CN206484746U - A kind of device for being used to lift diamond wire silicon chip working ability - Google Patents
A kind of device for being used to lift diamond wire silicon chip working ability Download PDFInfo
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- CN206484746U CN206484746U CN201621259484.2U CN201621259484U CN206484746U CN 206484746 U CN206484746 U CN 206484746U CN 201621259484 U CN201621259484 U CN 201621259484U CN 206484746 U CN206484746 U CN 206484746U
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- diamond wire
- casing
- sheave
- silicon chip
- lift
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Abstract
The utility model discloses a kind of device for being used to lift diamond wire silicon chip working ability, the inside of the casing is provided with coolant, the bottom of the casing is provided with ultrasonic generator, the upper surface of the casing is provided with fixed plate, spring is socketed with the installation screw rod, the upper end for installing screw rod passes through fixed plate, the lower end of the sheave support is arranged with two sheave mounting brackets, the sheave mounting bracket rotates connection sheave by mounting hole, and the two side of the escape pipe is provided with wire inlet-outlet.This is used for the device for lifting diamond wire silicon chip working ability, it is rational in infrastructure, practical, the setting of ultrasonic generator is cleaned by ultrasonic to the gauze below guide rail, the silica flour being wrapped on diamond wire is peeled off, the diamond cut ability of maintenance demand, the setting of air compressor machine is blown out after air is compressed by escape pipe, diamond wire after cleaning can be air-dried, and gases at high pressure can be to the further cleaning of diamond wire.
Description
Technical field
The utility model belongs to silicon chip process technology field, and in particular to one kind is used to lift diamond wire silicon chip working ability
Device.
Background technology
Diamond wire cutting process is mainly fixed abrasive material cutting, passes through the machine between the diamond and silico briquette on diamond wire line
Tool, which rubs, realizes the removal and processing of silicon materials, but steel wire carries out coming and going cutting in process, and hilted broadsword consumption line is less, steel wire
Upper each region rubs more than 2H in silico briquette.Silica flour is constantly peeled off in cutting process, because the silicon powder particle after cutting is special
Superfine, particle diameter about 2-5um, specific surface area is larger, therefore silica flour is easily adsorbed in diamond wire diamond particle surfaces and remained in
Between diamond particles, the diamond particles for participating in cutting are wrapped up, cause diamond later stage cutting power drastically to decline.
Utility model content
The purpose of this utility model is to provide a kind of device for being used to lift diamond wire silicon chip working ability, with solution
State the problem of being proposed in background technology.
To achieve the above object, the utility model provides following technical scheme:One kind is used to lift the processing of diamond wire silicon chip
The device of ability, including casing, the inside of the casing are provided with coolant, and the bottom of the casing is filled provided with ultrasonic wave
Put, the upper surface of the casing is provided with fixed plate, and the inside of the casing is provided with sheave support, and the upper end of the sheave support is set
Have and spring is socketed with two installation screw rods, the installation screw rod, the upper end of the installation screw rod passes through fixed plate, and installs spiral shell
The threaded upper ends of bar are connected nut, and the lower end of the sheave support is arranged with two sheave mounting brackets, the sheave peace
Shelve and connection sheave is rotated by mounting hole.
It is preferred that, upper end and the diamond wire of the escape pipe are vertically arranged.
It is preferred that, the left side of the casing is provided with air compressor machine, and the upper end of the air compressor machine is provided with escape pipe, the escape pipe
Two side be provided with wire inlet-outlet.
It is preferred that, the both sides of the escape pipe are provided with the air outlet pipe bracket for preventing from rocking.
It is preferred that, cushion is provided between the fixed plate and the upper surface of casing.
Technique effect of the present utility model and advantage:This is used for the device for lifting diamond wire silicon chip working ability, and structure is closed
Reason, practical, the setting of ultrasonic generator is cleaned by ultrasonic to the gauze below guide rail, will be wrapped in diamond wire
On silica flour peeled off, constantly repair because silica flour wraps up the diamond cut ability that constantly declines, maintain in cutting process
The diamond cut ability of demand, the setting of air compressor machine is blown out after air is compressed by escape pipe, can be by the gold after cleaning
Firm line is air-dried, and gases at high pressure can be to the further cleaning of diamond wire.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is A portions of the present utility model enlarged diagram;
Fig. 3 is sheave supporting structure schematic diagram of the present utility model.
In figure:Screw rod, 6 sheave mounting brackets, 7 are installed in 1 casing, 2 ultrasonic generators, 3 fixed plates, 4 sheave supports, 5
Mounting hole, 8 sheaves, 9 fixing nuts, 10 air compressor machines, 11 escape pipes, 12 wire inlet-outlets, 13 springs.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
The utility model provides a kind of device for being used to lift diamond wire silicon chip working ability as Figure 1-3, bag
Casing 1 is included, the inside of the casing 1 is provided with coolant, and the bottom of the casing 1 is provided with ultrasonic generator 2, the casing
1 upper surface is provided with fixed plate 3, and the inside of the casing 1 is provided with sheave support 4, and the upper end of the sheave support 4 is provided with two
Install and spring 13 is socketed with screw rod 5, the installation screw rod 5, the upper end for installing screw rod 5 passes through fixed plate 3, and installs spiral shell
The threaded upper ends of bar 5 are connected nut 9, and the lower end of the sheave support 4 is arranged with two sheave mounting brackets 6, the groove
Take turns mounting bracket 6 and connection sheave 8 is rotated by mounting hole 7, the upper end of the escape pipe 11 is vertically arranged with diamond wire, the casing
1 left side is provided with air compressor machine 10, and the upper end of the air compressor machine 10 is provided with escape pipe 11, the two side of the escape pipe 11 be provided with into
Line outlet 12, the both sides of the escape pipe 11 are provided with the air outlet pipe bracket for preventing from rocking, the fixed plate 3 and the upper end of casing 1
Cushion is provided between face.
Operation principle:Incisory diamond wire is entered in the coolant in casing 1 by sheave 8, ultrasonic generator 2
Diamond wire can be cleaned by ultrasonic, diamond wire passes through escape pipe 11, pneumatics from the wire inlet-outlet 12 of escape pipe 11 after cleaning
Machine 10 produces gases at high pressure and the diamond wire after cleaning is air-dried, and gases at high pressure can be to the further cleaning of diamond wire.
Finally it should be noted that:Preferred embodiment of the present utility model is the foregoing is only, this is not limited to
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Equivalent substitution is carried out, all within spirit of the present utility model and principle, any modification, equivalent substitution and improvements made etc.,
It should be included within protection domain of the present utility model.
Claims (5)
1. a kind of device for being used to lift diamond wire silicon chip working ability, including casing(1), the casing(1)Inside be provided with
Coolant, it is characterised in that:The casing(1)Bottom be provided with ultrasonic generator(2), the casing(1)Upper surface
Provided with fixed plate(3), the casing(1)Inside be provided with sheave support(4), the sheave support(4)Upper end be provided with two
Screw rod is installed(5), the installation screw rod(5)On be socketed with spring(13), the installation screw rod(5)Upper end pass through fixed plate
(3), and screw rod is installed(5)Threaded upper ends be connected nut(9), the sheave support(4)Lower end be arranged with two
Sheave mounting bracket(6), the sheave mounting bracket(6)Pass through mounting hole(7)Rotate connection sheave(8).
2. a kind of device for being used to lift diamond wire silicon chip working ability according to claim 1, it is characterised in that:It is described
Casing(1)Left side be provided with air compressor machine(10), the air compressor machine(10)Upper end be provided with escape pipe(11), the escape pipe(11)
Two side be provided with wire inlet-outlet(12).
3. a kind of device for being used to lift diamond wire silicon chip working ability according to claim 2, it is characterised in that:It is described
Escape pipe(11)Upper end be vertically arranged with diamond wire.
4. a kind of device for being used to lift diamond wire silicon chip working ability according to claim 2, it is characterised in that:It is described
Escape pipe(11)Both sides be provided with and prevent the air outlet pipe bracket that rocks.
5. a kind of device for being used to lift diamond wire silicon chip working ability according to claim 1, it is characterised in that:It is described
Fixed plate(3)With casing(1)Upper surface between be provided with cushion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201621259484.2U CN206484746U (en) | 2016-11-23 | 2016-11-23 | A kind of device for being used to lift diamond wire silicon chip working ability |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201621259484.2U CN206484746U (en) | 2016-11-23 | 2016-11-23 | A kind of device for being used to lift diamond wire silicon chip working ability |
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CN206484746U true CN206484746U (en) | 2017-09-12 |
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CN201621259484.2U Active CN206484746U (en) | 2016-11-23 | 2016-11-23 | A kind of device for being used to lift diamond wire silicon chip working ability |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108407117A (en) * | 2018-05-23 | 2018-08-17 | 江苏聚成金刚石科技有限公司 | A kind of slicer improving diamond wire chipping qualities |
CN108581790A (en) * | 2018-04-30 | 2018-09-28 | 宁波钜德精工机械有限公司 | Buddha's warrior attendant wire cutting machine |
CN110497544A (en) * | 2019-08-07 | 2019-11-26 | 江苏高照新能源发展有限公司 | A kind of cutting method applied to ultralow TTV monocrystalline silicon piece |
CN111715615A (en) * | 2020-06-29 | 2020-09-29 | 晶科绿能(上海)管理有限公司 | Ultrasonic cleaning device and cutting equipment |
-
2016
- 2016-11-23 CN CN201621259484.2U patent/CN206484746U/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108581790A (en) * | 2018-04-30 | 2018-09-28 | 宁波钜德精工机械有限公司 | Buddha's warrior attendant wire cutting machine |
CN108581790B (en) * | 2018-04-30 | 2019-11-12 | 宁波钜德精工机械有限公司 | Buddha's warrior attendant wire cutting machine |
CN108407117A (en) * | 2018-05-23 | 2018-08-17 | 江苏聚成金刚石科技有限公司 | A kind of slicer improving diamond wire chipping qualities |
CN110497544A (en) * | 2019-08-07 | 2019-11-26 | 江苏高照新能源发展有限公司 | A kind of cutting method applied to ultralow TTV monocrystalline silicon piece |
CN111715615A (en) * | 2020-06-29 | 2020-09-29 | 晶科绿能(上海)管理有限公司 | Ultrasonic cleaning device and cutting equipment |
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