CN206413285U - A quantum baking device applied to a circuit board soldering machine - Google Patents
A quantum baking device applied to a circuit board soldering machine Download PDFInfo
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- CN206413285U CN206413285U CN201720033543.2U CN201720033543U CN206413285U CN 206413285 U CN206413285 U CN 206413285U CN 201720033543 U CN201720033543 U CN 201720033543U CN 206413285 U CN206413285 U CN 206413285U
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- heating chamber
- box
- cover plate
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- circuit board
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- 238000005476 soldering Methods 0.000 title claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 238000005485 electric heating Methods 0.000 claims abstract description 7
- 238000009413 insulation Methods 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims 1
- 238000012423 maintenance Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 230000004907 flux Effects 0.000 description 3
- PZZOEXPDTYIBPI-UHFFFAOYSA-N 2-[[2-(4-hydroxyphenyl)ethylamino]methyl]-3,4-dihydro-2H-naphthalen-1-one Chemical compound C1=CC(O)=CC=C1CCNCC1C(=O)C2=CC=CC=C2CC1 PZZOEXPDTYIBPI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及锡焊加工烘烤装置技术领域，尤其涉及一种应用于电路板焊锡机的量子烘烤装置。The utility model relates to the technical field of soldering processing and baking devices, in particular to a quantum baking device applied to a circuit board soldering machine.
背景技术Background technique
在PCB电路板加工过程中，于焊锡加工前，需要在PCB电路板的焊接位置添加助焊剂，且添加有助焊剂的PCB电路板需经过烘烤处理后才可进行焊锡加工。In the process of PCB circuit board processing, flux needs to be added to the soldering position of the PCB circuit board before soldering, and the PCB circuit board with flux added needs to be baked before soldering can be processed.
需进一步解释，现有技术普遍采用波峰焊烘烤装置来对PCB电路板进行烘烤处理；然而，在实际的加工过程中，波峰焊烘烤装置存在以下优点，具体为：Further explanation is required. In the prior art, wave soldering baking devices are generally used to bake PCB circuit boards; however, in the actual processing process, wave soldering baking devices have the following advantages, specifically:
1、装置庞大，占地空间大，设备成本高；1. The device is huge, occupies a large space, and the equipment cost is high;
2、用电量大，能耗高；2. Large power consumption and high energy consumption;
3、烘箱过程复杂，流程长，易损伤产品；3. The oven process is complicated, the process is long, and the product is easy to be damaged;
4、维护成本高，维护困难，费人费时。4. High maintenance cost, difficult maintenance, and time-consuming.
实用新型内容Utility model content
本实用新型的目的在于针对现有技术的不足而提供一种应用于电路板焊锡机的量子烘烤装置，该应用于电路板焊锡机的量子烘烤装置设计新颖、结构简单、制作成本低、维护快速简单且维护成本低。The purpose of the utility model is to provide a quantum baking device applied to a circuit board soldering machine in view of the deficiencies of the prior art. The quantum baking device applied to a circuit board soldering machine is novel in design, simple in structure, and low in production cost. Maintenance is quick and easy with low maintenance costs.
为达到上述目的，本实用新型通过以下技术方案来实现。In order to achieve the above object, the utility model is realized through the following technical solutions.
一种应用于电路板焊锡机的量子烘烤装置，包括有呈水平横向布置的底板，底板的上表面装设有隔热箱体，隔热箱体的内部成型有朝上开口的送风加热腔室，隔热箱体的上端部于送风加热腔室的上端开口处装设有箱体盖板，箱体盖板的中间位置开设有上下完全贯穿且与送风加热腔室连通的盖板通孔，箱体盖板的上表面于盖板通孔的外围装设有用于放置PCB电路板的产品治具；A quantum baking device applied to a circuit board soldering machine, including a bottom plate arranged horizontally and horizontally, the upper surface of the bottom plate is equipped with a heat-insulating box, and the inside of the heat-insulating box is formed with an upward-opening air supply heating Chamber, the upper end of the heat insulation box is equipped with a box cover at the upper opening of the air supply heating chamber, and the middle position of the box cover is provided with a cover that completely penetrates up and down and communicates with the air supply heating chamber Board through hole, the upper surface of the box cover is equipped with a product fixture for placing the PCB circuit board on the periphery of the through hole of the cover;
隔热箱体的送风加热腔室内嵌装有呈镂空形状的发热铜板，发热铜板呈水平横向布置且发热铜板的内部嵌装有电加热管；A hollowed-out heating copper plate is embedded in the air supply heating chamber of the heat insulation box, and the heating copper plate is arranged horizontally and horizontally, and an electric heating tube is embedded inside the heating copper plate;
隔热箱体的下端部于发热铜板的下端侧开设有与送风加热腔室连通且由风机送风的送风口。The lower end of the heat-insulating box is provided with an air-supply port on the lower end side of the heat-generating copper plate, which communicates with the air-supply heating chamber and is blown by a fan.
其中，所述箱体盖板的下表面螺装有顶针安装块，顶针安装块装设有呈竖向布置且上端部伸入至所述盖板通孔内的产品顶针。Wherein, the lower surface of the box cover plate is screwed with a thimble mounting block, and the thimble mounting block is equipped with a vertically arranged product thimble whose upper end extends into the through hole of the cover plate.
本实用新型的有益效果为：本实用新型所述的一种应用于电路板焊锡机的量子烘烤装置，其包括有呈水平横向布置的底板，底板的上表面装设有隔热箱体，隔热箱体的内部成型有朝上开口的送风加热腔室，隔热箱体的上端部于送风加热腔室的上端开口处装设有箱体盖板，箱体盖板的中间位置开设有上下完全贯穿且与送风加热腔室连通的盖板通孔，箱体盖板的上表面于盖板通孔的外围装设有用于放置PCB电路板的产品治具；隔热箱体的送风加热腔室内嵌装有呈镂空形状的发热铜板，发热铜板呈水平横向布置且发热铜板的内部嵌装有电加热管；隔热箱体的下端部于发热铜板的下端侧开设有与送风加热腔室连通且由风机送风的送风口。通过上述结构设计，本实用新型具有设计新颖、结构简单、制作成本低、维护快速简单且维护成本低的优点。The beneficial effects of the utility model are: a quantum baking device applied to a circuit board soldering machine described in the utility model, which includes a bottom plate arranged horizontally and horizontally, and a heat insulation box is installed on the upper surface of the bottom plate, The inside of the heat-insulating box is formed with an upward-opening air-supply heating chamber. The upper end of the heat-insulating box is equipped with a box cover at the upper opening of the air-supply heating chamber. The middle position of the box cover is There is a through hole in the cover plate that completely penetrates up and down and communicates with the air supply heating chamber. The upper surface of the box cover plate is equipped with product fixtures for placing PCB circuit boards on the periphery of the through hole of the cover plate; the heat insulation box A hollowed-out heating copper plate is embedded in the air supply heating chamber, and the heating copper plate is arranged horizontally and horizontally, and an electric heating tube is embedded inside the heating copper plate; the lower end of the heat insulation box is opened on the lower end of the heating copper plate. The air supply port communicates with the air supply heating chamber and is supplied with air by the fan. Through the above structural design, the utility model has the advantages of novel design, simple structure, low manufacturing cost, fast and simple maintenance and low maintenance cost.
附图说明Description of drawings
下面利用附图来对本实用新型进行进一步的说明，但是附图中的实施例不构成对本实用新型的任何限制。The utility model is further described below using the drawings, but the embodiments in the drawings do not constitute any limitation to the utility model.
图1为本实用新型的结构示意图。Fig. 1 is the structural representation of the utility model.
图2为本实用新型的剖面示意图。Fig. 2 is a schematic cross-sectional view of the utility model.
在图1和图2中包括有：In Figure 1 and Figure 2 include:
1——底板 2——隔热箱体1——bottom plate 2——heat insulation box
21——送风加热腔室 3——箱体盖板21——air heating chamber 3——box cover
31——盖板通孔 4——产品治具31——through hole of cover plate 4——product fixture
5——发热铜板 6——电加热管5——heating copper plate 6——electric heating tube
7——送风口 8——顶针安装块7——air outlet 8——thimble mounting block
9——产品顶针。9——product thimble.
具体实施方式detailed description
下面结合具体的实施方式来对本实用新型进行说明。The utility model will be described below in conjunction with specific embodiments.
如图1和图2所示，一种应用于电路板焊锡机的量子烘烤装置，包括有呈水平横向布置的底板1，底板1的上表面装设有隔热箱体2，隔热箱体2的内部成型有朝上开口的送风加热腔室21，隔热箱体2的上端部于送风加热腔室21的上端开口处装设有箱体盖板3，箱体盖板3的中间位置开设有上下完全贯穿且与送风加热腔室21连通的盖板通孔31，箱体盖板3的上表面于盖板通孔31的外围装设有用于放置PCB电路板的产品治具4。As shown in Figures 1 and 2, a quantum baking device applied to a circuit board soldering machine includes a bottom plate 1 arranged horizontally and horizontally, the upper surface of the bottom plate 1 is equipped with a heat insulation box 2, and the heat insulation box The inside of the body 2 is formed with an upward-opening air supply heating chamber 21. The upper end of the heat insulation box 2 is equipped with a box cover plate 3 at the upper end opening of the air supply heating chamber 21. The box cover plate 3 There is a cover plate through hole 31 that completely penetrates up and down and communicates with the air supply heating chamber 21 at the middle position. The upper surface of the box cover plate 3 is equipped with a product for placing a PCB circuit board on the periphery of the cover plate through hole 31. Fixture 4.
进一步的，隔热箱体2的送风加热腔室21内嵌装有呈镂空形状的发热铜板5，发热铜板5呈水平横向布置且发热铜板5的内部嵌装有电加热管6。Further, the air supply heating chamber 21 of the heat insulation box 2 is embedded with a hollowed-out heating copper plate 5 , which is arranged horizontally and horizontally, and an electric heating tube 6 is embedded inside the heating copper plate 5 .
更进一步的，隔热箱体2的下端部于发热铜板5的下端侧开设有与送风加热腔室21连通且由风机送风的送风口7。Furthermore, the lower end of the heat insulation box 2 is provided with an air outlet 7 on the lower end side of the heating copper plate 5 , which communicates with the air heating chamber 21 and is blown by a fan.
在本实用新型工作过程中，隔热箱体2通过送风口7将外界空气引入至送风加热腔室21内，且进入至送风加热腔室21内的空气从下往上流动；其中，电加热管6对发热铜板5进行加热，由于发热铜板5设计成镂空结构，在气流通过发热铜板5的过程中，发热铜板5对气流进行加热，且经发热铜板5加热后的空气通过箱体盖板3的盖板通孔31而引送至放置于产品治具4的PCB电路板，热空气对PCB电路板进行加热烘烤处理，进而实现PCB电路板焊锡前助焊剂烘烤加工。During the working process of the utility model, the heat insulation box 2 introduces the external air into the air supply heating chamber 21 through the air supply port 7, and the air entering the air supply heating chamber 21 flows from bottom to top; wherein, The electric heating tube 6 heats the heating copper plate 5. Since the heating copper plate 5 is designed as a hollow structure, when the air flow passes through the heating copper plate 5, the heating copper plate 5 heats the air flow, and the air heated by the heating copper plate 5 passes through the box body The cover plate of the cover plate 3 is guided to the PCB circuit board placed on the product fixture 4 through the hole 31, and the hot air heats and bakes the PCB circuit board, thereby realizing the flux baking process before soldering the PCB circuit board.
综合上述情况可知，通过上述结构设计，本实用新型具有设计新颖、结构简单、制作成本低、维护快速简单且维护成本低的优点。Based on the above situation, it can be seen that through the above structural design, the utility model has the advantages of novel design, simple structure, low production cost, fast and simple maintenance and low maintenance cost.
作为优选的实施方式，如图1和图2所示，为保证本实用新型能够稳定可靠地辅助支撑放置于产品治具4的PCB电路板，本实用新型采用下述辅助支撑结构设计，具体的：箱体盖板3的下表面螺装有顶针安装块8，顶针安装块8装设有呈竖向布置且上端部伸入至盖板通孔31内的产品顶针9。在本实用新型工作过程中，待烘烤处理的PCB电路板放置于产品治具4，且产品顶针9顶持PCB电路板。As a preferred embodiment, as shown in Figure 1 and Figure 2, in order to ensure that the utility model can stably and reliably assist the PCB circuit board placed on the product fixture 4, the utility model adopts the following auxiliary support structure design, specifically 1. The lower surface of the box cover plate 3 is screwed with a thimble mounting block 8, and the thimble mounting block 8 is equipped with a product thimble 9 that is vertically arranged and the upper end extends into the through hole 31 of the cover plate. In the working process of the utility model, the PCB circuit board to be baked is placed on the product fixture 4, and the product thimble 9 supports the PCB circuit board.
以上内容仅为本实用新型的较佳实施例，对于本领域的普通技术人员，依据本实用新型的思想，在具体实施方式及应用范围上均会有改变之处，本说明书内容不应理解为对本实用新型的限制。The above content is only a preferred embodiment of the present utility model. For those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation and scope of application. The content of this specification should not be understood as Limitations on the Invention.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720033543.2U CN206413285U (en) | 2017-01-12 | 2017-01-12 | A quantum baking device applied to a circuit board soldering machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720033543.2U CN206413285U (en) | 2017-01-12 | 2017-01-12 | A quantum baking device applied to a circuit board soldering machine |
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| Publication Number | Publication Date |
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| CN206413285U true CN206413285U (en) | 2017-08-15 |
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| CN201720033543.2U Expired - Fee Related CN206413285U (en) | 2017-01-12 | 2017-01-12 | A quantum baking device applied to a circuit board soldering machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107631579A (en) * | 2017-09-12 | 2018-01-26 | 郑诗青 | A kind of surface-mounted integrated circuit apparatus for baking |
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2017
- 2017-01-12 CN CN201720033543.2U patent/CN206413285U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107631579A (en) * | 2017-09-12 | 2018-01-26 | 郑诗青 | A kind of surface-mounted integrated circuit apparatus for baking |
| CN107631579B (en) * | 2017-09-12 | 2019-07-02 | 广州京写电路板有限公司 | A kind of integrated circuit board apparatus for baking |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Qiu Yinhua Inventor after: Huang Jing Inventor after: Wang Zhihua Inventor before: Qiu Linghua Inventor before: Huang Jing Inventor before: Wang Zhihua |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170815 |