CN206196223U - Thermal film - Google Patents
Thermal film Download PDFInfo
- Publication number
- CN206196223U CN206196223U CN201621173312.3U CN201621173312U CN206196223U CN 206196223 U CN206196223 U CN 206196223U CN 201621173312 U CN201621173312 U CN 201621173312U CN 206196223 U CN206196223 U CN 206196223U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation film
- heat
- face
- dissipating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model provides a thermal film, is applicable to and is attachedly producing the component of heat for a moment, and this thermal film contains a heat dissipation layer, should include a varnish basement in the heat dissipation layer to and a plurality of heat dissipation powder that distribute in this varnish basement, and should heat dissipation the layer including a first face that is used for pasting this component, and opposite to this second face of first. Borrow this to make this component still have good heat radiation ability under operating temperature.
Description
Technical field
The utility model is related to a kind of heat dissipation film, more particularly to a kind of heat dissipation film radiated in heat radiation mode.
Background technology
With the fast development of science and technology, the efficiency of electronic installation is substantially improved, but also relatively causes these electronic installations
In running, produced heat is significantly increased, if heat cannot be excluded in time, often cause electronic installation internal temperature raise and
Cause system to stop normal operation, or even damage electronic installation.
A kind of existing fin is to remove heat by the mode of heat radiation.But, the work temperature of general Smartphone
Degree is and contour at 600 degree for example Celsius with the fin that heat radiation mode radiates probably between Celsius 40 to 60 degree
The lower radiating effect of temperature is just obvious, it is difficult in application to Smartphone.
The content of the invention
The purpose of this utility model is that offer is a kind of still good under the operating temperature of general portable electronic equipment
The heat dissipation film of thermal radiation capability.
The utility model heat dissipation film, it is adaptable to be attached to the element for producing heat for a moment, the heat dissipation film includes a heat dissipating layer, should
Heat dissipating layer includes a varnish substrate, and multiple is distributed in the radiating powder in the varnish substrate, and the heat dissipating layer includes that one uses
To paste the first face of the element, and in contrast to second face in first face.
The utility model heat dissipation film, the thickness of the heat dissipating layer is 15 microns.
The utility model heat dissipation film, the thickness of the heat dissipating layer is 25 microns.
The utility model heat dissipation film, the thickness of the heat dissipating layer is 40 microns.
The utility model heat dissipation film, the radiating powder is multiple-wall carbon nanotube.
The utility model heat dissipation film, also comprising the protective layer in second face for being arranged on the heat dissipating layer.
The utility model heat dissipation film, the release layer comprising first face for being arranged on the heat dissipating layer.
The utility model heat dissipation film, the material of the protective layer is PET, polyvinyl chloride, makrolon
One of three.
The utility model heat dissipation film, the protective layer is the second face that the heat dissipating layer is sticked in viscose.
The beneficial effects of the utility model are:The operating temperature of general Smartphone is probably between Celsius 40 to 60 degree
Between, and the heat dissipating layer including the radiating powder is lower with good thermal radiation capability, Neng Gouyou in Celsius 40 to 60 degree
Effect removes used heat produced when Smartphone is operated.
Brief description of the drawings
Fig. 1 is a schematic diagram of an embodiment of the utility model heat dissipation film.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment is described in detail to the utility model.
Refering to Fig. 1, one of this heat sinking film embodiment applies to be attached to the element such as wisdom for producing heat for a moment
On type mobile phone (not shown), the heat dissipation film includes a heat dissipating layer 1, for including one first opposite face 11 and one second face 12
Be arranged on the protective layer 2 in the second face 12 of the heat dissipating layer 1, and one be arranged on the heat dissipating layer 1 the first face 11 release layer 3.
The heat dissipating layer 1 includes a varnish substrate, and multiple is distributed in the radiating powder in the varnish substrate, and described
Radiating powder is coated in the way of scraper for coating on the release layer 3, is formed after then drying.The thickness of the heat dissipating layer 1
Preferably control between 15 to 40 microns.The protective layer 2 by a viscose 4 stick in the heat dissipating layer 1 the second face 12 so that
The heat dissipating layer 1 is not easy to be peeled off from the release layer 3, and in the present embodiment, the material of the protective layer 2 is poly terephthalic acid second two
Ester (PET) but it is not limited, or the pliability of the tool protective effect such as polyvinyl chloride (PVC), makrolon (PC) is saturating
Bright material.The release layer 3 is provided with the first face 11 of the heat dissipating layer 1 in the present embodiment, is not sticked in in the heat dissipating layer 1
Possess certain stickiness during the Smartphone.
After the heat dissipation film is removed into the release layer 3,1.5 × 5cm is directly attached to2Heater on and with 2.736 watts it
The temperature data that power heats gained between 25 degree to 27 degree Celsius of environment temperature is as shown in the table.
As seen from the above table between the degree of Celsius temperature 40 to 60, the heat dissipation film can reduce about 6 to 7 degree left and right.
In the present embodiment, the radiating powder of the heat dissipating layer 1 is powdered multiple-wall carbon nanotube, but in other implementation states
In sample, the radiating powder can also be for example powdered and high thermal conductivity coefficient ceramics or metal material, not with this implementation
The disclosed powdered multiple-wall carbon nanotube of example is limitation.
In sum, the utility model heat dissipation film, including it is described radiating powder the heat dissipating layer 1 in Celsius 40 to 60 spend under
With good thermal radiation capability, used heat produced when Smartphone is operated can be effectively removed, therefore this can be reached really
The purpose of utility model.
The above, embodiment only of the present utility model, when the model that the utility model implementation can not be limited with this
Enclose, i.e., the simple equivalence changes made according to the utility model claims and patent specification content generally and modification, all
Still belong in the range of the utility model patent covers.
Claims (9)
1. a kind of heat dissipation film, it is adaptable to be attached to the element for producing heat for a moment, it is characterised in that the heat dissipation film is included:
One heat dissipating layer, including a varnish substrate, and multiple are distributed in the radiating powder in the varnish substrate, and the heat dissipating layer includes
One the first face for being used to paste the element, and in contrast to second face in first face.
2. heat dissipation film as claimed in claim 1, it is characterised in that:The thickness of the heat dissipating layer is 15 microns.
3. heat dissipation film as claimed in claim 1, it is characterised in that:The thickness of the heat dissipating layer is 25 microns.
4. heat dissipation film as claimed in claim 1, it is characterised in that:The thickness of the heat dissipating layer is 40 microns.
5. heat dissipation film as claimed in claim 1, it is characterised in that:The radiating powder is multiple-wall carbon nanotube.
6. the heat dissipation film as described in claim 1 to 5 any of which claim, it is characterised in that:The heat dissipation film also includes one
It is arranged on the protective layer in the second face of the heat dissipating layer.
7. heat dissipation film as claimed in claim 6, it is characterised in that:The heat dissipation film is also arranged on the first of the heat dissipating layer comprising one
The release layer in face.
8. heat dissipation film as claimed in claim 7, it is characterised in that:The material of the protective layer be PET,
One of polyvinyl chloride, makrolon three.
9. heat dissipation film as claimed in claim 8, it is characterised in that:The protective layer is stick in the heat dissipating layer with viscose second
Face.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621173312.3U CN206196223U (en) | 2016-11-02 | 2016-11-02 | Thermal film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621173312.3U CN206196223U (en) | 2016-11-02 | 2016-11-02 | Thermal film |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206196223U true CN206196223U (en) | 2017-05-24 |
Family
ID=58733289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621173312.3U Expired - Fee Related CN206196223U (en) | 2016-11-02 | 2016-11-02 | Thermal film |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206196223U (en) |
-
2016
- 2016-11-02 CN CN201621173312.3U patent/CN206196223U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106304783B (en) | Thermal conductivity both-sided adhesive graphite flake | |
US20150313041A1 (en) | Graphene dissipation structure | |
KR101796206B1 (en) | thermal dissipation pad | |
CN104918468A (en) | Thermally conductive pad and electronic device | |
JP2020523233A (en) | Coating composition | |
JP3208275U (en) | Curable heat conductive interface material and heat dissipation device | |
JP2009066817A (en) | Thermally-conductive sheet | |
CN203438608U (en) | Enhanced graphite heat-dissipation film | |
CN103906418A (en) | Cooling fin and manufacturing method thereof | |
CN206196223U (en) | Thermal film | |
US10117355B2 (en) | Heat dissipation foil and methods of heat dissipation | |
CN203968557U (en) | High conductive graphite film | |
CN203912425U (en) | Thin type heat dissipating sheet and thermoelectricity device thereof | |
CN203884121U (en) | Radiating fin | |
KR20200089431A (en) | thermal diffusion member and thermal interface member using a plate type nonmetal thermal diffusion filler thermal diffusion filler | |
CN203968561U (en) | A kind of heat abstractor and electronic equipment | |
CN104812205A (en) | Tensile heat-radiating graphite patch | |
CN105611719A (en) | Printed circuit board (PCB) structure with high heat conduction and dissipation | |
TWM511068U (en) | Heat spreading device | |
CN105038626B (en) | Compound two-sided tape | |
CN203590667U (en) | Insulation heat dissipation film | |
CN106808767A (en) | Moistureproof Graphene composite radiating film | |
CN103756588B (en) | For the Pressuresensitive Tape of microelectronic device | |
TWM444701U (en) | Nano carbon ball heat dissipation patch structure | |
CN206085886U (en) | Insulating electromagnetic shield thermal film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170524 Termination date: 20191102 |
|
CF01 | Termination of patent right due to non-payment of annual fee |