CN206059899U - A kind of high power semiconductor lasers sinter the reduction apparatus of solder - Google Patents
A kind of high power semiconductor lasers sinter the reduction apparatus of solder Download PDFInfo
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- CN206059899U CN206059899U CN201621025151.3U CN201621025151U CN206059899U CN 206059899 U CN206059899 U CN 206059899U CN 201621025151 U CN201621025151 U CN 201621025151U CN 206059899 U CN206059899 U CN 206059899U
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- solder
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- shield cover
- sinter
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Abstract
This utility model is related to the reduction apparatus that a kind of high power semiconductor lasers sinter solder.The device includes replacing bottle, gas shield cover and warm table；Gas shield cover is arranged on the upper surface of warm table；Displacement top of bottle insertion is provided with nitrogen inlet duct and formic acid escape pipe；Insertion at the top of gas shield cover is provided with protective cover air inlet pipe, and insertion on the side wall of gas shield cover is provided with offgas duct；The formic acid escape pipe is connected with the protective cover air inlet pipe；It is horizontally disposed with gas shield cover and homogenizes plate, the slab construction for homogenizing plate and being provided with for surface multiple through holes；Protective cover air inlet pipe and offgas duct are separately positioned on the both sides up and down for homogenizing plate；Formic acid solution is filled in the displacement bottle.High power semiconductor lasers described in the utility model sinter the reduction apparatus of solder, simple structure, easy to operate, safety, low cost.
Description
Technical field
This utility model is related to the reduction apparatus that a kind of high power semiconductor lasers sinter solder, belongs to semiconductor laser
The technical field of device.
Background technology
The advantages of semiconductor laser is due to small volume, lightweight, high conversion efficiency, long service life, medical, aobvious
Show, pumping, the field such as industrial processes are widely used.In recent years, as epitaxial growth of semiconductor material growing technology, quasiconductor swash
Optical waveguide structure optimisation technique and passivating cavity surface technology are developed rapidly, and the performance of semiconductor laser has obtained very big carrying
Rise, attainable optical power density also more and more higher, and the radiating of higher luminous power output also noise spectra of semiconductor lasers is proposed
Higher requirement, and it is the main reason for causing semiconductor laser heat-sinking capability poor to sinter cavity.
In order to obtain high power output or high power density, in semiconductor laser encapsulation process, two are often related to
Secondary or multiple sintering, often uses in secondary or multiple sintering that fusing point is slightly lower, the slicken solder that sintering stress is little, such as indium weldering
Material, indium tin solder etc..Slicken solder is oxidizable, is oxidized to the high oxide of fusing point in atmosphere, can form weldering at weld interface
Cavity is connect, increases the thermal resistance of device, so as to affect performance and the life-span of semiconductor laser.In order to reduce the oxidation journey of solder
Degree, reduces voidage during sintering, it is necessary to carry out reduction treatment to solder before sintering, remove the oxide layer of solder surface.
Chinese patent literature CN201520034456.X discloses a kind of high power laser diode sintering gas medium
Homogenizer, including middle part is provided with the support of vacancy section, one side stand of vacancy section are provided with connecting plate, and the edge of vacancy section can be with
The suction nozzle sealing of agglomerating plant coordinates, and support is provided with the intake channel and exhaust gas passes connected with air inlet pipe and escape pipe, is entered
Gas path and the exhaust gas passes other end are communicated with the vacancy section of mid-stent.The device is sintered on platform by support is arranged on,
Reducing gas is passed through in sintering process, while reducing gas is homogenized by the vacancy section of support by reducing gas, heat is capable of achieving
The reduction of heavy upper solder.But as the device need to be arranged on agglomerating plant, the effect of competence exertion reduction in sintering process,
The application of agglomerating plant is limited so, and, reduced zone once can only be gone back only below the suction nozzle of agglomerating plant simultaneously
One laser instrument of former sintering, low production efficiency.
Chinese patent literature CN201210010539.6 discloses a kind of solder reducing agent automatic adding device, including：Storage
Liquid container, liquid pump, liquid feeding cup, the first detection means are located at the first predeterminated position in liquid feeding cup, for detecting going back in liquid feeding cup
Former agent dose simultaneously exports first detection signal；Controller, quits work for controlling liquid pump according to first detection signal, Yi Ji
Liquid pump quit work after open control valve control liquid feeding cup in reducing agent completely into solder pot；The device energy in commercial Application
Realize that reducing agent is quantitative and automatization adds, but semiconductor laser encapsulation field is higher to solder component requirements, and device chi
Very little less, operable space is little, and the device is not applied to.And, the device composition is complicated, relatively costly, is not suitable for quasiconductor
The batch encapsulation of laser instrument.
At present, the reducing gas great majority in semiconductor laser encapsulation field, used in the reduction process to solder
Or hydrogen or nitrogen, hydrogen mixed gas, hydrogen have greatly danger, restoring operation and vent gas treatment are proposed very high
Require, virtually considerably increase the cost of restoring operation.
The content of the invention
For the deficiencies in the prior art, this utility model provides the reduction that a kind of high power semiconductor lasers sinter solder
Device.
Term explanation：
It is heat sink：Refer to for installing the good copper billet of the heat conductivility of semiconductor laser chip or ceramic block.
The technical solution of the utility model is：
A kind of high power semiconductor lasers sinter the reduction apparatus of solder, including displacement bottle, gas shield cover and heating
Platform；Gas shield cover is arranged on the upper surface of warm table；Displacement top of bottle insertion is provided with nitrogen inlet duct and formic acid escape pipe；
Insertion at the top of gas shield cover is provided with protective cover air inlet pipe, and insertion on the side wall of gas shield cover is provided with offgas duct；It is described
Formic acid escape pipe is connected with the protective cover air inlet pipe；It is horizontally disposed with gas shield cover and homogenizes plate, it is described to homogenize plate for table
Face is provided with the slab construction of multiple through holes；Protective cover air inlet pipe and offgas duct are separately positioned on the both sides up and down for homogenizing plate；Institute
State in displacement bottle and fill formic acid solution.Wherein, the special construction for homogenizing plate can have just enter into the formic acid gas of gas shield cover
Body homogenization so as to uniformly across the solder surface on heat sink.
Preferably, the through hole homogenized on plate is uniformly distributed.
Preferably, the shape for homogenizing plate is corresponding to the shape of gas shield cover lateral cross section.
Preferably, cylindrical structural of the gas shield cover for bottom opening.
Preferably, offgas duct is arranged on the bottom of gas shield cover；The outlet of offgas duct is connected with exhaust gas processing device.
Preferably, the warm table is provided with temperature control panel.The advantage for designing herein is can to set institute as needed
The temperature for needing.
Preferably, the bottom of the nitrogen inlet duct is arranged on the downside of the liquid level of formic acid solution；The formic acid escape pipe sets
Put on the upside of the liquid level of formic acid solution.
Preferably, the displacement bottle and gas shield cover are glass material.The resistance to formic acid solution corrosion of glass material.
A kind of above-mentioned high power semiconductor lasers sinter the method for work of solder reduction apparatus, including step is as follows：
1) gas shield cover is placed on warm table, the heating-up temperature of warm table is arranged on 10～20 below solder melt point
℃；
2) nitrogen is passed through in formic acid solution by nitrogen inlet duct, nitrogen flow is 0.1L/min～0.3L/min；This
The purpose of step is to discharge the air in gas shield cover, and the reduction for solder provides reducibility gas pre- environment.
3) the heat sink upper surface for being placed into warm table of solder will be carried, nitrogen inlet duct will be continued through in formic acid solution
Nitrogen is passed through, and nitrogen carries formic acid gas and gas shield entered by the formic acid escape pipe and the protective cover air inlet pipe
Cover, warm table heat 4～5min to the solder in gas shield cover；
4) step 3) in heating stepses after the completion of, by gas shield cover and heat sink while carrying out cold with solder
But, and continue step 3) in the step of be passed through nitrogen；
5) gas shield cover and heat sink with solder are cooled to after room temperature, the step of be passed through nitrogen, are completed in stopping 3)
The reduction of solder.
Preferably, the step 3) in be provided with warm table it is multiple with the heat sink of solder.This step is realized to solder
Batch restoring operation.
The beneficial effects of the utility model are：
1. high power semiconductor lasers described in the utility model sinter the reduction apparatus of solder, using the reduction of formic acid
Property, below the fusing point of solder, the solder of evaporation is reduced in reducing atmosphere, removed the oxide layer on surface, improved
During sintering, chip and the wellability of solder, reduce the generation in cavity, and substantially increase high power semiconductor lasers can
By property；
2. high power semiconductor lasers described in the utility model sinter the reduction apparatus of solder, it is to avoid use hydrogen,
Safety is higher, low to restoring operation and vent gas treatment requirement, reduces restoring operation cost；
3. high power semiconductor lasers described in the utility model sinter the reduction apparatus of solder, simple structure, operation side
Just, safety, low cost.
Description of the drawings
Fig. 1 is the structural representation of the reduction apparatus of high power semiconductor lasers sintering solder described in the utility model；
Fig. 2 is described in the utility model with the heat sink of solder；
Wherein, 1, displacement bottle；2nd, formic acid solution；3rd, nitrogen inlet duct；4th, formic acid escape pipe；5th, protective cover air inlet pipe；6、
Gas shield cover；7th, homogenize plate；8th, offgas duct；9th, warm table；10th, through hole；11st, it is heat sink；12nd, solder.
Specific embodiment
This utility model is described further with reference to embodiment and Figure of description；But not limited to this.
Embodiment 1
As shown in Figure 1-2.
A kind of high power semiconductor lasers sinter the reduction apparatus of solder, including replace bottle 1, gas shield cover 6 and add
Thermal station 9；Gas shield cover 6 is arranged on the upper surface of warm table 9；Displacement 1 top insertion of bottle is provided with nitrogen inlet duct 3 and formic acid
Escape pipe 4；6 top insertion of gas shield cover is provided with protective cover air inlet pipe 5, and insertion on the side wall of gas shield cover 6 is provided with
Offgas duct 8；The formic acid escape pipe 4 is connected with the protective cover air inlet pipe 5；It is horizontally disposed with gas shield cover 6 and homogenizes plate
7, it is described to homogenize the slab construction that plate 7 is provided with multiple through holes 10 for surface；Protective cover air inlet pipe 5 and offgas duct 8 are respectively provided with
In the both sides up and down for homogenizing plate 7；Formic acid solution is filled in the displacement bottle 1.Wherein, the special construction for homogenizing plate 7 can be by
Have just enter into the formic acid gas equalization of gas shield cover so as to uniformly across the solder surface on heat sink.
Embodiment 2
High power semiconductor lasers sinter the reduction apparatus of solder as described in Example 1, except that, it is described even
The through hole 10 changed on plate 7 is uniformly distributed.
Embodiment 3
High power semiconductor lasers sinter the reduction apparatus of solder as described in Example 1, except that, homogenize plate
7 shape is corresponding to the shape of 6 lateral cross section of gas shield cover.
Embodiment 4
High power semiconductor lasers sinter the reduction apparatus of solder as described in Example 1, except that, the gas
Cylindrical structural of the body protective cover 6 for bottom opening.
Embodiment 5
High power semiconductor lasers sinter the reduction apparatus of solder as described in Example 1, except that, offgas duct
It is arranged on the bottom of gas shield cover；The outlet of offgas duct is connected with exhaust gas processing device, and the exhaust gas processing device is Shenzhen
Section flies the KF-200 activated carbon adsorption processing meanss for producing.
Embodiment 6
High power semiconductor lasers sinter the reduction apparatus of solder as described in Example 1, except that, it is described to add
Warm table of the thermal station for the JF-986 models of Chang'an Jin Feng electronics productions, the warm table are provided with temperature control panel.Set herein
The advantage of meter is the temperature needed for can setting as needed.
Embodiment 7
High power semiconductor lasers sinter the reduction apparatus of solder as described in Example 1, except that, the nitrogen
The bottom of gas air inlet pipe 3 is arranged on the downside of the liquid level of formic acid solution 2；The formic acid escape pipe 4 is arranged on the liquid level of formic acid solution 2
Upside.
Embodiment 8
High power semiconductor lasers sinter the reduction apparatus of solder as described in Example 1, except that, it is described to put
Change bottle 1 and gas shield cover 6 is glass material.The resistance to formic acid solution corrosion of glass material.
Claims (7)
1. a kind of high power semiconductor lasers sinter the reduction apparatus of solder, it is characterised in that including displacement bottle, gas shield
Cover and warm table；Gas shield cover is arranged on the upper surface of warm table；Displacement top of bottle insertion is provided with nitrogen inlet duct and first
Sour escape pipe；Insertion at the top of gas shield cover is provided with protective cover air inlet pipe, and insertion on the side wall of gas shield cover is provided with tail
Trachea；The formic acid escape pipe is connected with the protective cover air inlet pipe；It is horizontally disposed with gas shield cover and homogenizes plate, it is described even
Change the slab construction that plate is provided with multiple through holes for surface；Protective cover air inlet pipe and offgas duct are separately positioned on and homogenize the upper and lower of plate
Both sides；Formic acid solution is filled in the displacement bottle.
2. high power semiconductor lasers according to claim 1 sinter the reduction apparatus of solder, it is characterised in that described
The through hole homogenized on plate is uniformly distributed.
3. high power semiconductor lasers according to claim 1 sinter the reduction apparatus of solder, it is characterised in that homogenize
The shape of plate is corresponding to the shape of gas shield cover lateral cross section.
4. high power semiconductor lasers according to claim 1 sinter the reduction apparatus of solder, it is characterised in that described
Cylindrical structural of the gas shield cover for bottom opening.
5. high power semiconductor lasers according to claim 1 sinter the reduction apparatus of solder, it is characterised in that tail gas
Pipe is arranged on the bottom of gas shield cover；The outlet of offgas duct is connected with exhaust gas processing device.
6. high power semiconductor lasers according to claim 1 sinter the reduction apparatus of solder, it is characterised in that described
Warm table is provided with temperature control panel.
7. high power semiconductor lasers according to claim 1 sinter the reduction apparatus of solder, it is characterised in that described
The bottom of nitrogen inlet duct is arranged on the downside of the liquid level of formic acid solution；The formic acid escape pipe is arranged on the liquid level of formic acid solution
Side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621025151.3U CN206059899U (en) | 2016-08-31 | 2016-08-31 | A kind of high power semiconductor lasers sinter the reduction apparatus of solder |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621025151.3U CN206059899U (en) | 2016-08-31 | 2016-08-31 | A kind of high power semiconductor lasers sinter the reduction apparatus of solder |
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| CN206059899U true CN206059899U (en) | 2017-03-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106340802A (en) * | 2016-08-31 | 2017-01-18 | 山东华光光电子股份有限公司 | Large power semiconductor laser solder sintering reduction device and working method thereof |
-
2016
- 2016-08-31 CN CN201621025151.3U patent/CN206059899U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106340802A (en) * | 2016-08-31 | 2017-01-18 | 山东华光光电子股份有限公司 | Large power semiconductor laser solder sintering reduction device and working method thereof |
| CN106340802B (en) * | 2016-08-31 | 2023-12-12 | 山东华光光电子股份有限公司 | Reduction device for high-power semiconductor laser sintering solder and working method thereof |
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