CN206135202U - A integrative tool of automatic gold thread bonded for dark chamber encapsulation laser emitter - Google Patents
A integrative tool of automatic gold thread bonded for dark chamber encapsulation laser emitter Download PDFInfo
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- CN206135202U CN206135202U CN201621195765.6U CN201621195765U CN206135202U CN 206135202 U CN206135202 U CN 206135202U CN 201621195765 U CN201621195765 U CN 201621195765U CN 206135202 U CN206135202 U CN 206135202U
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- mounting table
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Abstract
The utility model relates to an optical communication field, concretely relates to tool that is used for the automatic gold thread bonded of miniaturized dark chamber encapsulation laser emitter. The utility model provides an integrative tool of automatic gold thread bonded for dark chamber encapsulation laser emitter places a subassembly and product clamp plate including bottom plate, warm table, product, and the warm table is provided with the heating rod and places the hole, and the warm table passes through the bolt fastening on the bottom plate, the product place a subassembly include the product place the platform and the handle, handle and product are placed the platform and are connected, an upper surface of arranging the warm table in is placed to the product, the product is placed the bench and has been seted up the product and place the recess, the product clamp plate sets up places the bench in the product, has seted up the product on the product clamp plate and has pressed the hole, and the product is pressed the hole site and is placed the recess directly over in the product. Use the utility model provides an integrative tool of automatic gold thread bonded can realize that dark chamber encapsulates laser emitter's automatic gold thread bonded, improves the operating efficiency and the success rate of gold thread bonded by a wide margin.
Description
Technical field
This utility model is related to optical communication field, and in particular to a kind of automatic gold thread that generating laser is encapsulated for deep chamber
Bonding one tool.
Background technology
It is with the extensive application of broadband services, also more and more to the demand of optical transceiver module, miniaturization semiconductor laser
Necessary building block of the emitter as optical transceiver module, its demand are more and more, while to semiconductor laser transmitter work
The long-time stability of work require also stricter.Miniaturization depth chamber encapsulation semiconductor laser transmitter is excellent in terms of performance and temperature control
In coaxial packaging, particularly suitable wide gentle wavelength division component, product market prospect is boundless, but if automatic metaplasia can not be realized
Produce, production capacity will be unable to rapid lifting, product quality concordance cannot be guaranteed, and cost declining is also highly difficult.Deep chamber encapsulated laser
The working performance and success rate of gold thread bonding are the keys for realizing deep chamber encapsulated laser automated production, and existing automatic gold
Line bonding machine is all based on plane bonding design, and corresponding gold thread bonding tool is also for plane bonding design, discomfort
Gold thread for deep chamber encapsulated laser is bonded.The tool needs designed to realize the automatic gold thread bonding of deep chamber encapsulated laser
Solve problems with：One when being to ensure that the chopper level of automatic gold thread bonder crosses four wall of product to be bonded, and chopper will not
Chopper is caused to touch because encountering product wall to be bonded disconnected；Two is to treat keyed cartridges to be accurately positioned and compressed so that treat key
Close product to be moved in bonding process, so as to improve the success rate of bonding operation；Three is in deep chamber encapsulated laser
During bonding, chopper is run when being bonded the gold thread of adjacent four wall of product up and down, and in the bracing wire operation of bonding, chopper will not be because encountering
Protrusion and touch disconnected.
Utility model content
The purpose of this utility model is to provide a kind of automatic gold thread bonding tool suitable for deep chamber encapsulated laser, with side
Just operator is operated, prevents chopper from being touched the automatic gold thread key of the deep chamber encapsulation generating laser of disconnected, raising by four walls of product to be bonded
The bonding efficiency and success rate of conjunction.
The technical scheme adopted for achieving the above object by this utility model is：Propose a kind of for deep chamber encapsulation laser
The automatic gold thread bonding one tool of emitter, including base plate, warm table, product mounting table component and product pressing plate, warm table
Heating rod putting hole is provided with, warm table is secured by bolts on base plate；Product mounting table component include product mounting table and
With handle, handle is connected with product mounting table, and product mounting table is placed in the upper surface of warm table, and product is offered on product mounting table
Product place groove；Product pressing plate is arranged on product mounting table, and product pressure hole is offered on product pressing plate, and product presses hole position in product
Product place the surface of groove.
The surrounding in the product pressure hole is set to slope.
L-type limited block is fixed with the warm table, two sides of L-type limited block are in an angle of 90 degrees, and product mounting table is positioned at L-type
In two right-angle sides of limited block.
A small sircle hole is offered on the inside of two right-angle side joining of the L-type limited block.
Two products are provided with the product mounting table and place groove, on product pressing plate, be correspondingly arranged on two product pressures
Hole.
It is provided with heat insulation between the handle and product setting table, handle and heat insulation are adopted and be bolted to product and set
Put the side of platform.
The heat insulation is by made by bakelite.
The heating rod putting hole is provided with two, and thermocouple putting hole is provided with above heating rod putting hole, heating
Rod putting hole and thermocouple putting hole are horizontally set at the side of warm table.
The product mounting table and warm table are processed by red copper.
The utility model proposes the one tool of the automatic gold thread bonding of deep chamber encapsulation generating laser is exclusively used in, including product
Product mounting table component, warm table and product pressing plate, product mounting table component include product mounting table, heat insulation and handle, heating
Platform is secured by bolts on base plate, and base plate is bolted on automatic gold thread bonding machine platform, and product mounting table is by adding
L-type limited block in thermal station determining position, hold handle and freely can put from warm table, take product mounting table by operator,
Product to be bonded is placed in the groove of product mounting table, and the product on product pressing plate presses hole position in the surface of product to be bonded
And overlap with product shell outer to be bonded, automatic gold thread bonder clamps product pressing plate by clamp, can control product pressing plate
Lifting.Automatically when gold thread bonder runs, product pressing plate is pushed, and product to be bonded is compressed, so as to complete automatic gold thread bonding.
Height of this utility model by appropriate design product mounting table so that chopper level crosses the four of product to be bonded
During wall, will not touch because encountering product wall to be bonded disconnected；This utility model is provided with the groove for placing product to be bonded, by producing
Correspondence pressure hole on product pressing plate will be placed on product in groove and compress so that product will not be subjected to displacement in bonding process, had
Beneficial to the success rate for improving bonding；Pressure hole surrounding design sloping in this utility model on product pressing plate, is bonded adjacent product
During the gold thread of four walls, bonding bracing wire during, ramp type design can be prevented effectively from chopper by product pressure hole wall touch it is disconnected；This reality
Warm table is carried with new tool, can effectively be monitored, be controlled heating-up temperature, warm table and product by heating rod and thermocouple
Mounting table is made using the good red copper of heat conductivity, is conducive to heat to be quickly transmitted to product to be bonded, is automatic gold thread key
Close and suitable temperature is provided.The automatic gold thread bonding one tool proposed by this utility model has rational in infrastructure, easily operated
Advantage, the automatic gold thread bonding of deep chamber encapsulation generating laser can be realized, the working performance of gold thread bonding can be greatly improved
And success rate, it is advantageously implemented the large-scale production of deep chamber encapsulated laser product.
Description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the front view of product mounting table component in this utility model；
Fig. 3 is the top view of product briquetting in this utility model；
Fig. 4 is the front view of warm table in this utility model
Upward views of the Fig. 5 for Fig. 4；
In figure：1- product pressing plates, 2- products pressure hole, 3- product mounting tables, 4- products place groove, and 5- handles, 6- are heat-insulated
Block, 7- handle fixing bolts, 8- warm tables, 9-L type limited blocks, 10-L type limited block fixing bolts, 11- heating rod putting holes,
12- thermocouple putting holes, 13- base plates, 14- warm table fixing bolts.
Specific embodiment
Below in conjunction with the accompanying drawings this utility model is described in detail.
The as shown in Figure 1 automatic gold thread bonding one tool that generating laser is encapsulated for deep chamber, including base plate 13, plus
Thermal station 8, product mounting table component and product pressing plate 1, the corner of base plate 13 are provided with for being entered with automatic gold thread bonder table top
The fixed bolt hole of row, warm table 8 are fixed on base plate 13 by warm table fixing bolt 14 as shown in Figure 5, and product is placed
Platform component includes product mounting table 3, heat insulation 6 and handle 5, and product mounting table 3 is placed on warm table 8, and product pressing plate 1 is located at
On product mounting table 3.
Product mounting table component as shown in Figure 2 includes product mounting table 3, heat insulation 6 and handle 5, and heat insulation 6 is located at handss
Between handle 5 and product setting table 3, handle 5 and heat insulation 6 pass through the side that handle fixing bolt 7 is fixed on product setting table 3.
Two products are provided with product mounting table 3 and place groove 4.Product mounting table 3 is made using red copper, is beneficial to the heat of warm table
Amount is quickly transmitted to product to be bonded.Heat insulation 6 is made using bakelite, quilt when can prevent operator from picking and placeing product mounting table
Scald.
Two product pressure holes 2 are provided with product pressing plate 1 as shown in Figure 3, product presses hole 2 for square opening, four sides in hole
Slope is set to, the little square pressure hole of big lower mouth suitable for reading is formed, product pressure hole 2 is located at the surface that product places groove 4, automatically
When gold thread is bonded, product pressure hole 2 is overlapped with product shell outer to be bonded, and the clamp of automatic gold thread bonder clamps product pressing plate 1,
The lifting of product pressing plate 1 can be automatically controlled.
L-type limited block 9 is provided with warm table 8 as shown in Figure 4, L-type limited block 9 passes through L-type limited block fixing bolt
10 are fixed on warm table 8, and two sides of L-type limited block 9 are in offer one on the inside of an angle of 90 degrees, and two right-angle side joinings
Small sircle hole.Product mounting table 3 is placed on warm table 8 and is positioned by L-type limited block 9, the roundlet on the inside of 9 summit of L-type limited block
Hole can make two of product mounting table 3 completely to overlap while with the two of L-type limited block 9.The side of warm table 8 offers two
Heating rod putting hole 11, the top of heating rod putting hole 11 are provided with a thermocouple putting hole 12.Two heating rod putting holes
Place heating rod to heat warm table 8 in 11, the thermocouple being placed in thermocouple putting hole 12 measures warm table in real time
Temperature, for automatically controlling the temperature of warm table.Wherein, L-type limited block 9 is made using rustless steel, and warm table 8 adopts red copper
Process.
Carried out using this utility model as follows the step of the automatic gold thread of deep chamber encapsulation generating laser is bonded operation：
1. press boot program and open automatic gold thread bonder, select the gold thread bonding program of corresponding product, be in machine
Normal operating conditions；
2. antistatic fingerstall is worn, product mounting table 3 is removed, and groove 4 is placed in two products and is loaded two products to be bonded
Product, product to be bonded are placed by the upper left corner.Then with the handle 5 of hand-held product mounting table, warm table 8 is put it into, is limited with L-type
Position block 9 overlaps；
3. button is run by automatic gold thread bonder, the clamp control product pressing plate 1 of automatic gold thread bonder declines automatically, pressure
Firmly product to be bonded, then machine will complete automatic gold thread bonding according to selected gold thread bonding program；
4., after the completion of automatic gold thread bonding, with the handle 5 of hand-held product mounting table, product placement is removed from warm table
Platform 3, removes the product being bonded, and is put into new product to be bonded, proceeds automatic gold thread bonding.
The automatic gold thread bonding one tool proposed using this utility model, it is possible to achieve miniaturization depth chamber encapsulation laser
The automatic gold thread bonding of emitter, greatly improves the working performance and success rate of gold thread bonding.
Claims (9)
1. the automatic gold thread bonding one tool of deep chamber encapsulation generating laser is used for, it is characterised in that：Including base plate, heating
Platform, product mounting table component and product pressing plate, warm table are provided with heating rod putting hole, and warm table is secured by bolts in base plate
On；Product mounting table component include product mounting table and and handle, handle is connected with product mounting table, product mounting table be placed in plus
The upper surface of thermal station, offers product and places groove on product mounting table；Product pressing plate is arranged on product mounting table, product pressure
Product pressure hole is offered on plate, product presses hole position that the surface of groove is placed in product.
2. the automatic gold thread for encapsulating generating laser for deep chamber according to claim 1 is bonded one tool, its feature
It is：The surrounding in the product pressure hole is set to slope.
3. the automatic gold thread for encapsulating generating laser for deep chamber according to claim 1 is bonded one tool, its feature
It is：L-type limited block is fixed with the warm table, two sides of L-type limited block are in an angle of 90 degrees, and product mounting table is positioned at L-type limit
In two right-angle sides of position block.
4. the automatic gold thread for encapsulating generating laser for deep chamber according to claim 3 is bonded one tool, its feature
It is：A small sircle hole is offered on the inside of two right-angle side joining of the L-type limited block.
5. according to the arbitrary described automatic gold thread bonding one tool that generating laser is encapsulated for deep chamber of claim 1-4,
It is characterized in that：Two products are provided with the product mounting table and place groove, on product pressing plate, be correspondingly arranged on two products
Product press hole.
6. according to the arbitrary described automatic gold thread bonding one tool that generating laser is encapsulated for deep chamber of claim 1-4,
It is characterized in that：Heat insulation is provided between the handle and product setting table, handle and heat insulation are adopted and be bolted to product
The side of product setting table.
7. the automatic gold thread for encapsulating generating laser for deep chamber according to claim 6 is bonded one tool, its feature
It is：The heat insulation is by made by bakelite.
8. according to the arbitrary described automatic gold thread bonding one tool that generating laser is encapsulated for deep chamber of claim 1-4,
It is characterized in that：The heating rod putting hole is provided with two, and thermocouple putting hole is provided with above heating rod putting hole, plus
Hot pin putting hole and thermocouple putting hole are horizontally set at the side of warm table.
9. according to the arbitrary described automatic gold thread bonding one tool that generating laser is encapsulated for deep chamber of claim 1-4,
It is characterized in that：The product mounting table and warm table are processed by red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621195765.6U CN206135202U (en) | 2016-11-07 | 2016-11-07 | A integrative tool of automatic gold thread bonded for dark chamber encapsulation laser emitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621195765.6U CN206135202U (en) | 2016-11-07 | 2016-11-07 | A integrative tool of automatic gold thread bonded for dark chamber encapsulation laser emitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206135202U true CN206135202U (en) | 2017-04-26 |
Family
ID=58577289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621195765.6U Active CN206135202U (en) | 2016-11-07 | 2016-11-07 | A integrative tool of automatic gold thread bonded for dark chamber encapsulation laser emitter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206135202U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106329309A (en) * | 2016-11-07 | 2017-01-11 | 大连藏龙光电子科技有限公司 | Automatic gold wire bonding integrated fixture for deep-cavity package laser transmitter |
-
2016
- 2016-11-07 CN CN201621195765.6U patent/CN206135202U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106329309A (en) * | 2016-11-07 | 2017-01-11 | 大连藏龙光电子科技有限公司 | Automatic gold wire bonding integrated fixture for deep-cavity package laser transmitter |
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