CN206181554U - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
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- CN206181554U CN206181554U CN201620713795.5U CN201620713795U CN206181554U CN 206181554 U CN206181554 U CN 206181554U CN 201620713795 U CN201620713795 U CN 201620713795U CN 206181554 U CN206181554 U CN 206181554U
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- para
- golden finger
- base material
- flexible pcb
- observation port
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Abstract
The utility model discloses a flexible circuit board includes the substrate, and the substrate includes multi -layered board and a plurality of circuit board, and each circuit board includes base plate, line layer and golden finger, and the base plate includes consecutive connecting portion, body, kink and ear portion, is equipped with the cover membrane on the golden finger, is the thickness scope that covers the membrane 0.16 0.25mm. It has increased the cohesion between golden finger and the base to cover the membrane, prevents that the golden finger from droing or is broken. When the golden finger covers the film thickness and is greater than 0.16mm, cover effectually, the pad drops in the time of can avoiding installing, and if the golden finger covers the film thickness and exceedes 0.25mm, then because the too big circuit board that influences of thickness is flexible, cover the film thickness 0.16 0.25mm the within range has increased the cohesion between golden finger and the base plate, it is flexible not influence the circuit board simultaneously, has improved the production yield.
Description
Technical field
This utility model is related to circuit board technology field, more particularly to a kind of flexible PCB.
Background technology
With the progress and development of science and technology, integrated circuit has been widely used in technical field of electronic communication,
And there is larger improvement.It is soft in order to adapt to present touch screen (such as mobile phone, palm PC etc.) toward the development in frivolous direction
Property circuit board arises at the historic moment.
Flexible PCB (Flexible Printed Circuit, FPC) is with polyimides or mylar as base material
Made by a kind of there is height reliability, excellent flexible printed circuit.When but conventional flex circuits plate is produced, easily go out
Cash finger comes off and fractures, and during installation situations such as Pad off, causes production yield low.
Utility model content
Based on this, it is necessary to for the problem that flexible PCB production yield of the prior art is low, there is provided Yi Zhongneng
Improve the flexible PCB of production yield.
A kind of flexible PCB, it is characterised in that include：
Base material, with a surface, the base material includes multi-layered board, and the multi-layered board is cascading；And
Multiple wiring boards, are spaced apart in the surface of the base material, and each wiring board includes substrate, line layer and gold
Finger, the line layer and the golden finger are arranged on the substrate, and the golden finger is electrically connected with the line layer；
The substrate includes connecting portion, body, kink and the ear portion being sequentially connected, and the line layer is by the connection
Portion extends to the ear portion via the body, kink, and the golden finger position is in the ear portion；
Coverlay is provided with the golden finger, the thickness of the coverlay is 0.16~0.25mm.
Flexible PCB of the present utility model includes base material, and base material includes multi-layered board and multiple wiring boards, each circuit
Plate includes substrate, line layer and golden finger, and substrate includes connecting portion, body, kink and the ear portion being sequentially connected, golden finger
Coverlay is provided with, the thickness range of coverlay is 0.16-0.25mm.Coverlay increased the combination between golden finger and base
Power, prevents golden finger from coming off or being broken off.When golden finger covers film thickness more than 0.16mm, coverage effect is good, can avoid
Pad off during installation；And if golden finger covers film thickness more than 0.25mm, affecting circuit board flexible because thickness is excessive, cover
Epiphragma thickness increased the adhesion between golden finger and substrate in the range of 0.16-0.25mm, while not affecting circuit board soft
Property, improve production yield.
Wherein in an embodiment, the thickness of the coverlay is 0.2mm.Verify in production practices, when covering thickness
Spend for 0.2mm when, coverage effect preferably, while not affecting circuit board flexible.
Wherein in an embodiment, at least two para-position observation port are offered on the base material, the para-position observation port are passed through
Wear the multi-layered board of base material, a diameter of 2mm of the para-position observation port.Thus, can pass through in flexible PCB production process
Para-position observation port carry out para-position, it is to avoid occur hole position deviation during two drilling.Monitoring bore dia is bigger, and each laminate material is less susceptible to send out
Raw situation about rotating around observation port, verifies in production practices, during a diameter of 2mm of observation port, can make para-position accurately firmly,
Avoiding hole position from deviateing causes open circuit or short circuit.
Wherein in an embodiment, para-position observation port described at least two respectively positioned at the base material a drift angle at and with
Relative diagonal angle at the drift angle.
Wherein in an embodiment, the quantity of the para-position observation port is 16, the para-position observation port at the drift angle
Quantity is 8, and the quantity of the para-position observation port of the diagonal angle relative with the drift angle is 8.
Wherein in an embodiment, 8 para-position observation port at the drift angle are divided to two rows uniformly to arrange, with the drift angle at phase
To 8 para-position observation port of diagonal angle be divided to two rows uniformly to arrange.
Wherein in an embodiment, the surface of the base material is further opened with steam vent, and the quantity of the steam vent is
Multiple, multiple steam vents are spaced apart on base material on the outside of wiring board to material edge region and wiring board encirclement or half
In the region of encirclement.Set to material edge region and in the region of wiring board encirclement or semi-surrounding on the outside of wiring board on base material
Steam vent, produces liquid medicine infiltration caused by bubble when can improve pressing.
Wherein in an embodiment, a diameter of 1.5mm of the steam vent.As a diameter of 1.5mm of steam vent, exhaust effect
Preferably, can avoid producing liquid medicine infiltration caused by bubble during pressing.
Wherein in an embodiment, Lou stannum hole is offered on the kink, the quantity in the leakage stannum hole is 4~6.
Wherein in an embodiment, the leakage stannum hole with diameter greater than 0.6mm.
Description of the drawings
Fig. 1 is the top view of the flexible PCB in an embodiment；
Fig. 2 is the schematic diagram of wiring board in Fig. 1；
Fig. 3 is the partial enlarged drawing in Fig. 2 at A.
Specific embodiment
For the ease of understanding this utility model, this utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But, this utility model can come in many different forms real
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to public affairs of the present utility model
The understanding for opening content is more thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can directly on another element
Or can also there is element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left side ",
" right side ", " on ", D score and similar statement for illustrative purposes only.
Unless otherwise defined, all of technology used herein and scientific terminology are led with technology of the present utility model is belonged to
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limiting this utility model.Term as used herein " and/or " include
The arbitrary and all of combination of one or more related Listed Items.
Fig. 1 is referred to, is the flexible PCB 10 in an embodiment.The flexible PCB 10 includes base material 100 and many
Individual wiring board 200.The flexible PCB 10 can apply in the electronic products such as mobile phone.
The material of base material 100 is generally polyimides or mylar, with stronger pliability and bending property.Base material
100 is generally rectangular shaped, with a surface.Base material 100 includes multi-layered board, and multi-layered board is cascading.
Multiple wiring boards 200 are spaced apart on the surface of base material 100.Specifically, can set on the surface of base material 100
Put 6 wiring boards 200.Certainly, in other embodiments, it is also possible to setting 4,5 or more according to actual needs
Wiring board 200.
See also Fig. 2 and Fig. 3, specific to present embodiment in, each wiring board 200 include substrate 210, line layer
220 and golden finger 230.Line layer 220 and golden finger 230 are all arranged on substrate 210, and golden finger 230 is electric with line layer 220
Connection.Specifically, line layer 220 and golden finger 230 can be formed on substrate 210 by way of etching or printing.
Substrate 210 includes connecting portion 211, body 212, kink 213 and the ear portion 214 being sequentially connected, line layer 220
Ear portion 214 is extended to via body 212, kink 213 by connecting portion 211, golden finger 230 is located in ear portion 214.
Golden finger 230 is provided with coverlay 240, and the thickness range of coverlay 240 is 0.16-0.25mm.Coverlay 240 increases
Add the adhesion between golden finger 230 and substrate 210, prevent golden finger 230 from coming off or being broken off.Test in production practices
Card, when the thickness of golden finger coverlay 240 is more than 0.16mm, coverage effect is good, Pad off when can avoid installing；And if golden handss
Refer to that the thickness of coverlay 240 more than 0.25mm, then affects circuit board flexible because thickness is excessive.Wherein, when the thickness of coverlay 240 is
During 0.2mm, coverage effect is best, while not affecting circuit board flexible.The thickness of coverlay 240 in the range of 0.16-0.25mm, especially
It is thickness when being 0.2mm, increased the adhesion between golden finger 230 and substrate 210, while do not affect circuit board flexible,
Improve production yield.
In the present embodiment, at least two para-position observation port 110, at least two para-position observation port are offered on base material 100
110 are located at respectively at a drift angle of base material 100 and the diagonal angle relative with the drift angle, and para-position observation port 110 run through base material 100
Multi-layered board.Thus, para-position can be carried out by para-position observation port 110 in flexible PCB production process, it is to avoid two drillings
When occur hole position deviation.
In the present embodiment, the quantity of para-position observation port 110 is 16, and the quantity of the para-position observation port 110 at drift angle is 8
Individual, the quantity of the para-position observation port 110 of the diagonal angle relative with the drift angle is 8.Certainly, in other embodiments,
The quantity of para-position observation port 110 can also be other quantity, such as 10,12 etc..
8 para-position observation port, 110 point of two row at drift angle uniformly arranges, and 8 of the diagonal angle relative with the drift angle are right
Position 110 point of two row of observation port uniformly arrange.A diameter of 2mm of para-position observation port 110.The diameter of observation port 110 is bigger, each laminate material
The situation for occurring to be rotated around observation port 110 is less susceptible to, is verified in production practices, during a diameter of 2mm of observation port 110, can
So that para-position is accurately firm, it is to avoid hole position deviates causes open circuit or short circuit.
The surface of base material 100 is further opened with steam vent 120, because of medicine that bubble causes when steam vent 120 can improve pressing
Water penetration phenomenon.The quantity of steam vent 120 is multiple, and multiple steam vents 120 are spaced apart on base material 100.Steam vent 120
With diameter greater than or equal to 1mm, verify in production practices, as a diameter of 1.5mm of steam vent 120, exhaust effect preferably, can
With the liquid medicine phenomenon of osmosis for avoiding causing because of bubble.
Specific to Lou stannum hole 213a in present embodiment, is further opened with kink 213, the quantity for leaking stannum hole 213a can be with
For 4~6.The purpose for opening up Lou stannum hole 213a is to improve ground connection weld strength.The diameter range of leakage stannum hole 213a is more than
0.6mm.Larger leakage stannum hole can ensure that weld strength, Jing production practices checking, when leakage stannum hole 213a is with diameter greater than 0.6mm
When can ensure that weld strength.
Flexible PCB of the present utility model includes base material, and base material includes multi-layered board and multiple wiring boards, each circuit
Plate includes substrate, line layer and golden finger, and substrate includes connecting portion, body, kink and the ear portion being sequentially connected, golden finger
Coverlay is provided with, the thickness range of coverlay is 0.16-0.25mm.Coverlay increased the combination between golden finger and base
Power, prevents golden finger from coming off or being broken off.When golden finger covers film thickness more than 0.16mm, coverage effect is good, can avoid
Pad off during installation；And if golden finger covers film thickness more than 0.25mm, affecting circuit board flexible because thickness is excessive, cover
Epiphragma thickness increased the adhesion between golden finger and base in the range of 0.16-0.25mm, while not affecting circuit board soft
Property, improve production yield.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more concrete and detailed,
But therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the common skill of this area
For art personnel, without departing from the concept of the premise utility, some deformations and improvement can also be made, these are belonged to
Protection domain of the present utility model.Therefore, the protection domain of this utility model patent should be defined by claims.
Claims (10)
1. a kind of flexible PCB, it is characterised in that include：
Base material, with a surface, the base material includes multi-layered board, and the multi-layered board is cascading；And
Multiple wiring boards, are spaced apart in the surface of the base material, and each wiring board includes substrate, line layer and golden handss
Refer to, the line layer and the golden finger are arranged on the substrate, and the golden finger is electrically connected with the line layer；
The substrate includes connecting portion, body, kink and the ear portion being sequentially connected, and the line layer is by the connecting portion Jing
The ear portion is extended to by the body, kink, the golden finger position is in the ear portion；
Coverlay is provided with the golden finger, the thickness of the coverlay is 0.16~0.25mm.
2. flexible PCB according to claim 1, it is characterised in that the thickness of the coverlay is 0.2mm.
3. flexible PCB according to claim 2, it is characterised in that at least two para-positions prison is offered on the base material
Window, the para-position observation port run through the multi-layered board of base material, a diameter of 2mm of the para-position observation port.
4. flexible PCB according to claim 3, it is characterised in that para-position observation port are located at respectively described at least two
At one drift angle of the base material and the diagonal angle relative with the drift angle.
5. flexible PCB according to claim 4, it is characterised in that the quantity of the para-position observation port is 16, institute
The quantity for stating para-position observation port at drift angle is 8, and the quantity of the para-position observation port of the diagonal angle relative with the drift angle is 8
It is individual.
6. flexible PCB according to claim 5, it is characterised in that 8 para-position observation port at the drift angle are divided to two
The uniform arrangement of row, 8 para-position observation port of the diagonal angle relative with the drift angle are divided to two rows uniformly to arrange.
7. flexible PCB according to claim 1, it is characterised in that the surface of the base material is further opened with aerofluxuss
Hole, the quantity of the steam vent is multiple, and multiple steam vents are spaced apart on base material on the outside of wiring board to material edge
In region and in the region of wiring board encirclement or semi-surrounding.
8. flexible PCB according to claim 7, it is characterised in that a diameter of 1.5mm of the steam vent.
9. flexible PCB according to claim 1, it is characterised in that Lou stannum hole is offered on the kink, it is described
The quantity in leakage stannum hole is 4~6.
10. flexible PCB according to claim 9, it is characterised in that the leakage stannum hole with diameter greater than 0.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620713795.5U CN206181554U (en) | 2016-07-07 | 2016-07-07 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620713795.5U CN206181554U (en) | 2016-07-07 | 2016-07-07 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206181554U true CN206181554U (en) | 2017-05-17 |
Family
ID=58673805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620713795.5U Active CN206181554U (en) | 2016-07-07 | 2016-07-07 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206181554U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105979701A (en) * | 2016-07-07 | 2016-09-28 | 上达电子（深圳）股份有限公司 | Flexible printed circuit |
-
2016
- 2016-07-07 CN CN201620713795.5U patent/CN206181554U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105979701A (en) * | 2016-07-07 | 2016-09-28 | 上达电子（深圳）股份有限公司 | Flexible printed circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220112 Address after: 435003 No. 91, Sike Avenue East, Jinshan street, Huangshi economic and Technological Development Zone, Huangshi City, Hubei Province Patentee after: LEADER-TECH (HUANGSHI) Inc. Address before: 518000 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. |