CN206179854U - Liquid submergence formula chip radiator - Google Patents
Liquid submergence formula chip radiator Download PDFInfo
- Publication number
- CN206179854U CN206179854U CN201621293059.5U CN201621293059U CN206179854U CN 206179854 U CN206179854 U CN 206179854U CN 201621293059 U CN201621293059 U CN 201621293059U CN 206179854 U CN206179854 U CN 206179854U
- Authority
- CN
- China
- Prior art keywords
- chip
- oil trap
- housing
- liquid working
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Abstract
The utility model discloses a liquid submergence formula chip radiator, include the casing attached to the chip top, casing inside has upper end open -ended oil trap, and the casing bottom is provided with a plurality of circulation grooves, and the circulation groove passes through the opening intercommunication with the oil trap, the lower side opening of circulation groove, under shed and chip contact, a plurality of overflow launders were offered to the side casing week, and the interior port and oil trap intercommunication, the outer port of overflow launder lead to the casing outside. The utility model discloses comparing with directly spraying liquid working medium to chip surface's cooling method, assembling liquid working medium through the oil trap, prolonged the contact time of liquid working medium with the chip on the one hand relatively via circulation groove and chip contact at last, be favorable to the chip surface samming, abundant heat dissipation improves the difference in temperature of chip business turn over oil to improve the availability factor of liquid working medium, on the other hand liquid working medium is stored a period in the oil trap, can carry out the part and preheat, avoids the influence of temperature rapid change to the chip.
Description
Technical field
This utility model is related to the cooling field of electronic device, more particularly to a kind of liquid submersion chip cooling
Device.
Background technology
Miniaturization, microminaturization with electronic devices and components, the highly integrated and micro-group dress of integrated circuit, the heat of components and parts
Current density is improved constantly, and thermal design faces a severe challenge.The high power devices such as electron power module, electronic chip are operationally produced
The substantial amounts of heat of life, it is necessary to which cooled device is taken away.The electronic chip radiator for using at present is suffered from the drawback that:
In air cooling, electronic chip radiator adopts metal material moulding, and by contacting with electronic chip heat conduction is carried out,
Then using the cooling of the forced air convections such as fan, fan power consumption is not only increased, and noise is improved, and affects great-power electronic
The use environment of device.Cooled down using air, it is desirable to which ambient temperature is reduced to 25 DEG C or so and just can guarantee that chip surface temperature exists
In optimum range, air-conditioning power consumption is big, and energy-saving effect is poor.Placement environmental requirement additionally, due to electronic device is dustless, using fan
Cooling is forced to require air cleanliness higher.
Liquid working substance is time of contact short with chip in liquid spraying cooling, and heat absorption is few, and liquid working substance service efficiency is low.
For disadvantage mentioned above, it is badly in need of a kind of radiator of the use of invention in liquid spraying cooling to extend liquid working substance
With the time of contact of chip, fully radiating, improve chip and enter the fuel-displaced temperature difference, so as to improve the service efficiency of liquid working substance.
Utility model content
The purpose of this utility model is to provide a kind of liquid submersion chip radiator, in solving existing liquid spraying cooling
Liquid working substance is time of contact short with chip, and heat absorption is few, the low problem of liquid working substance service efficiency.
To solve above-mentioned technical problem, this utility model is adopted the following technical scheme that:
A kind of liquid submersion chip radiator of this utility model, including the housing being attached to above chip;The housing
Oil trap of the inside with upper end open, the housing bottom is provided with multiple circulation grooves, the circulation groove and the oil trap
Connected by opening;The open lower side of the circulation groove, under shed is contacted with chip;The housing the week side of boss offers multiple overflowing
Chute, the inner port of the overflow launder and the oil sump, external port leads to the hull outside.
Further, the profile of the oil trap be shaped as it is bowl-shape.
Further, the profile of the oil trap is shaped as cylinder, square cylinder or polygon cylinder.
Further, the opening is vertical through hole, and upper end connects with the bottom of the oil trap, lower end with it is described
Circulation groove is connected.
Further, multiple circulation grooves are circumferentially arranged, and multiple circulation grooves have a termination to converge to centre
Connect with the opening.
Further, multiple overflow launder levels are circumferentially arranged.
Further, the overflow launder is located at the side wall middle part of the housing.
Further, the outline of the housing is shaped as cylindric, square cylinder or polygon cylinder.
Compared with prior art, Advantageous Effects of the present utility model are as follows:
This utility model compared with liquid working substance to be directly sprayed to the type of cooling of chip surface, by oil trap by liquid
Body working medium is converged, and is finally contacted with chip via circulation groove, on the one hand the relative time of contact for extending liquid working substance and chip,
Be conducive to chip surface samming, fully radiating, improve chip and enter the fuel-displaced temperature difference, so as to improve the service efficiency of liquid working substance;
Another aspect liquid working substance stores a period of time in oil trap, can carry out part preheating, it is to avoid temperature drastically changes to core
The impact of piece.
Description of the drawings
Below in conjunction with the accompanying drawings the utility model is described in further detail for explanation.
Fig. 1 is this utility model liquid submersion chip radiator sectional view;
Fig. 2 is overflow groove structure schematic diagram;
Fig. 3 is circulation slot structure schematic diagram;
Description of reference numerals:1st, housing;2nd, oil trap;3rd, overflow launder;4th, opening;5th, circulation groove;6th, chip.
Specific embodiment
As Figure 1-3, a kind of one of which specific embodiment of liquid submersion chip radiator, including being attached to core
The housing 1 of the top of piece 6, being shaped as the outline of housing is cylindric, square cylinder or polygon cylinder, in this specific embodiment
Being shaped as the outline of housing is cylindric, and the oil trap 2 of upper end open, the profile of oil trap 2 are offered inside the housing 1
Shape can be bowl-shape, cylinder, square cylinder or polygon cylinder, the oil trap 2 opened up in housing 1 in this specific embodiment
It is shaped as bowl-shape, for collecting the liquid working substance of top drippage, the upper end open of bowl-shape oil trap 2 is big, and smooth-sided is transitted to
Bottom.Oil-collecting trench bottom offers vertical opening 4, and the lower end of opening 4 is communicated with 12 circulation grooves, 5,12 circulations
Circumferentially shape dissipates the level of groove 5 to surrounding, and the open lower side of the circulation groove 5, under shed is contacted with chip 6, in oil trap 2
Cooling working medium circulates in groove 5 via opening 4, so as to contact with chip 6, by this kind of heat spreader structures liquid working substance is made
With the directly contact of chip 6 and time enough can be kept, liquid working substance fully exchanges heat with chip 6, improves radiator turnover
The temperature difference of liquid working substance, so as to improve the utilization ratio of liquid working substance.
In addition to above-mentioned technical characteristic, the side wall centre position the week side of boss of the housing 1 offers multiple overflow launders 3, overflow launder 3
By the side wall ring face of housing 1, uniformly arrangement is full, and the inner port of each overflow launder 3 is connected with the oil trap 2, and external port leads to institute
The outside of housing 1 is stated, oil trap 2 is connected with the outside of housing 1, make the internal liquid working medium of oil trap 2 converge to the height of overflow launder 3
When, liquid working substance flows out from overflow launder 3.
The radiator of liquid submersion chip 6 of the present utility model can adopt the material of light weight, low cost to make, and existing
Some metal alloy heat-sink devices are compared, and cost performance is high;The use of server internal fan is avoided simultaneously, power consumption is reduced, and reduction is made an uproar
Sound.
When chip 6 is started working, outside spray system is opened, and the liquid working substance of upper end spray passes through bowl-shape oil trap 2
The bottom of housing 1 is converged to so as to liquid level is constantly raised;When liquid level is increased to 3 height of overflow launder, liquid working substance flows from overflow launder 3
Out keep liquid level;Simultaneously liquid working substance enters liquid flow groove 5 by the liquid flow through hole 4 of bottom, and by liquid
The bottom opening of body circulation groove 5, with the following directly contact of chip 6, the heat that heater element is produced is taken to and is dissipated at a distance, then
The liquid working substance of cooling is sprayed again on radiator, said process is circulated.
Embodiment described above is only that optimal way of the present utility model is described, not to of the present utility model
Scope is defined, and on the premise of without departing from this utility model design spirit, those of ordinary skill in the art are new to this practicality
Various modifications and improvement that the technical scheme of type is made, all should fall into the protection domain of this utility model claims determination
It is interior.
Claims (8)
1. a kind of liquid submersion chip radiator, it is characterised in that:Including the housing (1) being attached to above chip (6);It is described
Oil trap (2) with upper end open inside housing (1), housing (1) bottom is provided with multiple circulation grooves (5), the stream
Groove (5) is connected with the oil trap (2) by opening (4);The open lower side of the circulation groove (5), under shed and chip
(6) contact;Housing (1) the week side of boss offers multiple overflow launders (3), the inner port and the oil trap of the overflow launder (3)
(2) connect, external port leads to the housing (1) outside.
2. liquid submersion chip radiator according to claim 1, it is characterised in that:The profile of the oil trap (2)
Be shaped as it is bowl-shape.
3. liquid submersion chip radiator according to claim 1, it is characterised in that:The profile of the oil trap (2)
Be shaped as cylinder, square cylinder or polygon cylinder.
4. the liquid submersion chip radiator according to Claims 2 or 3, it is characterised in that:The opening (4) is perpendicular
Clear opening, upper end connects with the bottom of the oil trap (2), and lower end connects with the circulation groove (5).
5. liquid submersion chip radiator according to claim 4, it is characterised in that:Multiple circulation grooves (5) are in
Circumferential arrangement, multiple circulation grooves (5) have a termination to converge to middle to connect with the opening (4).
6. liquid submersion chip radiator according to claim 1, it is characterised in that:The multiple overflow launder (3) water
It is flat circumferentially to arrange.
7. liquid submersion chip radiator according to claim 6, it is characterised in that:The overflow launder (3) is positioned at institute
State the side wall middle part of housing (1).
8. liquid submersion chip radiator according to claim 1, it is characterised in that:The outline of the housing (1)
Be shaped as cylindric, square cylinder or polygon cylinder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621293059.5U CN206179854U (en) | 2016-11-29 | 2016-11-29 | Liquid submergence formula chip radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621293059.5U CN206179854U (en) | 2016-11-29 | 2016-11-29 | Liquid submergence formula chip radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206179854U true CN206179854U (en) | 2017-05-17 |
Family
ID=60241814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621293059.5U Withdrawn - After Issue CN206179854U (en) | 2016-11-29 | 2016-11-29 | Liquid submergence formula chip radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206179854U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106409791A (en) * | 2016-11-29 | 2017-02-15 | 广东合新材料研究院有限公司 | Liquid submerged chip radiator |
-
2016
- 2016-11-29 CN CN201621293059.5U patent/CN206179854U/en not_active Withdrawn - After Issue
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106409791A (en) * | 2016-11-29 | 2017-02-15 | 广东合新材料研究院有限公司 | Liquid submerged chip radiator |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20170517 Effective date of abandoning: 20200522 |
|
AV01 | Patent right actively abandoned |