CN206312678U - Tubulose MOV with thermal tripping mechanism - Google Patents

Abstract

The utility model discloses a kind of tubulose MOV with thermal tripping mechanism, includes tubulose MOV chips, thermal tripping mechanism and encapsulated layer；Tubulose MOV chips include main body, and the main body has an accommodating cavity, and the inwall of the accommodating cavity is formed with and PUR is filled with first annular electrode, accommodating cavity, and the outer wall of the main body is formed with the second annular electrode, the first pin is welded with second annular electrode；The thermal tripping mechanism produced by insert molding is in PUR and is located in accommodating cavity.By using tubulose MOV chips, thermal tripping mechanism produced by insert molding is in PUR and is located in accommodating cavity, enable that thermal tripping mechanism is reasonably integrated in tubulose MOV chips, in use, user only needs a step welded and installed, without tubulose MOV chips and thermal tripping mechanism are separately mounted on the diverse location of circuit board, welded and installed operation is few, easy to operate, and reduces taking up space for circuit board, make the dimensioned area of circuit board smaller, beneficial to the development of the miniaturization of product.

Description

Tubulose MOV with thermal tripping mechanism

Technical field

The utility model is related to piezo-resistance art, refers in particular to a kind of tubulose MOV with thermal tripping mechanism.

Background technology

MOV is piezo-resistance, and piezo-resistance is a kind of resistance device with nonlinear wind vibration, is mainly used in electricity Road bears to carry out voltage clamping during overvoltage, absorbs unnecessary electric current to protect Sensitive Apparatus.English name is " Voltage Dependent Resistor " are abbreviated as " VDR ", or are called " Varistor ".The resistor material of piezoresistor is half Conductor, so it is a kind of semiconductor resistor." zinc oxide " for largely using now（ZnO）Piezoresistor, it Material of main part have diad zinc（Zn）With hexad oxygen（O）Constituted.So from from the perspective of material, zinc oxide pressure Sensitive resistor is a kind of " II-VI race's oxide semiconductor ".

Piezo-resistance is a kind of votage limit type protection device.Using the nonlinear characteristic of piezo-resistance, when overvoltage is appeared in Two interpolars of piezo-resistance, piezo-resistance can be by voltage clamping to a relatively-stationary magnitude of voltage, so as to realize to rear class The protection of circuit.The major parameter of piezo-resistance has：Pressure sensitive voltage, discharge capacity, junction capacity, response time etc..

In order to protect piezo-resistance, usually using thermal tripping mechanism, in use, thermal tripping mechanism and piezo-resistance Series connection, when the electric current for flowing through cross high product heating it is serious when, thermal tripping mechanism disconnects, so as to protect the piezo-resistance will not be because of holding Continuous overcurrent and catching fire.However, existing piezo-resistance to separate welded and installed from thermal tripping mechanism different in circuit board On position, welding sequence is more, it has not been convenient to, and the installing space of circuit board is occupied, make the dimensioned area of circuit board big, it is unfavorable for The development of the miniaturization of product.

The content of the invention

In view of this, in view of the existing deficiencies of the prior art, it is de- that its main purpose is to provide a kind of band heat to the utility model The tubulose MOV of buckle mechanism, it is integrated with thermal tripping mechanism, compact conformation, and reduction and takes up space.

To achieve the above object, the utility model is using following technical scheme：

A kind of tubulose MOV with thermal tripping mechanism, includes tubulose MOV chips, thermal tripping mechanism and encapsulated layer；The pipe Shape MOV chips include main body, and the main body has an accommodating cavity, and the inwall of the accommodating cavity is by spraying, sputtering, deposit or print Mode be formed with first annular electrode, PUR is filled with accommodating cavity, the outer wall of the main body is by spraying, sputtering, deposition Or the mode of printing is formed with the second annular electrode, and the first pin is welded with second annular electrode；The thermal tripping mechanism is inlayed Embedding to be molded in PUR and be located in accommodating cavity, thermal tripping mechanism has second pin and the 3rd pin, the 3rd pin and First annular electrode contact electrical connection；The encapsulated layer fully wrapped around firmly tubulose MOV chips, the tail end of the first pin, second pin Tail end and the tail end of the 3rd pin stretch out outside encapsulated layer.

Preferably, the both ends open of the main body, one end of main body is packaged with lid, and the encapsulated layer wraps lid.

Preferably, the lid is ceramics or engineering plastics.

Preferably, the one end open of the main body, other end closing, first annular electrode is covered to the interior bottom of accommodating cavity Face.

Preferably, one end of first pin is looped around the outer surface of the second annular electrode.

Preferably, the thermal tripping mechanism is located at the center position of accommodating cavity.

Preferably, first pin for copper wire rod, bar, sheet material, or copper covered steel wire rod, bar, sheet material；The Two pins for copper wire rod, bar, sheet material, or copper covered steel wire rod, bar, sheet material；3rd pin is wire rod, the rod of copper Material, sheet material, or copper covered steel wire rod, bar, sheet material.

Preferably, the encapsulated layer is epoxy resin, phenolic resin or silicones.

Preferably, the thermal tripping mechanism includes housing, and the inner of the second pin is stretched into housing, the 3rd pin The inner stretch into housing, the inner of the 3rd pin has elastic joint part, after the elastic joint part compression pass through low temperature Tin cream is welded with the inner of second pin.

The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology Scheme understands：

By using tubulose MOV chips, thermal tripping mechanism produced by insert molding is in PUR and is located in accommodating cavity so that heat Tripping mechanism can be reasonably integrated in tubulose MOV chips, and in use, user only needs a step welded and installed, Without tubulose MOV chips and thermal tripping mechanism are separately mounted on the diverse location of circuit board, welded and installed operation is few, operation It is convenient, and taking up space for circuit board is reduced, make the dimensioned area of circuit board smaller, beneficial to the development of the miniaturization of product.

More clearly to illustrate architectural feature of the present utility model and effect, come right with specific embodiment below in conjunction with the accompanying drawings The utility model is described in detail.

Brief description of the drawings

Fig. 1 is the schematic perspective view of first preferred embodiment of the utility model；

Fig. 2 is the sectional view of first preferred embodiment of the utility model；

Fig. 3 is the schematic perspective view of second preferred embodiment of the utility model；

Fig. 4 is the sectional view of second preferred embodiment of the utility model.

Accompanying drawing identifier declaration：

10th, tubulose MOV chips 11, main body

12nd, first annular electrode 13, the second annular electrode

14th, lid 101, accommodating cavity

20th, thermal tripping mechanism 21, second pin

22nd, the 3rd pin 221, elastic joint part

23rd, shell 30, encapsulated layer

40th, PUR 51, the first pin.

Specific embodiment

Refer to shown in Fig. 1 to Fig. 2, that show the concrete structure of first preferred embodiment of the utility model, bag Tubulose MOV chips 10, thermal tripping mechanism 20 and encapsulated layer 30 are included.

Tubulose MOV chips 10 include main body 11, and the main body 11 is metal oxide, and the main body 11 has an accommodating cavity 101, the inwall of the accommodating cavity 101 is formed with first annular electrode 12 by modes such as spraying, sputtering, deposition or printings, houses PUR 40 is filled with chamber 101, the outer wall of the main body 11 is formed with second by modes such as spraying, sputtering, deposition or printings Annular electrode 13, is welded with the first pin 51 on second annular electrode 13；Electrode material can be that silver, copper etc. conduct electricity very well Material；Can also first prepare the cheap metals such as one layer of aluminium（In order to improve the purposes such as adhesive force or matching）, then at it It is upper to prepare the material that a layer of silver, copper etc. conduct electricity very well.In the present embodiment, the both ends open of the main body 11, main body 11 One end is packaged with lid 14, and the lid 14 is ceramic material, the ceramics of such as aluminum oxide, or other species；It can also be work Engineering plastics（Such as PPS）.One end of first pin 51 is looped around the outer surface of the second annular electrode 13, first pin The outer surface that 51 one end is looped around the second annular electrode 13 is to pursue more preferable surge protection performance, or straight line Be connected with annular electrode, first pin 51 for copper wire rod, bar, sheet material, or copper covered steel wire rod, bar, sheet material.

The produced by insert molding of thermal tripping mechanism 20 is in PUR 40 and is located in accommodating cavity 101, and thermal tripping mechanism 20 has There is the pin 22 of second pin 21 and the 3rd, the 3rd pin 22 contacts electrical connection with first annular electrode 12；In the present embodiment, The thermal tripping mechanism 20 is located at the center position of accommodating cavity 101.The second pin 21 is wire rod, bar, the sheet material of copper, Or wire rod, bar, the sheet material of copper covered steel；3rd pin 22 is wire rod, bar, the sheet material of copper, or copper covered steel wire rod, rod Material, sheet material.Also, specifically, the thermal tripping mechanism 20 includes housing 23, housing is stretched into the inner of the second pin 21 In 23, the inner of the 3rd pin 22 is stretched into housing 10, and the inner of the 3rd pin 22 has elastic joint part 221, the elasticity Welded with the inner of second pin 21 by low temperature tin cream after the compression of connecting portion 221.

The encapsulated layer 30 it is fully wrapped around live tubulose MOV chips 10, the tail end of the first pin 51, the tail end of second pin 21 and The tail end of the 3rd pin 22 is stretched out outside encapsulated layer 30, and the encapsulated layer 30 wraps surrounding for the pin 51 of lid 14 and first Section.In the present embodiment, the encapsulated layer 30 is epoxy resin, phenolic resin or silicones.

During making, first, main body 11 is molded, then, first is formed with the inner-wall spraying of the accommodating cavity 101 of main body 11 Annular electrode 12, and main body 11 outside wall surface spraying be formed with the second annular electrode 13；Then, lid 14 is covered into main body 11 one end open；Then, thermal tripping mechanism 20 is placed in accommodating cavity 101, while making the 3rd pin 22 and first annular electricity Pole 12 is welded and contacts electrical connection, then, PUR 40 is filled toward accommodating cavity 101, after PUR 40 solidifies, thermal tripping mechanism 20 are embedded in PUR 40, then, coat epoxy resin in tubulose MOV chips 10 and form encapsulated layer 30, encapsulated layer 30 By tubulose MOV chips 10 it is fully wrapped around live, the only tail end of the first pin 51, the tail end of second pin 21 and the 3rd pin 22 Tail end stretches out.

The operation principle that the present embodiment is described in detail in detail is as follows：

When using, the first pin 51, the pin 22 of second pin 21 and the 3rd are electrically connected with external circuit welding, tubulose MOV chips 10 and thermal tripping mechanism 20 are connected；Under normal excessive voltage condition, the elastic joint part 221 in thermal tripping mechanism 20 Will not act, lightning surge is normal through element；Under the conditions of abnormal overvoltage, the temperature anomaly of thermal tripping mechanism 20 is raised, Elastic joint part 221 in thermal tripping mechanism 20 fuses, and the resilience of elastic joint part 221 causes the interruption with second pin 21 Open, the electrical connection cut-out between second pin 21 and element, voltage is no longer applied on element, and this prevents component temperature from rising extremely It is on fire caused by high.The indirectly suitable circuit of the pin 22 of second pin 21 and the 3rd can monitor whether thermal tripping mechanism 20 breaks Open.

Refer to shown in Fig. 3 to Fig. 4, that show the concrete structure of second preferred embodiment of the utility model, this The concrete structure of embodiment is essentially identical with the concrete structure of foregoing first preferred embodiment, itself except that：

In the present embodiment, the one end open of the main body 11, other end closing and domed structure, the first annular electricity Pole 12 is covered to the inner bottom surface of accommodating cavity 101.

The present embodiment eliminates installation lid 14 when making, and makes simpler convenience, other making of the present embodiment Step is identical with foregoing first preferred embodiment, is not described in detail herein.The application method of the present embodiment is preferable with first The application method of embodiment is identical, and the application method at this to the present embodiment is not described in detail.

The operation principle of the present embodiment is identical with the operation principle of foregoing first preferred embodiment, at this to the present embodiment Operation principle does not make narration in detail.

Design focal point of the present utility model is：By using tubulose MOV chips, thermal tripping mechanism produced by insert molding is in PUR It is interior and in accommodating cavity so that thermal tripping mechanism can be reasonably integrated in tubulose MOV chips, in use, use Family only needs a step welded and installed, the different positions without tubulose MOV chips and thermal tripping mechanism to be separately mounted to circuit board Put, welded and installed operation is few, easy to operate, and reduce taking up space for circuit board, make the dimensioned area of circuit board smaller, profit In the development of the miniaturization of product.

Know-why of the present utility model is described above in association with specific embodiment.These descriptions are intended merely to explain this reality With new principle, and can not by any way be construed to the limitation to the utility model protection domain.Based on explanation herein, Those skilled in the art associates other specific embodiments of the present utility model by would not require any inventive effort, These modes are fallen within protection domain of the present utility model.

Claims (9)

1. a kind of tubulose MOV with thermal tripping mechanism, it is characterised in that：Include tubulose MOV chips, thermal tripping mechanism and bag Sealing；Tubulose MOV chips include main body, and the main body has an accommodating cavity, the inwall of the accommodating cavity by spraying, sputtering, Deposition or the mode of printing are formed with first annular electrode, are filled with PUR in accommodating cavity, the outer wall of the main body by spraying, The mode of sputtering, deposition or printing is formed with the second annular electrode, and the first pin is welded with second annular electrode；The heat takes off Buckle mechanism produced by insert molding is in PUR and is located in accommodating cavity, and thermal tripping mechanism has second pin and the 3rd pin, and this Three pins are electrically connected with first annular electrode contact；The fully wrapped around firmly tubulose MOV chips of the encapsulated layer, the tail end of the first pin, The tail end of the tail end of second pin and the 3rd pin is stretched out outside encapsulated layer.

2. the tubulose MOV with thermal tripping mechanism as claimed in claim 1, it is characterised in that：The both ends open of the main body, it is main One end of body is packaged with lid, and the encapsulated layer wraps lid.

3. the tubulose MOV with thermal tripping mechanism as claimed in claim 2, it is characterised in that：The lid is ceramics or work Engineering plastics.

4. the tubulose MOV with thermal tripping mechanism as claimed in claim 1, it is characterised in that：The one end open of the main body, separately One end is closed, and the first annular electrode is covered to the inner bottom surface of accommodating cavity.

5. the tubulose MOV with thermal tripping mechanism as claimed in claim 1, it is characterised in that：One end ring of first pin It is wound on the outer surface of the second annular electrode.

6. the tubulose MOV with thermal tripping mechanism as claimed in claim 1, it is characterised in that：The thermal tripping mechanism is located at and holds Put the center position in chamber.

7. the tubulose MOV with thermal tripping mechanism as claimed in claim 1, it is characterised in that：First pin is the line of copper Material, bar, sheet material, or copper covered steel wire rod, bar, sheet material；Second pin is wire rod, bar, the sheet material of copper, or copper-clad The wire rod of steel, bar, sheet material；3rd pin for copper wire rod, bar, sheet material, or copper covered steel wire rod, bar, sheet material.

8. the tubulose MOV with thermal tripping mechanism as claimed in claim 1, it is characterised in that：The encapsulated layer be epoxy resin, Phenolic resin or silicones.

9. the tubulose MOV with thermal tripping mechanism as claimed in claim 1, it is characterised in that：The thermal tripping mechanism is included Housing, the inner of the second pin is stretched into housing, and the inner of the 3rd pin is stretched into housing, and the inner of the 3rd pin has Elastic joint part, is welded by low temperature tin cream after the elastic joint part compression with the inner of second pin.