CN206098446U - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
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- CN206098446U CN206098446U CN201621094057.3U CN201621094057U CN206098446U CN 206098446 U CN206098446 U CN 206098446U CN 201621094057 U CN201621094057 U CN 201621094057U CN 206098446 U CN206098446 U CN 206098446U
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Abstract
The utility model provides a LED packaging structure, includes glass apron, dark purple outer LED and LED base plate, the centre of LED base plate is equipped with first recess, and the edge of following the LED base plate is equipped with the second recess, forms to enclose between first recess and the second recess and closes the cofferdam of first recess, dark purple outer LED locates in the first recess, the top bearing in cofferdam the glass apron, be equipped with the first metal layer that combines with the LED base plate in the second recess, the bottom edge of glass apron is equipped with the second metal level, the first metal layer welds the combination with the second metal level through resistance. The utility model discloses packaging structure will be used for combined sealing's metal level to establish at the edge of base plate and glass apron, prevent that steam from getting into, the bottom laminating of the top in cofferdam and glass apron forms sealedly, gets into the route of first recess with the metal seal layer cooperation extension steam at edge, and then further improves packaging structure's leakproofness.
Description
Technical field
This utility model is related to LED field, especially a kind of deep ultraviolet LED encapsulation structure.
Background technology
At present UVLED mainly includes UVA and UVB, UVC wave band, UVA wave bands, 320～400nm of wavelength, and
Referred to as long wave black speck effect ultraviolet, it has very strong penetration power, can penetrate most of transparent glass and plastics；
UVB wave bands, 280～320nm of wavelength is also called medium wave erythemal effect ultraviolet, and medium penetration power, its wavelength is shorter
Part can be absorbed by clear glass；UVC wave bands, in below 280nm, be also called it is short refute sterilizing ultraviolet, its penetration capacity is most
It is weak, it is impossible to penetrate most of clear glass and plastics.For the characteristic of each wave band of ultraviolet light, for different-waveband using different
Packaged type, the UVLED of 385nm band above is mainly encapsulated using organosilicon material in such as UVA, 385nm with
Under UVA, UVB and UVC due to its high-energy, to phenyl in silicone-based materials etc., some groups have destruction,
Device ultimate failure will be caused in long service.It is approach using inorganic encapsulated to improve the service life of low band UVLED
One of, there is the technology being packaged to deep ultraviolet LED using full-inorganic material in prior art, such as China Patent Publication No. is
A kind of 103325922 LED encapsulation method, is provided with metal level, by metal level between substrate and the edge of glass cover-plate
The sealing in LED-baseplate is realized in welding.But realize that inorganic seal encapsulation techniques difficulty is larger at present, its main cause is temperature
Limit, and the restriction of material each side combination property.
The content of the invention
Technical problem to be solved in the utility model is to provide a kind of LED encapsulation structure, full-inorganic material seal, and close
Sealing property is more preferable.
To solve above-mentioned technical problem, the technical solution of the utility model is：A kind of LED encapsulation structure, including glass cover
Plate, deep ultraviolet LED and LED-baseplate；The centre of the LED-baseplate is provided with the first groove, is provided with second along the edge of LED-baseplate recessed
Groove, forms the cofferdam for enclosing first groove between the first groove and the second groove, the deep ultraviolet LED is located at described first
In groove；Glass cover-plate described in the top support in the cofferdam, is provided with the first gold medal combined with LED-baseplate in second groove
Category layer, the bottom margin of the glass cover-plate is provided with second metal layer, and the first metal layer passes through resistance with second metal layer
Weldering is combined.This utility model is packaged using full-inorganic material, and material will not be affected by ultraviolet, and life of product is more
It is long；This utility model encapsulating structure will be located at the edge of substrate and glass cover-plate for the metal level for combining sealing, prevent steam
Into；The top in cofferdam fits to form sealing with the bottom of glass cover-plate, coordinates prolongation steam to enter with the metal sealing layer at edge
Enter the path of the first grooving, and then further improve the sealing of encapsulating structure.
As improvement, the shape of the glass cover-plate and the mating shapes of LED-baseplate.
Used as improvement, the side of first groove is inclined-plane.
The beneficial effect that this utility model is brought compared with prior art is：
Utility model encapsulating structure will be located at the edge of substrate and glass cover-plate for the metal level for combining sealing, prevent water
Vapour is entered；The top in cofferdam fits to form sealing with the bottom of glass cover-plate, coordinates with the metal sealing layer at edge and extends steam
Into the path of the first groove, and then further improve the sealing of encapsulating structure.
Description of the drawings
Fig. 1 is embodiment 1LED encapsulating structure sectional view.
Fig. 2 is embodiment 1LED substrate sectional view.
Fig. 3 is embodiment 2LED encapsulating structure sectional view.
Fig. 4 is embodiment 2LED substrate sectional view.
Specific embodiment
With reference to Figure of description, the utility model is described in further detail.
Embodiment 1
As shown in figure 1, a kind of deep ultraviolet LED encapsulation structure, including glass cover-plate 2, deep ultraviolet LED 3 and LED-baseplate 1.
The shape of the glass cover-plate 2 and the mating shapes of LED-baseplate 1, can be circular or square.The material of the LED-baseplate 1
It is ceramic for Al2O3 or AlN；The material of the glass cover-plate 2 is quartz glass.As shown in Fig. 2 the LED-baseplate 1
Centre is provided with the first groove 4, and the shape of the first groove 4 can be square or circle, and the side of first groove 4 is inclined-plane,
Form reflecting surface；The second groove 8 is provided with along the edge of LED-baseplate 1, is formed between the first groove 4 and the second groove 8 described in enclosing
The cofferdam 5 of the first groove 4, the deep ultraviolet LED 3 is in first groove 4.Second groove 8 is located at LED-baseplate 1 most
Outward flange position, due to being using LED-baseplate edge is all cut away, so as to convenient employing.Electric resistance welding is carried out between metal level
Connection, only need to be attached in position to be connected pressure using electric resistance welding, so as to only need to be in the metal of the first metal layer 7 and second
Pressed between layer 6.Glass cover-plate 2 described in the top support in the cofferdam 5, top and the glass cover-plate 2 in cofferdam 5
Fit to form sealed pathway in bottom.The first metal layer 7 combined with LED-baseplate 1, the glass are provided with second groove 8
The bottom margin of cover plate 2 is provided with second metal layer 6, and the first metal layer 7 is combined with second metal layer 6 by electric resistance welding.
This utility model is packaged using full-inorganic material, and material will not be affected by ultraviolet, and life of product is more
It is long；This utility model encapsulating structure will be located at the edge of substrate and glass cover-plate 2 for the metal level for combining sealing, prevent steam
Into；The top in cofferdam 5 fits to form sealing with the bottom of glass cover-plate 2, coordinates with the metal sealing layer at edge and extends steam
Into the path of the first groove 4, and then further improve the sealing of encapsulating structure.
Embodiment 2
As shown in figure 3, a kind of deep ultraviolet LED encapsulation structure, including glass cover-plate 2, deep ultraviolet LED 3 and LED-baseplate 1.
The shape of the glass cover-plate 2 and the mating shapes of LED-baseplate 1, can be circular or square.The material of the LED-baseplate 1
It is ceramic for Al2O3 or AlN；The material of the glass cover-plate 2 is quartz glass.As shown in figure 4, the LED-baseplate 1
Centre is provided with the first groove 4, and the shape of the first groove 4 can be square or circle, and the side of first groove 4 is inclined-plane,
Form reflecting surface；The second groove 8 is provided with along the edge of LED-baseplate 1, is formed between the first groove 4 and the second groove 8 described in enclosing
The cofferdam 5 of the first groove 4, the deep ultraviolet LED 3 is in first groove 4.The outside of the second groove 8 is additionally provided with periphery
Plate；The top in the cofferdam 5 and glass cover-plate 2 described in the top support of peripheral board, the top in cofferdam 5 and the top of peripheral board with
Fit to form sealed pathway in the bottom of glass cover-plate 2.The first metal layer combined with LED-baseplate 1 is provided with second groove 8
7, the bottom margin of the glass cover-plate 2 is provided with second metal layer 6, and the first metal layer 7 passes through resistance with second metal layer 6
Weldering is combined.
This utility model is packaged using full-inorganic material, and material will not be affected by ultraviolet, and life of product is more
It is long；This utility model encapsulating structure will be located at the edge of substrate and glass cover-plate 2 for the metal level for combining sealing, prevent steam
Into；The top in cofferdam 5 and the top of peripheral board fit to form sealing with the bottom of glass cover-plate 2, the metal sealing with edge
Layer coordinates the path for extending steam into the first groove 4, and then further improves the sealing of encapsulating structure.
Claims (3)
1. a kind of LED encapsulation structure, including glass cover-plate, deep ultraviolet LED and LED-baseplate；It is characterized in that：The LED-baseplate
Centre be provided with the first groove, be provided with the second groove along the edge of LED-baseplate, between the first groove and the second groove formed enclose
The cofferdam of first groove, the deep ultraviolet LED is in first groove；Glass described in the top support in the cofferdam
Cover plate, is provided with the first metal layer combined with LED-baseplate in second groove, the bottom margin of the glass cover-plate is provided with
Two metal levels, the first metal layer is combined with second metal layer by electric resistance welding.
2. a kind of LED encapsulation structure according to claim 1, it is characterised in that：The shape of the glass cover-plate and LED bases
The mating shapes of plate.
3. a kind of LED encapsulation structure according to claim 1, it is characterised in that：The side of first groove is inclined-plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621094057.3U CN206098446U (en) | 2016-09-30 | 2016-09-30 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621094057.3U CN206098446U (en) | 2016-09-30 | 2016-09-30 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206098446U true CN206098446U (en) | 2017-04-12 |
Family
ID=58481533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621094057.3U Active CN206098446U (en) | 2016-09-30 | 2016-09-30 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206098446U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231976A (en) * | 2017-12-29 | 2018-06-29 | 上海大学 | A kind of UV LED and packaging method |
| CN109584733A (en) * | 2018-12-06 | 2019-04-05 | 广东洲明节能科技有限公司 | A kind of LED display and preparation method thereof |
| CN110645490A (en) * | 2019-09-23 | 2020-01-03 | 周孔礼 | Structure and method for packaging UVLED lamp glass piece by magnetron sputtering method |
| CN112838077A (en) * | 2021-01-08 | 2021-05-25 | 厦门市信达光电科技有限公司 | LED packaging structure, preparation process and display module |
| CN113394320A (en) * | 2020-03-11 | 2021-09-14 | 隆达电子股份有限公司 | Light emitting diode packaging structure |
-
2016
- 2016-09-30 CN CN201621094057.3U patent/CN206098446U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231976A (en) * | 2017-12-29 | 2018-06-29 | 上海大学 | A kind of UV LED and packaging method |
| CN109584733A (en) * | 2018-12-06 | 2019-04-05 | 广东洲明节能科技有限公司 | A kind of LED display and preparation method thereof |
| CN110645490A (en) * | 2019-09-23 | 2020-01-03 | 周孔礼 | Structure and method for packaging UVLED lamp glass piece by magnetron sputtering method |
| CN113394320A (en) * | 2020-03-11 | 2021-09-14 | 隆达电子股份有限公司 | Light emitting diode packaging structure |
| US11670748B2 (en) | 2020-03-11 | 2023-06-06 | Lextar Electronics Corporation | LED package structure |
| CN112838077A (en) * | 2021-01-08 | 2021-05-25 | 厦门市信达光电科技有限公司 | LED packaging structure, preparation process and display module |
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