CN206004985U - Conducting construction and electronic equipment - Google Patents

Abstract

Conducting construction and electronic equipment that this utility model provides, can fully guarantee the conducting with the part of the protecting film that there is insulating properties.The metal plate component (4A 1) of the substrate of frame (4A) is covered by the protecting film (4A 2) with insulating properties.Prominent face (4A 4) has：From prominent and the planar portions (4A 5) covering and the metal plate component (4A 1) exposing substrate by protecting film (4A 2) the outer peripheral face (4A 6) of frame (4A).Electroconductive component 5 is configured to contact with the metal plate component (4A 1) of the substrate exposed from outer peripheral face (4A 6).

Description

Conducting construction and electronic equipment

Technical field

This utility model is directed to tackle electrostatic or reply EMI (Electro Magnetic Interference：Electricity Magnetic disturbance), and make conducting construction that the parts such as metallic plate turn on each other and the electronic equipment possessing this conducting construction.

Background technology

In the past, there is the electronic equipment in the housing that electronic unit is accommodated in metal plate component combination and constitutes.At this In the electronic equipment of sample, for the impact to the electronic unit in housing of minimizing electrostatic or electromagnetic wave, and by metal plate component that This combinations of states to turn on and be grounded.

Further, since metal plate component is placed in the state easily got rusty because of the use environment of electronic equipment sometimes, because This, as antirust countermeasure, can form the protecting film with electrical insulating property on top layer in most cases.

If being formed with such protecting film, so that metal plate component is contacted with each other and being sometimes easily caused poor flow, and no Method is grounded.

For this problem, the such as combined structure of the metal plate component that patent documentation 1 is recorded, is to define on top layer to have Configure electroconductive component between the metal plate component of the protecting film of electrical insulating property, forged by punch process in this condition Make, so that the rear side combining the faying face from metal plate component for the surface side is protruded.

In the jut producing with reference to surface side, the protecting film near summit is made to crack by the power forging applied And expose the metal of substrate.Contacted with electroconductive component by the metal so exposing, thus to guarantee via electroconductive component Conducting between metal plate component.

Patent documentation 1：Japanese Unexamined Patent Publication 2007-73758 publication

In the combined structure that patent documentation 1 is recorded, it is pointed near the summit of jut by the power forging applied Protecting film stretched, so that it cracks.

However, the metal of substrate only exposes eventually between the crackle of the protecting film near the summit of jut.

So, because the amount of exposing of metal in jut is less, therefore there is following problem, that is,：Cannot be met should Higher to the probability of the amount of exposing of the conducting state needed for electrostatic or EMI.

Utility model content

This utility model is to solve that above-mentioned problem is made it is therefore intended that obtaining one kind can fully guarantee have There are conducting construction and the electronic equipment of the conducting of the part of the protecting film that there is insulating properties.

Conducting construction of the present utility model possesses：First component, the substrate of its metal is covered by the protecting film with insulating properties Lid；Prominent face, it has：The planar portions that project and covered by described protecting film from described first component and expose described substrate Outer peripheral face；And electroconductive component, it is configured to and the described substrate contact exposing from described outer peripheral face.

And, of the present utility model be characterised by, second component, the substrate of its metal is covered by the protecting film with insulating properties Lid；And prominent facial, it has：The planar portions that project and covered by described protecting film from described second component and expose described The outer peripheral face of substrate, described second component is via the described conduction being configured to the described substrate contact exposing from described outer peripheral face Property part and with described first component conducting.

And, of the present utility model be characterised by, described planar portions be circle, described prominent face be cylindrical shape.

And, of the present utility model be characterised by, described planar portions be polygon, described prominent face be polygon prism shape.

And, electronic equipment of the present utility model is characterised by, possesses any one conducting construction above-mentioned.

According to this utility model, the substrate due to making metal is exposed from the outer peripheral face of the prominent face being arranged at first component, Therefore make the amount of exposing of the construction that the crackle of the metal of the substrate protecting film of apex portion from jut exposes than ever Many, and also the amount of exposing can be adjusted according to the overhang of planar portions.

Thereby, it is possible to fully guarantee the conducting with electroconductive component for the part with the protecting film that there is insulating properties, enter And be capable of improving the countermeasure of electrostatic or EMI.

Brief description

Figure 1A is the front view illustrating to possess the electronic equipment of conducting construction of embodiment 1 of the present utility model.Figure 1B It is the profile illustrating the section along line A-A sectility by the electronic equipment of Figure 1A.

Fig. 2A is the sectional view of the conducting construction illustrating embodiment 1.Fig. 2 B is the conducting construction illustrating embodiment 1 The sectional view of another example.

Fig. 3 A is to illustrate to constitute the metal plate component of conducting construction of embodiment 1 and the axonometric chart of electroconductive component. Fig. 3 B is the section direction view illustrating the section along line B-B sectility by the metal plate component of Fig. 3 A and electroconductive component.

Fig. 4 A is the axonometric chart illustrating to constitute the metal plate component of conducting construction of embodiment 1.Fig. 4 B is to illustrate to scheme The section direction view of the section along line C-C sectility for the metal plate component of 4A.

Fig. 5 is the brief figure of the manufacture method of the conducting construction illustrating embodiment 1.

Fig. 6 A is the main view illustrating to constitute the example of the metal plate component of conducting construction of embodiment 2 of the present utility model Figure.Fig. 6 B is the axonometric chart of the metal plate component illustrating Fig. 6 A.

Fig. 7 A is the front view illustrating to constitute another example of the metal plate component of conducting construction of embodiment 2.Fig. 7 B It is the axonometric chart of the metal plate component illustrating Fig. 7 A.

Fig. 8 A is the front view illustrating to constitute the another example of the metal plate component of conducting construction of embodiment 2.Fig. 8 B It is the axonometric chart of the metal plate component illustrating Fig. 8 A.

Description of reference numerals：1 ... electronic equipment；2 ... liquid crystal panels；2A ... liquid crystal portion；2B ... protection board；3 ... housings； 4A, 4B, 4C ... frame；4A-1,4C-1 metal plate component ... 4A-2,4A-3,4C-2,4C-3 protecting film；4A-4、4A-7、4A- 10th, the prominent face of 4A-13,4C-4 ...；4A-5,4A-8,4A-11,4A-14,4C-5 ... planar portions；4A-6、4A-9、4A-12、4A- 15 ... outer peripheral faces；5 ... electroconductive components；6 ... moulds；7 ... drifts.

Specific embodiment

Embodiment 1

Figure 1A is the front view illustrating to possess the electronic equipment 1 of the conducting construction of embodiment 1 of the present utility model.Figure 1B It is the profile illustrating the section along line A-A sectility by the electronic equipment 1 of Figure 1A.

Electronic equipment 1 is, for example, the vehicle-mounted electronic equipments such as vehicle navigation apparatus, possesses liquid crystal panel 2 and housing 3.As Shown in Figure 1A, liquid crystal panel 2 is to expose to outside composed component from the one side of housing 3, and it makes in the outside direct capacitance producing Easily it is transferred to the circuit substrate of inside.

For example, as shown in Figure 1B, liquid crystal panel 2 exist liquid crystal portion 2A be held in frame 4B and circuit substrate (not shown) peace It is loaded on the situation of frame 4B.In addition, the display surface side in liquid crystal portion 2A is assembled with protection board 2B, protection board 2B is assembled in housing 3 Front-surface side.Constituted due to such, therefore there is the electrostatic producing in protection board 2B or housing 3 and pass through protection board 2B and housing Gap between 3, and it is transferred to the situation of foregoing circuit substrate from frame 4B of metallic plate.

On the other hand, in the past using by frame 4A located at earthing potential, and by between frame 4A and frame 4B via conduction Property part electrical connection, thus prevent electrostatic to be transferred to the construction of circuit substrate.

However, as described above, as the antirust countermeasure of the frame of metallic plate, it is to be existed by plating etc. in most cases Top layer forms the protecting film with electrical insulating property.

In this case, if only electroconductive component is clamped each other by frame, the conducting between frame and electroconductive component Insufficient it is possible to frame cannot be made fully to electrically connect each other.

On the other hand, conducting construction of the present utility model possesses prominent face by part punch process etc., this prominent face Have：Outer peripheral face from the frame planar portions projecting and the metal plate component exposing substrate.Electroconductive component be configured to from outer The metal plate component contact of the substrate that side face exposes.

So, exposed from the outer peripheral face of prominent face by making the metal plate component of substrate, thus record with such as patent documentation 1 Combined structure make the structure phase that the crackle of the metal plate component of the substrate protecting film of apex portion from jut exposes like that Ratio can be in each layer more amount exposed.In addition, by the overhang changing planar portions, substrate thus also can be adjusted Metal plate component the amount of exposing.

Fig. 2A is the sectional view of the conducting construction illustrating embodiment 1, illustrates only frame 4A to be provided with prominent face 4A-4 Construction.In this configuration, the frame of the protecting film without electrical insulating property is for example used as frame 4B.In addition, Fig. 2 B is The sectional view of another example of the conducting construction of embodiment 1 is shown, is shown in frame 4A setting prominent face 4A-4, in frame 4C It is also provided with the construction of prominent face 4C-4.

In fig. 2, frame 4A is the composed component embodying the first component in this utility model, metal plate component 4A-1 is the part being covered by protecting film 4A-2, the 4A-3 with electrical insulating property.That is, in the table of the side of metal plate component 4A-1 Layer is formed with the protecting film 4A-2 of electrical insulating property, is formed with protecting film 4A-3 on the top layer of opposite side.

Prominent face 4A-4 is to be formed with planar portions 4A-5, and the metal of substrate from a part of prominent state of frame 4A Plate member 4A-1 is exposed from the outer peripheral face 4A-6 of planar portions 4A-5.

The part of the substrate contact that electroconductive component 5 is arranged to and the outer peripheral face 4A-6 from planar portions 4A-5 exposes, example As there is electric conductivity and being made up of spongiform soft part.

Specifically, the example covering sponge member with the metal netted thin plate such as rustless steel can be included.This When being clamped by frame 4A and frame 4B, as shown in Figure 2 A, prominent face 4A-4 becomes the shape of sinking to the electroconductive component 5 that sample is constituted State, thus with the substrate contact exposing from outer peripheral face 4A-6.

For example, the size of the short transverse of the electroconductive component 5 before by frame 4A and the clamping of frame 4B is the situation of 5mm Under, frame 4A and frame 4B clamping electroconductive component 5, by the size compression of the short transverse of electroconductive component 5 to becoming 2.5mm Left and right.The face 4A-4 that thus dashes forward sinks to electroconductive component 5, makes substrate and electroconductive component 5 reliability exposed from outer peripheral face 4A-6 Ground contact.

In fig. 2b, frame 4C is the composed component embodying second component of the present utility model, metal plate component 4C- 1 is the part being covered by protecting film 4C-2, the 4C-3 with electrical insulating property.That is, protecting film 4C-2 is formed at metal plate component 4C- The top layer of 1 side, protecting film 4C-3 is formed at the top layer of opposite side.

In addition, frame 4C can also frame 4B as shown in Figure 1B like that, be to maintain the machine of the metallic plate of liquid crystal portion 2A Frame.

Prominent face 4C-4 is same with frame 4A, is formed with planar portions 4C-5 from a part for frame 4C with prominent state, And the metal plate component 4C-1 of substrate exposes from outer peripheral face 4C-6.

As shown in Figure 2 B, because electroconductive component 5 is configured to and the substrate contact exposing from outer peripheral face 4C-6, therefore frame 4C is turned on frame 4A via electroconductive component 5.

Fig. 3 A is to illustrate to constitute the metal plate component of conducting construction of embodiment 1 and the axonometric chart of electroconductive component, Frame 4A and the electroconductive component 5 being configured at frame 4A are shown.And, Fig. 3 B is to illustrate frame 4A of Fig. 3 A and conduction The section direction view of the property section along line B-B sectility for the part 5.

Fig. 4 A is the axonometric chart illustrating to constitute the metal plate component of conducting construction of embodiment 1, is shown provided with prominent face Frame 4A of portion 4A-4.Fig. 4 B is the section direction view illustrating the section along line C-C sectility by frame 4A of Fig. 4 A.

In the past, there is construction frame being electrically connected to each other via electroconductive component, electroconductive component is by using viscous Connect agent or two-sided tape and be installed on frame.

In this configuration, if bonding agent or two-sided tape are electrical insulating properties, they can become obstruction frame and conduction Property part electrical connection key factor.

On the other hand, as shown in fig. 4 a and fig. 4b, the prominent face 4A-4 in this utility model has only makes planar portions 4A-5 The construction projecting from frame 4A, and planar portions 4A-5 are formed on the protecting film 4A-2 covering on the top layer of frame 4A.

But, as shown in Fig. 3 A and Fig. 3 B, by making electroconductive component 5 and the substrate contact exposing from outer peripheral face 4A-6, To guarantee the conducting of frame 4A and electroconductive component 5.

Thus, electroconductive component 5 is by being configured at the bonding agent of the electrical insulating property on the protecting film 4A-2 of planar portions 4A-5 Or two-sided tape and be installed on frame 4A.

So, the conducting of without prejudice to frame 4A and electroconductive component 5, and electroconductive component 5 can be installed on frame 4A.

In addition, in Figure 4 A although being shown provided with the situation of two prominent face 4A-4 but it is also possible to be one or three More than.

Fig. 5 is the brief schematic diagram of the manufacture method of the conducting construction illustrating embodiment 1, illustrates to form prominent face Frame 4A of 4A-4 and the section being configured with the mould 6 of this frame 4A along the pressing direction sectility of drift 7.

First, frame 4A is configured at the mould 6 having with the hole portion of planar portions 4A-5 same diameter.

Then, will there is the drift 7 than planar portions 4A-5 slightly larger diameter, from mould 6 opposite side with frame 4A Face is along arrow D direction press-in die 6 side.

Prominent face 4A-4 passes through to carry out stopping the so-called of the press-in of drift 7 before frame 4A completely disengages from planar portions 4A-5 Part punching press being formed.

Cut off the protecting film 4A-2 of outer peripheral face 4A-6 by the press-in of drift 7 and using mould 6, so that metal plate component 4A-1 exposes from outer peripheral face 4A-6.

In addition, in the case that the intrusion of drift 7 is E1, the height E2 of outer peripheral face 4A-6 also becomes and E1 identical chi Very little.Therefore by adjusting the intrusion of drift 7 such that it is able to adjust the amount that metal plate component 4A-1 exposes from outer peripheral face 4A-6.

For example, the position by being pressed further into representing drift 7 to Fig. 5 dotted line, so that planar portions 4A-5 are further Prominent, thus also increase the amount of exposing of metal plate component 4A-1.

In addition, though illustrate to form the situation of prominent face 4A-4 by part punch process, but prominent shown in Fig. 2 B Facial 4C-4 can also be formed by part punch process.Even if in this case it is also possible to obtain and by part punching press Processing and be formed with the same effect of situation of prominent face 4A-4.

As described above, in the conducting construction of embodiment 1, the metal plate component 4A-1 of frame 4A is by having insulating properties Protecting film 4A-2 covers.Prominent face 4A-4 has：Planar portions 4A-5 projecting and being covered by protecting film 4A-2 from frame 4A and dew Go out the outer peripheral face 4A-6 of the metal plate component 4A-1 of substrate.Electroconductive component 5 is configured to and the substrate exposed from outer peripheral face 4A-6 Metal plate component 4A-1 contact.

So, by making the outer peripheral face 4A-6 from the prominent face 4A-4 being arranged at frame 4A for the metal plate component 4A-1 of substrate Expose, thus the construction phase exposed with the crackle of the protecting film making the metal of the substrate apex portion from jut in the past The amount of exposing is more, and also can adjust, according to the overhang of planar portions, the amount of exposing for ratio.Thus, it is possible to fully guarantee to have There is frame 4A of protecting film 4A-2 of insulating properties and the conducting of electroconductive component 5, and can improve and possess this conducting construction Reply electrostatic in electronic equipment 1 or the effect of EMI.

In addition, the conducting construction of embodiment 1 possesses：Frame 4C, its metal plate component 4C-1 is by the guarantor with insulating properties Cuticula 4C-2 covers；Prominent face 4C-4, it has planar portions 4C-5 projecting and being covered by protecting film 4C-2 from frame 4C and dew Go out the outer peripheral face 4C-6 of the metal plate component 4C-1 of substrate.Frame 4C is via being configured to and the substrate exposed from outer peripheral face 4C-6 Metal plate component 4C-1 contact electroconductive component 5 and with frame 4A conducting.

In addition, in embodiment 1, planar portions 4A-5 and planar portions 4C-5 are circle, dash forward face 4A-4 and prominent face Portion 4C-4 is cylindrical shape.

Even if so constituting it is also possible to fully guarantee the conducting of frame 4A and frame 4C via electroconductive component 5.

Additionally, in the manufacture method of the conducting construction of embodiment 1, portion is carried out to planar portions 4A-5 or planar portions 4C-5 Divide punch process, thus forming the facial 4C-4 of prominent face 4A-4 or prominent.

In such manner, it is possible to be readily formed prominent face 4A-4.Additionally by the intrusion of adjustment drift 7, thus, it is possible to adjust Metal plate component 4A-1 is from the amount of exposing of outer peripheral face 4A-6.Thereby, it is possible to adjust the conducting of frame 4A and electroconductive component 5, energy Enough effects tackling electrostatic or EMI improving the electronic equipment 1 possessing this conducting construction.

Embodiment 2

Although passing through the overhang of planar portions 4A-5 or planar portions 4C-5, to metal plate component 4A-1 in embodiment 1 Or the amount that metal plate component 4C-1 exposes is adjusted, but in embodiment 2, change base to by the shape of planar portions The construction of the amount that the metal plate component at bottom exposes illustrates.

Fig. 6 A is the main view illustrating to constitute the example of the metal plate component of conducting construction of embodiment 2 of the present utility model Figure, is shown in the construction that frame 4A is provided with prominent face 4A-7.And, Fig. 6 B is the axonometric chart of frame 4A illustrating Fig. 6 A.

As shown in Figure 6A, planar portions 4A-8 are star, and as shown in Figure 6B, the face 4A-7 that dashes forward is in the polygon prism that end face is star Shape.Even if so constituting, the metal plate component of substrate also can expose from the outer peripheral face 4A-9 of planar portions 4A-8.

Electroconductive component 5 shown in embodiment 1 is configured to the metal with the substrate exposed from this outer peripheral face 4A-9 Plate member contacts, therefore, it is possible to fully guarantee the conducting of frame 4A and electroconductive component 5.Possesses this conducting thus, it is possible to improve The reply electrostatic of the electronic equipment 1 of construction or the effect of EMI.

Fig. 7 A is the front view representing another example of the metal plate component of conducting construction constituting embodiment 2, illustrates It is provided with the construction of prominent face 4A-10 in frame 4A.And Fig. 7 B is the axonometric chart of frame 4A illustrating Fig. 7 A.

As shown in Figure 7 A, planar portions 4A-11 are tetragon, and as shown in Figure 7 B, the face 4A-10 that dashes forward is in end face is tetragon Polygon prism shape.Even if so constituting, the metal plate component of substrate also can expose from the outer peripheral face 4A-12 of planar portions 4A-11.

Electroconductive component 5 due to representing in embodiment 1 is configured to and the substrate exposed from this outer peripheral face 4A-12 Metal plate component contacts, therefore, it is possible to fully guarantee the conducting of frame 4A and electroconductive component 5.Possesses this thus, it is possible to improve The reply electrostatic of the electronic equipment 1 of conducting construction or the effect of EMI.

Fig. 8 A is the front view illustrating to constitute the another example of the metal plate component of conducting construction of embodiment 2, illustrates It is provided with the construction of prominent face 4A-13 in frame 4A.And, Fig. 8 B is the axonometric chart of frame 4A illustrating Fig. 8 A.

As shown in Figure 8 A, planar portions 4A-14 are triangle, and as shown in Figure 8 B, the face 4A-13 that dashes forward is in end face is triangle Polygon prism shape.Even if so constituting, the metal plate component of substrate also can expose from the outer peripheral face 4A-15 of planar portions 4A-14.

Electroconductive component 5 due to representing in embodiment 1 is configured to and the substrate exposed from this outer peripheral face 4A-15 Metal plate component contacts, therefore, it is possible to fully guarantee the conducting of frame 4A and electroconductive component 5.Possess thereby, it is possible to improve The reply electrostatic of the electronic equipment 1 of this conducting construction or the effect of EMI.

As described above, in the conducting construction of embodiment 2, planar portions 4A-8,4A-11,4A-14 are polygon, prominent face Portion 4A-7,4A-10,4A-13 are polygon prism shape.Constituted by such, thus with made the metal of substrate from projection in the past The construction that the apex portion in portion is exposed is compared, the amount of exposing more it is also possible to shape according to planar portions 4A-8,4A-11,4A-14 To adjust the amount of exposing.

Therefore, it is possible to fully guarantee frame 4A of the protecting film 4A-2 with insulating properties and the conducting of electroconductive component 5, And the reply electrostatic of the electronic equipment possessing this conducting construction or the effect of EMI can be improved.

In addition, in the case of forming prominent face 4A-4 and prominent face 4C-4 two side, the planar portions of above-mentioned prominent face Shape can identical it is also possible to different.

Additionally, as shown in Figure 4 A, in the case that an electroconductive component is arranged with multiple prominent faces, can change respectively The shape of planar portions of prominent face or size.

In addition it is also possible to combine embodiment 1 with embodiment 2, change shape and the overhang of planar portions, to adjust The amount that the metal plate component at integral basis bottom exposes from outer peripheral face.

In addition although illustrating by there is electric conductivity and constitute electroconductive component 5 for spongiform flexible member, But electroconductive component 5 can also be constituted by the harder part with the hole portion chimeric for prominent face.

That is, as long as electroconductive component is when being configured at frame, the structure that can contact with the outer peripheral face of planar portions.

In addition, this utility model can carry out each embodiment in the range of its utility model freely combining or each The omission of arbitrary composed component in the deformation of the arbitrary element of embodiment or each embodiment.

Claims (5)

1. a kind of conducting construction is it is characterised in that possess：

First component, the substrate of its metal is covered by the protecting film with insulating properties；

Prominent face, it has：The planar portions that project and covered by described protecting film from described first component and expose described substrate Outer peripheral face；And

Electroconductive component, it is configured to and the described substrate contact exposing from described outer peripheral face.

2. conducting construction according to claim 1 is it is characterised in that possess：

Second component, the substrate of its metal is covered by the protecting film with insulating properties；And

Prominent face, it has：The planar portions that project and covered by described protecting film from described second component and expose described substrate Outer peripheral face,

Described second component is via the described electroconductive component being configured to the described substrate contact exposing from described outer peripheral face With the conducting of described first component.

3. conducting construction according to claim 1 and 2 it is characterised in that

Described planar portions are circle,

Described prominent face is cylindrical shape.

4. conducting construction according to claim 1 and 2 it is characterised in that

Described planar portions are polygon,

Described prominent face is polygon prism shape.

5. a kind of electronic equipment it is characterised in that

Possesses the conducting construction any one of Claims 1 to 4.