CN206149590U - Structure of antarafacial circuit is realized to FPC single face copper foil - Google Patents
Structure of antarafacial circuit is realized to FPC single face copper foil Download PDFInfo
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- CN206149590U CN206149590U CN201621229906.1U CN201621229906U CN206149590U CN 206149590 U CN206149590 U CN 206149590U CN 201621229906 U CN201621229906 U CN 201621229906U CN 206149590 U CN206149590 U CN 206149590U
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- copper foil
- top layer
- circuit
- substrate
- antarafacial
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Abstract
The utility model provides a structure of antarafacial circuit is realized to FPC single face copper foil, its characterized in that: the lower surface of bottom PI's upper surface bonding bottom glue film and become the bottom substrate, the upper surface bonding copper foil back of bottom glue film, the bottom substrate is equipped with the opening corresponding to the position of copper foil back circuit, the upper surface of top layer PI's lower surface bonding top layer glue film and become the top layer substrate, the lower surface bonding copper foil of top layer glue film openly, the top layer substrate is equipped with the opening corresponding to the position of copper foil front circuit. Top layer PI's upper surface bonds corresponding to the open -ended position of bottom substrate has reinforcement PI. The utility model discloses a front and the back of single face copper foil all are equipped with circuit and corresponding substrate opening, can realize the purpose of two terminal line UNICOM, can subtract heavy copper facing hole chemical industry preface, greatly reduced cost and improvement production efficiency.
Description
Technical field
This utility model belongs to a kind of wiring board, more particularly to a kind of flexible circuitry plate structure.
Background technology
Modern electronic product mainboard and screen or miscellaneous part need to carry out circuit by FPC to be connected, and some mainboards with
Screen or miscellaneous part, due to circuit or reasons in structure, it is impossible to coplanar connection is carried out with FPC single sided boards, need by double
The mode of face wiring board via conducting carries out two ends frontback connection.But dual platen high cost, friendship phase are long.
The content of the invention
This utility model provides the structure that a kind of FPC one sides Copper Foil realizes antarafacial circuit, its objective is to solve prior art
The shortcoming of presence, makes FPC one side Copper Foils reach the purpose of two-termial line UNICOM, then will deduct heavy copper facing hole chemical industry sequence, significantly
Reduces cost and improve production efficiency.
This utility model solves the technical scheme that its technical problem adopted：
A kind of FPC one sides Copper Foil realizes the structure of antarafacial circuit, it is characterised in that：The upper surface bonding bottom glue of bottom PI
Layer lower surface and become bottom substrate, the upper surface bonding Copper Foil back side of bottom glue-line, bottom substrate correspond to the Copper Foil back side
The position of circuit is provided with opening；The upper surface of the lower surface bonds top layer glue-line of top layer PI and become top layer base material, top layer glue-line
Lower surface bonds Copper Foil front, top layer base material is provided with opening corresponding to the position of Copper Foil front circuit.
The upper surface of top layer PI is bonded with reinforcement PI corresponding to the position of the opening of bottom substrate.
It is of the present utility model to be beneficial in that：
The front and back of one side Copper Foil of the present utility model is designed with circuit and corresponding base material opening, it is possible to achieve two
The purpose of end line UNICOM, can deduct heavy copper facing hole chemical industry sequence, substantially reduce cost and improve production efficiency.
Description of the drawings
This utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is this utility model laminated construction figure.
Specific embodiment
In order to be illustrated more clearly that the technical solution of the utility model, the accompanying drawing to be used needed for description will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present utility model, for this area
For those of ordinary skill, on the premise of not paying creative work, can be implemented with obtaining others according to these accompanying drawings
Example.
As shown in Figure 1：
This utility model manufacturing process：
Together with first bottom PI3 (Kapton) is fitted with bottom glue-line 2, become bottom substrate 23, then will correspondence
In Copper Foil back side circuit 7（Copper Foil antarafacial circuit）The bottom substrate 23 at place position goes out opening 71.Then according to location hole by copper
Paper tinsel 1 is bonded with bottom substrate 23, forms bottom substrate 23 in the copper-clad plate for needing position to open a window.Again institute is made on copper-clad plate two sides
The circuit for needing.
Together with top layer PI6 (Kapton) is bonded with top layer glue-line 5, become top layer base material 56, top layer PI6's is upper
Surface is bonded with reinforcement PI8 corresponding to the position of the opening of bottom substrate 23, then by corresponding to position at Copper Foil front circuit 4
Top layer base material 56 goes out opening.
The circuit that copper-clad plate is made, is combined with top layer base material 56 according to location hole para-position, and is laminated solidification, just shape
The FPC flexible circuit board of antarafacial circuit UNICOM is realized into one side Copper Foil.
The FPC flexible circuitry plate structures are：
The lower surface of the upper surface bonding bottom glue-line 2 of bottom PI3 and become bottom substrate 23, the upper table of bottom glue-line 2
The back side of face bonding Copper Foil 1, bottom substrate 23 is provided with opening 71 corresponding to the position of Copper Foil back side circuit 7；The following table of top layer PI6
The upper surface of face bonding top layer glue-line 5 and become top layer base material 56, the front of the lower surface bonds Copper Foil 1 of top layer glue-line 5, top layer
Base material 56 is provided with opening 41 corresponding to the position of Copper Foil front circuit 4.
The upper surface of top layer PI6 is bonded with reinforcement PI8 corresponding to the position of the opening 71 of bottom substrate 23.
Each embodiment is described by the way of progressive in this specification, and what each embodiment was stressed is and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.To the upper of the disclosed embodiments
State bright, professional and technical personnel in the field is realized or use this utility model.Various modifications to these embodiments are right
Will be apparent for those skilled in the art, generic principles defined herein can be without departing from this reality
In the case of with new spirit or scope, realize in other embodiments.Therefore, this utility model is not intended to be limited to this
These embodiments shown in text, and it is to fit to the most wide scope consistent with principles disclosed herein and features of novelty.
Claims (2)
1. a kind of FPC one sides Copper Foil realizes the structure of antarafacial circuit, it is characterised in that：The upper surface bonding bottom glue-line of bottom PI
Lower surface and become bottom substrate, the upper surface bonding Copper Foil back side of bottom glue-line, bottom substrate correspond to Copper Foil back side line
The position on road is provided with opening；The upper surface of the lower surface bonds top layer glue-line of top layer PI and become top layer base material, top layer glue-line
Lower surface bonds Copper Foil front, top layer base material is provided with opening corresponding to the position of Copper Foil front circuit.
2. FPC one sides Copper Foil as claimed in claim 1 realizes the structure of antarafacial circuit, it is characterised in that：The upper table of top layer PI
Face is bonded with reinforcement PI corresponding to the position of the opening of bottom substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621229906.1U CN206149590U (en) | 2016-11-16 | 2016-11-16 | Structure of antarafacial circuit is realized to FPC single face copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621229906.1U CN206149590U (en) | 2016-11-16 | 2016-11-16 | Structure of antarafacial circuit is realized to FPC single face copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206149590U true CN206149590U (en) | 2017-05-03 |
Family
ID=58626635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621229906.1U Active CN206149590U (en) | 2016-11-16 | 2016-11-16 | Structure of antarafacial circuit is realized to FPC single face copper foil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206149590U (en) |
-
2016
- 2016-11-16 CN CN201621229906.1U patent/CN206149590U/en active Active
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