CN205987346U - Loudspeaker module group - Google Patents
Loudspeaker module group Download PDFInfo
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- CN205987346U CN205987346U CN201620801493.3U CN201620801493U CN205987346U CN 205987346 U CN205987346 U CN 205987346U CN 201620801493 U CN201620801493 U CN 201620801493U CN 205987346 U CN205987346 U CN 205987346U
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- sound
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- entrant sound
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Abstract
The utility model relates to a loudspeaker module group. This loudspeaker module group includes: the module shell, the module shell has the inner chamber, inhale the sound subassembly, it includes entrant sound casing and backing sheet to inhale the sound subassembly, the entrant sound casing surrounds to inject inhales sound material fill area, one side of entrant sound casing has the opening, the backing sheet sets up the opening part of entrant sound casing, the backing sheet with the interior fixed surface of module shell connects, in order to incite somebody to action it fixes to inhale the sound subassembly in the inner chamber. The speaker of electronic product is applied to to utility model's an usage.
Description
Technical field
This utility model belongs to loudspeaker techniques field, and specifically, this utility model is related to a kind of speaker module.
Background technology
Loudspeaker assembly is important electro-acoustic conversion device in modern electronic product, and it is used for completing the signal of telecommunication and acoustical signal
Between conversion.With the gradually development of electronic product, loudspeaker techniques are also gradually improved, and adapt to electronic product to performance, knot
The needs of structure.
In the prior art, speaker module is a kind of regular loudspeaker collocation form.In order to improve speaker module
Acoustical behavior, those skilled in the art are using the technological means arranging sound-absorbing material in the cavity of module.Sound-absorbing material is permissible
Effectively reduce the F0 of module, and make intermediate frequency frequency response curve more smooth.
The sound-absorbing material commonly using in speaker module at present is acoustical cotton, more next with requiring to speaker performance
Higher, the sound-absorbing effect of acoustical cotton can not meet follow-up speaker module performance demand.Those skilled in the art start
It is filled in speaker module as sound-absorbing material using porous materials such as zeolite granulars.But, this particle type materials are difficult
Place, fill, existing sound-absorbing material set-up mode is not suitable for this sound-absorbing material.
Thus, it is necessary to improve so as to effectively to the filling of the granular pattern sound-absorbing material such as zeolite granular, set-up mode
Performance sound absorption qualities.
Utility model content
A purpose of the present utility model is the scheme proposing to encapsulate sound-absorbing material in a kind of improved module in speaker.
According to one side of the present utility model, there is provided a kind of speaker module, including：
Module shell, described module shell has inner chamber；
Sound-absorbing assembly, described sound-absorbing assembly includes entrant sound housing and support chip, and described entrant sound housing surrounds and limits sound-absorbing material
Fill area, the side of described entrant sound housing has opening, and described support chip is arranged at the opening of described entrant sound housing；
Described support chip is fixedly connected with the inner surface of described module shell, described sound-absorbing assembly is fixed on described interior
In chamber.
Alternatively, described support chip is adhesively fixed at the opening of described entrant sound housing.
Alternatively, the opening of described entrant sound housing closed by described support chip.
Alternatively, described support chip is to support gasket ring, fixes at described support chip and the edge of opening of described entrant sound housing
Connect, the module shell relative with described support chip position closes the opening of described entrant sound housing.
Alternatively, described entrant sound housing has at described opening to outside sound-absorbing material fill area or inner side transverse curvature is prolonged
The flange stretched, described support chip is fixedly connected with described flange.
Alternatively, described entrant sound housing is metal reticulated shell.
Alternatively, described speaker module also includes loudspeaker monomer, and described loudspeaker monomer is arranged on outside described module
In the inner chamber of shell, described loudspeaker monomer mark off in described inner chamber after the operatic tunes, described sound-absorbing assembly be located at the described rear operatic tunes
In, it is filled with sound-absorbing material granule in described sound-absorbing material fill area.
Alternatively, described support chip is PET sheet, sheet metal, graphite flake, PC piece or PEN piece.
Alternatively, described sound-absorbing material fill area is rectangular body region, and described support chip is in rectangular configuration.
Alternatively, the side surface that described support chip is not contacted with entrant sound housing is bonded in the inner surface of described module shell
On.
One of the present utility model has technical effect that, described sound-absorbing assembly can provide good support, rigid condition,
Improve the package reliability to sound-absorbing material.
By the detailed description to exemplary embodiment of the present utility model referring to the drawings, other of the present utility model
Feature and its advantage will be made apparent from.
Brief description
Constitute the Description of Drawings of a part the embodiment of the present utility model of description, and use together with the description
In explanation principle of the present utility model.
Fig. 1 is the side sectional view of the speaker module that a kind of embodiment of this utility model provides；
Fig. 2 is the partial enlarged drawing of Fig. 1；
The side, sectional enlarged drawing of the speaker module that a kind of embodiment of Fig. 3 this utility model provides.
Specific embodiment
To describe various exemplary embodiment of the present utility model now with reference to accompanying drawing in detail.It should be noted that：Unless it is another
Illustrate outward, the positioned opposite, numerical expression of the part otherwise illustrating in these embodiments and step and numerical value do not limit
Make scope of the present utility model.
Description only actually at least one exemplary embodiment is illustrative below, never as to this practicality
Any restriction that is new and its applying or use.
May be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but in suitable situation
Under, described technology and equipment should be considered a part for description.
In all examples with discussion shown here, any occurrence should be construed as merely exemplary, and not
It is as restriction.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represent similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then do not need it is further discussed in subsequent accompanying drawing.
This utility model provides a kind of improved speaker module, and this module can pass through sound-absorbing area side wall and packaging part
Effective, reliable encapsulation is carried out to sound-absorbing material granule, enables sound-absorbing material granule to play good sound-absorbing effect.
With reference to a kind of specific embodiment of the present utility model and accompanying drawing, scheme of the present utility model is illustrated.Institute
State speaker module and include module shell and packaging part, wherein, module shell has and can accommodate the devices such as speaker, sound-absorbing material
The inner chamber of part.As shown in figure 1, described sound-absorbing assembly is arranged in the inner chamber 11 of described module shell 1, described sound-absorbing assembly includes
Entrant sound housing 21 and support chip 22.Described entrant sound housing 21 1 aspect is used for surrounding restriction sound-absorbing material fill area, on the other hand,
Entrant sound housing 21 allows air, sound wave to extend there through, and the sound wave in entrant sound housing 21 outside can be incoming by entrant sound housing 21
Inside sound housing 21.The side of described entrant sound housing 21 has opening, is used for filling sound-absorbing material at opening into entrant sound housing 21.
As shown in Figure 1, 2, described support chip 22 is fixedly installed at the opening of described entrant sound housing 21, the surface of its side
It is fixedly connected with described entrant sound housing 21.Another side surface of support chip 22 is fixedly connected with the inner surface of described module shell 1,
Thus sound-absorbing assembly is integrally attached in described inner chamber 11.Described support chip 22 be used for for sound-absorbing assembly integrally provide fixing,
The effect supporting therefrom spills it is also possible to be prevented from sound-absorbing material.Entrant sound housing 21 is not directly connect with the inner surface of module shell 1
Touch, but be fixed in described module shell 1 by support chip 22.On the one hand, the sound-absorbing assembly that this utility model provides can
Reliably it is fixed in module, structural stability is good, and the opening of entrant sound housing 21 is directly by support chip or module shell 1
Inwall seals, and is less prone to the problem that sound-absorbing material spills.On the other hand, described entrant sound housing 21 has larger entrant sound region,
Can make sound wave smoothly in incoming sound-absorbing material fill area, make sound-absorbing material effectively play sound absorption.
In order that support chip can be firmly installed at the opening of described entrant sound housing, alternatively, support chip can lead to
Cross the mode being adhesively fixed to be arranged at the opening of entrant sound housing.As shown in Fig. 2 the opening of described entrant sound housing 21 and described
It is coated with bonding glue-line 23, described bonding glue-line 23 need to ensure that support chip 22 will not be departed from entrant sound housing 21 between blade 22,
Or bonding glue-line 23 can be double faced adhesive tape.
Alternatively, described support chip can close the opening of described entrant sound housing, to improve the closing of sound-absorbing material fill area
Reliability, prevents sound-absorbing material therein from spilling.In embodiment shown in Fig. 1,2, described support chip 22 is complete sheet material,
It covers at the opening of entrant sound housing 21, can completely enclose opening.Further, due to the area of described support chip 22
Larger, it is relative with the contact surface of module shell 1 bigger, and the reliability being fixedly connected is higher.
This utility model does not carry out concrete restriction to the material of support chip, is ensureing that support chip has good rigidity simultaneously
In the case of reliably fixing, supporting role can be provided, different materials can be selected to make described support chip.For example, one
In a little embodiments, described support chip can be PET sheet, sheet metal, graphite flake, PC piece or PEN piece etc..
Alternatively, in another embodiment it is contemplated that acoustic performance requirements of module or bigger in order to provide
Sound-absorbing material fill area, as shown in figure 3, described support chip 22 can be supporting pad ring, is only preserved for fixing with entrant sound housing 21
The region connecting.When described support gasket ring is arranged on described entrant sound housing 21, it is solid with the edge of opening of entrant sound housing 21
Fixed connection, and the region in the middle of opening is then hollow out.This structure design can increase the body of sound-absorbing material fill area further
Long-pending.After sound-absorbing assembly is fixedly connected with the inner surface of module shell 1 by support gasket ring, the inwall of module shell 1 can be to saturating
The opening of sound housing 21 plays sealing process, prevents the sound-absorbing material in entrant sound housing 21 from spilling.
Especially, in order to prevent entrant sound housing 21 from disengaging with support chip 22, both connection reliability are improved, such as Fig. 2,3
Shown, can have flange 211 at the opening of described entrant sound housing 21.Described flange 211 from the side-walls of entrant sound housing 21 to
Sound-absorbing material fill area bending extension laterally outside, thus increase the surface area of entrant sound housing 21 at opening.So, entrant sound housing 21
Surface area for being connected with support chip 22 is increased, it is possible to increase both connection reliability.For example, using being adhesively fixed
In embodiment, bigger contact area can coat more bonding agents, makes bonding more firm.This utility model is not intended to limit
Described flange can only extend to the outside of sound-absorbing material fill area, and in other embodiments, described flange can also be to sound-absorbing material
Extend inside fill area, those skilled in the art can be selected according to practical situation.
Described entrant sound housing both needs there is certain rigidity, is required to allow sound wave, air to extend there through, in order to full again
Sufficient performance requirement, in a kind of embodiment of the present utility model, described entrant sound housing is preferably metal reticulated shell.Metal reticulated shell by
Fine and closely woven metal wire knitted is formed, or can be made up of the metal material with uniformly fine and closely woven hole.In order to prevent entrant sound
The sound-absorbing material of enclosure interior spills, and the hole of metal reticulated shell can not be excessive.In other embodiments, described entrant sound housing also may be used
To be combined and to be formed by metal framework and entrant sound screen cloth, this utility model is not limited to this, and those skilled in the art are permissible
Selected according to practical situation.
Common, as shown in figure 1, described speaker module includes loudspeaker monomer 3, described loudspeaker monomer 3 is arranged
In the inner chamber 11 of described module shell 1.The inner chamber 11 of module shell 1 is marked off rear operatic tunes region by described loudspeaker monomer 3,
The described rear operatic tunes is connected with the back side of loudspeaker monomer 3.Preferably, described sound-absorbing assembly is located in the described rear operatic tunes, sound-absorbing material
The acoustical behavior of speaker module can more effectively be improved in the rear operatic tunes.
Further, as shown in figure 1, sound-absorbing material granule 4 can be filled with sound-absorbing material fill area, this by porous
The sound-absorbing material that zeolitic material is made, with respect to traditional sound-absorbing material, has more preferable sound absorption qualities and corresponding sensitivity, energy
The higher acoustic performance requirements of enough satisfactions.In the assembling process of module, first fill this sound-absorbing material in entrant sound housing 21
Granule 4, then support chip 22 is fixed at the opening of entrant sound housing 21 again.Then, by another side surface of support chip 22 with
The inner surface of module shell 1 is fixedly connected, and realizes the encapsulation overall to sound-absorbing assembly and fixation, prevents sound-absorbing material granule 4 from leaking
Go out and come off with sound-absorbing assembly.Sound is passed on sound-absorbing material granule 4 by described entrant sound housing 21.
Alternatively, described entrant sound housing 21 can be according to the planform of module shell 1, and the sound to speaker module
Learn performance requirement, surround and form the sound-absorbing material fill area being adapted, for placing sound-absorbing material.For example, in one embodiment,
Described entrant sound housing 21 can surround the region forming cuboid in inner chamber 11, and in this case, described support chip 22 is then
Region shape in rectangular configuration, to adapt to entrant sound housing 21 encirclement.And in other embodiments, described entrant sound housing also may be used
Form cylindrical region or erose region to surround, this utility model is not limited to this.
In addition, being fixedly connected mode with module shell for described support chip, this utility model is not specifically limited
System, in the case of ensureing firmly to connect, those skilled in the art can be in the way of using being suitable for.For example, in a kind of embodiment party
In formula, the side surface that described support chip is not contacted with entrant sound housing can be fixed in module shell by way of bonding
On surface.It is coated with bonding agent or direct sticking two-faced adhesive tape between support chip and the inner surface of module shell.Implement another kind of
In mode, the side surface that described support chip is not contacted with entrant sound housing can also be fixed on mould by way of ultrasonic bonding
On the inner surface of assembly housing.
Although being described in detail to some specific embodiments of the present utility model by example, this area
It is to be understood by the skilled artisans that above example is merely to illustrate, rather than in order to limit scope of the present utility model.This
Field it is to be understood by the skilled artisans that can be in the case of without departing from scope and spirit of the present utility model, to above example
Modify.Scope of the present utility model is defined by the following claims.
Claims (10)
1. a kind of speaker module is it is characterised in that include：
Module shell (1), described module shell (1) has inner chamber (11)；
Sound-absorbing assembly, described sound-absorbing assembly includes entrant sound housing (21) and support chip (22), and described entrant sound housing (21) surrounds limit
Determine sound-absorbing material fill area, the side of described entrant sound housing (21) has opening, and described support chip (22) is arranged on described entrant sound shell
At the opening of body (21)；
Described support chip (22) is fixedly connected with the inner surface of described module shell (1), and described sound-absorbing assembly is fixed on institute
State in inner chamber (11).
2. speaker module according to claim 1 it is characterised in that described support chip (22) be adhesively fixed on described
At the opening of sound housing (21).
3. speaker module according to claim 1 is it is characterised in that described entrant sound housing closed by described support chip (22)
(21) opening.
4. speaker module according to claim 1 it is characterised in that described support chip (22) be support gasket ring (221),
Described support chip (22) is fixedly connected with the edge of opening of described entrant sound housing (21), relative with described support chip (22) position
Module shell (1) close described entrant sound housing (21) opening.
5. speaker module according to claim 1 is it is characterised in that described entrant sound housing (21) has at described opening
Outside oriented sound-absorbing material fill area or the flange (211) that extends of inner side transverse curvature, described support chip (22) and described flange
(211) it is fixedly connected.
6. speaker module according to claim 1 is it is characterised in that described entrant sound housing (21) is metal reticulated shell.
7. speaker module according to claim 1 is it is characterised in that described speaker module also includes loudspeaker monomer
(3), described loudspeaker monomer is arranged in the inner chamber (11) of described module shell (1), and described loudspeaker monomer is in described inner chamber
(11) mark off the rear operatic tunes in, described sound-absorbing assembly is located in the described rear operatic tunes；
It is filled with sound-absorbing material granule (4) in described sound-absorbing material fill area.
8. speaker module according to claim 1 is it is characterised in that described support chip is PET sheet, sheet metal, graphite
Piece, PC piece or PEN piece.
9. speaker module according to claim 1 it is characterised in that described sound-absorbing material fill area be rectangular body region,
Described support chip (22) is in rectangular configuration.
10. speaker module according to claim 1 it is characterised in that described support chip (22) not with entrant sound housing
(21) side surface contacting is bonded on the inner surface of described module shell (1)；
Or the side surface that described support chip is not contacted with entrant sound housing (21) is fixed on described module by ultrasonic bonding
On the inner surface of shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620801493.3U CN205987346U (en) | 2016-07-27 | 2016-07-27 | Loudspeaker module group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620801493.3U CN205987346U (en) | 2016-07-27 | 2016-07-27 | Loudspeaker module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205987346U true CN205987346U (en) | 2017-02-22 |
Family
ID=58027181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620801493.3U Active CN205987346U (en) | 2016-07-27 | 2016-07-27 | Loudspeaker module group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205987346U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426655A (en) * | 2017-08-31 | 2017-12-01 | 歌尔股份有限公司 | Sound-producing device module |
| CN108377451A (en) * | 2018-03-30 | 2018-08-07 | 歌尔股份有限公司 | A kind of sound-producing device and electronic equipment |
| CN109831725A (en) * | 2018-12-27 | 2019-05-31 | 瑞声科技(新加坡)有限公司 | Loudspeaker mould group |
| CN111083602A (en) * | 2019-12-19 | 2020-04-28 | 歌尔股份有限公司 | Sound absorbing material packaging structure for sound generating device and sound generating device |
-
2016
- 2016-07-27 CN CN201620801493.3U patent/CN205987346U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426655A (en) * | 2017-08-31 | 2017-12-01 | 歌尔股份有限公司 | Sound-producing device module |
| CN107426655B (en) * | 2017-08-31 | 2021-11-16 | 歌尔股份有限公司 | Sound production device module |
| CN108377451A (en) * | 2018-03-30 | 2018-08-07 | 歌尔股份有限公司 | A kind of sound-producing device and electronic equipment |
| WO2019184477A1 (en) * | 2018-03-30 | 2019-10-03 | 歌尔股份有限公司 | Sound production apparatus and electronic device |
| CN109831725A (en) * | 2018-12-27 | 2019-05-31 | 瑞声科技(新加坡)有限公司 | Loudspeaker mould group |
| CN111083602A (en) * | 2019-12-19 | 2020-04-28 | 歌尔股份有限公司 | Sound absorbing material packaging structure for sound generating device and sound generating device |
| WO2021120915A1 (en) * | 2019-12-19 | 2021-06-24 | 歌尔股份有限公司 | Sound absorbing material encapsulation structure for sound production device, and sound production device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |