CN206226570U - Camera module and electronic product - Google Patents
Camera module and electronic product Download PDFInfo
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- CN206226570U CN206226570U CN201621173580.5U CN201621173580U CN206226570U CN 206226570 U CN206226570 U CN 206226570U CN 201621173580 U CN201621173580 U CN 201621173580U CN 206226570 U CN206226570 U CN 206226570U
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- group circuit
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Abstract
The utility model is related to a kind of camera module and electronic product.Including mould-group circuit-board, optical pickocff and lens assembly, the modular circuit intralamellar part has shading coating, the optical pickocff and lens assembly are fixedly connected with the mould-group circuit-board, and electrically connected with the mould-group circuit-board, the lens assembly is covered on the optical pickocff, so that the light for injecting lens assembly is radiated on the optical pickocff.A technical problem to be solved in the utility model is how to weaken the light leak of camera module, the reflective interference caused to optical pickocff.One purposes of utility model is applied on mobile phone.
Description
Technical field
The utility model belongs to camera technology field, and specifically, the utility model is related to a kind of camera module and electronics
Product.
Background technology
With the fast development of consumer electronics product in recent years, each accessory in mobile phone, panel computer is all gradually
Improve, update.In miniature video camera module field, with the emergence of new technology, the minisize pick-up head of increasingly high-order is received
To the favor of producer and consumer.In existing minisize pick-up head module, due to module in itself and photosensitive sensor knot
There is light leak or photosensitive situation about being interfered in structure feature, camera module.
In order to tackle the drawbacks described above of camera module, those skilled in the art attempt carrying out the structure of photosensitive sensor
Improve, with disturbing of reducing that sensor is subject to.But, the photosensitive sensor structure after on the one hand improving is relative complex, on cost
Rise, on the other hand, this structure is improved and can not effectively reduce disturbing for other light that sensor is subject to.Because, logical
In normal minisize pick-up head module, light is irradiated in photosensitive sensor through lens assembly, and some light can be through sensing
Device is further irradiated on the circuit board below sensor.Circuit board is generally formed using translucent, yellow base material, with one
Fixed reflective, transmittancy, circuit board can reflect light back into the position of photosensitive sensor, so as to cause photosensitive sensor to receive
To interference light, image defects are caused.
Thus, it is necessary to be improved to camera module, the reflective photosensitive sensing for causing of circuit board is reduced or eliminated
Device is presented defect.
Utility model content
A purpose of the present utility model is the problem for improving camera module image defects.
According to one side of the present utility model, there is provided a kind of camera module, including mould-group circuit-board, optical pickocff
And lens assembly, the modular circuit intralamellar part has shading coating, the optical pickocff and lens assembly and the mould
Group circuit board is fixedly connected, and is electrically connected with the mould-group circuit-board, and the lens assembly is covered on the optical pickocff, with
The light for injecting lens assembly is set to be radiated on the optical pickocff.
Alternatively, there is black-out ink layer in the topsheet surface of the mould-group circuit-board.
Alternatively, the thickness range of the black-out ink layer is 15-25 microns.
Alternatively, the black-out ink layer is formed by black ink.
Alternatively, the thickness range of the shading coating is 11-13 microns.
Alternatively, the shading coating is made up of black material.
Alternatively, the mould-group circuit-board from bottom to the top successively include basalis, reinforcement glue-line, shading coating and
Circuit layer.
Alternatively, the mould-group circuit-board includes black-out ink layer, and the black-out ink layer is arranged on the circuit layer.
Alternatively, the camera module includes lens bracket, and the lens bracket is arranged on the mould-group circuit-board,
The lens bracket is configured for carrying the lens assembly.
The utility model additionally provides a kind of electronic product, and the electronic product includes whole casing body and above-mentioned shooting head mould
Group, the camera module is fixedly installed in the whole casing body.
One of the present utility model has technical effect that, the shading coating in the mould-group circuit-board can weaken module
The reflective function of circuit board, so as to reduce interference of the mould-group circuit-board to optical pickocff.
By referring to the drawings to the detailed description of exemplary embodiment of the present utility model, it is of the present utility model other
Feature and its advantage will be made apparent from.
Brief description of the drawings
The Description of Drawings embodiment of the present utility model of a part for specification is constituted, and is used together with the description
In explanation principle of the present utility model.
Fig. 1 is the side cross sectional views of the camera module that the utility model is provided；
Fig. 2 is the partial enlarged drawing of Fig. 1.
Specific embodiment
Describe various exemplary embodiments of the present utility model in detail now with reference to accompanying drawing.It should be noted that：Unless another
Illustrate outward, the part and the positioned opposite of step, numerical expression and numerical value for otherwise illustrating in these embodiments are not limited
Make scope of the present utility model.
The description only actually at least one exemplary embodiment is illustrative below, never as to this practicality
New and its application or any limitation for using.
May be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but in appropriate situation
Under, the technology and equipment should be considered as a part for specification.
In all examples shown here and discussion, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it need not be further discussed in subsequent accompanying drawing.
The utility model provides a kind of camera module, and this camera module is improved mould-group circuit-board,
The reflective function of mould-group circuit-board is weakened, so as to reduce interference when mould-group circuit-board carries out photosensitive to optical pickocff, is carried
The image quality of camera module high.
As shown in figure 1, the camera module can include mould-group circuit-board 1, optical pickocff 2 and lens assembly 3.Institute
Mould-group circuit-board 1 is stated for carrying the optical pickocff 2 and lens assembly 3, optical pickocff 2 and lens assembly 3 are all set
On the mould-group circuit-board 1.Wherein, the lens assembly 3 covers on the top of the optical pickocff 2, so, from lens group
The light that part 3 is injected can be radiated on the optical pickocff 2, be imaged optical pickocff.Optical pickocff 2 and mirror
Head assembly 3 is electrically connected with mould-group circuit-board 1, is controlled to carry out data exchange and shooting.Especially, the mould-group circuit-board
1 inside has shading coating 11 (coverlay), and the shading coating 11 is used to block, absorbs light, weakens module electricity
Reflective, the light transmission of the entirety of road plate 1.In the presence of the shading coating 11, the light of lens assembly 3 is injected from the external world
Even if being irradiated on the mould-group circuit-board 1, light also will not reflect back into the institute of optical pickocff 2 by mould-group circuit-board 1 substantially
Region.So, reflective interference of the mould-group circuit-board to optical pickocff is effectively weakened, so as to enhance shooting head mould
The image quality of group.In addition, the shading coating also plays a protective role to the structure of mould-group circuit-board.
In order to further weaken the reflective function of the mould-group circuit-board, in a preferred embodiment, the module electricity
Black-out ink layer 12 is also provided with the topsheet surface of road plate, Fig. 2 shows the mould-group circuit-board in this implementation method
1.With the shading coating 11 similarly, the black-out ink layer 12 can weaken reflective, the printing opacity of the entirety of mould-group circuit-board 1
Ability, the light absorption that will be injected.By setting shading coating 11 and black-out ink layer 12 in the mould-group circuit-board 1,
Reflective, the light transmission of mould-group circuit-board can be substantially eliminated, light leak, reflective interference that optical pickocff is subject to is effectively reduced.
More preferably, the black-out ink layer can be formed by black ink, and the absorbing ability of black material is best, due to hiding
The gloss oil layer of ink thinner thickness of itself, easily produces a certain degree of reflective, light transmission.So, using the ink shape of black
The reflective and translucency of its own can further be weakened into black-out ink layer.
Preferably, the thickness range of the black-out ink layer is preferably between 15-25 microns, in one kind of the present utility model
In implementation method, the thickness of black-out ink layer is 20 microns.The thickness of black-out ink layer is maintained at when within above range, can
Preferably ensure the performance of mould-group circuit-board.On the one hand, if thickness is thicker, although can further improve black-out ink layer
Extinction, interception, but the overall thickness of mould-group circuit-board can be increased, and then have influence on the overall volume of camera module；
On the other hand, if thinner thickness, extinction shaded effect is weaker.
For shading coating of the present invention, its thickness range is optionally being implemented preferably between 11-13 microns
In mode, the thickness of shading coating is 12.5 microns.Above-mentioned preferred thickness range is to ensure that shading coating is as thin as possible
In the case of, while ensureing shading, the photo absorption performance of shading coating.The present invention is not to black-out ink layer and shading coating
Thickness range carry out concrete restriction, above-mentioned thickness range is preferred scope.
Preferably, the shading coating can also be made up of black material, or can carry out black dye to molding mass
Color.So, shading, the photo absorption performance of the shading coating can be strengthened.
In addition, as shown in Fig. 2 giving the concrete structure of the mould-group circuit-board 1 in the specific embodiment of the invention.
The mould-group circuit-board 1 can successively include basalis 13, reinforcement glue-line 14, shading coating 11 and circuit from bottom to the top
Layer 15.The basalis 13 is the basal layer of the mould-group circuit-board 1, can have metal material such as stalloy to be made, described
Reinforcement glue-line 14 is used to strengthen the basalis 13, and bonds other laminated portions of mould-group circuit-board 1.The shading coating
11 play a part of extinction, shading, and the circuit layer 15 is played a protective role as transition.Mould-group circuit-board 1 it is main
Circuit is arranged in circuit layer 15, and the circuit layer 15 can be made up of conductor metals such as copper.
Further, above-mentioned black-out ink layer can be arranged on the circuit layer, and on the one hand it play shading, extinction
Effect, on the other hand also act as the effect of isolation shielding, be prevented from that unnecessary circuit connection causes it is short-circuit the problems such as.
Specific breach can be only offered in the black-out ink layer, so that the circuit layer under it can be with optical pickocff, camera lens
Component realizes electrical connection.
Preferably, the camera module can also include lens bracket 4, as shown in figure 1, the lens bracket 4 is fixed
On the mould-group circuit-board 1, it is used to support, carries the lens assembly 3, so that lens assembly 3 can cover on the light
Learn on sensor 2.Further, the lens bracket 4 can be used for controlling the action, institute such as the zoom of lens assembly 3, flexible
State and can include motor in lens bracket 4, lens bracket 4 is also electrically connected with the mould-group circuit-board 1.
The utility model additionally provides a kind of electronic product, and the electronic product can be mobile phone, panel computer etc..The electronics
Product includes whole casing body, wherein being fixedly installed above-mentioned camera module.The camera module by mould-group circuit-board with
The whole machine of electronic product realizes electrical connection, is shot with carrying out data exchange and control.
Although being described in detail to some specific embodiments of the present utility model by example, this area
It is to be understood by the skilled artisans that above example is merely to illustrate, rather than in order to limit scope of the present utility model.This
Field it is to be understood by the skilled artisans that can be in the case where scope and spirit of the present utility model not be departed from, to above example
Modify.Scope of the present utility model is defined by the following claims.
Claims (10)
1. a kind of camera module, it is characterised in that including mould-group circuit-board (1), optical pickocff (2) and lens assembly (3),
There is shading coating (11) inside the mould-group circuit-board (1), the optical pickocff (2) and lens assembly (3) with it is described
Mould-group circuit-board (1) is fixedly connected, and is electrically connected with the mould-group circuit-board (1), and the lens assembly (3) covers on the optics
On sensor (2), so that the light for injecting lens assembly (3) is radiated on the optical pickocff (2).
2. camera module according to claim 1, it is characterised in that in the topsheet surface of the mould-group circuit-board (1)
With black-out ink layer (12).
3. camera module according to claim 2, it is characterised in that the thickness range of the black-out ink layer (12) is
15-25 microns.
4. camera module according to claim 2, it is characterised in that the black-out ink layer (12) is by black ink shape
Into.
5. camera module according to claim 1, it is characterised in that the thickness range of the shading coating is 11-
13 microns.
6. camera module according to claim 1, it is characterised in that the shading coating is made up of black material.
7. camera module according to claim 1, it is characterised in that the mould-group circuit-board (1) is from bottom to the top
Include basalis (13), reinforcement glue-line (14), shading coating and circuit layer (15) successively.
8. camera module according to claim 7, it is characterised in that the mould-group circuit-board (1) is including black out ink
Layer (12), the black-out ink layer (12) is arranged on the circuit layer.
9. camera module according to claim 1, it is characterised in that the camera module includes lens bracket (4),
The lens bracket (4) is arranged on the mould-group circuit-board (1), and the lens bracket (4) is configured for carrying the mirror
Head assembly (3).
10. a kind of electronic product, it is characterised in that including one of any described camera of whole casing body and claim 1-9
Module, the camera module is fixedly installed in the whole casing body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621173580.5U CN206226570U (en) | 2016-10-26 | 2016-10-26 | Camera module and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621173580.5U CN206226570U (en) | 2016-10-26 | 2016-10-26 | Camera module and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206226570U true CN206226570U (en) | 2017-06-06 |
Family
ID=58789584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621173580.5U Active CN206226570U (en) | 2016-10-26 | 2016-10-26 | Camera module and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206226570U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108491761A (en) * | 2018-02-26 | 2018-09-04 | 维沃移动通信有限公司 | The photosensitive identification assembling structure of fingerprint and electronic equipment |
| CN109462936A (en) * | 2018-12-24 | 2019-03-12 | 信利光电股份有限公司 | A kind of pcb board for camera module |
| CN111752071A (en) * | 2019-03-29 | 2020-10-09 | 三营超精密光电(晋城)有限公司 | Lens module and electronic device with same |
| CN114501777A (en) * | 2021-12-24 | 2022-05-13 | 江西合力泰科技有限公司 | Prevent FPC structure and camera module of light leak |
| TWI811032B (en) * | 2022-06-10 | 2023-08-01 | 新煒科技有限公司 | Circuit board assembly, camera module and electronic device therefor |
-
2016
- 2016-10-26 CN CN201621173580.5U patent/CN206226570U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108491761A (en) * | 2018-02-26 | 2018-09-04 | 维沃移动通信有限公司 | The photosensitive identification assembling structure of fingerprint and electronic equipment |
| CN108491761B (en) * | 2018-02-26 | 2019-11-15 | 维沃移动通信有限公司 | The photosensitive identification assembling structure of fingerprint and electronic equipment |
| CN109462936A (en) * | 2018-12-24 | 2019-03-12 | 信利光电股份有限公司 | A kind of pcb board for camera module |
| CN111752071A (en) * | 2019-03-29 | 2020-10-09 | 三营超精密光电(晋城)有限公司 | Lens module and electronic device with same |
| CN114501777A (en) * | 2021-12-24 | 2022-05-13 | 江西合力泰科技有限公司 | Prevent FPC structure and camera module of light leak |
| TWI811032B (en) * | 2022-06-10 | 2023-08-01 | 新煒科技有限公司 | Circuit board assembly, camera module and electronic device therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201109 Address after: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building) Patentee after: GoerTek Optical Technology Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |