CN206186128U

CN206186128U - Diamond wheel hub type fluting wafer scribing sword

Info

Publication number: CN206186128U
Application number: CN201621121129.9U
Authority: CN
Inventors: 刘学明; 冉隆光; 陈昱
Original assignee: Suzhou Sail Science & Technology Co Ltd
Current assignee: Saier Technology (Rudong) Co.,Ltd.
Priority date: 2016-10-14
Filing date: 2016-10-14
Publication date: 2017-05-24
Anticipated expiration: 2026-10-14

Abstract

The utility model discloses a diamond wheel hub type fluting wafer scribing sword, including ring shape blade, its characterized in that the angle intervals such as blade surface of the outer circumference of ring shape blade are equipped with a plurality of flutings, grooved both sides and the transition of bottom circular arc, this transition department R1 angle radian is 0.3~0.6, both sides and the blade surface circular arc of slotting simultaneously passes through, and the R2 angle radian of this transition department is 1.2~1.4. The utility model discloses a heat dissipation and chip removal when the fluting does benefit to the blade cutting can improve cutting speed and cutting quality to extension scribing sword life.

Description

Diamond hub type fluting Wafer Dicing knife

Technical field

The utility model is related to a kind of diamond hub type fluting Wafer Dicing knife.

Background technology

Scribing process is the necessary operation of semiconductor packages, and the effect of the operation is cut with Wafer Dicing hilt full wafer wafer One single chip is cut into, saw blade is typically by diamond（Diamond）Constitute, because cutting integrated circuit needs precision higher, cause Product technology content is high.Known Wafer Dicing knife is annular, and excircle is coherent circular arc cutting edge, with certain cutting edge of a knife or a sword Sharp degree, cutting performance is preferable in theory.

But in actual job, it has been found that there are the following problems for existing above-mentioned coherent circular arc cutting edge：

1）Coherent cutting edge and knife face are unfavorable for radiating, and heat dissipation difference causes saw blade caloric value big, service life reduction；

2）Coherent cutting edge and knife face are unfavorable for cutting chip removal, easily cause talus accumulation and backfill, substantially reduce cutting product Matter.

The content of the invention

The utility model purpose is：A kind of radiating of offer is more preferable, and beneficial to the diamond hub type fluting wafer stroke of chip removal Piece knife, it has preferably cutting quality and longer service life.

The technical solution of the utility model is：A kind of diamond hub type fluting Wafer Dicing knife, including annular blade, It is characterized in that the edge surface of the annular blade excircle is equiangularly spaced to be provided with some flutings, the both sides of the fluting With bottom arc transition, transition position R1 angles radian is 0.3 ~ 0.6；While slot both sides and edge surface arc transition, the mistake The R2 angles radian for crossing place is 1.2 ~ 1.4.

Further, both sides and the bottom arc transition slotted described in the utility model, transition position R1 angles radian is 0.5；While slot both sides and edge surface arc transition, the R2 angles radian of the transition position is 1.32.

Further, groove depth h described in the utility model is the 1/10 ~ 1/5 of annular blade radial width H.

Further, outer diameter D=180 of annular blade described in the utility model ~ 200mm, internal diameter d=140 ~ 160mm, The groove width L is 0.5 ~ 1.5mm.

Further, outer diameter D=190 of annular blade described in the utility model ~ 200mm, internal diameter d=150 ~ 160mm, the groove width L are 0.8 ~ 1.5mm.

Further, the quantity slotted described in the utility model is 16 ~ 32.

The utility model has the advantages that：

1. being set on the excircle cutting edge of annular blade for the utility model novelty is slotted, and these are recessed at increasing Plus while blade sharpness, not only can by saw blade high-speed cutting wafer when the chip that produces timely and effectively discharge, keep away Exempt from chip stick to cutter hub in itself or product to be cut on, can also effectively improve radiating efficiency, increase substantially cutting Speed, effectively solves the problems, such as the cutting efficiency of semiconductor crystal wafer encapsulating products.So that known its has more preferable cutting product Matter and longer service life.

2. the utility model is designed as arc transition by by fluting both sides and circumferential edge discharge surface, while will fluting Bottom is set to semi circular surface, and the semi circular surface is also configured as arc transition with fluting both sides, redesigns suitable R angles, this fluting Shape is more conducive to smooth chip removal and radiating, while being obtained in that optimal sharpness.

Brief description of the drawings

Below in conjunction with the accompanying drawings and embodiment is further described to the utility model：

Fig. 1 is floor map of the present utility model；

Fig. 2 is the floor map of another embodiment of the utility model.

Wherein：1st, blade；2nd, cutting edge；3rd, slot.

Specific embodiment

Embodiment 1：A kind of diamond hub type fluting Wafer Dicing knife of the utility model offer is provided with reference to Fig. 1, It has annular blade 1, the outer diameter D=200mm of the annular blade 1, internal diameter d=160mm, outside the annular blade 1 The surface of cutting edge 2 of circumference is equiangularly spaced to be provided with 16 flutings 3, the both sides of the fluting 3 and bottom arc transition, the transition position R1 angles radian is 0.5；While slot 3 both sides and edge surface arc transition, the R2 angles radian of the transition position is 1.32.It is described to open The width L of groove 3 is 1.5mm, the depth h=2mm of the fluting 3.

Embodiment 2：A kind of diamond hub type fluting Wafer Dicing knife of the utility model offer is provided with reference to Fig. 1, It has annular blade 1, the outer diameter D=185mm of the annular blade 1, internal diameter d=140mm, outside the annular blade 1 The surface of cutting edge 2 of circumference is equiangularly spaced to be provided with 16 flutings 3, the both sides of the fluting 3 and bottom arc transition, the transition position R1 angles radian is 0.4；While slot 3 both sides and edge surface arc transition, the R2 angles radian of the transition position is 1.25.It is described to open The width L of groove 3 is 1mm, the depth h=4.5mm of the fluting 3.

Embodiment 3：A kind of diamond hub type fluting Wafer Dicing knife of the utility model offer is provided with reference to Fig. 1, It has annular blade 1, the outer diameter D=198mm of the annular blade 1, internal diameter d=150mm, outside the annular blade 1 The surface of cutting edge 2 of circumference is equiangularly spaced to be provided with 16 flutings 3, the both sides of the fluting 3 and bottom arc transition, the transition position R1 angles radian is 0.55；While slot 3 both sides and edge surface arc transition, the R2 angles radian of the transition position is 1.35.It is described The 3 width L that slot are 0.8mm, the depth h=3mm of the fluting 3.

Embodiment 4：As shown in Fig. 2 the quantity of fluting 3 is 32 in the present embodiment, it is equiangularly spaced to be opened in annular The surface of excircle cutting edge 2 of blade 1, the present embodiment remaining parameter is with embodiment 1.

Certain above-described embodiment is familiar with this only to illustrate technology design of the present utility model and feature its object is to allow The people of technology will appreciate that content of the present utility model and implements according to this, can not limit protection model of the present utility model with this Enclose.The modification that all Spirit Essences according to the utility model main technical schemes are done, should all cover in guarantor of the present utility model Within the scope of shield.

Claims

1. a kind of diamond hub type fluting Wafer Dicing knife, including annular blade（1）, it is characterised in that the annular knife Body（1）The cutting edge of excircle（2）Surface is equiangularly spaced to be provided with some flutings（3）, the fluting（3）Both sides and bottom circular arc Transition, transition position R1 angles radian is 0.3 ~ 0.6；Slot simultaneously（3）Both sides and edge surface arc transition, the R2 of the transition position Angle radian is 1.2 ~ 1.4.

2. diamond hub type according to claim 1 fluting Wafer Dicing knife, it is characterised in that the fluting（3）Two Side and bottom arc transition, transition position R1 angles radian are 0.5；While slot both sides and edge surface arc transition, the transition The R2 angles radian at place is 1.32.

3. diamond hub type according to claim 1 fluting Wafer Dicing knife, it is characterised in that the fluting（3）Depth H is annular blade（1）The 1/10 ~ 1/5 of radial width H.

4. according to claim 1 or 3 diamond hub type fluting Wafer Dicing knife, it is characterised in that the annular knife Body（1）Outer diameter D=180 ~ 200mm, internal diameter d=140 ~ 160mm, the fluting（3）Width L is 0.5 ~ 1.5mm.

5. diamond hub type according to claim 4 fluting Wafer Dicing knife, it is characterised in that the annular blade （1）Outer diameter D=190 ~ 200mm, internal diameter d=150 ~ 160mm, the fluting（3）Width L is 0.8 ~ 1.5mm.

6. diamond hub type according to claim 1 fluting Wafer Dicing knife, it is characterised in that the fluting（3）Number Measure is 16 ~ 32.