CN206449544U - Radiator - Google Patents
Radiator Download PDFInfo
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- CN206449544U CN206449544U CN201621092274.9U CN201621092274U CN206449544U CN 206449544 U CN206449544 U CN 206449544U CN 201621092274 U CN201621092274 U CN 201621092274U CN 206449544 U CN206449544 U CN 206449544U
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Abstract
Embodiment of the present utility model provides a kind of radiator, including:Substrate;Being arranged side by side in the first area of substrate and multiple heat-dissipating fins each other with gap;There are with being arranged side by side in the second area different from first area of substrate and each other multiple thermal columns in gap.The radiator is by setting two kinds of radiator structures of heat-dissipating fin and thermal column to improve the flexibility ratio of fansink designs to optimize and improve radiating effect simultaneously.
Description
Technical field
The utility model is related to light fixture field of radiating, more particularly to a kind of radiator.
Background technology
The light source of a variety of light fixtures also releases substantial amounts of heat while light is sent.The accumulation of these heats may cause
The local high temperature of light fixture is so that damage part.This phenomenon is especially serious in LED lamp.Therefore, radiator exists
Effect in light fixture also becomes more and more important.It is scattered such as being widely used in the car light of motor vehicles (such as headlamp and light signaling devices)
Hot device.Existing radiator is generally using the form of the heat-dissipating fin positioned at light source (such as light-emitting diode chip for backlight unit) back side.
Utility model content
The purpose of this utility model is to provide a kind of radiator, and it has thermal column and heat-dissipating fin simultaneously, so as to
The radiating effect of radiator is optimized.
Embodiment of the present utility model provides a kind of radiator, including:
Substrate;
Being arranged side by side in the first area of substrate and multiple heat-dissipating fins each other with gap;With
Being arranged side by side in the second area different from first area of substrate and many with gap each other
Individual thermal column.
In one embodiment, the first area is located at the end of the substrate.
In one embodiment, the multiple heat-dissipating fin is disposed through the substrate and described the first of the substrate
The ventilation slot of substrate is formed through between the heat-dissipating fin in region, adjacent.
In one embodiment, the width of the ventilation slot is less than the spacing between adjacent heat-dissipating fin.
In one embodiment, the substrate has an installation surface, the installation surface be used to carrying printed circuit board (PCB) and/or
Light source, the multiple thermal column is located on the side facing away from the installation surface of the substrate.
In one embodiment, the light source is light emitting diode, and installation surface is provided with boss, the light emitting diode energy
Enough it is directly installed on boss.
In one embodiment, the first area is arranged at the air flow position weaker than second area.
In one embodiment, the bearing of trend of the thermal column it is parallel with the bearing of trend of the heat-dissipating fin or relative to
The bearing of trend of the heat-dissipating fin is tilted.
In one embodiment, the thermal column is cylindrical shape or prism shape.
In one embodiment, the thickness of the heat-dissipating fin is in the range of 0.5mm to 5mm.
In one embodiment, the diameter of the thermal column is in the range of 0.5mm to 5mm.
In one embodiment, the radiator is integrated cold-forging forming part.
Radiator as described at least one above-mentioned embodiment of the present utility model, by simultaneously set heat-dissipating fin and
Two kinds of radiator structures of thermal column are to improve the flexibility ratio of fansink designs to optimize and improve radiating effect.
Brief description of the drawings
Fig. 1 shows the peace of the schematic perspective view, wherein radiator of the radiator according to an embodiment of the present utility model
Fill surface upward;
Fig. 2 shows the back of the body of the schematic perspective view, wherein radiator of the radiator according to an embodiment of the present utility model
Up;
Fig. 3 shows the schematic elevational view of the radiator according to an embodiment of the present utility model;
Fig. 4 shows the schematic side elevation of the radiator according to an embodiment of the present utility model;
Fig. 5 shows the schematic rear view of the radiator according to an embodiment of the present utility model;And
Fig. 6 shows the schematic plan of the radiator according to an embodiment of the present utility model.
Embodiment
Below by embodiment, and with reference to accompanying drawing, the technical solution of the utility model is described in further detail.
In specification, same or analogous drawing reference numeral represents same or analogous part.It is following real to the utility model referring to the drawings
The explanation for applying mode is intended to explain overall utility model design of the present utility model, and is not construed as to this practicality
A kind of new limitation.
According to general plotting of the present utility model there is provided a kind of radiator, including:Substrate;Positioned at the first area of substrate
In be arranged side by side and each other have gap multiple heat-dissipating fins;With positioned at substrate different from the second of first area
Being arranged side by side in region and multiple thermal columns each other with gap.
In addition, in the following detailed description, for ease of explaining, elaborating many concrete details to provide to present disclosure
The comprehensive understanding of embodiment.It should be apparent, however, that one or more embodiments also may be used in the case of these no details
To be carried out.
Fig. 1-6 schematically shows the radiator 100 according to an embodiment of the present utility model.The radiator 100 is wrapped
Include:Substrate 10;Being arranged side by side in the first area 11 of substrate 10 and multiple heat-dissipating fins each other with gap
20;There is with being arranged side by side in the second area 12 different from first area 11 of substrate 10 and each other gap
Multiple thermal columns 30.Thermal column 30 can be for example cylindrical shape or prism shape, have with heat-dissipating fin 20 in thermolysis
Institute is different, heat-dissipating fin 20 due to be sheet structure, passage can be formed between each adjacent heat-dissipating fin 20, this leads to
Road can guide air flow, for example, can guide heat to the region of needs or avoid may be hurtful to part
Region.Moreover, heat-dissipating fin 20 generally has more preferable intensity, not easy to break and deformation.And thermal column 30 and heat-dissipating fin 20
Compare, air can be made more freely to circulate, without only along fixed passage one-way flow.
The characteristics of both have each different due to thermal column 30 and heat-dissipating fin 20, both combination applications can be directed to
Different cooling requirements between regional are optimized to the radiating effect of radiator.Actual in use, light fixture
In structure design be diversified, thus may faces according to the different positions of the radiator of embodiment of the present utility model
Face different situations, in other words, the different piece of same radiator can be used for meeting dissipating for radiating conditions different in system
Heat request.For example, heat-dissipating fin 20 can be arranged to the weaker position of air flow, and thermal column 30 is arranged at air stream
Dynamic stronger position.In the example depicted in fig. 1, the air flow of the position where first area 11 can be than second area 12
The air flow of the position at place is weak, i.e., the air velocity of the position where first area 11 can be than the place of second area 12
The air velocity of position is small.So, in position of the air flow compared with strong (i.e. air velocity is larger), thermal column 30 can allow sky
Gas flows freely to take away heat to all directions;And in the position of air flow relatively poor (i.e. air velocity is smaller), dissipate
The one-way guide flow effect of hot fin 20 can accelerate air flow, so as to improve radiating effect.This thermal column 30 and radiating wing
The radiator that piece 20 is applied in combination is provided compared with the radiator of thermal column 30 or heat-dissipating fin 20 is used alone for heat dissipation design
Greater flexibility, helps to optimize the radiating effect of radiator.
In one example, the first area 11 where multiple heat-dissipating fins 20 can be located at the end of the substrate 10 (such as
Shown in Fig. 1).In practice, this region is often smaller with other part spacing in system, and air flow property is relatively poor.
As an example, the multiple heat-dissipating fin 20 can be disposed through the substrate 10.This can substrate 10 thickness it is little
In the case of form longer flow-guiding channel, so as to reduce the thickness of substrate 10.In addition, in firstth area of the substrate 10
The ventilation slot 40 of substrate 10 can also be formed through between the heat-dissipating fin 20 in domain 11, adjacent, to promote air stream
It is dynamic.As an example, the width of the ventilation slot 40 can be less than the spacing between adjacent heat-dissipating fin 20 (referring to Fig. 3 and figure
5).In this case, ventilation slot 40 can be used for forming restriction, to improve air-flow exhaust system design.The heat-dissipating fin 20
It can be used together with reference to fan.
In one example, substrate 10 have installation surface 13, the installation surface 13 be used for carry printed circuit board (PCB) and/or
Light source, the multiple thermal column 30 is located on the side facing away from the installation surface 13 of the substrate 10 (as referring to Fig. 2 institutes
Show).Thermal column 30 will can be transmitted from the heat produced by light source and/or line device to the air flowed outside four.
In one example, light source can be light emitting diode.Installation surface 13 can be provided with boss 14, described luminous two
Pole pipe can be directly installed on boss 14.Light emitting diode is directly installed on boss 14, rather than passes through large-size
Printed circuit board (PCB) be arranged on boss 14 on, radiating during LED operation can be more conducive to.
As an example, the bearing of trend of the thermal column 30 can be parallel (such as with the bearing of trend of the heat-dissipating fin 20
Shown in Fig. 5).This is favourable for the manufacture craft of radiator.But, embodiment not limited to this of the present utility model, for example,
The bearing of trend of the thermal column 30 can also be tilted relative to the bearing of trend of the heat-dissipating fin 20.
As an example, the thickness of the heat-dissipating fin 20 can be in the range of 0.5mm to 5mm, such as 1mm to 3mm.As
Example, the diameter of the thermal column 30 can be in the range of 0.5mm to 5mm, such as 1mm to 3mm.Heat-dissipating fin 20 and thermal column
30 height can give according to actual design requirement.The area of dissipation (surface area) of heat-dissipating fin 20 and thermal column 30 is got over
Greatly, radiating effect is better.
In embodiment of the present utility model, heat-dissipating fin 20 and thermal column 30 are all disposed within same radiator, are scattered
Thermal design provides bigger flexibility ratio., can be right by adjusting heat-dissipating fin 20 and the respective quantity of thermal column 30 and layout
The radiating effect of radiator is optimized.Experiment shows, under equal conditions, according to the radiator of embodiment of the present utility model
Compared with the radiator of heat-dissipating fin is only set, the temperature of light emitting diode can at least be reduced by 1 to 2 degree Celsius.
It can manufacture higher to obtain by integrally formed mode according to the radiator of embodiment of the present utility model
Bulk strength, for example, the radiator can be integrated cold-forging forming part.Integral cold-forging forming part and traditional cast form part
Compare, the mechanical defect of structure is less, and weight is lighter, and cost is lower.
It can be used for according to the radiator of embodiment of the present utility model in various light fixtures, it is particularly possible to for all kinds
Headlight for motor-driven vehicles and/or signal lamp in, for example headlamp, center high-mounted stop lamp, steering indicating light, position lamp, afterbody are stopped
Car light etc..
Although the utility model is illustrated with reference to accompanying drawing, the embodiment disclosed in accompanying drawing is intended to this practicality
New preferred embodiment is illustrative, and it is not intended that to a kind of limitation of the present utility model.Chi in accompanying drawing
Very little ratio is only schematical, can not be interpreted as to limitation of the present utility model.
Although some embodiments of the utility model general plotting are shown and illustrated, those of ordinary skill in the art will
Understand, in the case of the principle and spirit conceived without departing substantially from this overall utility model, these embodiments can be made a change, this
The scope of utility model is limited with claim and their equivalent.
Claims (12)
1. a kind of radiator, including:
Substrate;
Being arranged side by side in the first area of substrate and multiple heat-dissipating fins each other with gap;With
Being arranged side by side in the second area different from first area of substrate and each other with gap it is multiple dissipate
Plume.
2. radiator according to claim 1, it is characterised in that the first area is located at the end of the substrate.
3. radiator according to claim 1 or 2, it is characterised in that the multiple heat-dissipating fin is disposed through described
The ventilation of substrate is formed through between substrate and the heat-dissipating fin in the first area of the substrate, adjacent
Groove.
4. radiator according to claim 3, it is characterised in that the width of the ventilation slot is less than adjacent heat-dissipating fin
Between spacing.
5. radiator according to claim 1 or 2, it is characterised in that the substrate has installation surface, the installation table
Face is used to carry printed circuit board (PCB) and/or light source, the multiple thermal column be located at the substrate facing away from the installation surface
On side.
6. radiator according to claim 5, it is characterised in that the light source is light emitting diode, installation surface is set
There is boss, the light emitting diode can be directly installed on boss.
7. radiator according to claim 1 or 2, it is characterised in that the first area is arranged at air flow and compares
The weak position in two regions.
8. radiator according to claim 1 or 2, it is characterised in that the bearing of trend of the thermal column and the radiating
The bearing of trend of fin is parallel or bearing of trend relative to the heat-dissipating fin is tilted.
9. radiator according to claim 1 or 2, it is characterised in that the thermal column is cylindrical shape or prism shape.
10. radiator according to claim 1 or 2, it is characterised in that the thickness of the heat-dissipating fin is in 0.5mm to 5mm
In the range of.
11. radiator according to claim 1 or 2, it is characterised in that the diameter of the thermal column is in 0.5mm to 5mm models
In enclosing.
12. radiator according to claim 1 or 2, it is characterised in that the radiator is integrated cold-forging forming part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621092274.9U CN206449544U (en) | 2016-09-28 | 2016-09-28 | Radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621092274.9U CN206449544U (en) | 2016-09-28 | 2016-09-28 | Radiator |
Publications (1)
Publication Number | Publication Date |
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CN206449544U true CN206449544U (en) | 2017-08-29 |
Family
ID=59661970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201621092274.9U Active CN206449544U (en) | 2016-09-28 | 2016-09-28 | Radiator |
Country Status (1)
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CN (1) | CN206449544U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108302504A (en) * | 2016-09-28 | 2018-07-20 | 法雷奥照明湖北技术中心有限公司 | Radiator |
-
2016
- 2016-09-28 CN CN201621092274.9U patent/CN206449544U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108302504A (en) * | 2016-09-28 | 2018-07-20 | 法雷奥照明湖北技术中心有限公司 | Radiator |
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