CN206313112U - One kind miniaturization is high to suppress multilayer Balun - Google Patents
One kind miniaturization is high to suppress multilayer Balun Download PDFInfo
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- CN206313112U CN206313112U CN201621216364.4U CN201621216364U CN206313112U CN 206313112 U CN206313112 U CN 206313112U CN 201621216364 U CN201621216364 U CN 201621216364U CN 206313112 U CN206313112 U CN 206313112U
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- balun
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Abstract
The utility model is related to a kind of miniaturization suppression multilayer Balun high, including external electrode, interior electrode, multiple flaky pottery dielectric layers stacked together；External electrode is made up of the metal electrode of bonding and the metal end electrodes of input and output；Interior electrode includes：Bonding electrode, tape conductor plane coupling electrode, coupled capacitor pellet electrode, 1 λ/2 coupling line spiral line electrode, 2 λ/4 coupling line spiral line electrodes 3 coupling line spiral line electrodes vertical distribution two-by-two, there is electromagnetic coupled between two coupling line helixes of vertical distribution, the structure makes unbalanced input signal change into two same width signals of balance, and phase difference is 180 °, a signal transformation for uneven balance is finally played；By structure optimization of the interior electrode on different flaky pottery dielectric layers, the wave filter of different electrical properties can be designed in identical wave filter volume, and effectively improve the uniformity of technique, reliability.
Description
Technical field
The utility model is related to the multi-layer ceramics imbalance balanced to unbalanced transformer used in a kind of microwave communication system.
Background technology
In RF application, balun purposes is quite varied, and the place that any need is balanced unbalanced transformation is required for
Use, such as Bluetooth chip front end, single side-band modulator, balanced mixer and antenna.The balun of microstrip line construction, especially
Marchand baluns, because its model analysis is simple, is easy to the advantages of being coupled with coaxial line and is widely applied.
But its volume or larger, it is integrated to be not easy to miniaturization module, such as bluetooth, WIFI module etc., and this practicality is newly
Type proposes the multilayer Balun that a kind of utilization low-temperature sintered ceramics is made, and it is excessive to solve balun volume in the prior art, no
Beneficial to integrated and Out-of-band rejection it is not deep enough the problems such as.
The content of the invention
To solve above-mentioned problem, the purpose of this utility model is to propose that a kind of miniaturization is high to suppress multilayer Balun, the balun
Structure assembly bandpass filter and improved balun, realize the balun function of miniaturization and high out-of-side rejection；
In order to realize above-mentioned purpose, the utility model employs following technical scheme：
One kind miniaturization is high to suppress multilayer Balun, and the balun includes：
1）Layered product, layered product includes several insulating medium layers stacked together in the stacking direction；
2）Three input and output external electrodes, four grounded external electrode and one connect direct current or vacant external electrode, three inputs
Output external electrode, four grounded external electrode and one connect the exposed outside for being arranged on layered product of direct current or vacant external electrode；
3）Two ground shields, respectively the first ground shield and the second ground shield, the first ground shield
It is connected with ground connection external electrode respectively with the second ground shield；
4）One plane formula bandpass filtering space circuit, the space circuit includes three inductor wires of orthogonal coupling,
Two of which inductor wire passed through hole post and was connected with ground shield；
5）One balun circuit, balun circuit includes 2 λ/4 coupling inductances of segmentation, and each λ/4 coupling inductance is by 2
λ/4 wire-wound inductor is in series, and two λ/4 coupling inductances are finally connected with input and output external electrode respectively, by levels it
Between electromagnetic coupled, make output two paths of signals formed 180 degree phase difference；
6）Four grounded electric capacity, respectively ground capacity C1, ground capacity C2, ground capacity C3 and ground capacity C4, four
Individual ground capacity is connected with balun circuit respectively.
Preferably, described plane formula bandpass filtering space circuit includes the first inductor wire, the second inductor wire, the 3rd electricity
Sense line and the first ground shield, separated by insulating medium layer between each bar inductor wire, the first inductor wire, the 3rd inductor wire and
First ground shield passed through hole post E interconnections, and the first inductor wire, the other end of the 3rd inductor wire passed through hole post F phases
Connect, described the first inductor wire, the second inductor wire and the 3rd inductor wire is vertically superposed forms form mutually vertical coupled electricity
Hold, and one end passed through the lower ground of hole post E connections, formed a resonance effect for capacitor and inductor earth.
Preferably, described plane formula bandpass filtering space circuit also includes fine setting small capacitances, fine setting small capacitances are by small
Capacitance sheet and the first inductor wire are constituted, and small capacitances piece is connected with hole post C is crossed.
Preferably, described plane formula bandpass filtering space circuit also includes regulation electric capacity, regulation electric capacity is by ground connection electricity
Hold piece and the first ground shield is constituted, ground capacity piece is connected with hole post F is crossed.
Preferably, described balun circuit includes that λ/2 transmission line is formed with two λ/4 transmission line overlaps, two
λ/4 transmission line is located at same insulating medium layer, and λ/2 transmission line is located at different insulative dielectric layer, and the two ends of λ/2 transmission line lead to respectively
Hole post B, D connect two one end of λ/4 transmission line, wherein λ/2 transmission line passed through hole post D, the first transmission line, cross hole post
C is connected with plane formula bandpass filtering space circuit, and two λ/4 transmission lines are connected with two input and output external electrodes respectively.
Preferably, two described λ/4 transmission lines passed through hole post B, excessively hole post D be respectively connected with internal pattern,
Internal pattern with connect direct current or vacant external electrode is connected.
Preferably, described ground capacity C1, ground capacity C2 include two under capacitance sheet, ground capacitance sheet under two
It is connected with two input and output external electrodes respectively, has insulating medium layer between capacitance sheet and the second ground shield under two,
Two independent ground capacity C1, ground capacity C2 are formed respectively.
Preferably, described ground capacity C4 includes the first capacitance sheet and the second capacitance sheet, the second capacitance sheet and ground connection
External electrode is connected, and the first capacitance sheet passed through hole post A, the second transmission line, hole post B excessively and is connected with λ/2 transmission line.
Preferably, described ground capacity C3 includes internal pattern and the second ground shield, internal pattern with connect straight
Stream or vacant external electrode are connected, internal pattern passed through hole post B, cross hole post D respectively with two λ/4 coupling inductance phases of segmentation
Connection.
Preferably, described layered product is made up of eight insulating medium layers, respectively insulating medium layer P1, dielectric
Layer P2, insulating medium layer P3, insulating medium layer P4, insulating medium layer P5, insulating medium layer P6, insulating medium layer P7 and insulation are situated between
Matter layer P8.
The utility model can design different electricity as a result of above-mentioned technical scheme in identical wave filter volume
The wave filter of performance, and effectively improve the uniformity of technique, reliability.
Brief description of the drawings
Fig. 1 ~ Fig. 2 is one side view of the multilayer ceramic filter of preferred embodiment of the utility model and internal pattern
Exploded view.
Fig. 3 is the outer surface structure schematic diagram of the utility model multilayer ceramic filter.
Fig. 4 is the frequency characteristic curve diagram of multilayer ceramic filter shown in Fig. 1.
Fig. 5 is the equivalent electrical schematic diagram of the ceramic filter implemented according to the utility model.
Specific embodiment
The example implemented according to this patent is described in detail with reference to the accompanying drawings.Fig. 1 ~ Fig. 2 is example filter
Decomposition diagram, Fig. 3 is the outer surface structure schematic diagram of example filter, and Fig. 4 is bent for the frequecy characteristic of embodiment wave filter
Line.Metallic conductor is in Fig. 1 ~ Fig. 3, the material such as such as Ag, Cu, Au or other metallic compounds is applied by printing, evaporation
The technology such as cover to be formed.
A kind of miniaturization suppression multilayer Balun high as shown in Fig. 1 ~ Fig. 3, including：Layered product 309, by 8 layers of dielectric
Layer composition, its surface is provided with input external electrode 301, ground connection external electrode 303,304,308,306 and NC（Vacant pin position）Outward
Electrode 302；And its whole interior structure is as depicted in figs. 1 and 2, Fig. 1 is side sectional view, including layered product insulating medium layer
P1, P2, P3, P4, P5, P6, P7, P8 and excessively hole post, wherein interior electrode layer prints lamination on medium diaphragm and forms, and mistake
Hole is formed by punching and inserting silver paste on medium diaphragm.
Fig. 2 is the plane design drawing of the inner electrode layer of Fig. 1, including plane formula bandpass filtering space circuit and balun circuit,
Wherein, plane formula bandpass filtering space circuit（That is the BPF marked in Fig. 5）It is made up of single order plane formula bandpass structures, including
First inductor wire 203, the second inductor wire 2043, the 3rd inductor wire 205 and the first ground shield 206, between each bar inductor wire
Separated by insulating medium layer, the first inductor wire 203 is located at insulating medium layer P3, the second inductor wire 2043 is located at insulating medium layer
P4, the 3rd inductor wire 205 is located at insulating medium layer P5, and the first ground shield 206 is located at insulating medium layer P6.First inductor wire
203rd, the 3rd inductor wire 205 and the first ground shield 206 passed through hole post E interconnections, the electricity of the first inductor wire the 203, the 3rd
Feel line 205 the other end passed through hole post F interconnection, junction be respectively 203.e, 205.e, 206.e and 203.f,
205.f、2073.f；Described the first inductor wire 203, the second inductor wire 2043 and the 3rd inductor wire 205 is vertically superposed forms, mutually
Vertical coupled electric capacity is mutually formed, and one end passed through the lower ground of hole post E connections, formed a resonance for capacitor and inductor earth
Effect.And this resonance effect is exactly a simple bandpass filter, the band logical maximum effect is that one is produced outside passband
Filling wave point, the filling wave point as marked in Fig. 4, it greatly suppresses interference of the mobile phone signal channel to Bluetooth communication.Plane formula
Bandpass filtering space circuit also includes fine setting small capacitances and regulation electric capacity, and fine setting small capacitances are by the inductance of small capacitances piece 2022 and first
Line 203 is constituted, and small capacitances piece 2022 is located at insulating medium layer P2, and small capacitances piece 2022 is connected with hole post C is crossed；Regulation electric capacity by
The ground shield 206 of ground capacity piece 2073 and first is constituted, and ground capacity piece 2073 is located at insulating medium layer P7, ground capacity
Piece 2073 is connected with hole post F is crossed.
As shown in Fig. 2 balun circuit by balun circuit include λ/2 transmission line 2021 and two λ/4 transmission lines 2041,
2042 overlaps are formed（The coupling1＆coupling2 that as Fig. 5 is indicated）, λ/2 transmission line 2021 is positioned at insulating medium layer
P2, two λ/4 transmission lines 2041,2042 are located at insulating medium layer P4, the two ends of λ/2 transmission line 2021 passed through respectively hole post B,
D connects two one end of λ/4 transmission line 2041,2042, and wherein λ/2 transmission line 2021 passed through hole post D, the first transmission line
2011st, cross hole post C to be connected with plane formula bandpass filtering space circuit, the first transmission line 2011 is positioned at insulating medium layer P1, and two
Bar λ/4 transmission line 2041,2042 is connected with two input and output external electrodes 305,307 respectively.In addition, balun circuit also has ground connection
Electric capacity C1, ground capacity C2 include two under capacitance sheet 2071,2072, under two capacitance sheet 2071,2072 be located at insulation
Dielectric layer P7, under two capacitance sheet be connected with two input and output external electrodes 305,307 respectively, ground capacitance sheet and position under two
There is insulating medium layer between second ground shield 208 of insulating medium layer P8, two independent ground capacities are formed respectively
C1, ground capacity C2, the electric capacity can finely tune the communication frequency of balun, and its equivalent circuit is C1, the C2 in Fig. 5；And wherein
One capacitance sheet 202 and the second capacitance sheet 204 formed under one electric capacity, the first capacitance sheet 202 distinguishes position with the second capacitance sheet 204
In insulating medium layer P2 and P4, the second capacitance sheet 204 is connected with ground connection external electrode, and the first capacitance sheet 202 passed through hole post A, the
Two transmission lines 201, hole post B excessively are connected with λ/2 transmission line 2021, and the second transmission line 201 is located at insulating medium layer P1, its electric capacity etc.
It is the C4 in Fig. 5 circuits to imitate.
In addition, two λ/4 transmission lines 2041,2042 passed through hole post B, excessively hole post D and were connected with internal pattern 207 respectively
Connect, internal pattern 207 is located at insulating medium layer P7, internal pattern 207 with connect direct current or vacant external electrode 302 is connected, connection
Place is respectively 2041.b, 207.b and .d, 207.d.Wherein 207 and second ground shield of internal pattern 208 forms one greatly
Electric capacity（C3 in as Fig. 5）, and internal pattern 207 with connect direct current or vacant external electrode 302 is connected, connect direct current or it is vacant outward
Electrode 302 is direct-flow input end, can be connected by inside and be powered to external electrode, and external electrode is connected with master chip, so as to meet
To the function that master chip is powered.
Each crosses the tie point respectively 201.a-202.a of hole post above；201.b-.b；2011.c-2022.c-2031-
2043.c；2011.d-.d；203.e-2045-205.e-206.e；203.f-2044-205.f-2062-2073.f；2041.b-
2051-2061-207.b；.d-2052-2063-207.d；
Although this patent is specifically illustrating and described with reference to preferred embodiment, those skilled in the art will be bright
In vain, in the case of the spirit and scope without prejudice to this patent, other changes can in form and details be made.
Claims (10)
1. a kind of miniaturization is high suppresses multilayer Balun, it is characterised in that the balun includes：
1）Layered product（309）, layered product（309）Including several insulating medium layers stacked together in the stacking direction；
2）Three input and output external electrodes（301、）, four grounded external electrode（303、304、306、308）With one connect direct current or
Vacant external electrode（302）, three input and output external electrodes（301、）, four grounded external electrode（303、304、306、308）With one
It is individual to connect direct current or vacant external electrode（302）It is exposed to be arranged on layered product（309）Outside；
3）Two ground shields, respectively the first ground shield（206）With the second ground shield（208）, the first ground connection
Screen layer（206）With the second ground shield（208）It is connected with ground connection external electrode respectively；
4）One plane formula bandpass filtering space circuit, the space circuit includes three inductor wires of orthogonal coupling, wherein
Two inductor wires passed through hole post and were connected with ground shield；
5）One balun circuit, balun circuit include 2 segmentation λ/4 coupling inductances, each λ/4 coupling inductance by 2 λ/4 around
Line inductance is in series, and two λ/4 coupling inductances are finally connected with input and output external electrode respectively, by the electricity between levels
Magnetic coupling, makes the two paths of signals of output form 180 degree phase difference；
6）Four grounded electric capacity, respectively ground capacity C1, ground capacity C2, ground capacity C3 and ground capacity C4, four connect
Ground electric capacity is connected with balun circuit respectively.
2. a kind of miniaturization according to claim 1 is high suppresses multilayer Balun, it is characterised in that：Plane formula bandpass filtering is empty
Between circuit include the first inductor wire（203）, the second inductor wire（2043）, the 3rd inductor wire（205）With the first ground shield
（206）, separated by insulating medium layer between each bar inductor wire, the first inductor wire（203）, the 3rd inductor wire（205）With first
Ground shield（206）It is connected with each other by crossing hole post E, the first inductor wire（203）, the 3rd inductor wire（205）The other end lead to
Hole post F be connected with each other, the first described inductor wire（203）, the second inductor wire（2043）With the 3rd inductor wire（205）Vertically
Overlap is formed, and vertical coupled electric capacity is formed mutually, and one end passed through the lower ground of hole post E connections, formed a capacitor and inductor simultaneously
Couple the resonance effect on ground.
3. a kind of miniaturization according to claim 2 is high suppresses multilayer Balun, it is characterised in that：Plane formula bandpass filtering is empty
Between circuit also include fine setting small capacitances, fine setting small capacitances by small capacitances piece（2022）With the first inductor wire（203）Constitute, small capacitances
Piece（2022）It is connected with hole post C is crossed.
4. a kind of miniaturization according to claim 2 is high suppresses multilayer Balun, it is characterised in that：Plane formula bandpass filtering is empty
Between circuit also include regulation electric capacity, regulation electric capacity by ground capacity piece（2073）With the first ground shield（206）Constitute, ground connection
Capacitance sheet（（2073）It is connected with hole post F is crossed.
5. a kind of miniaturization according to claim 1 is high suppresses multilayer Balun, it is characterised in that：Balun circuit includes one
λ/2 transmission line（2021）With two λ/4 transmission lines（2041、2042）Overlap is formed, two λ/4 transmission lines（2041、2042）Position
In same insulating medium layer, λ/2 transmission line（2021）Positioned at different insulative dielectric layer, λ/2 transmission line（2021）Two ends difference
Two λ/4 transmission lines are connected by crossing hole post B, D（2041、2042）One end, wherein λ/2 transmission line（2021）By crossing hole post
D, the first transmission line（2011）, cross hole post C and be connected with plane formula bandpass filtering space circuit, and two λ/4 transmission lines（2041、
2042）Respectively with two input and output external electrodes（305、307）It is connected.
6. a kind of miniaturization according to claim 5 is high suppresses multilayer Balun, it is characterised in that：Two λ/4 transmission lines
（2041、2042）Pass through hole post B respectively, cross hole post D with internal pattern（207）It is connected, internal pattern（207）With connect direct current
Or vacant external electrode（302）It is connected.
7. a kind of miniaturization height according to claim 5 or 6 suppresses multilayer Balun, it is characterised in that：Ground capacity C1, connect
Ground electric capacity C2 include two under capacitance sheet（2071、2072）, under two capacitance sheet respectively with two input and output external electrodes
（305、307）It is connected, ground capacitance sheet and the second ground shield under two（208）Between have insulating medium layer, two are formed respectively
Individual independent ground capacity C1, ground capacity C2.
8. a kind of miniaturization height according to claim 5 or 6 suppresses multilayer Balun, it is characterised in that：Ground capacity C4 bags
Include the first capacitance sheet（202）With the second capacitance sheet（204）, the second capacitance sheet（204）It is connected with ground connection external electrode, the first capacitance sheet
（202）By crossing hole post A, the second transmission line（201）, cross hole post B and λ/2 transmission line（2021）It is connected.
9. a kind of miniaturization height according to claim 5 or 6 suppresses multilayer Balun, it is characterised in that：Ground capacity C3 bags
Include internal pattern（207）With the second ground shield（208）, internal pattern（207）With connect direct current or vacant external electrode（302）Phase
Connection, internal pattern（207）By cross hole post B, cross hole post D respectively with two λ/4 transmission lines of segmentation（2041、2042）It is connected
Connect.
10. a kind of miniaturization according to claim 1 is high suppresses multilayer Balun, it is characterised in that：Layered product（309）By eight
Individual insulating medium layer is constituted, respectively insulating medium layer P1, insulating medium layer P2, insulating medium layer P3, insulating medium layer P4, absolutely
Edge dielectric layer P5, insulating medium layer P6, insulating medium layer P7 and insulating medium layer P8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621216364.4U CN206313112U (en) | 2016-10-31 | 2016-10-31 | One kind miniaturization is high to suppress multilayer Balun |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621216364.4U CN206313112U (en) | 2016-10-31 | 2016-10-31 | One kind miniaturization is high to suppress multilayer Balun |
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| Publication Number | Publication Date |
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| CN206313112U true CN206313112U (en) | 2017-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621216364.4U Withdrawn - After Issue CN206313112U (en) | 2016-10-31 | 2016-10-31 | One kind miniaturization is high to suppress multilayer Balun |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106450630A (en) * | 2016-10-31 | 2017-02-22 | 嘉兴佳利电子有限公司 | Miniaturized high-restrain multilayer balun |
-
2016
- 2016-10-31 CN CN201621216364.4U patent/CN206313112U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106450630A (en) * | 2016-10-31 | 2017-02-22 | 嘉兴佳利电子有限公司 | Miniaturized high-restrain multilayer balun |
| CN106450630B (en) * | 2016-10-31 | 2021-08-03 | 嘉兴佳利电子有限公司 | Miniaturized high-inhibition multilayer balun |
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