CN206455834U - A kind of cutting head of silicon chip wire cutting - Google Patents
A kind of cutting head of silicon chip wire cutting Download PDFInfo
- Publication number
- CN206455834U CN206455834U CN201720080321.6U CN201720080321U CN206455834U CN 206455834 U CN206455834 U CN 206455834U CN 201720080321 U CN201720080321 U CN 201720080321U CN 206455834 U CN206455834 U CN 206455834U
- Authority
- CN
- China
- Prior art keywords
- cutting head
- mortar
- cutting
- silicon chip
- catch basin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 25
- 239000010703 silicon Substances 0.000 title claims abstract description 25
- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 30
- 239000012634 fragment Substances 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000012797 qualification Methods 0.000 abstract description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a kind of cutting head of silicon chip wire cutting, cutting head column, mortar nozzle, fragment box including cutting head base, positioned at cutting head base two ends, the cutting head column is provided with two cutting head mounting holes for being used to install the bearing of cutting head bearing housing；The mortar nozzle is located in the middle of the cutting head column, is located between two mortar nozzles below mortar nozzle and is provided with fragment box；The mortar nozzle includes catch basin, and the catch basin is provided with water inlet, and the catch basin side is provided with apopore, and inclined deflector is arranged below in the apopore.The utility model sets mortar nozzle in the both sides of cutting guide wheel, after mortar is filled inside box, at the uniform velocity flows out, and to silicon chip impulsive force less, can also be uniformly distributed on the net online positioned at both sides mortar.The centre-to-centre spacing of cutting head mounting hole is reduced, and gauze is reduced, more stable to be not easy broken string, and cut quality is higher, improves production efficiency and the qualification rate of silicon chip.
Description
Technical field
The utility model belongs to silicon chip line cutting technology field, more particularly to a kind of cutting head of silicon chip wire cutting.
Background technology
The cutting head of traditional silicon chip linear cutting equipment, the centre-to-centre spacing of bearing housing is relatively wide, and centre-to-centre spacing is wide, the rotation of guide wheel
Speed is slow, and cutting efficiency is low, and the process of cutting easily breaks, the easy fragmentation of silicon chip, can more seriously cause whole silicon rod to be broken.It is former
Some mortar nozzles are sprayed directly on on silicon chip or gauze, and mortar is larger to silicon chip shock dynamics, easily causes silicon chip rupture, line
Mortar can not be evenly distributed on the net；Traditional mortar nozzle usage quantity is more in addition, installs cumbersome.
Utility model content
To solve above mentioned problem present in prior art and actual conditions, the utility model is cut there is provided a kind of silicon chip line
The cutting head cut, including cutting head base, the cutting head column positioned at cutting head base two ends, mortar nozzle, fragment box are described
Cutting head column is provided with two cutting head mounting holes for being used to install the bearing of cutting head bearing housing；The mortar nozzle is located at
In the middle of the cutting head column, each one of both sides are oppositely arranged；It is located between two mortar nozzles below mortar nozzle and sets
There is fragment box.
Preferably, the mortar nozzle includes catch basin, and the catch basin is provided with water inlet, and the catch basin both sides are set
There is support frame, the catch basin side is provided with apopore, and inclined deflector is arranged below in the apopore.
Preferably, the fragment box, including box body, the box body is provided with opening, and the both ends of the surface bottom of the box body is provided with
Fragment box delivery port.
The cutting head base is used to install with board.
Mortar nozzle is set in the both sides of cutting guide wheel, after mortar is filled inside box, at the uniform velocity flows out, silicon chip is impacted
Power less, can also be uniformly distributed on the net online positioned at both sides mortar.
There are line of cut group and silicon rod above fragment box, during cutting, there is part silicon chip to drop, silicon chip can drop
Inside fragment box, there is part can be recycled；Fragment box is located at gauze bottom, effectively protects fragment, is easy to collect.
The cutting head of the utility model silicon chip linear cutting equipment, the centre-to-centre spacing of mounting hole is reduced, and gauze is reduced, more surely
Fixed to be not easy broken string, cut quality is higher, improves production efficiency and the qualification rate of silicon chip.
Brief description of the drawings
Fig. 1 is the structural representation of the cutting head of the silicon chip wire cutting of the utility model embodiment.
Embodiment
As shown in figure 1, a kind of cutting head of silicon chip wire cutting, including cutting head base 4, positioned at the two ends of cutting head base 4
Cutting head column 5, mortar nozzle 1 and fragment box 7, the cutting head column 5 provided with two be used for cutting head bearing is installed
The cutting head mounting hole 2 of the bearing of case；The mortar nozzle 1 is located in the middle of the cutting head column 5, each one of both sides, relatively
Set；Fragment box 7 is arranged below positioned at mortar nozzle 1 between two mortar nozzles 1.
The mortar nozzle 1 includes catch basin 10, and the catch basin 10 is provided with water inlet 11, the both sides of catch basin 10
Provided with support frame 12, the catch basin side is provided with apopore, and inclined deflector 9 is arranged below in the apopore.
Opening is provided with above the fragment box 7, including box body, the box body, the both ends of the surface bottom of the box body is provided with broken
Film magazine delivery port 6.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, this is not limited to
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Carry out equivalent substitution.It is all it is of the present utility model spirit and principle within, any modification, equivalent substitution and improvements made etc.,
It should be included within protection domain of the present utility model.
Claims (3)
1. a kind of cutting head of silicon chip wire cutting, it is characterised in that including cutting head base, cutting positioned at cutting head base two ends
A column, mortar nozzle and fragment box are cut, the cutting head column is provided with two bearings for being used to install cutting head bearing housing
Cutting head mounting hole；The mortar nozzle is located in the middle of the cutting head column, and each one of both sides are oppositely arranged；Two institutes
State to be located at below mortar nozzle between mortar nozzle and be provided with fragment box.
2. the cutting head of silicon chip wire cutting according to claim 1, it is characterised in that the mortar nozzle includes retaining
Groove, the catch basin is provided with water inlet, and the catch basin both sides are provided with support frame, and the catch basin side is provided with apopore,
Inclined deflector is arranged below in the apopore.
3. the cutting head of silicon chip wire cutting according to claim 1, it is characterised in that the fragment box includes box body, institute
State and opening is provided with above box body, the both ends of the surface bottom of the box body is provided with fragment box delivery port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720080321.6U CN206455834U (en) | 2017-01-22 | 2017-01-22 | A kind of cutting head of silicon chip wire cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720080321.6U CN206455834U (en) | 2017-01-22 | 2017-01-22 | A kind of cutting head of silicon chip wire cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206455834U true CN206455834U (en) | 2017-09-01 |
Family
ID=59698722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720080321.6U Active CN206455834U (en) | 2017-01-22 | 2017-01-22 | A kind of cutting head of silicon chip wire cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206455834U (en) |
-
2017
- 2017-01-22 CN CN201720080321.6U patent/CN206455834U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231214 Address after: No. 10, Chengtang Road, Huishan Economic Development Zone, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Zhanzhao Precision Machinery Technology Co.,Ltd. Address before: 214407 No. 10, Chengtang Road, Huishan District, Wuxi City, Jiangsu Province Patentee before: JIANGYIN ZHANZHAO TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right |