CN206181010U - Miniaturized fragment of brick formula binary channels TR subassembly of X wave band - Google Patents
Miniaturized fragment of brick formula binary channels TR subassembly of X wave band Download PDFInfo
- Publication number
- CN206181010U CN206181010U CN201621301206.9U CN201621301206U CN206181010U CN 206181010 U CN206181010 U CN 206181010U CN 201621301206 U CN201621301206 U CN 201621301206U CN 206181010 U CN206181010 U CN 206181010U
- Authority
- CN
- China
- Prior art keywords
- partition wall
- box body
- stacking
- fragment
- smp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Aerials With Secondary Devices (AREA)
Abstract
The utility model relates to a miniaturized fragment of brick formula binary channels TR subassembly of X wave band, including the box body, set up antenna mouth SMP in one side of box body and connect, set up power control port and set mouthful SMP in the opposite side of box body and connect a SMP and connect. The box body is connected by bottom plate, boss, first partition wall and second partition wall and is formed integratively, offers interior cavity in the boss, and wherein first partition wall and second partition wall are including also in the cavity. In inner chamber indoor location LTCC base plate, still splice the HTCC base plate in the upper portion of first partition wall and second partition wall. The utility model has the advantages of small in size, light in weight, high, the good reliability of integrated level, binary channels receiving and dispatching timesharing work, each passageway all possess perfect numerical control move attenuate mutually, standby function, its transmission output range is high, the receiving gain is big, noise coefficient is little, at the exportable transmit power who exceedes 10W of X wave band, be greater than 25dB's receive channel gain. Suitable extensive batch production.
Description
Technical field
This utility model is related to radar equipment field, is especially for the X-band miniaturization of Connectors for Active Phased Array Radar
Fragment of brick formula dual pathways TR component.
Background technology
Along with the fast development in the fields such as satellite, electronic countermeasure, radar and precise guidance, TR components, subsystem it is little
Type and integrated manufacture claim more and more higher.At present the design difficulty of existing TR components be volume further reduce, weight
Mitigation, functional integration raising etc..For transmission channel storage capacitor volume is excessive, the constraint of large volume of X-band circulator
The overall volume of component, needs badly and seeks that TR assembly volumes are less, weight lighter, integrated level higher and higher realization means.
Utility model content
The applicant is directed to above-mentioned existing issue, has carried out Improvement, there is provided a kind of X-band miniaturization fragment of brick formula bilateral
Road TR components, its achievable dual pathways receives and dispatches time-sharing work, and each passage is provided with complete numerical control phase shift, numerical control attenuation, standby
Etc. function.
The technical scheme that this utility model is adopted is as follows：
A kind of X-band miniaturization fragment of brick formula dual pathways TR component, including box body, in the side of the box body antenna opening is arranged
SMP joints, arrange power supply port and collection heal up SMP joints in the opposite side of the box body, and the box body is by base plate, convex
Platform, the first partition wall and the second partition wall are connected to form one, and open up inner cavity chamber in the boss, first partition wall and second every
Wall may be contained within the inner chamber room；Ltcc substrate is also set up in the inner chamber room, the ltcc substrate is by left half of first
Plant stacking and right half of second stacked combination forms two kinds of stepped constructions；In the top of first partition wall and the second partition wall also
It is glued HTCC substrates.
Its further technical scheme is：
It is described it is left it is half of the first be laminated for 18 layers of medium substrate, be laminated for 11 layers of medium base described right half of second
Plate；
The inside of left half of the first stacking and right half of second stacking is adopted for transmitting in the ltcc substrate
The micro-strip of radiofrequency signal turns banding, turns the structure of micro-strip to banding again；
The HTCC substrates are glued by conducting resinl and the first partition wall and the second partition wall.
The beneficial effects of the utility model are as follows：
This utility model simple structure, easy to use, it has compact, the high, good reliability of lightweight, integrated level etc.
Advantage, dual pathways transmitting-receiving time-sharing work, each passage is provided with perfect numerical control phase shift decay, idle function, its transmitting output width
Degree is high, and reception gain is big, and noise coefficient is little, in the exportable transmission power more than 10W of X-band, the receiving channel more than 25dB
Gain.Using the setting of ltcc substrate and HTCC substrates and by micro-strip to banding, the radio frequency transient mode reality of banding to micro-strip
Show the higher dual pathways TR component of integrated level, and Jing small lots are produced as a trial, reach development target.It is suitable to turn extensive batch life
Produce.
Description of the drawings
Fig. 1 is the structural representation of box body in this utility model.
Fig. 2 is the right view of Fig. 1.
Fig. 3 is the left view of Fig. 1.
Fig. 4 is the structural representation of tray interior in this utility model.
Fig. 5 is the structural representation of assembling ltcc substrate in box body in this utility model.
Fig. 6 is the structural representation of assembling HTCC substrates in box body in this utility model.
Wherein：1st, box body；101st, boss；102nd, inner cavity chamber；103rd, base plate；104th, antenna opening SMP joint；105th, power supply control
Port processed；106th, the SMP joint SMP joints that heal up are collected；107th, the first partition wall；108th, the second partition wall；2nd, left half of the first stacking；
3rd, right half of second stacking；4th, HTCC substrates.
Specific embodiment
Specific embodiment of the present utility model is illustrated below.
As shown in figure 1, the X-band miniaturization fragment of brick formula dual pathways TR component of the present embodiment, including box body 1, in box body 1
Side arranges antenna opening SMP joint 104, arranges power supply port 105 in the opposite side of box body 1 and collects the SMP joints that heal up
106, box body 1 is connected to form one by base plate 103, boss 101, the first partition wall 107 and the second partition wall 108, is opened in boss 101
If inner cavity chamber 102, the first partition wall 107 and the second partition wall 108 may be contained within inner cavity chamber 102；Also set up in inner cavity chamber 102
Ltcc substrate, ltcc substrate forms two kinds of stackings by the stacking 2 and right half of second stacking 3 combination of left half of the present embodiment
Structure；Also it is glued HTCC substrates 4 in the top of the first partition wall 107 and the second partition wall 108.Left half of the first stacking 2 is 18 layers
Medium substrate, right half of second stacking 3 is 11 layers of medium substrate.Left half of the first stacking 2 and right one side of something in ltcc substrate
The inside of second stacking 3 is turned banding, is turned the structure of micro-strip to banding again using the micro-strip for transmitting radio frequency signal.It is above-mentioned
HTCC substrates 4 are glued by conducting resinl with the first partition wall 107 and the second partition wall 108.
HTCC substrates 4 have the advantages that good heat dissipation, mechanical strength are strong in this utility model, and it passes through conducting resinl and is glued to box
Good earth and radiating are formed on the first partition wall 107 and the second partition wall 108 in body 1.This utility model is inside ltcc substrate
The one-to-two decile of an X-band micro-strip-banding-micro-strip is devised in mid5~mid11 layers using electromagnetic simulation software HFSS
Power splitter, other components and parts of layout on top layer.
This utility model simple structure, easy to use, it has the advantages that compact, lightweight, reliability are high, bilateral
Time-sharing work is received and dispatched in road, and each passage is provided with perfect numerical control phase shift decay, idle function, and its transmitting output amplitude is high, receives
Gain is big, and noise coefficient is little, using the setting of ltcc substrate and HTCC substrates and by micro-strip to banding, banding penetrating to micro-strip
Frequency transient mode realizes the higher dual pathways TR component of integrated level, suitable large-scale mass production.
It, to explanation of the present utility model, is not the restriction to utility model that above description is, what this utility model was limited
Referring to claim, in the case of without prejudice to basic structure of the present utility model, this utility model can make any shape to scope
The modification of formula.
Claims (4)
1. a kind of X-band miniaturization fragment of brick formula dual pathways TR component, including box body (1), in the side of the box body (1) day is arranged
Line mouth SMP joints (104), arranges power supply port (105) and collects the SMP joints that heal up in the opposite side of the box body (1)
(106), it is characterised in that：The box body (1) is by base plate (103), boss (101), the first partition wall (107) and the second partition wall
(108) be connected to form one, open up inner cavity chamber (102) in the boss (101), first partition wall (107) and second every
Wall (108) may be contained within the inner cavity chamber (102)；Ltcc substrate, the LTCC bases are also set up in the inner cavity chamber (102)
Plate forms two kinds of stepped constructions by left half of the first stacking (2) and right half of second stacking (3) combination；In described first every
Also it is glued HTCC substrates (4) in the top of wall (107) and the second partition wall (108).
2. X-band miniaturization fragment of brick formula dual pathways TR component as claimed in claim 1, it is characterised in that：Described left half of
One kind stacking (2) is 18 layers of medium substrate, and right half of second stacking (3) is 11 layers of medium substrate.
3. X-band miniaturization fragment of brick formula dual pathways TR component as claimed in claim 1, it is characterised in that：The ltcc substrate
The inside of middle left half of the first stacking (2) and right half of second stacking (3) is using the micro-strip for transmitting radio frequency signal
Turn banding, turn the structure of micro-strip to banding again.
4. X-band miniaturization fragment of brick formula dual pathways TR component as claimed in claim 1, it is characterised in that：The HTCC substrates
(4) it is glued by conducting resinl and the first partition wall (107) and the second partition wall (108).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621301206.9U CN206181010U (en) | 2016-11-30 | 2016-11-30 | Miniaturized fragment of brick formula binary channels TR subassembly of X wave band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621301206.9U CN206181010U (en) | 2016-11-30 | 2016-11-30 | Miniaturized fragment of brick formula binary channels TR subassembly of X wave band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206181010U true CN206181010U (en) | 2017-05-17 |
Family
ID=60242256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621301206.9U Active CN206181010U (en) | 2016-11-30 | 2016-11-30 | Miniaturized fragment of brick formula binary channels TR subassembly of X wave band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206181010U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117674879A (en) * | 2024-01-31 | 2024-03-08 | 成都华兴大地科技有限公司 | Brick type TR module |
-
2016
- 2016-11-30 CN CN201621301206.9U patent/CN206181010U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117674879A (en) * | 2024-01-31 | 2024-03-08 | 成都华兴大地科技有限公司 | Brick type TR module |
| CN117674879B (en) * | 2024-01-31 | 2024-04-02 | 成都华兴大地科技有限公司 | Brick type TR module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112994760B (en) | Multi-beam tile type TR (transmitter-receiver) component with high integration degree | |
| CN105655725B (en) | A kind of extendible chip Active Arrays of two dimension | |
| CN107565225B (en) | Array antenna structure and multilayer via hole structure | |
| CN104332413A (en) | 3D assembling method for integrally integrating chips of T/R assembly | |
| US8988299B2 (en) | Integrated antenna for RFIC package applications | |
| CN113451732B (en) | Novel airtight tile formula phased array antenna | |
| CN103515682A (en) | Micro-strip-to-waveguide vertical transition structure achieved through multi-layer step type substrate integration waveguide | |
| CN206181010U (en) | Miniaturized fragment of brick formula binary channels TR subassembly of X wave band | |
| CN111180899A (en) | Micro-system-based light and thin high-density integrated antenna array structure | |
| CN204189798U (en) | A kind of novel TR assembly based on LTCC | |
| CN106102350B (en) | A kind of packaging method of TR component | |
| CN204696114U (en) | A kind of dual chamber three-dimension packaging structure | |
| CN108091969B (en) | High-isolation microwave transceiving assembly | |
| CN115513153A (en) | High-power multichannel multi-chip 3D (three-dimensional) packaging structure | |
| CN206673954U (en) | Multi-chip RF receiving/transmission device based on Digital Microwave composite base plate technology | |
| CN206533355U (en) | Millimeter wave 4 closes 1 multi-functional transmitting chip | |
| CN113098551B (en) | HTCC three-dimensional receiving and transmitting assembly | |
| CN102201607A (en) | Microstrip and strip line transformation based on low temperature co-fired ceramic (LTCC) technology | |
| CN113809053A (en) | TSV-based compact power divider utilizing parallel RC | |
| CN205123724U (en) | Channel subassembly | |
| CN105827259A (en) | High-perform miniature C waveband altimeter TR component | |
| CN201540943U (en) | Small-size isolator for GSM communication system | |
| CN105870558A (en) | W-wave-band circulator | |
| CN115714608A (en) | Multichannel bottom feed type T/R assembly | |
| CN205666821U (en) | Miniaturized C wave band altimeter TR subassembly of high performance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |