CN206411685U - Semiconductor fingerprint extracting device with water-proof function - Google Patents
Semiconductor fingerprint extracting device with water-proof function Download PDFInfo
- Publication number
- CN206411685U CN206411685U CN201621177732.9U CN201621177732U CN206411685U CN 206411685 U CN206411685 U CN 206411685U CN 201621177732 U CN201621177732 U CN 201621177732U CN 206411685 U CN206411685 U CN 206411685U
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- becket
- cover plate
- water
- proof function
- extracting device
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Abstract
The utility model discloses a kind of semiconductor fingerprint extracting device with water-proof function, including cover plate, fingerprint recognition chip, installing plate, becket and circuit board, the installing plate has an installation through-hole, in the installation through-hole of the becket insertion installing plate, the cover plate and fingerprint recognition chip are installed in the through hole of becket, the cover plate is located at directly over fingerprint recognition chip, the circuit board is located at the underface of fingerprint recognition chip and becket, the bottom of the becket has an outward flange, the region of this becket lateral surface and close outward flange is circumferentially provided with a groove, one silica gel ring is located between becket and installing plate, in the groove of the medial extremity insertion becket of this silica gel ring, the outboard end of the silica gel ring exposes becket and is in close contact with installing plate.The utility model has the effect of the semiconductor fingerprint extracting device waterproof and dustproof of water-proof function, reduces failure, effective protection equipment, so that service life is extended, and fingerprint module can load from the back side of communication apparatus or casing.
Description
Technical field
The utility model is related to a kind of semiconductor fingerprint extracting device with water-proof function, belongs to semiconductor packaging
Field.
Background technology
Along with the development of development of Mobile Internet technology, mobile Internet terminal user identification information safety problem is increasingly
It is prominent, because identity identification information is stolen and palms off and caused by the situation of user's economic loss appear in the newspapers repeatly end.Conventional password formula identity
Identifying schemes, there are problems that efficiency is low, time-consuming, security is low and, turn into current mobile interchange gradually
The short slab problem of network technology development popularization.Above-mentioned ask can be efficiently solved as the fingerprint identification technology of the unique biological characteristic of user
Topic.
But, prior art fingerprint module, as shown in Figure 1, the cover plate for protecting chip include but is not limited to blue precious
Stone cover plate, glass cover-plate, ceramic cover plate, there is quoit sideways, are deposited between the quoit and communication apparatus protective glass or casing
In gap, due to the presence in gap, communication apparatus is easily immersed by liquid such as water, causes failure, is unfavorable for waterproof and dustproof, one
Denier is intake, and may damage communication apparatus.
The content of the invention
The utility model purpose is to provide a kind of semiconductor fingerprint extracting device with water-proof function, should have waterproof work(
The effect of the semiconductor fingerprint extracting device waterproof and dustproof of energy, reduces failure, effective protection equipment is used so as to extend
Life-span, and fingerprint module can load from the back side of communication apparatus or casing.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of semiconductor with water-proof function refers to
Line sampler, including fingerprint recognition chip, installing plate, becket and circuit board, the installing plate have an installation through-hole, institute
In the installation through-hole for stating becket insertion installing plate, the fingerprint recognition chip is installed in the through hole of becket, the circuit
Plate is located at the underface of fingerprint recognition chip and becket, and the bottom of the becket has on the outside of an outward flange, this becket
Face and circumferentially it is provided with a groove close to the region of outward flange, a silica gel ring is located between becket and installing plate, this silica gel ring
Medial extremity insertion becket groove in, the outboard end of the silica gel ring exposes becket and is in close contact with installing plate；
The rear end of the circuit board has a bending part, and a button key is installed on the lower surface of bending part, this bending part
Upper surface is connected by an adhesive layer with positioned at the lower surface of circuit board immediately below fingerprint recognition chip.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the installation through-hole is shaped as circular, square, oval or track type.
2. in such scheme, the cover plate is shaped as circular, square, oval or track type.
3. in such scheme, the cover plate is sapphire cover plate, glass cover-plate or ceramic cover plate.
4. in such scheme, in addition to a cover plate, this cover plate is directly over fingerprint recognition chip.
5. in such scheme, the installing plate is protective glass piece or casing.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model has the semiconductor fingerprint extracting device of water-proof function, and the bottom of its becket has an evagination
The region of edge, this becket lateral surface and close outward flange is circumferentially provided with a groove, and a silica gel ring is located at becket with installing
Between plate, in the groove of the medial extremity of this silica gel ring insertion becket, the outboard end of the silica gel ring expose becket and with
Installing plate is in close contact, and can be played a part of waterproof and dustproof, be reduced failure, effective protection equipment is used so as to extend
Life-span, and fingerprint module can load from the back side of communication apparatus or casing；Secondly, the rear end of its circuit board has a bending
Portion a, button key is installed on the lower surface of bending part, and the upper surface of this bending part is by an adhesive layer and positioned at fingerprint recognition core
The lower surface connection of circuit board, is conducive to reducing the volume of module, improves production efficiency immediately below piece.
Brief description of the drawings
Accompanying drawing 1 is existing fingerprint modular structure schematic diagram；
Accompanying drawing 2 is the semiconductor fingerprint extracting device structural representation one that the utility model has water-proof function；
Accompanying drawing 3 is the semiconductor fingerprint extracting device structural representation two that the utility model has water-proof function.
In the figures above：1st, cover plate；2nd, fingerprint recognition chip；3rd, installing plate；31st, installation through-hole；4th, circuit board；5th, metal
Ring；51st, through hole；6th, outward flange；7th, groove；8th, silica gel ring；9th, bending part；10th, button key；11st, adhesive layer.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of semiconductor fingerprint extracting device with water-proof function, including cover plate 1, fingerprint recognition chip 2,
Installing plate 3, becket 5 and circuit board 4, the installing plate 3 have an installation through-hole 31, the insertion of becket 5 installing plate 3
In installation through-hole 31, the cover plate 1 and fingerprint recognition chip 2 are installed in the through hole 51 of becket 5, and the cover plate 1, which is located at, to be referred to
Directly over line identification chip 2, the circuit board 4 is located at the underface of fingerprint recognition chip 2 and becket 5, the becket 5
Bottom is provided with an outward flange 6, this lateral surface of becket 5 and circumferentially a groove 7, a silica gel ring close to the region of outward flange
8 are located between becket 5 and installing plate 3, in the groove 7 of the medial extremity insertion becket 5 of this silica gel ring 8, the silica gel ring 8
Outboard end exposes becket 5 and is in close contact with installing plate 3；
The rear end of the circuit board 4 has a bending part 9, and a button key 10 is installed on the lower surface of bending part 9, this bending
The upper surface in portion 9 is connected by an adhesive layer 11 with the lower surface positioned at the underface circuit board 4 of fingerprint recognition chip 2.
Above-mentioned installation through-hole 31 is shaped as circle, and above-mentioned cover plate 1 is shaped as circle, and above-mentioned cover plate 1 is sapphire cover plate.
Embodiment 2：A kind of semiconductor fingerprint extracting device with water-proof function, including cover plate 1, fingerprint recognition chip 2,
Installing plate 3, becket 5 and circuit board 4, the installing plate 3 have an installation through-hole 31, the insertion of becket 5 installing plate 3
In installation through-hole 31, the cover plate 1 and fingerprint recognition chip 2 are installed in the through hole 51 of becket 5, and the cover plate 1, which is located at, to be referred to
Directly over line identification chip 2, the circuit board 4 is located at the underface of fingerprint recognition chip 2 and becket 5, the becket 5
Bottom is provided with an outward flange 6, this lateral surface of becket 5 and circumferentially a groove 7, a silica gel ring close to the region of outward flange
8 are located between becket 5 and installing plate 3, in the groove 7 of the medial extremity insertion becket 5 of this silica gel ring 8, the silica gel ring 8
Outboard end exposes becket 5 and is in close contact with installing plate 3；
The rear end of the circuit board 4 has a bending part 9, and a button key 10 is installed on the lower surface of bending part 9, this bending
The upper surface in portion 9 is connected by an adhesive layer 11 with the lower surface positioned at the underface circuit board 4 of fingerprint recognition chip 2.
Above-mentioned installation through-hole 31 is shaped as track type, and above-mentioned cover plate 1 is shaped as track type, and above-mentioned cover plate 1 is glass cover-plate.
During using above-mentioned semiconductor fingerprint extracting device with water-proof function, the bottom of its becket has an evagination
The region of edge, this becket lateral surface and close outward flange is circumferentially provided with a groove, and a silica gel ring is located at becket with installing
Between plate, in the groove of the medial extremity of this silica gel ring insertion becket, the outboard end of the silica gel ring expose becket and with
Installing plate is in close contact, and can be played a part of waterproof and dustproof, be reduced failure, effective protection equipment is used so as to extend
Life-span, and fingerprint module can load from the back side of communication apparatus or casing；Secondly, the rear end of its circuit board has a bending
Portion a, button key is installed on the lower surface of bending part, and the upper surface of this bending part is by an adhesive layer and positioned at fingerprint recognition core
The lower surface connection of circuit board, is conducive to reducing the volume of module, improves production efficiency immediately below piece.
Above-described embodiment is only to illustrate technical concepts and features of the present utility model, and its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover protection domain of the present utility model it
It is interior.
Claims (6)
1. a kind of semiconductor fingerprint extracting device with water-proof function, it is characterised in that：Including fingerprint recognition chip（2）, peace
Fill plate（3）, becket（5）And circuit board（4）, the installing plate（3）With an installation through-hole（31）, the becket（5）It is embedding
Enter installing plate（3）Installation through-hole（31）It is interior, the fingerprint recognition chip（2）It is installed on becket（5）Through hole（51）It is interior, institute
State circuit board（4）Positioned at fingerprint recognition chip（2）And becket（5）Underface, the becket（5）Bottom have one outside
Flange（6）, this becket（5）The region of lateral surface and close outward flange is circumferentially provided with a groove（7）, a silica gel ring（8）Position
In becket（5）With installing plate（3）Between, this silica gel ring（8）Medial extremity insertion becket（5）Groove（7）It is interior, the silicon
Cushion rubber（8）Outboard end expose becket（5）And and installing plate（3）It is in close contact；
The circuit board（4）Rear end have a bending part（9）, a button key（10）It is installed on bending part（9）Lower surface, this
Bending part（9）Upper surface pass through an adhesive layer（11）With positioned at fingerprint recognition chip（2）Underface circuit board（4）Lower surface
Connection.
2. the semiconductor fingerprint extracting device according to claim 1 with water-proof function, it is characterised in that：Also include one
Cover plate（1）, this cover plate（1）Positioned at fingerprint recognition chip（2）Surface.
3. the semiconductor fingerprint extracting device according to claim 2 with water-proof function, it is characterised in that：The cover plate
（1）For sapphire cover plate, glass cover-plate or ceramic cover plate.
4. the semiconductor fingerprint extracting device according to claim 1 with water-proof function, it is characterised in that：It is described to install
Through hole（31）It is shaped as circular, square, oval or track type.
5. the semiconductor fingerprint extracting device according to claim 2 with water-proof function, it is characterised in that：The cover plate
（1）It is shaped as circular, square, oval or track type.
6. the semiconductor fingerprint extracting device according to claim 1 with water-proof function, it is characterised in that：It is described to install
Plate（3）For protective glass piece or casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621177732.9U CN206411685U (en) | 2016-11-03 | 2016-11-03 | Semiconductor fingerprint extracting device with water-proof function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621177732.9U CN206411685U (en) | 2016-11-03 | 2016-11-03 | Semiconductor fingerprint extracting device with water-proof function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206411685U true CN206411685U (en) | 2017-08-15 |
Family
ID=59547822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621177732.9U Expired - Fee Related CN206411685U (en) | 2016-11-03 | 2016-11-03 | Semiconductor fingerprint extracting device with water-proof function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206411685U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108596072A (en) * | 2018-04-17 | 2018-09-28 | Oppo广东移动通信有限公司 | Electronic device and its fingerprint recognition module |
| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
-
2016
- 2016-11-03 CN CN201621177732.9U patent/CN206411685U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108596072A (en) * | 2018-04-17 | 2018-09-28 | Oppo广东移动通信有限公司 | Electronic device and its fingerprint recognition module |
| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
| CN110210388B (en) * | 2019-05-31 | 2021-03-09 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170815 Termination date: 20181103 |