CN206311219U - A kind of temperature sensor packaging system - Google Patents

Abstract

The utility model is related to a kind of temperature sensor packaging system, is related to sensor encapsulation field.Purpose is the poor sealing performance for solving existing sensor package apparatus, and the problem for causing sensor to put difficulty is limited by the bottom of a pan thickness.Conductor casing is internally provided with the chip of temperature sensor, a number lead of the chip of the temperature sensor is fixedly connected with the inwall of conductor casing, No. two leads of the chip of the temperature sensor pass through the conductor casing and extend to the outside of the conductor casing, sleeve pipe is arranged with outside No. two leads of the chip of the temperature sensor, the chip of the temperature sensor and temperature sensor chip lead are completely sealed in the conductor casing, wire is fixed with the lateral wall of the conductor casing, and the wire, current flowing between a number lead of the chip of conductor casing and temperature sensor.The utility model is encapsulated suitable for temperature sensor.

Description

A kind of temperature sensor packaging system

Technical field

The utility model is related to sensor encapsulation field.

Background technology

Traditional electromagnetic oven the bottom of a pan is carried out thermometric be by being carried out installed in the low temperature sensor of micro-crystal plate, Due to micro-crystal plate poor thermal conductivity, so measured temperature value deviation is also very big, this control band to temperature during cooking Challenge is carried out.Intelligent pan is just arisen at the historic moment under the inaccurate pain spot demand of this solution thermometric, and temperature is inserted by the bottom of a pan Sensor, measured temperature value is issued the electromagnetic oven of pairing.Due to the limitation of the bottom of a pan thickness, the structure of sensor is also limited System.

Utility model content

The utility model provides a kind of temperature sensor packaging system, it is therefore intended that solve existing sensor package apparatus Poor sealing performance, and the problem for causing sensor to put difficulty is limited by the bottom of a pan thickness.

The technical scheme that the utility model solves above-mentioned technical problem is as follows：Temperature sensor packaging system, described device Including conductor casing, the conductor casing is the shell structure of inner hollow, and the conductor casing is internally provided with TEMP The chip of device a, lead of the chip of the temperature sensor is fixedly connected with the inwall of conductor casing, the TEMP No. two leads of the chip of device pass through the conductor casing and extend to the outside of the conductor casing, the temperature sensor Sleeve pipe is arranged with outside No. two leads of chip, the chip of the temperature sensor and temperature sensor chip lead are complete It is hermetically sealed to be fixed with wire on the lateral wall of the conductor casing in the conductor casing, and the wire, conductor casing and Current flowing between a number lead of the chip of temperature sensor.

The beneficial effects of the utility model are：A number lead of temperature sensor chip is welded in conductor casing, is utilized Conductor casing does a signal transmission for lead, then on the side wall of conductor casing fixed conductor so as to draw signal.So Temperature sensor inner space actually only needs to meet No. two leads and be set in its outside sleeve pipe use, and greatlys save Space requirement, what can be made temperature sensor is finer.

On the basis of above-mentioned technical proposal, the utility model can also do following improvement.

Further, the conductor casing is the elongate structure of inner hollow.

Beneficial effect using above-mentioned further scheme is：Elongate structure makes the easier for installation of packaging system, More save sensor internal space.

Further, the conductor casing includes case head and outer cover body, and the case head is with outer cover body The hollow housing structure of one end open, the case head openend is fixedly connected and seals with outer cover body openend, described A number lead of the chip of temperature sensor chip and the temperature sensor is respectively positioned in the case head.

Beneficial effect using above-mentioned further scheme is：When being packaged to temperature sensor chip, can first by After a number lead of temperature sensor chip is fixed with case head inwall, temperature sensor chip is set to be located at case head In, outer cover body is fixedly connected with case head again then, encapsulation process more facilitates.

Further, the wire is fixed on the blind end lateral wall of outer cover body.

Beneficial effect using above-mentioned further scheme is：The bottom that lead location is arranged on into outer cover body can be more square Being attached with other circuits or module just.

Further, between a lead and the inwall of case head of the chip of the temperature sensor and outer cover body Lateral wall and wire between be and be welded to connect.

Beneficial effect using above-mentioned further scheme is：Wire, conductor casing and temperature ensure that by welding manner Current flowing between a number lead of the chip for spending sensor, does not result in insulating phenomenon.

Further, the material of described sleeve pipe is high temperature heat-resistant compression material.

Beneficial effect using above-mentioned further scheme is：Because No. two leads will be connected with external circuit structure, therefore Being set in the sleeve pipe outside No. two leads needs with resistant to elevated temperatures characteristic.

Further, the material of the conductor casing is high temperature resistant conductor metal material.

Beneficial effect using above-mentioned further scheme is：Because the present apparatus needs encapsulation temperature sensor, and the temperature Degree sensor is used to detect cooking bottom temperature, accordingly, it would be desirable to the shell of encapsulation temperature sensor has resistant to elevated temperatures characteristic, Simultaneously in order to current flowing between a lead of the chip for meeting wire, shell and temperature sensor, shell is also required to There is the characteristic of conduction simultaneously.

Further, the material of the conductor casing is copper, iron, aluminium or stainless steel.

Beneficial effect using above-mentioned further scheme is：Copper, iron, aluminium or stainless steel have high temperature resistant and lead simultaneously The good characteristic of electrical property.

Brief description of the drawings

Fig. 1 is the structural representation of the temperature sensor packaging system described in the utility model embodiment.

In accompanying drawing, the list of parts representated by each label is as follows：

1st, case head, 2, outer cover body, 3, chip, 4, lead, 5, No. two leads, 6, sleeve pipe, 7, wire.

Specific embodiment

Principle of the present utility model and feature are described below in conjunction with accompanying drawing, example is served only for explaining this practicality It is new, it is not intended to limit scope of the present utility model.

As shown in figure 1, the present embodiment proposes a kind of temperature sensor packaging system, the packaging system is included outside conductor Shell, sleeve pipe 6 and wire 7, the conductor casing are the shell structure of inner hollow, and the conductor casing is internally provided with temperature biography The chip 3 of sensor, temperature sensor is used for the heat that induction kettle bottom passes over, and temperature value is converted into itself different electricity Resistance.

The chip 3 of temperature sensor draws two leads, wherein a lead 4 of the chip 3 of the temperature sensor with The inwall of conductor casing is fixedly connected, and No. two bottoms of lead 5 of the chip 3 of the temperature sensor pass through the conductor casing And the outside of the conductor casing is extended to, and sleeve pipe 6 is arranged with No. two leads 5 of the chip 3 of the temperature sensor, it is described A number lead 4 of the chip 3 of temperature sensor and temperature sensor chip 3 is entirely sealed in the conductor casing by conductor casing In, be fixed with wire 7 on the lateral wall of the conductor casing, and the wire 7, conductor casing and temperature sensor chip 3 A lead 4 between current flowing.

In the scheme of the present embodiment, a lead 4 of temperature sensor chip 3 is welded on the inwall of conductor casing, A signal transmission for lead 4 is done using conductor casing, then welding lead 7 again on the lateral wall of conductor casing, so that Draw a signal for lead 4.So sensor internal space actually only needs to meet No. two leads 5 and wraps up its sleeve pipe 6 use, and save the space requirement of temperature sensor.

In actually detected cooking bottom temperature, temperature sensor is located at microcrystalline board of electromagnetic oven bottom, due to micro-crystal plate thermal conductivity Can be poor, temperature detection occurs deviation, therefore, current pan is realized temperature and is examined by inserting temperature sensor in the bottom of a pan Survey, need to open up jack in pan bottom in this course, therefore, in order to better meet the installation of temperature sensor Condition, is set to elongate structure most appropriate by conductor casing, can either meet and realize temperature in the bottom of a pan insertion temperature sensor Spend the purpose of detection, it is also possible to save the installing space of temperature sensor to a certain extent.

Because temperature sensor can run into temperature higher during detection temperature, accordingly, it would be desirable to conductor casing has Good resistance to elevated temperatures, also, conductor casing also functions to connect the effect of current flowing between chip 3 and wire 7, therefore, The material of conductor casing should select high temperature resistant conductor metal material, make it have the common effect of both of the above.

Meanwhile, in order to make temperature sensor chip 3 easier in encapsulation process, the present embodiment is by conductor casing It is divided into case head 1 and outer cover body 2, before encapsulation, a lead 4 of chip 3 is welded in case head 1 first On wall, so that chip 3 is integrally located at case head 1, outer cover body 2 and case head 1 are welded again then, and two Resistant to elevated temperatures sleeve pipe 6 is superscribed on the side wall of number lead 5, the purpose of insulation and thermal insulation is played, encapsulation process is eased.

Temperature sensor in detection temperature, it is necessary to temperature signal to be sent to other circuit structures as data reference, Accordingly, it would be desirable to temperature sensor is connected with other circuit realirations, in order that temperature sensor can be more easily electric with other Road connects, and it is optimal that wire 7 is arranged on the bottom outside wall of outer cover body 2, makes the thread that it is connected with other circuits most It is short, easy to connect and save space.

In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width Degree ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward ", " suitable The orientation or position relationship of the instruction such as hour hands ", " counterclockwise ", " axial direction ", " radial direction ", " circumference " are based on orientation shown in the drawings Or position relationship, be for only for ease of description the utility model and simplify and describe, rather than indicate or imply signified device or Element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limit of the present utility model System.

In the utility model, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " Gu It is fixed " etc. term should be interpreted broadly, for example, it may be fixedly connected, or be detachably connected, or integrally；Can be Mechanically connect, or electrically connect；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two The connection of element internal or two interaction relationships of element, unless otherwise clearly restriction.For the common skill of this area For art personnel, concrete meaning of the above-mentioned term in the utility model can be as the case may be understood.

In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score Can be the first and second feature directly contacts, or the first and second features are by intermediary mediate contact.And, first is special Levy second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only Represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be with Be fisrt feature immediately below second feature or obliquely downward, or be merely representative of fisrt feature level height less than second feature.

In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means to combine specific features, structure, material or spy that the embodiment or example are described Point is contained at least one embodiment of the present utility model or example.In this manual, to the schematic table of above-mentioned term State and be necessarily directed to identical embodiment or example.And, the specific features of description, structure, material or feature can be with Combined in an appropriate manner in any one or more embodiments or example.Additionally, in the case of not conflicting, this area Technical staff the feature of the different embodiments or example described in this specification and different embodiment or example can be entered Row is combined and combined.

Although embodiment of the present utility model has been shown and described above, it is to be understood that above-described embodiment is Exemplary, it is impossible to it is interpreted as to limitation of the present utility model, one of ordinary skill in the art is in scope of the present utility model It is interior above-described embodiment to be changed, changed, replaced and modification.

Claims (8)

1. a kind of temperature sensor packaging system, it is characterised in that including conductor casing, the conductor casing is inner hollow Shell structure, the conductor casing is internally provided with the chip (3) of temperature sensor, the chip (3) of the temperature sensor A number lead (4) is fixedly connected with the inwall of conductor casing, and No. two leads (5) of the chip (3) of the temperature sensor pass through The conductor casing simultaneously extends to the outside of the conductor casing, and No. two leads (5) of the chip (3) of the temperature sensor are outward Sleeve pipe (6) is arranged with, the chip (3) of the temperature sensor and a lead (4) of temperature sensor chip (3) are by completely close It is enclosed in the conductor casing, wire (7), and the wire (7), conductor casing is fixed with the lateral wall of the conductor casing A current flowing and lead (4) of the chip (3) of temperature sensor between.

2. a kind of temperature sensor packaging system according to claim 1, it is characterised in that the conductor casing is inside Hollow elongate structure.

3. a kind of temperature sensor packaging system according to claim 2, it is characterised in that the conductor casing includes outer Shell head (1) and outer cover body (2), the case head (1) are the hollow housing knot of one end open with outer cover body (2) Structure, case head (1) openend is fixedly connected and seals with outer cover body (2) openend, the temperature sensor chip (3) it is respectively positioned in the case head (1) with the lead (4) of chip (3) of the temperature sensor.

4. a kind of temperature sensor packaging system according to claim 3, it is characterised in that the wire (7) is fixed on On the blind end lateral wall of outer cover body (2).

5. a kind of temperature sensor packaging system according to claim 4, it is characterised in that the core of the temperature sensor Between a number lead (4) of piece (3) and the inwall of case head (1) and between the lateral wall and wire (7) of outer cover body (2) It is and is welded to connect.

6. a kind of temperature sensor packaging system according to any one of claim 1 to 5, it is characterised in that described sleeve pipe (6) material is high temperature heat-resistant compression material.

7. a kind of temperature sensor packaging system according to any one of claim 1 to 5, it is characterised in that the conductor The material of shell is high temperature resistant conductor metal material.

8. a kind of temperature sensor packaging system according to any one of claim 1 to 5, it is characterised in that the conductor The material of shell is copper, iron, aluminium or stainless steel.