CN206312924U - 一种聚光贴片led - Google Patents

一种聚光贴片led Download PDF

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Publication number
CN206312924U
CN206312924U CN201621435657.1U CN201621435657U CN206312924U CN 206312924 U CN206312924 U CN 206312924U CN 201621435657 U CN201621435657 U CN 201621435657U CN 206312924 U CN206312924 U CN 206312924U
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pedestal
led
optically focused
junction block
groove
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洪海水
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Dongguan City Silver Electronic Technology Co Ltd
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Dongguan City Silver Electronic Technology Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本实用新型公开了一种聚光贴片LED,包括壳体,所述壳体上开有通槽,所述壳体上固定有基座和接线座,所述基座与接线座的一端均设置于通槽内,所述基座与接线座的另一端均设有引脚,所述基座上设有LED晶片,所述LED晶片上连接有金线,所述金线另一端连接在接线座上,所述LED晶片通过胶体封装在基座上,所述胶体内开有凹槽。本实用新型的有益效果是,结构简单,实用性强。

Description

一种聚光贴片LED
技术领域
本实用新型涉及LED技术领域,特别是一种聚光贴片LED。
背景技术
发光二极管(Light Emitting Diode,LED)作为一种新型的光源,越来越受到人们的关注,其应用也越来越广泛。现有的LED主要有以下几类:大功率LED、直插式LED、灌胶式LED和贴片LED。其中贴片LED也叫做SMD LED,它的发光原理就是将电流通过化合物半导体,通过电子与空穴的结合,过剩的能量将以光的形式释出,达到发光的效果。
贴片LED以其体积小的优点得到了广泛的应用。现有的贴片LED虽然体积较小,但其亮度不够大,消耗功率大,不环保,因此,需要一种能够聚光的贴片式LED。
实用新型内容
本实用新型的目的是为了解决上述问题,设计了一种聚光贴片LED。
实现上述目的本实用新型的技术方案为,一种聚光贴片LED,包括壳体,所述壳体上开有通槽,所述壳体上固定有基座和接线座,所述基座与接线座的一端均设置于通槽内,所述基座与接线座的另一端均设有引脚,所述基座上设有LED晶片,所述LED晶片上连接有金线,所述金线另一端连接在接线座上,所述LED晶片通过胶体封装在基座上,所述胶体内开有凹槽。
所述基座为PCB板。
所述胶体为正方形。
所述通槽的纵截面为凹字形。
所述引脚设于壳体外。
利用本实用新型的技术方案制作的聚光贴片LED,利用透镜聚焦特性,将胶体设计成内凹型状,改变发光角度,提升了亮度,且消耗功率小,更加环保。
附图说明
图1是本实用新型所述聚光贴片LED的结构示意图;
图2是本实用新型所述聚光贴片LED胶体的主视示意图;
图中,1、壳体;2、通槽;3、基座;4、接线座;5、引脚;6、LED晶片;7、金线;8、胶体;9、凹槽。
具体实施方式
下面结合附图对本实用新型进行具体描述,如图1-2所示,一种聚光贴片LED,包括壳体(1),所述壳体(1)上开有通槽(2),所述壳体(1)上固定有基座(3)和接线座(4),所述基座(3)与接线座(4)的一端均设置于通槽(2)内,所述基座(3)与接线座(4)的另一端均设有引脚(5),所述基座(3)上设有LED晶片(6),所述LED晶片(6)上连接有金线(7),所述金线(7)另一端连接在接线座(4)上,所述LED晶片(6)通过胶体(8)封装在基座(3)上,所述胶体(8)内开有凹槽(9);所述基座(3)为PCB板;所述胶体(8)为正方形;所述通槽(2)的纵截面为凹字形;所述引脚(5)设于壳体(1)外。
本实施方案的特点为,壳体上开有通槽,壳体上固定有基座和接线座,基座与接线座的一端均设置于通槽内,基座与接线座的另一端均设有引脚,基座上设有LED晶片,LED晶片上连接有金线,金线另一端连接在接线座上,LED晶片通过胶体封装在基座上,胶体内开有凹槽,利用透镜聚焦特性,将胶体设计成内凹型状,改变发光角度,提升了亮度,且消耗功率小,更加环保。
在本实施方案中,首先将LED晶片通过银胶固定在基座上,然后将与LED晶片连接的金线连接到接线座上,再用胶体将LED晶片和金线封装在基座上,由于胶体内成凹型状,利用透镜聚焦特性,改变了LED灯的发光角度,从而提升了灯光的亮度,同时消耗功率小,更加环保,具有新颖性,实用性强。
上述技术方案仅体现了本实用新型技术方案的优选技术方案,本技术领域的技术人员对其中某些部分所可能做出的一些变动均体现了本实用新型的原理,属于本实用新型的保护范围之内。

Claims (5)

1.一种聚光贴片LED,包括壳体(1),其特征在于,所述壳体(1)上开有通槽(2),所述壳体(1)上固定有基座(3)和接线座(4),所述基座(3)与接线座(4)的一端均设置于通槽(2)内,所述基座(3)与接线座(4)的另一端均设有引脚(5),所述基座(3)上设有LED晶片(6),所述LED晶片(6)上连接有金线(7),所述金线(7)另一端连接在接线座(4)上,所述LED晶片(6)通过胶体(8)封装在基座(3)上,所述胶体(8)内开有凹槽(9)。
2.根据权利要求1所述的一种聚光贴片LED,其特征在于,所述基座(3)为PCB板。
3.根据权利要求1所述的一种聚光贴片LED,其特征在于,所述胶体(8)为正方形。
4.根据权利要求1所述的一种聚光贴片LED,其特征在于,所述通槽(2)的纵截面为凹字形。
5.根据权利要求1所述的一种聚光贴片LED,其特征在于,所述引脚(5)设于壳体(1)外。
CN201621435657.1U 2016-12-23 2016-12-23 一种聚光贴片led Active CN206312924U (zh)

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