CN206273041U - Heat abstractor - Google Patents

Abstract

The utility model is related to a kind of heat abstractor, for dissipation from electronic devices, it includes radiation shell and radome, and the radiation shell includes heat-dissipating casing and master control fin, the master control fin heat transfer is engaged in electronic device surface, for absorbing and storing the heat that electronic device comes out；The radome constitutes the space of sealed electronic device around electronic device periphery and with master control fin, and the heat-dissipating casing is covered and is dispersed into the external world with by the heat that master control fin is stored in master control fin top.The utility model structure is novel, and heat that can be quickly by electronic device generation be dispersed into the external world, has the advantages that radiating efficiency is high, radiating rate is fast.

Description

Heat abstractor

Technical field

The utility model is related to technical field of heat dissipation, more particularly to a kind of heat abstractor.

Background technology

With developing rapidly for science and technology, various smart mobile phones, the super clear top box of intelligence, intelligent players, game cartridge and Similar electronic equipment is widely used.The electronic equipment internal of this class would generally be provided with master control set, generally master control Chip, because main control chip working frequency is more and more faster, its caloric value is also increasing, and is similar to the electricity of this class of smart mobile phone Sub- equipment generally uses closed plastic construction.Therefore, if the radiating for not solving the main control chip of electronic equipment internal is asked Topic, can cause electronic equipment surface temperature to raise, and have impact on the service life of electronic equipment.And, when user touches the electricity During sub- equipment, burning heat sensation is had, influence Consumer's Experience.

Existing radiating mode is typically radiated using aluminum alloy heat sink mode, with the increasing of the working frequency of main control chip Height, this radiating mode can not meet demand.

Utility model content

In view of this, it is necessary to which a kind of structure novelty, the heat abstractor that radiating efficiency is high and radiating rate is fast are provided.

A kind of heat abstractor, for dissipation from electronic devices, it includes radiation shell and radome, and the radiation shell includes radiating Shell and master control fin, the master control fin heat transfer are engaged in electronic device surface, for absorbing and storing electronics device The heat that part comes out；The radome constitutes sealed electronic device around electronic device periphery and with master control fin Space, the heat-dissipating casing is covered and is dispersed into the external world with by the heat that master control fin is stored in master control fin top.

Further, the electronic device includes main control chip and circuit board, and the shielding is covered with through hole, the through hole Positioned at main control chip top, the through hole is consistent with main control chip shape.

Further, the main control chip is installed on circuit board, and the master control fin is installed on circuit board.

Further, the master control fin is provided with projection in face of main control chip position, described raised logical with radome Hole site is consistent with shape.

Further, the master control fin is provided with one layer of heat-conducting layer with main control chip contact plane, and the heat-conducting layer will The heat that main control chip is produced is transmitted in master control fin.

Further, the heat abstractor also includes heat-conducting glue, and the heat-conducting glue is located at heat-dissipating casing and master control fin Joint, leave gap between the heat-dissipating casing and master control fin, the heat of the master control fin passes through thermal convection current Heat-dissipating casing is passed to heat exchange pattern.

Further, the master control fin is provided with several radiating grooves with heat-dissipating casing contact surface, and the radiating groove is used In placing heat sink material accelerating distributing for master control fin heat.

Further, the heat-dissipating casing inner side whole master control fin of parcel, the heat transfer that will be absorbed to the external world.

Further, the heat-dissipating casing surface scribbles a nanometer carbon coating.

Further, the radiation shell is aluminum alloy casing or aluminum hull, and the radome is foreign copper-nickel alloy cover.

Above-mentioned heat abstractor is absorbed and is stored the heat that main control chip comes out by the master control fin, and master control dissipates The heat that backing absorbs passes to heat-dissipating casing by heat conductive silica gel again, and finally the nanometer carbon coating by being scribbled on heat-dissipating casing will The heat for being delivered to heat-dissipating casing is distributed in the way of infra-red radiation, reaches great heat radiation effect, and rapid heat dissipation.This reality It is novel with new structure, have the advantages that radiating efficiency is high, radiating rate is fast.

Brief description of the drawings

Fig. 1 is the heat abstractor dimensional decomposition structure diagram of the utility model embodiment.

Fig. 2 is the heat abstractor sectional structure decomposition texture schematic diagram of the utility model embodiment.

Specific embodiment

The utility model is described in detail below with reference to specific embodiments and the drawings.

Fig. 1 and Fig. 2 is referred to, a kind of heat abstractor 10 is shown, radiated for electronic device 40, it includes the He of radiation shell 20 Radome 30, the radiation shell 20 includes heat-dissipating casing 21 and master control fin 22, the heat transfer of master control fin 22 engagement In the surface of electronic device 40, for absorbing and storing the heat that electronic device 40 comes out；The radome 30 is around electricity The periphery of sub- device 40 simultaneously constitutes the space of sealed electronic device 40 with master control fin 22, and the heat-dissipating casing 21 is covered in master control The top of fin 22 is dispersed into the external world with by the heat that master control fin 22 is stored.

Further, the electronic device 40 includes main control chip 41 and circuit board 42, and the radome 30 is provided with through hole 31, the through hole 31 is located at the top of main control chip 41, and the through hole 31 is consistent with the shape of main control chip 41.The main control chip 41 It is installed on circuit board 42, the master control fin 22 is installed in circuit board.The radome 30 is placed in main control chip 41 On the heat that main control chip 41 comes out can concentrate on the through hole 31 of the radome 30, transmitted from the through hole 31 Stored in master control fin 22, its heat for distributing is not transmitted to other parts because of heat transfer, so that Other parts will not caused by temperature is too high part damage.The radome 30 is by foreign copper-nickel alloy material by mould punching mode Bending is made, and is foreign copper-nickel alloy cover.

Further, the area of the master control heat sink 22 is more than the area of the circuit board 42, the master control fin 22 is plane near the side of circuit board 42；The master control fin 22 is provided with projection 221 in face of the position of main control chip 41, described convex Play 221 consistent with the location and shape of through hole 31 of radome 30.When the main control chip 41 works, described raised 221 are close to Main control chip 41, substantial amounts of heat absorption is come out in master control fin 22 and storing by main control chip 41.

Further, the master control fin 22 is provided with one layer of heat-conducting layer, the heat conduction with the contact plane of main control chip 42 Be transmitted to the heat that main control chip 41 is produced in master control fin 22 by layer, and the heat-conducting layer is heat-conducting silicone grease.Simultaneously located at electricity A small amount of heat that the other parts of road plate 42 are produced can also be delivered in the master control fin 22 by the heat-conducting layer, made The heat that disappears is more efficient, more quickly.To extend the service life of whole electronic device 40, electronic device 40 is reduced because working long hours And break down, it is easy to people to use.

Further, the heat abstractor 10 also includes heat-conducting glue 50, and the heat-conducting glue 50 is located at heat-dissipating casing 21 and master The joint of fin 22 is controlled, gap, the master control fin 22 are left between the heat-dissipating casing 21 and master control fin 22 Heat heat-dissipating casing 21 is passed to by thermal convection current and heat exchange pattern.The master control fin 22 connects with heat-dissipating casing 21 Contacting surface is provided with several radiating grooves 222, and the radiating groove 222 is used to place heat sink material to accelerate the heat of master control fin 22 Distribute.Specifically, the amount of heat part in the storage of master control fin 22 passes through heat by the heat-conducting glue 50 located at junction The mode of conduction passes to heat-dissipating casing, because leaving gap between master control fin 22 and An Re shells 21, that is, leaves cavity, institute With another part heat located at the radiating groove 222 on the surface of master control fin 22 by thermal convection current or heat radiation by way of pass It is delivered in heat-dissipating casing.Two kinds of transfer modes are carried out simultaneously, and the heat of fin is distributed in effectively accelerating, and is reached and is efficiently dissipated The purpose of heat.Meanwhile, the inner side of the heat-dissipating casing 21 whole master control fin 22 of parcel can be by master control fin 22 from master control core The heat absorbed at piece 41 is all delivered to the external world, without causing heat to distribute in time electronic device 40 occurs The consequence of damage.

Further, the surface of the heat-dissipating casing 21 scribbles a nanometer carbon coating, and the nanometer carbon coating can be outer by radiating Heat in shell 21 is converted to electromagnetic infrared wave, realizes autonomous heat loss through radiation, and the calorie source of heat-dissipating casing 21 is delivered to so as to allow Distributed in the continuous outwardly air in source, enable the normal operation of main control chip 41, it is ensured that the reliability of electronic equipment, and The service life of electronic equipment can be extended.The radiation shell 20 is aluminum alloy material, and specifically, heat-dissipating casing 21 and master control dissipate Backing 22 is made up of aluminium alloy of mold injection mode die casting, with thermal conductive resin and can store substantial amounts of heat.

Above-mentioned heat abstractor 10 absorbs and stores the heat that main control chip 42 comes out by master control fin 22, described The heat that master control fin 22 absorbs passes to heat-dissipating casing 21 by heat conductive silica gel 50 again, is finally scribbled by heat-dissipating casing 21 Nanometer carbon coating will dissipate the heat for being delivered to hot shell 21 and be distributed in the way of infra-red radiation.Radome 30 can be by master simultaneously The heat that control chip 42 is produced is concentrated and is delivered in master control heat radiation chip 22, it is ensured that the stable operation of electronic equipment, is reached good Good radiating effect, and rapid heat dissipation, make the long-time of main control chip 41 be in normal operating condition, extend the use longevity of main control chip Life, is worthy to be popularized.

It should be noted that the utility model is not limited to above-mentioned implementation method, essence is created according to of the present utility model God, those skilled in the art can also make other and change, these changes done according to creative spirit of the present utility model, all Should be included in the utility model it is claimed within the scope of.

Claims (10)

1. a kind of heat abstractor, for dissipation from electronic devices, it is characterised in that including radiation shell and radome, the radiation shell Including heat-dissipating casing and master control fin, the master control fin heat transfer is engaged in electronic device surface, for absorbing and depositing The heat that storage electronic device comes out；The radome constitutes sealing electricity around electronic device periphery and with master control fin The space of sub- device, the heat-dissipating casing is covered and is dispersed into outward with by the heat that master control fin is stored in master control fin top Boundary.

2. heat abstractor as claimed in claim 1, it is characterised in that the electronic device includes main control chip and circuit board, The shielding is covered with through hole, and the through hole is located at main control chip top, and the through hole is consistent with main control chip shape.

3. heat abstractor as claimed in claim 2, it is characterised in that the main control chip is installed on circuit board, the master Control fin is installed on circuit board.

4. heat abstractor as claimed in claim 3, it is characterised in that the master control fin is provided with face of main control chip position Projection, the projection is consistent with the lead to the hole site and shape of radome.

5. heat abstractor as claimed in claim 4, it is characterised in that the master control fin sets with main control chip contact plane There is one layer of heat-conducting layer, be transmitted to the heat that main control chip is produced in master control fin by the heat-conducting layer.

6. heat abstractor as claimed in claim 1, it is characterised in that also including heat-conducting glue, the heat-conducting glue is outer located at radiating Shell and the joint of master control fin, leave gap between the heat-dissipating casing and master control fin, the master control fin Heat passes to heat-dissipating casing by thermal convection current and heat exchange pattern.

7. heat abstractor as claimed in claim 6, it is characterised in that the master control fin is provided with heat-dissipating casing contact surface Several radiating grooves, the radiating groove is used to place heat sink material to accelerate distributing for master control fin heat.

8. heat abstractor as claimed in claim 6, it is characterised in that the whole master control radiating of heat-dissipating casing inner side parcel Piece, the heat transfer that will be absorbed to the external world.

9. heat abstractor as claimed in claim 8, it is characterised in that the heat-dissipating casing surface scribbles a nanometer carbon coating.

10. heat abstractor as claimed in claim 1, it is characterised in that the radiation shell is aluminum alloy casing or aluminum hull, described Radome is foreign copper-nickel alloy cover.