CN206476315U - A kind of silicon chip transport package box - Google Patents
A kind of silicon chip transport package box Download PDFInfo
- Publication number
- CN206476315U CN206476315U CN201621352915.XU CN201621352915U CN206476315U CN 206476315 U CN206476315 U CN 206476315U CN 201621352915 U CN201621352915 U CN 201621352915U CN 206476315 U CN206476315 U CN 206476315U
- Authority
- CN
- China
- Prior art keywords
- casing
- box
- silicon chip
- bottom plate
- box door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a kind of silicon chip transport package box, including casing, top plate, bottom plate, go out box door, packing box, via hole, top plate and bottom plate are provided with the casing, top plate is connected by some first springs with box top wall, bottom plate is connected by some second springs with casing bottom wall, some packing boxes are placed between top plate and bottom plate, casing side side wall is provided with out box door, and the offside for going out box door place side of casing is provided with a via hole.The utility model is by the way that the top for being connected with the first spring and the bottom plate for being connected with second spring are arranged in casing; so that the packing box equipped with silicon chip is being difficult acutely to beat up and down compared with bumpy sections; it is effective to protect the silicon chip of the inside; also the horizontal level of the packing box of the top can simultaneously be in out in the range of box door place all the time, the taking-up of packing box is facilitated.
Description
【Technical field】
The utility model is related to the technical field of the technical field of silicon chip, particularly silicon chip transport package box.
【Background technology】
Silicon chip is raw material indispensable in the fields such as electronic product and photovoltaic generation, and silicon wafer to manufacture is cumbersome and compares
Crisp, it is easily broken by impact in transportation, and the silicon chip after smashing is not easily recycled utilization, therefore to ensure silicon as far as possible
Piece is difficult broken in transportation.Existing packing case is not ideal enough, it is necessary to improve in terms of silicon chip is protected.
【Utility model content】
The purpose of this utility model is exactly to solve the problems of the prior art, proposes a kind of silicon chip transport package box, can
Silicon chip is set to be difficult in transportation broken, and the packing box equipped with silicon chip easily takes out.
To achieve the above object, the utility model proposes a kind of silicon chip transport package box, including casing, top plate, bottom plate,
Go out and top plate and bottom plate are provided with box door, packing box, via hole, the casing, top plate passes through some first springs and box top wall
It is connected, bottom plate is connected by some second springs with casing bottom wall, and some packing boxes, the casing are placed between top plate and bottom plate
Side side wall is provided with out box door, and the offside for going out box door place side of casing is provided with a via hole.
Preferably, it is described go out box door be located at casing top half, go out box door height be packing box height 1.2-
1.8 again.
Preferably, have some positive stop lug boss on two adjacent walls of the casing the latter half, casing the latter half
There are some limited impressions corresponding with spacing raised line on two other adjacent wall.
The beneficial effects of the utility model:The utility model is by will be connected with the top of the first spring and be connected with second spring
Bottom plate be arranged in casing so that the packing box equipped with silicon chip is being difficult acutely to beat up and down compared with bumpy sections, effective to protect
The silicon chip of the inside has been protected, while the horizontal level of the packing box of the top can also be in out in the range of box door place all the time,
Facilitate the taking-up of packing box;The setting of spacing raised line and limited impression causes all casings to be linked to be an entirety so that case
Body is difficult rollover in transportation, is effectively protected silicon chip.
Feature and advantage of the present utility model will be described in detail by embodiment combination accompanying drawing.
【Brief description of the drawings】
Fig. 1 is a kind of front view of silicon chip transport package box of the utility model;
Fig. 2 is a kind of upward view of silicon chip transport package box of the utility model.
In figure:1- casings, 2- top plates, 3- bottom plates, 4- packing boxes, 11- go out box door, 12- via holes, 15- positive stop lug boss,
16- limited impressions, the springs of 21- first, 31- second springs.
【Embodiment】
Refering to Fig. 1 and Fig. 2, a kind of silicon chip transport package box of the utility model, including casing 1, top plate 2, bottom plate 3, go out box
Top plate 2 and bottom plate 3 are provided with door 11, packing box 4, via hole 12, the casing 1, top plate 2 passes through some first springs 21 and case
The roof of body 1 is connected, and bottom plate 3 is connected by some second springs 31 with the bottom wall of casing 1, and some bags are placed between top plate 2 and bottom plate 3
Mounted box 4, the side side wall of casing 1 is provided with out box door 11, and the offside for going out 11 place sides of box door of casing 1 is provided with a via hole
12, it is described go out box door 11 be located at the top half of casing 1, the height for going out box door 11 is 1.2-1.8 times of the height of packing box 4, institute
There are some positive stop lug boss 15, two other adjacent wall of the latter half of casing 1 on two adjacent walls for stating the latter half of casing 1
On have some limited impressions 16 corresponding with spacing raised line.
Utility model works process:
A kind of silicon chip transport package box of the utility model in the course of the work, selects the suitable bullet of first spring 21 and second
Spring 31 causes the packing box 4 of the superiors to be always positioned at out in the scope corresponding to box door 11, is easy to the taking-up of packing box 4, takes out
When inserted with stub in via hole 12, packing box 4 is released directly can be taken out packing box with hand after a segment distance, simultaneously
First spring 21 and second spring 31 can play a part of damping, be effectively protected silicon chip, can be by when transporting many packing cases
Positive stop lug boss 15 on packing case is inserted in the limited impression 16 of adjacent packing case so that each packing case is linked to be an entirety,
So that packing case is difficult rollover in transportation.
It, to explanation of the present utility model, is limited of the present utility model that above-described embodiment, which is, any new to this practicality
Scheme after type simple transformation belongs to protection domain of the present utility model.
Claims (3)
1. a kind of silicon chip transport package box, it is characterised in that:Including casing (1), top plate (2), bottom plate (3), go out box door (11), bag
Top plate (2) and bottom plate (3) are provided with mounted box (4), via hole (12), the casing (1), top plate (2) passes through some first springs
(21) be connected with casing (1) roof, bottom plate (3) is connected by some second springs (31) with casing (1) bottom wall, top plate (2) with
It is placed with some packing boxes (4) between bottom plate (3), casing (1) side side wall is provided with out box door (11), casing (1) goes out
The offside of side is provided with a via hole (12) where box door (11).
2. a kind of silicon chip transport package box as claimed in claim 1, it is characterised in that:It is described go out box door (11) be located at casing
(1) top half, the height for going out box door (11) is 1.2-1.8 times of packing box (4) height.
3. a kind of silicon chip transport package box as claimed in claim 1, it is characterised in that:The two of casing (1) the latter half
Have on adjacent wall on some positive stop lug boss (15), two other adjacent wall of casing (1) the latter half have it is some with it is spacing
The corresponding limited impression of raised line (16).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621352915.XU CN206476315U (en) | 2016-12-09 | 2016-12-09 | A kind of silicon chip transport package box |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621352915.XU CN206476315U (en) | 2016-12-09 | 2016-12-09 | A kind of silicon chip transport package box |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206476315U true CN206476315U (en) | 2017-09-08 |
Family
ID=59757021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621352915.XU Expired - Fee Related CN206476315U (en) | 2016-12-09 | 2016-12-09 | A kind of silicon chip transport package box |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206476315U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107914950A (en) * | 2017-12-29 | 2018-04-17 | 天津天蓝生物质利用科技有限公司 | A kind of positioning protection device easy to kit transport |
-
2016
- 2016-12-09 CN CN201621352915.XU patent/CN206476315U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107914950A (en) * | 2017-12-29 | 2018-04-17 | 天津天蓝生物质利用科技有限公司 | A kind of positioning protection device easy to kit transport |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170908 Termination date: 20171209 |
|
CF01 | Termination of patent right due to non-payment of annual fee |