CN206267453U - A kind of improved structure of ceramic wafer - Google Patents
A kind of improved structure of ceramic wafer Download PDFInfo
- Publication number
- CN206267453U CN206267453U CN201621305173.5U CN201621305173U CN206267453U CN 206267453 U CN206267453 U CN 206267453U CN 201621305173 U CN201621305173 U CN 201621305173U CN 206267453 U CN206267453 U CN 206267453U
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- CN
- China
- Prior art keywords
- ceramic wafer
- pit
- ceramic
- back side
- improved structure
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Abstract
The utility model discloses a kind of improved structure of ceramic wafer, including ceramic wafer body, the ceramic wafer body has and the back side that metope fits and the front relative with this back side, the back side of the ceramic wafer body has the once compressing pit in net distribution, the pit is uniformly covered with the back side of the ceramic wafer body, and the depth of the pit is 3~8mm.A kind of improved structure of ceramic wafer of the utility model, simple structure, on the premise of not influenceing ceramic wafer intensity to reach the relevant criterion of conventional ceramic plate, the weight of ceramic wafer is greatly reduced, so as to be conducive to the emission reduction energy-conservation in production process, the secondary operation such as the cladding mounting opening fluting of ceramic wafer are not influenceed, and ceramic wafer wet combining is also more firm, and reduces ceramic wafer under self gravitation effect, to the pulling force of metope.
Description
Technical field
The utility model is related to building decoration technology field, and in particular to be a kind of improved structure of ceramic wafer.
Background technology
Ceramic production industry is the industry of highly energy-consuming, maximum discharge, in order to adapt to the situation demands of energy-saving and emission-reduction, in the industry
Carry out building tile slimming energetically, research and develop various ceramic thin plates.But simply the thinning ceramic thin plate of tile thickness is also had
A series of deficiency, one be ceramic thin plate because thickness only has the half of common ceramic tile or thinner, the breakdown strength of its product
Inevitably significantly decline, two is that ceramic thin plate integral thickness is thinning, it is difficult to carry out carrying out edge fluting perforate etc. two
Secondary processing, is not easy to the installation of cladding engineering, is also accordingly restricted using scope.
Utility model content
The purpose of this utility model is to provide a kind of improved structure of ceramic wafer, can change width in ceramic wafer product strength
Degree is smaller, and in the case of sufficiently achieving common ceramic tile relevant criterion, the weight of ceramic wafer is greatly reduced, and is conducive to industry
Energy-saving and emission-reduction, stickup with wall bonding more firmly, and does not influence the perforate at ceramic wafer edge secondary the adding such as slot when using
Work, convenient to be constructed with various wet extensions, applicability is wide, practical.
In order to reach above-mentioned purpose, solution of the present utility model is：
A kind of improved structure of ceramic wafer, including ceramic wafer body, the ceramic wafer body have and are fitted with metope
The back side and the front relative with this back side, it is characterised in that：The back side of the ceramic wafer body has once compressing
In the pit of net distribution, the pit is uniformly covered with the back side of the ceramic wafer body, the depth of the pit for 3~
8mm。
The cross section of the pit is square or circle.
The inside of the pit is in rounding mesa-shaped or chamfered edge mesa-shaped.
Each inner edge angle of the pit is formed with chamfering.
After said structure, a kind of improved structure of ceramic wafer of the utility model, on the one hand, the back side of ceramic wafer body
Pit group with net distribution is greatly reduced the weight of ceramic wafer, is conducive to the energy-saving and emission-reduction of industry, simultaneously because respectively
The thickness at the edge of individual pit is not reduced, plays a part of reinforcement, so as to maintain the original intensity of ceramic wafer substantially, it is ensured that
Ceramic panel products remain to reach the relevant criterion of conventional ceramic plate.On the other hand, the thickness on the side edge of the ceramic wafer with it is common
The thickness of ceramic wafer is identical, can carry out various perforate flutings, facilitates the installation of cladding engineering, and reduce ceramic wafer at itself
To the pulling force of metope under Action of Gravity Field.Additionally due to the depth of pit relatively depth is 3~8mm, when being constructed using wet method barbola work
The adhesion of the Binder Materials such as ceramic wafer body and cement mortar can significantly be increased, ceramic wafer is combined more firm with metope
Gu, it is difficult for drop-off.
Therefore, a kind of improved structure of ceramic wafer of the utility model, simple structure can change width in ceramic wafer product strength
Degree is smaller, and in the case of sufficiently achieving common ceramic tile relevant criterion, the weight of ceramic wafer is greatly reduced, and is conducive to industry
Energy-saving and emission-reduction, stickup with wall bonding more firmly, and does not influence the perforate at ceramic wafer edge secondary the adding such as slot when using
Work, convenient to be constructed with various extension methods, applicability is wide, practical.
Further, the inside of pit is in rounding mesa-shaped or chamfered edge mesa-shaped, and each inner edge angle of pit forms chamfering, is easy to
The pressure brick demoulding of ceramic wafer in production process.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the improved structure of ceramic wafer of the utility model.
In figure：
The back side 11 of ceramic wafer body 1
Pit 12
Specific embodiment
In order to the technical solution of the utility model is explained further, the utility model is entered below by specific embodiment
Row is elaborated.
A kind of improved structure of ceramic wafer, as shown in figure 1, including ceramic wafer body 1, ceramic wafer body 1 has and metope
The back side 11 and the front relative with this back side 11 for fitting, the back side 11 of ceramic wafer body 1 is with once compressing
In the pit 12 of net distribution, these pits 12 are spaced substantially equidistant respectively along vertical and horizontal and are covered with ceramic wafer body 1
The back side 11, the depth of pit 12 is 3~4mm.Specifically, the cross section of pit can be square, or circular, pit
Inside is in chamfered edge mesa-shaped, also can be in rounding mesa-shaped, and each inner edge angle of pit is formed with chamfering, is easy to ceramic wafer in production process
The pressure brick demoulding.
After said structure, a kind of improved structure of ceramic wafer of the utility model, on the one hand, the back of the body of ceramic wafer body 1
The pit group that face has net distribution is greatly reduced the weight of ceramic wafer, is conducive to the energy-saving and emission-reduction of industry, simultaneously because
The thickness at the edge of each pit 12 is not reduced, plays a part of reinforcement, so that the original intensity of ceramic wafer is maintained substantially,
Ensure that ceramic panel products remain to reach the relevant criterion of common ceramic tile.On the other hand, the thickness on the side edge of the ceramic wafer body 1
Thickness with common ceramic tile is identical, can carry out various perforate flutings, facilitates the installation of cladding engineering, and reduces ceramic wafer and exists
To the pulling force of metope under self gravitation effect,.
Further, since the depth of pit 12 relatively depth is 3~8mm, when being constructed using wet method barbola work, by ceramic wafer body
1 is pressed in the Binder Materials such as cement mortar, and Binder Materials can be flowed into pit 12 along the edge of pit 12 so that ceramic wafer sheet
Body 1 bonds even closer with the Binder Materials after solidification, so that ceramic wafer is combined more firm with metope, is difficult to take off
Fall.
Therefore, a kind of improved structure of ceramic wafer of the utility model, simple structure can change width in ceramic wafer product strength
Degree is smaller, and in the case of sufficiently achieving common ceramic tile relevant criterion, the weight of ceramic wafer is greatly reduced, and is conducive to industry
Energy-saving and emission-reduction, stickup with wall bonding more firmly, and does not influence the perforate at ceramic wafer edge secondary the adding such as slot when using
Work, convenient to be constructed with various wet extensions, applicability is wide, practical.
Above-described embodiment and schema and non-limiting product form of the present utility model and style, any art
Appropriate change or modification that those of ordinary skill is done to it, all should be regarded as not departing from patent category of the present utility model.
Claims (4)
1. a kind of improved structure of ceramic wafer, including ceramic wafer body, the ceramic wafer body has the back of the body fitted with metope
Face and the front relative with this back side, it is characterised in that：The back side of the ceramic wafer body has once
The pit of net distribution, the pit is uniformly covered with the back side of the ceramic wafer body, and the depth of the pit is 3~8mm.
2. the improved structure of a kind of ceramic wafer according to claim 1, it is characterised in that：The cross section of the pit is side
Shape or circle.
3. the improved structure of a kind of ceramic wafer according to claim 1, it is characterised in that：The inside of the pit is in rounding
Mesa-shaped or chamfered edge mesa-shaped.
4. the improved structure of a kind of ceramic wafer according to claim 1, it is characterised in that：Each interior corner of the pit
It is formed with chamfering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621305173.5U CN206267453U (en) | 2016-11-30 | 2016-11-30 | A kind of improved structure of ceramic wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621305173.5U CN206267453U (en) | 2016-11-30 | 2016-11-30 | A kind of improved structure of ceramic wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206267453U true CN206267453U (en) | 2017-06-20 |
Family
ID=59041547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621305173.5U Expired - Fee Related CN206267453U (en) | 2016-11-30 | 2016-11-30 | A kind of improved structure of ceramic wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206267453U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114016689A (en) * | 2021-10-21 | 2022-02-08 | 中建科技有限公司华东分公司 | Prefabricated UHPC grid decorative exterior wall cladding |
-
2016
- 2016-11-30 CN CN201621305173.5U patent/CN206267453U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114016689A (en) * | 2021-10-21 | 2022-02-08 | 中建科技有限公司华东分公司 | Prefabricated UHPC grid decorative exterior wall cladding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170620 Termination date: 20181130 |