CN206272969U - A kind of welding resistance consent general air guide backing plate of printed substrate - Google Patents

A kind of welding resistance consent general air guide backing plate of printed substrate Download PDF

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Publication number
CN206272969U
CN206272969U CN201621373885.0U CN201621373885U CN206272969U CN 206272969 U CN206272969 U CN 206272969U CN 201621373885 U CN201621373885 U CN 201621373885U CN 206272969 U CN206272969 U CN 206272969U
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CN
China
Prior art keywords
air guide
backing plate
printed substrate
welding resistance
consent
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CN201621373885.0U
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Chinese (zh)
Inventor
赖建平
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Zhuhai Jingyi Circuit Co Ltd
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Zhuhai Jingyi Circuit Co Ltd
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Priority to CN201621373885.0U priority Critical patent/CN206272969U/en
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Publication of CN206272969U publication Critical patent/CN206272969U/en
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Abstract

The utility model is related to a kind of general air guide backing plate of the welding resistance consent of printed substrate, it includes epoxy core plate, BGA porose area is drilled with the epoxy core plate, the BGA porose area includes macropore and aperture, a diameter of 3.0mm of the macropore, a diameter of 1.0mm of the aperture, the aperture is the complementary apertures in the middle of adjacent 4 macropores.Air guide backing plate of the present utility model has versatility, by increasing capacitance it is possible to increase wiring board welding resistance consent plumpness, improves the quality and producing efficiency of consent.

Description

A kind of welding resistance consent general air guide backing plate of printed substrate
Technical field
The utility model is related to printed substrate to make field, more particularly to a kind of welding resistance consent of printed substrate is general Air guide backing plate.
Background technology
Conductive hole (Via hole) in printed substrate can play a part of circuit and interlink conducting.With electronics Product develops to " light, thin, short, small " direction, and printed substrate surface-assembled occurs also to high density, highly difficult development Technology (SMT), welded ball array encapsulation technology (BGA), this proposes requirement higher, conductive stopple to printed substrate manufacture craft Hole technique is arisen at the historic moment.Conductive hole consent mainly has five effects:
1) tin causes short circuit from via through component side when preventing printed substrate from crossing wave-soldering;
2) welding assisted agent residuals are avoided in via;
3) printed substrate will inhale vacuum on a testing machine after the completion of Electronics Factory's surface mount and element are assembled has foot Enough negative pressure;
4) prevent from causing rosin joint in the tin cream ostium of surface, influence attachment;
5) tin sweat(ing) was ejected when preventing wave-soldering, caused short circuit.
For surface mounting board, especially welded ball array encapsulation and the attachment of integrated circuit, also require that conductive hole consent must Must be smooth.
At present, the mode of welding resistance consent is broadly divided into even two kinds of print band plug and aluminium flake consent.During using even print band plug mode, Ink is not full in hole, and it is rubescent aperture easily occur, and large quantity of air can be deposited in hole, and air expansion can break through welding resistance during solidification Film, causes cavity, a small amount of via is had during hot air leveling and hides tin, can not meet high-end customer quality requirements.Using aluminium flake plug , it is necessary to be aided in using air guide backing plate during the mode of hole, air in hole is smoothly discharged during consent, satisfy so as to reach consent Full effect.Traditional air guide backing plate is the special backing plate corresponding with printed substrate model, is together bored with aluminium flake when using Go out, different printing wiring board model needs the air guide backing plate of different model, cause printed substrate cost of manufacture to increase, production effect Rate is relatively low.
Utility model content
In view of the shortcomings of the prior art, the purpose of this utility model is to provide a kind of the logical of replacement conventional dedicated air guide backing plate Air guide backing plate is used, cost of manufacture is saved while identical consent effect is played, consent efficiency is improved.
To reach above-mentioned purpose, the technical solution adopted in the utility model is:
A kind of general air guide backing plate of welding resistance consent of printed substrate is provided, it includes epoxy core plate, the epoxy core plate On be drilled with BGA porose area, the BGA porose area includes macropore and aperture, and a diameter of 3.0mm of the macropore is described A diameter of 1.0mm of aperture, the aperture is the complementary apertures in the middle of adjacent 4 macropores.
Preferably, the size of the epoxy core plate is 700mm × 800mm.
Preferably, the thickness of the epoxy core plate is 2mm.
Preferably, the scope of the BGA porose area is 550mm × 650mm.The size in the BGA area is upper State the consent making that scope interior energy meets conventional maximum wiring board jigsaw size 540 × 625mm plates.
Preferably, the hole back gauge of the BGA porose area is 0.5mm.
The beneficial effects of the utility model are:By such scheme, special air guide backing plate is replaced using general air guide backing plate, Identical consent effect can be played, the efficiency that cost of manufacture improves consent is saved.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the general air guide backing plate of welding resistance consent of printed substrate of the utility model.
Fig. 2 is the zoomed-in view of Blocked portion in Fig. 1.
Specific embodiment
The utility model is further illustrated with reference to Figure of description and specific embodiment:
A kind of general air guide backing plate of welding resistance consent of printed substrate as shown in Figure 1-2, it includes epoxy core plate 1, institute State and BGA porose area 2 is drilled with epoxy core plate 1, the BGA porose area 2 includes macropore 3 and aperture 4, the macropore 3 A diameter of 3.0mm, a diameter of 1.0mm of the aperture 4, the aperture 4 are the complementary apertures in the middle of adjacent 4 macropores 3.The ring The size of oxygen core plate 1 is 700mm × 800mm.The thickness of the epoxy core plate 1 is 2mm.The scope of the BGA porose area 2 It is 550mm × 650mm.The size in the BGA area 2 can meet conventional maximum wiring board jigsaw size within the above range The consent of 540 × 625mm plates makes.The hole back gauge of the BGA porose area 2 is 0.5mm.
The utility model provides a kind of general air guide backing plate of welding resistance consent of printed substrate, mainly substitutes special plug Hole air guide backing plate, the welding resistance consent for wiring board makes, and the general air guide base plate of plug hole of the printed substrate can be with venting Air in consent conductive hole, while ensureing uniform force during ink plugging, consent is full, is not in existing depression and cavity As improve the efficiency of consent.
Above content is to combine the step detailed description that specific preferred embodiment is made to the utility model, it is impossible to recognized Fixed specific implementation of the present utility model is confined to these explanations.For the ordinary skill people of the utility model art For member, without departing from the concept of the premise utility, some simple deduction or replace can also be made should all work as and regard Originally belong to the protection domain of utility model to belong to.

Claims (5)

1. the general air guide backing plate of the welding resistance consent of a kind of printed substrate, it is characterised in that:Including epoxy core plate (1), the ring BGA porose area (2) is drilled with oxygen core plate (1), the BGA porose area (2) includes macropore (3) and aperture (4), described big A diameter of 3.0mm in hole (3), a diameter of 1.0mm of the aperture (4), the aperture (4) is provided in adjacent 4 macropores (3) Middle complementary apertures.
2. the general air guide backing plate of the welding resistance consent of a kind of printed substrate according to claim 1, it is characterised in that:It is described Epoxy core plate (1) size is 700mm × 800mm.
3. the general air guide backing plate of the welding resistance consent of a kind of printed substrate according to claim 1, it is characterised in that:It is described The thickness of epoxy core plate (1) is 2mm.
4. a kind of general air guide backing plate of the welding resistance consent of the printed substrate according to claim any one of 1-3, its feature It is:The scope of the BGA porose area (2) is 550mm × 650mm.
5. a kind of general air guide backing plate of the welding resistance consent of the printed substrate according to claim any one of 1-3, its feature It is:The hole back gauge of the BGA porose area (2) is 0.5mm.
CN201621373885.0U 2016-12-14 2016-12-14 A kind of welding resistance consent general air guide backing plate of printed substrate Active CN206272969U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621373885.0U CN206272969U (en) 2016-12-14 2016-12-14 A kind of welding resistance consent general air guide backing plate of printed substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621373885.0U CN206272969U (en) 2016-12-14 2016-12-14 A kind of welding resistance consent general air guide backing plate of printed substrate

Publications (1)

Publication Number Publication Date
CN206272969U true CN206272969U (en) 2017-06-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621373885.0U Active CN206272969U (en) 2016-12-14 2016-12-14 A kind of welding resistance consent general air guide backing plate of printed substrate

Country Status (1)

Country Link
CN (1) CN206272969U (en)

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