CN206388687U - A kind of carrier for semiconductor substrate visual examination - Google Patents
A kind of carrier for semiconductor substrate visual examination Download PDFInfo
- Publication number
- CN206388687U CN206388687U CN201621404076.1U CN201621404076U CN206388687U CN 206388687 U CN206388687 U CN 206388687U CN 201621404076 U CN201621404076 U CN 201621404076U CN 206388687 U CN206388687 U CN 206388687U
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- baffle
- carrier
- semiconductor substrate
- skylight board
- visual examination
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Abstract
This application discloses a kind of carrier for semiconductor substrate visual examination, belong to field of semiconductor package, the carrier includes first baffle, second baffle and third baffle, the second baffle and third baffle are symmetrically installed on the both sides of the first baffle, the second baffle and third baffle are perpendicular with the first baffle, the first baffle cross slide way mutually corresponding and parallel with being respectively arranged with the inside of second baffle.The utility model realizes the detection of substrate tow sides, checks that more thorough and checking process will not damage chip and electric capacity.
Description
Technical field
The utility model is related to field of semiconductor package, and in particular to a kind of load for semiconductor substrate visual examination
Tool.
Background technology
In field of semiconductor package, substrate is important raw material in encapsulation process, and substrate is passing through print solder paste, patch electricity
Hold and paste after chip, the abnormal conditions of outer appearnce will all occur in the upper and lower surface of substrate, it is therefore desirable in optics inspection
Station is looked into print solder paste, patch electric capacity and the inspection for pasting the substrate progress outward appearance after chip.In checking process, substrate needs list
Solely taken out and upper table being placed on base board carrier up from magazine, traditional base board carrier is the rectangle of upper surface open
Box body, rectangular box is internally provided with the spacing edge for bearing substrate, during inspection, and substrate is placed on limit by upper surface open
Position is along upper.
Because upper surface of base plate posts chip and electric capacity, inspection personnel is when checking, upper surface of the inspection personnel to substrate
Outward appearance carry out inspection and be easier, relatively difficult is checked to the lower surface of substrate；And can be deposited when checking the lower surface of substrate
In following problem：
1st, upper surface of base plate has chip and electric capacity, and the substrate manually inverted on carrier would be possible to cause chip or electricity
Hold damage；
If the 2, directly publishing in instalments tool and substrate being inverted together, submounts upper surface is unobstructed to cause substrate to drop and lower surface
It can not be checked without detection fluting；
3rd, such as substrate does not overturn and does not check lower surface, once the situation for the pollution of base lower surface tin cream occur will be present
Missing inspection situation.
Utility model content
In view of drawbacks described above of the prior art or deficiency, the utility model purpose are to provide a kind of for semiconductor-based
The carrier of plate visual examination.
A kind of carrier for semiconductor substrate visual examination, the carrier includes first baffle, second baffle and third gear
Plate, second baffle and third baffle are symmetrically installed on the both sides of first baffle, and second baffle and third baffle are and first gear
Plate is perpendicular, is looked down from top, and first baffle, second baffle and third baffle surround a " u "-shaped structure, first baffle,
Second baffle and third baffle constitute three side walls of " u "-shaped structure, the first baffle of " u "-shaped structure and the inner side of second baffle
Be respectively arranged with mutually correspondence and parallel cross slide way, the upper edge of two guide rails and second baffle or third baffle or under
Lateral edges are parallel, and substrate is slided into two guide rails, is in this way connected to substrate " in U " shape structures, can by this mode
The observations of substrate tow sides is detected in carrier with realizing, inspection personnel directly overturns carrier, it is to avoid human contact's base
Plate, so as to avoid the damage of chip or electric capacity.
A grade bar is hinged with the forward edge of second baffle or third baffle, the effect of shelves bar is the base prevented in slide rail
Plate is skidded off out of slide rail, the effect with fixed substrate.
Shelves bar includes horizontal stripe and vertical bar, and horizontal stripe and vertical bar surround " L " shape, and it is specially the beam portions and second gear of grade bar
It is hinged at the forward edge of plate or third baffle, the concrete mode being hinged is at the forward edge of second baffle or third baffle
An axis body parallel with the forward edge of second baffle or third baffle is fixed, then the end of horizontal stripe sets one and axis body
The fixed cover that mutually socket coordinates, can realize that grade bar carries out the feature of transverse rotation by axle center of axis body using this.In second baffle
Or a hinge is connected between the inwall and horizontal stripe of third baffle, provide restraint of grade bar to substrate with this.
The carrier also includes upper skylight board, and upper skylight board goes up to the sky with being hinged at second baffle or third baffle upper edge
Luffer boards can realize the unlatching and sealing at the top of carrier.
The carrier also includes lower skylight board, and lower skylight board at second baffle or third baffle lower edge with being hinged, lower day
Luffer boards can realize the unlatching and sealing of carrier bottom.
When the unlatching and sealing of upper skylight board and lower skylight board may be implemented in the one side of procurator's inspection substrate, another side
It can be protected by skylight board.
Upper skylight board is with the articulated manner at second baffle or third baffle upper edge：Connect by the way that hinge is fixed respectively
Connect at upside and second baffle or the third baffle upper edge of skylight board.On lower skylight board and second baffle or third baffle
Articulated manner at lateral edges is：It is respectively fixedly connected with by hinge under the downside of lower skylight board and second baffle or third baffle
At lateral edges.Upper skylight board or lower skylight board are when closing state, by with magnetic magnet strip and second baffle or the 3rd
Baffle sidewall is fixed, and particular location is upper skylight board or lower skylight board and second baffle or the contact position of third baffle.
The beneficial effects of the utility model are：
1. substrate is limited in guide rail, and submounts upper surface and lower surface are all each provided with the upper skylight board that can close
And lower skylight board, on the premise of substrate is not contacted, can realize the detection of substrate tow sides, check more thoroughly and
Checking process will not damage chip and electric capacity；
2. the vertical bar of grade bar is used to block substrate, substrate is set more to be consolidated in guide rail.
Brief description of the drawings
By reading the detailed description made to non-limiting example made with reference to the following drawings, the application's is other
Feature, objects and advantages will become more apparent upon：
Fig. 1 is a kind of structural representation of carrier for semiconductor substrate visual examination；
Fig. 2 is the closed mode schematic diagram of upper skylight board and shelves bar in Fig. 1；
Fig. 3 is Fig. 1 top view.
In figure：1. hinge, skylight board, 3. first baffles, 4. hinges, 5. horizontal stripes, 6. vertical bars, 7. third baffles, 8. on 2.
Substrate, 9. times skylight boards, 10. guide rails, 11. second baffles.
Embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining relevant utility model, rather than the restriction to the utility model.Further need exist for explanation
, for the ease of description, the part related to utility model is illustrate only in accompanying drawing.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.Describe the application in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Embodiment 1
As shown in Fig. 1 to Fig. 3, a kind of carrier for the visual examination of semiconductor substrate 8, including first baffle 3, second gear
Plate 11 and third baffle 7, second baffle 11 and third baffle 7 are symmetrically installed on the both sides of first baffle 3, the He of second baffle 11
Third baffle 7 is perpendicular with first baffle 3, and first baffle 3, second baffle 11 and third baffle 7 surround one " U " shape knots
Structure, first baffle 3 and the inner side of second baffle 11 of " u "-shaped structure are respectively arranged with mutually correspondence and parallel cross slide way
10, two guide rails 10 are parallel with the upper edge of second baffle 11 or third baffle 7, and substrate 8 is slided into two guide rails 10, with
Substrate 8 is connected in " u "-shaped structure by this mode, and the sight in carrier to the tow sides of substrate 8 can be realized by this mode
Detection is examined, inspection personnel directly overturns carrier, it is to avoid human contact's substrate 8, so as to avoid the damage of chip or electric capacity.The
A grade bar is hinged with the forward edge of three baffle plates 7, the effect of shelves bar is to prevent the substrate 8 in slide rail from being skidded off out of slide rail, had
There is fixed substrate 8.Shelves bar includes horizontal stripe 5 and vertical bar 6, and horizontal stripe 5 and vertical bar 6 surround " L " shape, and it is specially the horizontal stroke of grade bar
The part of bar 5 at the forward edge of third baffle 7 with being hinged, and the concrete mode being hinged is consolidated at the forward edge of third baffle 7
Fixed one with third baffle 7 or the parallel axis body of forward edge, the then end setting one of horizontal stripe 5 is mutually socketed with axis body
The fixed cover of cooperation, can realize that grade bar carries out the feature of transverse rotation by axle center of axis body using this.Third baffle 7 inwall with
A hinge 4 is connected between horizontal stripe 5.
The carrier also includes upper skylight board 2, and upper skylight board 2 at the upper edge of second baffle 11 with being hinged, and upper skylight board 2 can
To realize the unlatching and sealing at the top of carrier.The carrier also includes lower skylight board 9, lower skylight board 9 and the lower side of second baffle 11
It is hinged at edge, lower skylight board 9 can realize the unlatching and sealing of carrier bottom.The unlatching of upper skylight board 2 and lower skylight board 9 and close
When envelope may be implemented in the one side of procurator's inspection substrate 8, another side can be protected by skylight board.Upper skylight board 2 and second
Articulated manner at the upper edge of baffle plate 11 is：Upside and the second baffle 11 of upper skylight board 2 are respectively fixedly connected with by hinge 1
At upper edge.Lower skylight board 9 is with the articulated manner at the upper edge of second baffle 11：It is respectively fixedly connected with by hinge 1
At the downside of lower skylight board 9 and the lower edge of second baffle 11.Upper skylight board 2 and lower skylight board 9 pass through band when closing state
Magnetic magnet strip is fixed with the side wall of third baffle 7, and particular location is upper skylight board 2 or lower skylight board 9 and third baffle 7
Contact position.
Wherein, the box body structure of the carrier generally cuboid, in use, shelves bar is opened, then by the follows track of substrate 8
10 slide into carrier inside, are then shut off a grade bar, when then observing 8 upper surface of substrate, skylight board 2 in opening；Observe under substrate 8
During surface, lower skylight board 9 is opened.
Embodiment 2
" second baffle " in embodiment 1 is replaced with " third baffle "；" third baffle " is replaced with into " second baffle ",
Other structures are constant, exchanged second baffle and the technical characteristic of third baffle with this.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that utility model scope involved in the application, however it is not limited to the particular combination of above-mentioned technical characteristic
Technical scheme, while should also cover in the case where not departing from utility model design, by above-mentioned technical characteristic or its be equal
Feature be combined formed by other technical schemes.Such as features described above has with (but not limited to) disclosed herein
The technical characteristic for having similar functions carries out technical scheme formed by replacement mutually.
Claims (8)
1. a kind of carrier for semiconductor substrate visual examination, it is characterized in that, the carrier include first baffle, second baffle and
Third baffle, the second baffle and third baffle are symmetrically installed on the both sides of the first baffle, the second baffle and
Third baffle is perpendicular with the first baffle, and mutual correspondence is respectively arranged with the inside of the first baffle and second baffle
And parallel cross slide way.
2. the carrier according to claim 1 for semiconductor substrate visual examination, it is characterized in that, described second baffle
Or a grade bar is hinged with the forward edge of third baffle.
3. the carrier according to claim 2 for semiconductor substrate visual examination, it is characterized in that, described shelves bar includes
Horizontal stripe and vertical bar, described horizontal stripe and vertical bar connect to form L-shaped structure at one end, the horizontal stripe and the second baffle or the 3rd
It is hinged at the forward edge of baffle plate.
4. according to any described carrier for semiconductor substrate visual examination of claims 1 to 3, it is characterized in that, the carrier
Also include upper skylight board, described upper skylight board at second baffle or third baffle upper edge with being hinged.
5. according to any described carrier for semiconductor substrate visual examination of claims 1 to 3, it is characterized in that, the carrier
Also include lower skylight board, described lower skylight board at second baffle or third baffle lower edge with being hinged.
6. the carrier according to claim 4 for semiconductor substrate visual examination, it is characterized in that, described upper skylight board
It is with the articulated manner at second baffle or third baffle upper edge：The upper skylight board is respectively fixedly connected with by hinge
At upside and the second baffle or third baffle upper edge.
7. the carrier according to claim 5 for semiconductor substrate visual examination, it is characterized in that, described lower skylight board
It is with the articulated manner at second baffle or third baffle upper edge：The lower skylight board is respectively fixedly connected with by hinge
At downside and the second baffle or third baffle lower edge.
8. the carrier according to claim 3 for semiconductor substrate visual examination, it is characterized in that, in the second baffle
Or connect a hinge between the inwall and the horizontal stripe of third baffle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621404076.1U CN206388687U (en) | 2016-12-20 | 2016-12-20 | A kind of carrier for semiconductor substrate visual examination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621404076.1U CN206388687U (en) | 2016-12-20 | 2016-12-20 | A kind of carrier for semiconductor substrate visual examination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206388687U true CN206388687U (en) | 2017-08-08 |
Family
ID=59488710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621404076.1U Active CN206388687U (en) | 2016-12-20 | 2016-12-20 | A kind of carrier for semiconductor substrate visual examination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206388687U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341886A (en) * | 2020-03-26 | 2020-06-26 | 中国电子科技集团公司第十一研究所 | Tool for separating detector mixed chip, preparation method and separation method |
-
2016
- 2016-12-20 CN CN201621404076.1U patent/CN206388687U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341886A (en) * | 2020-03-26 | 2020-06-26 | 中国电子科技集团公司第十一研究所 | Tool for separating detector mixed chip, preparation method and separation method |
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