CN206143308U - Adopt zinc alloy surfaces plating layer structure of new material - Google Patents
Adopt zinc alloy surfaces plating layer structure of new material Download PDFInfo
- Publication number
- CN206143308U CN206143308U CN201621128105.6U CN201621128105U CN206143308U CN 206143308 U CN206143308 U CN 206143308U CN 201621128105 U CN201621128105 U CN 201621128105U CN 206143308 U CN206143308 U CN 206143308U
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- Prior art keywords
- copper
- nickel
- wire drawing
- zinc alloy
- layer
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to a metal material surface coating structure field, more specifically the adopt zinc alloy surfaces plating layer structure of new material that says so not only can cover the rough surface of alkaline electroplated copper, makes the surfacing, makes through the wire drawing indenture in addition that to plate the interlayer continuity inseparabler, prevents that cladding material from coming off. Bright plating copper layer contacts with nickel phosphorus alloy functional gradient coating to bright plating copper level is provided with wire drawing indenture III in nickel phosphorus alloy functional gradient coating's the outside on the nickel phosphorus alloy functional gradient coating. Nickel phosphorus alloy functional gradient coating and chemical nickel layer contact to nickel phosphorus alloy functional gradient coating is located chemical nickel layer's the outside, the last wire drawing indenture II that is provided with of chemical nickel layer. Chemical nickel layer contacts with alkaline electroplated copper layer to chemical nickel layer is located the outside on alkaline electroplated copper layer, is provided with wire drawing indenture I on the alkaline electroplated copper layer. Alkaline electroplated copper layer contacts with zinc alloy surfaces to alkaline electroplated copper level is in zinc alloy surfaces's the outside.
Description
Technical field
This utility model is related to metal material surface coating structure field, is in particular a kind of zinc of employing new material
Alloy surface coating structure.
Background technology
Kirsite often occurs many surface blemishes in electroplating process, this is because directly electric in zinc alloy surface
The bright electro-coppering of plating, bright plating copper also becomes referred to as acid copper plating, is characterized in that electroplating velocity is fast, and bright property is good, shortcoming
It is that the flaw position of zinc alloy surface is difficult to cover, and flaw position is subject to have deepened depth on the contrary after the corrosion of acidic Bath
Degree, simultaneously because nickel dam is different with the coefficient of expansion of layers of copper, causes thermal deformation different, and the thermal stress of generation is easily caused coating and takes off
Fall.
The content of the invention
This utility model mainly solving the technical problems that provide a kind of zinc alloy surface coating structure of employing new material,
The copper-plated rough surface of alkaline electro can not only be covered, make surfacing, and plating interlayer is connected more by wire drawing indenture
Closely, prevent coating from coming off.
To solve above-mentioned technical problem, this utility model is related to metal material surface coating structure field, in particular
It is a kind of zinc alloy surface coating structure of employing new material, including bright plating layers of copper, nickel-phosphorus alloy functionally gradient deposit, changes
Nickel dam, basic plating layers of copper, zinc alloy surface, wire drawing indenture I, wire drawing indenture II and wire drawing indenture III are learned, can not only be by alkali
Property electro-coppering rough surface cover, make surfacing, and the connection of plating interlayer is made more closely by wire drawing indenture, prevent coating
Come off.
Bright plating layers of copper contacts with nickel-phosphorus alloy functionally gradient deposit, and bright plating layers of copper is located at nickel-phosphorus alloy
The outside of functionally gradient deposit, is provided with wire drawing indenture III on nickel-phosphorus alloy functionally gradient deposit.Nickel-phosphorus alloy functionally gradient is plated
Layer contacts with electroless nickel layer, and nickel-phosphorus alloy functionally gradient deposit is located at the outside of electroless nickel layer, arranges in electroless nickel layer
There is wire drawing indenture II.Electroless nickel layer contacts with basic plating layers of copper, and electroless nickel layer is located at the outside of basic plating layers of copper,
Wire drawing indenture I is provided with basic plating layers of copper.Basic plating layers of copper contacts with zinc alloy surface, and basic plating layers of copper
Positioned at the outside of zinc alloy surface.
As the further optimization of the technical program, a kind of zinc alloy surface coating knot of employing new material of this utility model
The thickness of bright plating layers of copper described in structure is 30～40 microns.
As the further optimization of the technical program, a kind of zinc alloy surface coating knot of employing new material of this utility model
The thickness of nickel-phosphorus alloy functionally gradient deposit described in structure is 10～15 microns.
As the further optimization of the technical program, a kind of zinc alloy surface coating knot of employing new material of this utility model
The thickness of electroless nickel layer described in structure is 20～30 microns.
As the further optimization of the technical program, a kind of zinc alloy surface coating knot of employing new material of this utility model
The thickness of basic plating layers of copper described in structure is 5～10 microns.
A kind of this utility model zinc alloy surface coating structure of employing new material has the beneficial effect that：
A kind of zinc alloy surface coating structure of employing new material of this utility model, can not only be copper-plated thick by alkaline electro
Rough surface covers, and makes surfacing, and makes the connection of plating interlayer more closely by wire drawing indenture, prevents coating from coming off.
Description of the drawings
Below in conjunction with the accompanying drawings the utility model is described in more detail with specific implementation method.
Fig. 1 is a kind of structural representation of the zinc alloy surface coating structure of employing new material of this utility model.
In figure：Bright plating layers of copper 1；Nickel-phosphorus alloy functionally gradient deposit 2；Electroless nickel layer 3；Basic plating layers of copper 4；Zinc is closed
Gold surface 5；Wire drawing indenture I 6；Wire drawing indenture II 7；Wire drawing indenture III 8.
Specific embodiment
Specific embodiment one：
Present embodiment is illustrated with reference to Fig. 1, this utility model is related to metal material surface coating structure field, more
Saying for body is a kind of zinc alloy surface coating structure of employing new material, including bright plating layers of copper 1, nickel-phosphorus alloy functionally gradient
Coating 2, electroless nickel layer 3, basic plating layers of copper 4, zinc alloy surface 5, wire drawing indenture I 6, wire drawing indenture II 7 and wire drawing indenture III
8, the copper-plated rough surface of alkaline electro can not only be covered, surfacing is made, and connect plating interlayer by wire drawing indenture
More closely, prevent coating from coming off.
Bright plating layers of copper 1 contacts with nickel-phosphorus alloy functionally gradient deposit 2, and bright plating layers of copper 1 is located at nickel phosphorus
The outside of alloy functionally gradient deposit 2, is provided with wire drawing indenture III 8 on nickel-phosphorus alloy functionally gradient deposit 2.Nickel-phosphorus alloy function
Gradient coating 2 contacts with electroless nickel layer 3, and nickel-phosphorus alloy functionally gradient deposit 2 is located at the outside of electroless nickel layer 3, chemistry
Wire drawing indenture II 7 is provided with nickel dam 3.Electroless nickel layer 3 contacts with basic plating layers of copper 4, and electroless nickel layer 3 is located at alkalescence
The outside of copper electroplating layer 4, is provided with wire drawing indenture I 6 in basic plating layers of copper 4.Basic plating layers of copper 4 and the phase of zinc alloy surface 5
Contact, and basic plating layers of copper 4 is located at the outside of zinc alloy surface 5.Plated in nickel-phosphorus alloy functionally gradient by drawing process
Wire drawing indenture III 8 is produced on layer 2, wire drawing indenture II 7 is produced in electroless nickel layer 3, wire drawing is produced in basic plating layers of copper 4 recessed
Trace I 6, plating interlayer be connected with each other by wire drawing indenture, make plating interlayer connection it is even closer prevent coating from coming off, while nickel phosphorus conjunction
The heat that golden functionally gradient deposit 2 has phosphorus content gradient and thermal coefficient of expansion Gradient distribution and can effectively alleviate plating interlayer is answered
Power, prevents coating from coming off.Bright plating layers of copper 1 is located at outermost, makes surface keep smooth.
Specific embodiment two：
Present embodiment is illustrated with reference to Fig. 1, present embodiment is described further to embodiment one, the light
The thickness of copper electroplating layer 1 is 30～40 microns.
Specific embodiment three：
Present embodiment is illustrated with reference to Fig. 1, present embodiment is described further to embodiment one, the nickel phosphorus
The thickness of alloy functionally gradient deposit 2 is 10～15 microns.
Specific embodiment four：
Present embodiment is illustrated with reference to Fig. 1, present embodiment is described further to embodiment one, the chemistry
The thickness of nickel dam 3 is 20～30 microns.
Specific embodiment five：
Present embodiment is illustrated with reference to Fig. 1, present embodiment is described further to embodiment one, the alkalescence
The thickness of copper electroplating layer 4 is 5～10 microns.
Certainly, described above is not limitation of the utility model, and this utility model is also not limited to the example above, this skill
Change, remodeling, addition or replacement that the those of ordinary skill in art field is made in essential scope of the present utility model, also belong to
In protection domain of the present utility model.
Claims (5)
1. a kind of zinc alloy surface coating structure of employing new material, including bright plating layers of copper（1）, nickel-phosphorus alloy functionally gradient
Coating（2）, electroless nickel layer（3）, basic plating layers of copper（4）, zinc alloy surface（5）, wire drawing indenture I（6）, wire drawing indenture II（7）
With wire drawing indenture III（8）, it is characterised in that：Bright plating layers of copper（1）With nickel-phosphorus alloy functionally gradient deposit（2）Contact, and
And bright plating layers of copper（1）Positioned at nickel-phosphorus alloy functionally gradient deposit（2）Outside, nickel-phosphorus alloy functionally gradient deposit（2）On
It is provided with wire drawing indenture III（8）；Nickel-phosphorus alloy functionally gradient deposit（2）With electroless nickel layer（3）Contact, and nickel-phosphorus alloy work(
Can gradient coating（2）Positioned at electroless nickel layer（3）Outside, electroless nickel layer（3）On be provided with wire drawing indenture II（7）；Electroless nickel layer
（3）With basic plating layers of copper（4）Contact, and electroless nickel layer（3）Positioned at basic plating layers of copper（4）Outside, basic plating
Layers of copper（4）On be provided with wire drawing indenture I（6）；Basic plating layers of copper（4）With zinc alloy surface（5）Contact, and basic plating
Layers of copper（4）Positioned at zinc alloy surface（5）Outside.
2. the zinc alloy surface coating structure of a kind of employing new material according to claim 1, it is characterised in that：The light
Bright copper electroplating layer（1）Thickness be 30～40 microns.
3. the zinc alloy surface coating structure of a kind of employing new material according to claim 1, it is characterised in that：The nickel
Phosphorus alloy functionally gradient deposit（2）Thickness be 10～15 microns.
4. the zinc alloy surface coating structure of a kind of employing new material according to claim 1, it is characterised in that：Describedization
Learn nickel dam（3）Thickness be 20～30 microns.
5. the zinc alloy surface coating structure of a kind of employing new material according to claim 1, it is characterised in that：The alkali
Property copper electroplating layer（4）Thickness be 5～10 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621128105.6U CN206143308U (en) | 2016-10-17 | 2016-10-17 | Adopt zinc alloy surfaces plating layer structure of new material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621128105.6U CN206143308U (en) | 2016-10-17 | 2016-10-17 | Adopt zinc alloy surfaces plating layer structure of new material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206143308U true CN206143308U (en) | 2017-05-03 |
Family
ID=58621269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621128105.6U Expired - Fee Related CN206143308U (en) | 2016-10-17 | 2016-10-17 | Adopt zinc alloy surfaces plating layer structure of new material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206143308U (en) |
-
2016
- 2016-10-17 CN CN201621128105.6U patent/CN206143308U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170503 Termination date: 20171017 |