bar 4 and outer support bar 5 by curved portions 6, inner bracing piece 4, curved portions 6 and the u-shaped arrangement of outer support bar 5
And in same horizontal plane.It is be arranged in parallel between inner bracing piece 4 and outer support bar 5.
In the present embodiment, a diameter of 0.45mm of lead, the connecting portion and curved portions of lead include irony internal layer, copper
Middle level and tin matter outer layer, by mass fraction, its irony internal layer accounts for 67.55%, and copper middle level accounts for 18.83%, and tin matter outer layer is accounted for
5.43%；Inner bracing piece and inner bracing piece also include irony internal layer, copper middle level and tin matter outer layer, by mass fraction its accounting point
Wei not 79.94%, 10.39%, 5.46%.
The lead shaped device of the pin configuration of the present embodiment, including material carrier platform 7, separately the first punch die 13, bar 8 and second
Punch die 9；First punch die 13 and material carrier platform 7 are oppositely arranged, and the first punch die 13 includes flat-die 11 and perpendicular mould 12, and perpendicular mould 12 is set
Arranged in the both sides flat-die 11 and perpendicular mould 12 of flat-die 11 in concave shape；The both sides for separating bar 8 are respectively arranged with second punch die 9
Centre；Second punch die 9 is arranged on the lower section of baffle plate 10, and the second punch die 9 and the first punch die 13 are arranged on approximately the same plane
On, the external side parallel of the perpendicular mould 12 of the inner side of the second punch die 9 and the first punch die 13, and the second punch die 9 inner side outside.
In the present embodiment, the head for separating bar 8 is in isosceles trapezoid, and separately the head of bar 8 can be in other embodiments
Isosceles triangle.
In the present embodiment, chamfering is provided with the inside of the both sides and the head of the second punch die 9 on the perpendicular head of mould 12.
The pin configuration of the present embodiment do not need seat board can just stand stabilization, and standing part be provided with inner bracing piece and
Outer support bar, such a pin configuration has 4 support bars to be supported, and its intensity is high, so ensure that capacitor is stood
When it is highly stable, and the stress on every support bar is highly uniform, is not in because lead is just deformed by collision rift
And cause the phenomenon of astasia.
Embodiment 2
In the present embodiment, a diameter of 0.50mm of lead, the connecting portion and curved portions of lead include irony internal layer, copper
Middle level and tin matter outer layer, by mass fraction, its irony internal layer accounts for 68.59%, and copper middle level accounts for 19.23%, and tin matter outer layer is accounted for
12.18%；Inner bracing piece and inner bracing piece also include irony internal layer, copper middle level and tin matter outer layer, by its accounting of mass fraction
Respectively 80.79%, 10.50%, 8.71%.
The other parts of the present embodiment are same as Example 1.
Embodiment 3
In the present embodiment, a diameter of 0.60mm of lead, the connecting portion and curved portions of lead include irony internal layer, copper
Middle level and tin matter outer layer, by mass fraction, its irony internal layer accounts for 70.17%, and copper middle level accounts for 19.67%, and tin matter outer layer is accounted for
10.16%；Inner bracing piece and inner bracing piece also include irony internal layer, copper middle level and tin matter outer layer, by its accounting of mass fraction
Respectively 82.07%, 10.66%, 7.27%.
The other parts of the present embodiment are same as Example 1.
Embodiment 4
In the present embodiment, a diameter of 0.80mm of lead, the connecting portion and curved portions of lead include irony internal layer, copper
Middle level and tin matter outer layer, by mass fraction, its irony internal layer accounts for 74.80%, and copper middle level accounts for 19.76%, and tin matter outer layer accounts for 5,
43%；Inner bracing piece and inner bracing piece also include irony internal layer, copper middle level and tin matter outer layer, and by mass fraction, its accounting is distinguished
For 83.67%, 10.87%, 5.46%.
The other parts of the present embodiment are same as Example 1.
Embodiment 5
The pin configuration of the present embodiment, applied on battery, the positive wire and negative wire of battery use this implementation
The pin configuration of example, the other parts of the present embodiment are same as Example 1.
Claims (8)
1. a kind of pin configuration, it is characterised in that：Including connecting portion and standing part, capacitor sheet is stretched into one end of the connecting portion
It is connected in vivo with the electrode of capacitor, the other end and standing part are connected, the standing part is vertically arranged with connecting portion；It is described to stand
Portion is horizontally disposed with；The standing part includes inner bracing piece and outer support bar, and the inner bracing piece is connected on connecting portion, described interior
Connected between support bar and outer support bar by curved portions.
2. pin configuration according to claim 1, it is characterised in that：The inner bracing piece, curved portions and outer support bar are in U
Font is arranged and in same horizontal plane.
3. pin configuration according to claim 1, it is characterised in that：The connecting portion and curved portions include in irony
Layer, copper middle level and tin matter outer layer, by mass fraction, its irony internal layer accounts for 67.55%-74.84%, and copper middle level is accounted for
18.83%-19.76%, tin matter outer layer accounts for 5.43%-13.52%；The inner bracing piece and inner bracing piece also include in irony
Layer, copper middle level and tin matter outer layer, are respectively 79.94%-83.7%, 10.39%-10.87% by mass fraction its accounting,
5.46%-9.67%.
4. pin configuration according to claim 1, it is characterised in that：Angle between the inner bracing piece and outer support bar
For 0-45 degree.
5. pin configuration according to claim 1, it is characterised in that：The connecting portion and standing part are integrally formed.
6. a kind of lead shaped device of pin configuration according to claim any one of 1-5, it is characterised in that：Including carrying
Expect platform, the first punch die, separate bar and the second punch die；First punch die and material carrier platform are oppositely arranged, and first punch die includes
Flat-die and perpendicular mould, perpendicular mould are arranged on the both sides of flat-die, and flat-die and perpendicular mould are arranged in concave shape；The both sides for separating bar are set respectively
It is equipped with second punch die；Second punch die is arranged on the lower section of baffle plate, and the second punch die and the first punch die are arranged on together
In one plane, the external side parallel of the inner side of second punch die and the perpendicular mould of the first punch die, and the inner side of the second punch die exists
Outside.
7. the lead shaped device of pin configuration according to claim 6, it is characterised in that：The head of the separately bar is in
Isosceles trapezoid or isosceles triangle.
8. the lead shaped device of pin configuration according to claim 6, it is characterised in that：The perpendicular mould and the second punch die
The contact site of lead is provided with chamfering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621371559.6U CN206497833U (en) | 2016-12-14 | 2016-12-14 | Pin configuration and its lead shaped device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621371559.6U CN206497833U (en) | 2016-12-14 | 2016-12-14 | Pin configuration and its lead shaped device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206497833U true CN206497833U (en) | 2017-09-15 |
Family
ID=59800464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621371559.6U Active CN206497833U (en) | 2016-12-14 | 2016-12-14 | Pin configuration and its lead shaped device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206497833U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601481A (en) * | 2016-12-14 | 2017-04-26 | 湖南艾华集团股份有限公司 | Leading wire structure and leading wire forming device, and leading wire forming process |
| CN108160864A (en) * | 2018-01-24 | 2018-06-15 | 东莞市瑞其精密机械有限公司 | Capacitance cutting bending and molding method and its former |
-
2016
- 2016-12-14 CN CN201621371559.6U patent/CN206497833U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601481A (en) * | 2016-12-14 | 2017-04-26 | 湖南艾华集团股份有限公司 | Leading wire structure and leading wire forming device, and leading wire forming process |
| WO2018108094A1 (en) * | 2016-12-14 | 2018-06-21 | 湖南艾华集团股份有限公司 | Leading wire structure, and leading wire forming device thereof and leading wire forming process thereof |
| CN106601481B (en) * | 2016-12-14 | 2020-01-21 | 湖南艾华集团股份有限公司 | Lead forming device and lead forming process |
| CN108160864A (en) * | 2018-01-24 | 2018-06-15 | 东莞市瑞其精密机械有限公司 | Capacitance cutting bending and molding method and its former |
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