CN206046775U - The stamping mold of 263 type lead frames of TO - Google Patents
The stamping mold of 263 type lead frames of TO Download PDFInfo
- Publication number
- CN206046775U CN206046775U CN201621034017.XU CN201621034017U CN206046775U CN 206046775 U CN206046775 U CN 206046775U CN 201621034017 U CN201621034017 U CN 201621034017U CN 206046775 U CN206046775 U CN 206046775U
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- Prior art keywords
- machete
- tool bore
- mould
- mold insert
- upper slitter
- Prior art date
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Abstract
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Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201621034017.XU CN206046775U (en) | 2016-08-31 | 2016-08-31 | The stamping mold of 263 type lead frames of TO |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621034017.XU CN206046775U (en) | 2016-08-31 | 2016-08-31 | The stamping mold of 263 type lead frames of TO |
Publications (1)
Publication Number | Publication Date |
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CN206046775U true CN206046775U (en) | 2017-03-29 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201621034017.XU Active CN206046775U (en) | 2016-08-31 | 2016-08-31 | The stamping mold of 263 type lead frames of TO |
Country Status (1)
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CN (1) | CN206046775U (en) |
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2016
- 2016-08-31 CN CN201621034017.XU patent/CN206046775U/en active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Stamping die for TO-263 lead frame Effective date of registration: 20180131 Granted publication date: 20170329 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: Wuxi Roum Semiconductor Technology Co., Ltd. Registration number: 2018990000073 |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 222300 No. 88 Shuofang Zhongtong East Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu Donghai Semiconductor Technology Co., Ltd. Address before: 214000 No. 88 Shuofang Zhongtong East Road, Wuxi New District, Jiangsu Province Patentee before: Wuxi Roum Semiconductor Technology Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: No.88, East Zhongtong Road, Shuofang, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Jiangsu Donghai Semiconductor Co.,Ltd. Address before: 222300 No. 88 Shuofang Zhongtong East Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: WUXI ROUM SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220322 Granted publication date: 20170329 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch Pledgor: WUXI ROUM SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: 2018990000073 |