CN205981480U - Temperature detection circuit and temperature measurement structure - Google Patents
Temperature detection circuit and temperature measurement structure Download PDFInfo
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- CN205981480U CN205981480U CN201620671210.8U CN201620671210U CN205981480U CN 205981480 U CN205981480 U CN 205981480U CN 201620671210 U CN201620671210 U CN 201620671210U CN 205981480 U CN205981480 U CN 205981480U
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Abstract
The utility model provides a temperature detection circuit and temperature measurement structure, temperature detection circuit includes: temperature measuring resistor comprises the snakelike line copper foil of walking on the printed circuit board for connect and treat temperature element, the measuring circuit is used for measuring resistance changes when treating temperature element's temperature variation the last voltage of temperature measuring resistor, analog to digital conversion circuit for the voltage of the analog signal form of acquireing the measurement turns into the voltage of data signal form, the treater is used for the basis the corresponding relation of voltage and temperature acquire with the temperature that the current resistance value of temperature measuring resistor corresponds. The utility model discloses a snakelike line copper foil of walking by on the printed circuit board constitutes temperature measuring resistor, utilizes PCB to walk the line and replaces temperature sensor such as thermistor, realizes the temperature measurement of device such as laser diode, can make between laser diode and the semiconductor refrigerator only printed circuit board, does not have other sensor isotructure pieces, and package assembly is simple.
Description
Technical field
The present invention relates to electronic circuit technology field, specially a kind of temperature measurement circuit and a kind of temperature measurement structure.
Background technology
In optical fiber laser, laser diode (LD, Laser Diode) is as core component, its Output optical power and light
Wavelength has vital impact to the performance of laser instrument.LD is temperature sensor, and 0.1 DEG C of temperature change is to optical wavelength
Just have a significant effect.LD makees as power device semiconductor cooler (TEC, Thermoelectric Cooler) generally to be used
For refrigeration device.So LD, TEC and heat sink composition similar to the structure of sandwich, and in order to test the temperature of LD, generally in LD
The temperature sensor of critesistor NTC etc will be put into and TEC between.Because NTC has certain thickness, it usually needs trough of belt
Aluminium sheet or the metallic plate such as copper coin in LD and TEC between the two, wherein slot for placing critesistor.In order to engage fixation
LD and TEC, metallic plate needs perforate.This package assembly is complicated, and assembling is relatively difficult, causes reliability also than relatively low.
Content of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of temperature measurement circuit and a kind of thermometric
Structure is complicated and can for solving the package assembly brought using the temperature of critesistor testing laser diode in prior art
By the low problem of property.
For achieving the above object and other related purposes, the present invention provides a kind of temperature measurement circuit, and described temperature measurement circuit includes：
Temperature detecting resistance, is made up of the snakelike cabling Copper Foil on printed circuit board, treats temperature element for connecting；Measuring circuit, and described
Temperature detecting resistance is connected, for measuring the described temperature detecting resistance that resistance changes in the described temperature change whne temperature element
Voltage；Analog to digital conversion circuit, is connected with described measuring circuit, the photovoltaic conversion of the analog signal form for obtaining measurement
Voltage for digital signal form；Processor, for obtaining and described thermometric electricity according to the corresponding relation of described voltage and temperature
Hinder the current corresponding temperature of resistance value.
In one embodiment of the invention, described measuring circuit includes：Measuring bridge, for the electricity in described temperature detecting resistance
Resistance is with the voltage on described temperature detecting resistance described when the temperature of temperature element changes；Amplifier, with described measuring bridge
It is connected, the voltage for inputting to described measuring bridge is amplified.
In one embodiment of the invention, the first brachium pontis of described measuring bridge is by first resistor and described temperature detecting resistance structure
Become, the second brachium pontis is made up of second resistance and 3rd resistor；The normal phase input end of described amplifier is connected to described first resistor
And described temperature detecting resistance between, the inverting input of described amplifier be connected to described second resistance and described 3rd resistor it
Between.
In one embodiment of the invention, the resistance of the resistance of described second resistance and described 3rd resistor is equal.
In one embodiment of the invention, described measuring circuit also includes being connected to the first reference voltage and described first bridge
Between first common port of arm and described second brachium pontis, it is connected to described first brachium pontis and the second common port of described second brachium pontis
It is used between over the ground the voltage inputting in described measuring circuit is carried out with the first current-limiting resistance and second current-limiting resistance of current limliting.
In one embodiment of the invention, the resistance phase of the resistance of described first current-limiting resistance and described second current-limiting resistance
Deng.
In one embodiment of the invention, described amplifier is the instrument amplifier of high input impedance.
In one embodiment of the invention, described measuring circuit also includes being used in conjunction with the reference input phase of described amplifier
Biasing circuit in the output voltage stablizing described amplifier.
In one embodiment of the invention, described biasing circuit includes：The reference input phase of one end and described amplifier
Even, the 5th resistance of other end ground connection is connected with the reference input of described amplifier with one end, and the other end connects the second reference
6th resistance of voltage.
For achieving the above object, the present invention also provides a kind of temperature measurement structure, and described temperature measurement structure includes：Printed circuit board,
The temperature detecting resistance be made up of is arranged on described printed circuit board, the laser two being connected with described temperature detecting resistance snakelike cabling Copper Foil
Pole pipe and the semiconductor cooler being connected to described printed circuit back.
As described above, a kind of temperature measurement circuit of the present invention and a kind of temperature measurement structure, have the advantages that：
1st, the present invention, by constituting temperature detecting resistance by the snakelike cabling Copper Foil on printed circuit board, is replaced using PCB trace
Critesistor equitemperature sensor, realizes the temperature survey of the devices such as laser diode, can make laser diode and quasiconductor
Only have printed circuit board between refrigerator, there is not the structural members such as other sensors, package assembly is simple.
2nd, present configuration is simple, controls flexibility and reliability, economical and practical, has wide applicability.
Brief description
Fig. 1 is shown as a kind of principle schematic of temperature measurement circuit in the present invention.
Fig. 2 is shown as the structural representation of measuring circuit in a kind of temperature measurement circuit of the present invention.
Fig. 3 is shown as a kind of principle schematic of temperature measurement structure of the present invention.
Component label instructions
100 temperature measurement circuits
101 temperature detecting resistances
102 measuring circuits
103 analog to digital conversion circuits
104 processors
200 temperature measurement structures
201 printed circuit boards
202 cabling Copper Foils
203 laser diodes
204 semiconductor coolers
205 connection conductors
206 radiators
Specific embodiment
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also be by addition different concrete realities
The mode of applying is carried out or applies, and the every details in this specification can also be based on different viewpoints and application, without departing from
Carry out various modifications and changes under the spirit of the present invention.
The purpose of the present embodiment is to provide a kind of temperature measurement circuit and a kind of temperature measurement structure, for solving profit in prior art
The package assembly complexity brought with the temperature of critesistor testing laser diode and the low problem of reliability.Explained in detail below
State a kind of temperature measurement circuit and a kind of principle of temperature measurement structure and the embodiment of the present embodiment, so that those skilled in the art is not needed
Creative work is appreciated that a kind of temperature measurement circuit of the present embodiment and a kind of temperature measurement structure.
A kind of temperature measurement circuit of the present embodiment, specifically, as shown in figure 1, described temperature measurement circuit 100 includes：Temperature detecting resistance
101, measuring circuit 102, analog to digital conversion circuit 103 and processor 104.
Hereinafter the temperature measurement circuit 100 in the present embodiment is described in detail.
In the present embodiment, as shown in figure 1, described temperature detecting resistance 101 is by the snakelike cabling copper on printed circuit board (PCB)
Paper tinsel is constituted, and treats temperature element for connecting.I.e. in the present embodiment, described temperature detecting resistance 101 is treated under temperature element by being coiled in
The snakelike PCB trace of side is constituted, and this section of snakelike cabling provides the resistance required for measurement temperature.Wherein, described treat thermometric unit
Part is, for example, laser diode.When the temperature of laser diode changes, the resistance of this section of circuit will change therewith, its change
Change amount is together decided on by the temperature coefficient of the resistivity of copper, temperature variation and trace resistances in Copper Foil.Use PCB trace
Copper Foil substitutes the temperature test that no additional structure is realized in temperature sensor, that is, treat that temperature element laser diode can directly be fixed
On Metal Substrate pcb board, only has pcb board between semiconductor cooler (TEC) and laser diode (LD) it is no longer necessary to other are tied
Component, and can achieve the temperature test to laser diode above snakelike cabling Copper Foil.
As can be seen here, in the present embodiment, directly by the use of PCB Copper Foil as temperature detecting resistance 101 it is not necessary to use critesistor
NTC or other kinds of temperature sensor, does not have interface unit, so increased system reliability.Meanwhile, PCB Copper Foil does not account for
With volume it is not necessary to using other thermometric modes temperature measurement structure to be used, also simplify the complexity of system mechanics structure design.
In the present embodiment, described measuring circuit 102 is connected with described temperature detecting resistance 101, for measurement described to be measured
The voltage on described temperature detecting resistance 101 that during temperature change of warm element, resistance changes.Described measuring circuit 102 is use
In the resistive voltage change-over circuit realizing Copper Foil resistance microvariations.
Specifically, as shown in Fig. 2 in the present embodiment, described measuring circuit 102 includes：Measuring bridge, for described
The resistance of temperature detecting resistance 101 is with the voltage on described temperature detecting resistance 101 described when the temperature of temperature element changes；Amplify
Device, is connected with described measuring bridge, and the voltage for inputting to described measuring bridge is amplified.
In the present embodiment, the first brachium pontis of described measuring bridge is made up of first resistor R1 and described temperature detecting resistance 101,
Second brachium pontis is made up of second resistance R2 and 3rd resistor R3；The normal phase input end of described amplifier is connected to described first resistor
Between R1 and described temperature detecting resistance 101, the inverting input of described amplifier is connected to described second resistance R2 and the described 3rd
Between resistance R3.Wherein, the resistance of the resistance of described second resistance R2 and described 3rd resistor R3 is equal.It can be seen that, the present embodiment
Described in measuring bridge adopt class Huygens's bridge circuit, can realize under power consumption constraint small-signal input accurate survey
Amount.Wherein, described amplifier is preferably instrument amplifier or the instrument amplifier circuit of high input impedance.
So the described measuring circuit 102 in the present embodiment is the instrument amplifier by measuring bridge and high input impedance
AFE (the Analog Front End) analog front end circuit of micro- resistance variations test that INA is constituted.The two ends of snakelike cabling Copper Foil
It is connected respectively to the two ends of measuring bridge.
In the present embodiment, described measuring circuit 102 also includes being connected to the first reference voltage Vcc and described first brachium pontis
And the first common port of described second brachium pontis between, be connected to described first brachium pontis and described second brachium pontis the second common port and
It is used between over the ground the voltage inputting in described measuring circuit 102 is carried out with the first current-limiting resistance Ru1 and second current limliting of current limliting
Resistance Ru2.Wherein, the resistance of the resistance of described first current-limiting resistance Ru1 and described second current-limiting resistance Ru2 is preferably equal.
The Main Function of described first current-limiting resistance Ru1 and described second current-limiting resistance Ru2 is to limit to flow through measuring bridge
Electric current and the output level of measuring bridge is adjusted near the power supply intermediate level of instrument amplifier INA.Because thermometric is electric
The resistance of resistance Rs is smaller, if directly electric bridge two ends are connected between reference power source and ground network to lead to high current to flow through
Rs, and then lead to the temperature rise of Rs itself to affect test result.Here it is the place effect of current-limiting resistance Ru1 and Ru2.Meanwhile, because
, when the centre position of its power rail, the index such as linearity of INA is best for the input signal of instrument amplifier circuit INA.In electricity
Bridge two ends respectively add current-limiting resistance Ru1 and Ru2 and the output level of electric bridge are adjusted to this input area of INA.For convenience of enforcement,
Instrument amplifier circuit adopts single supply circuit in the present embodiment, and adjustment circuit parameter exports electric bridge near Vcc/2.As
Fruit adopts dual power supply instrument amplifier circuit, and this output should be just near ground level.
In the present embodiment, described measuring circuit 102 also includes being used in conjunction with the reference input Vref phase of described amplifier
Biasing circuit in the output voltage stablizing described amplifier.
Wherein, as shown in Fig. 2 described biasing circuit includes：One end is connected with the reference input Vref of described amplifier,
5th resistance R5 of other end ground connection is connected with the reference input Vref of described amplifier with one end, and the other end connects the second ginseng
Examine the 6th resistance R6 of voltage vcc.
In the present embodiment, analog-digital conversion circuit as described 103 is connected with described measuring circuit 102, for obtaining measurement
Analog signal form photovoltaic conversion be digital signal form voltage；Described processor 104 be used for according to described voltage with
The corresponding relation of temperature obtains the resistance value corresponding temperature current with described temperature detecting resistance 101.
Hereinafter the temperature-measurement principle of temperature measurement circuit in the present embodiment 100 is described in detail.
From circuit voltage divider principle, when, at a temperature of certain, the output of measuring bridge is determined by formula below：
Vin=Vin+-Vin-
Wherein：Vin-=Vcc/2；
If Ru1=Ru2=Ru, R2=R3=R0 are then：
R=Rs (20 DEG C), if R3=R2=R1=Ru=R, A=α × (T-20).
If R=Rs (20 DEG C), R1=R3=R2=R, A=α × (T-20), then
Temperature detecting resistance Rs (T)=R × (1+A),
Can obtain
In this patent, temperature detecting resistance Rs is the resistance of PCB trace Copper Foil.PCB trace resistance formula is Rs (T)=ρ × L/
Area, ρ are copper resistance rate；Area is the cross-sectional area of PCB trace, and Area=live width * copper is thick；L is track lengths.By above-mentioned
Formula understands that Rs to be made is big with respect to the variable quantity of temperature change, just should increase line length L, reduces live width and copper is thick.Using snakelike
Cabling is exactly that the length reaching and making cabling in same area is the longest, the maximum method of resistance.
Hereinafter the projected area treating temperature element laser diode in the present embodiment is illustrated.
Taking the laser diode of a volume ratio less 8W power as a example, a length of 11.9mm of its base plane, a width of
8.5mm, the projected area on printing board PCB is 8.5x11.9mm2.Adopt serpentine fashion cabling in this region, then
Line length L=projected area/(live width+line-spacing).The making technology of PCB can obtain big resistance using compared with high technology, also can lead
Cause the increase of PCB production cost, adopt the making technology level of general PCB, line taking width 0.1mm, line-spacing 0.1mm, Copper Foil here
Thickness 0.5oz.So：Area=live width × copper thickness=1.75e-3mm2；L is track lengths,
ρ=0.0175 Ω mm2/m at 20 DEG C, then
This shows generally, and the PCB trace of laser diode projection lower section may be larger than 5 Ω.In Vcc=
5.0V, during 1 DEG C of temperature change, selection Ru is 100 Ω, now understands：
After the instrument amplifier INA that gain is 1000, corresponding output voltage Vout=0.12V.The work of laser diode
Make temperature range typically at 20～40 DEG C, so when range of temperature is at 20 DEG C, Vout_max≈ 2.4V is for input range
Significance bit for 3.0V is 14bit, corresponding 164 least significant bits (LSB) of 0.12V, i.e. 0.006 DEG C/LSB.
Additionally, as shown in figure 3, the present embodiment also provides a kind of temperature measurement structure 200, described temperature measurement structure 200 includes：Print
Circuit board 201, is arranged at the temperature detecting resistance be made up of on described printed circuit board 201 snakelike cabling Copper Foil 202, with described thermometric
Laser diode 203 and the semiconductor cooler 204 being connected to described printed circuit board 201 back side that resistance connects.Wherein,
Described laser diode 203 can be connected on described cabling Copper Foil 202 by connecting conductor 205 (such as solder or colloid),
Described semiconductor cooler 204 can also connect radiator 206.
Temperature measurement structure 200 in figure from Fig. 3 can be seen that laser diode 203 and can be directly anchored to Metal Substrate PCB
On plate, only have pcb board between semiconductor cooler 204 (TEC) and laser diode 203 (LD) it is no longer necessary to other structures part,
And can achieve the temperature test to laser diode 203 above snakelike cabling Copper Foil 202.
In sum, the present invention, by constituting temperature detecting resistance by the snakelike cabling Copper Foil on printed circuit board, is walked using PCB
Line replace critesistor equitemperature sensor, realize the temperature survey of the devices such as laser diode, can make laser diode and
Only have printed circuit board between semiconductor cooler, there is not the structural members such as other sensors, package assembly is simple；The present invention ties
Structure is simple, controls flexibility and reliability, economical and practical, has wide applicability.So, the present invention effectively overcomes in prior art
Various shortcoming and have high industrial utilization.
Above-described embodiment only principle of the illustrative present invention and its effect, not for the restriction present invention.Any ripe
The personage knowing this technology all can carry out modifications and changes without prejudice under the spirit and the scope of the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete with institute under technological thought without departing from disclosed spirit such as
All equivalent modifications becoming or change, must be covered by the claim of the present invention.
Claims (9)
1. a kind of temperature measurement circuit it is characterised in that：Described temperature measurement circuit includes：
It is made up of the snakelike cabling Copper Foil on printed circuit board, for connecting the temperature detecting resistance treating temperature element；
It is connected with described temperature detecting resistance, for measurement described in the described temperature change whne temperature element, resistance changes
The measuring circuit of the voltage on temperature detecting resistance；
It is connected with described measuring circuit, the photovoltaic conversion of the analog signal form for obtaining measurement is digital signal form
The analog to digital conversion circuit of voltage；
For the resistance value corresponding temperature current with described temperature detecting resistance is obtained with the corresponding relation of temperature according to described voltage
Processor.
2. temperature measurement circuit according to claim 1 it is characterised in that：Described measuring circuit includes：
Measure described temperature detecting resistance for the resistance in described temperature detecting resistance with described when the temperature of temperature element changes
On voltage measuring bridge；
It is connected with described measuring bridge, the amplifier that the voltage for inputting to described measuring bridge is amplified.
3. temperature measurement circuit according to claim 2 it is characterised in that：First brachium pontis of described measuring bridge is by first resistor
Constitute with described temperature detecting resistance, the second brachium pontis is made up of second resistance and 3rd resistor；The normal phase input end of described amplifier is even
Be connected between described first resistor and described temperature detecting resistance, the inverting input of described amplifier be connected to described second resistance and
Between described 3rd resistor.
4. temperature measurement circuit according to claim 3 it is characterised in that：The resistance of described second resistance and described 3rd resistor
Resistance equal.
5. temperature measurement circuit according to claim 3 it is characterised in that：Described measuring circuit also includes being connected to the first reference
Between first common port of voltage and described first brachium pontis and described second brachium pontis, it is connected to described first brachium pontis and described second
Second common port of brachium pontis and over the ground between for input described measuring circuit in voltage carry out current limliting first current limliting electricity
Resistance and the second current-limiting resistance.
6. temperature measurement circuit according to claim 5 it is characterised in that：The resistance of described first current-limiting resistance and described second
The resistance of current-limiting resistance is equal.
7. temperature measurement circuit according to claim 2 it is characterised in that：Described amplifier is that the instrument of high input impedance is amplified
Device.
8. the temperature measurement circuit according to claim 2 or 7 it is characterised in that：Described measuring circuit also includes and described amplification
The reference input of device is connected the biasing circuit of the output voltage for stablizing described amplifier.
9. temperature measurement circuit according to claim 8 it is characterised in that：Described biasing circuit includes：One end and described amplification
The reference input of device is connected, and the 5th resistance of other end ground connection is connected with the reference input of described amplifier with one end, separately
One end connects the 6th resistance of the second reference voltage.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620671210.8U CN205981480U (en) | 2016-06-30 | 2016-06-30 | Temperature detection circuit and temperature measurement structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620671210.8U CN205981480U (en) | 2016-06-30 | 2016-06-30 | Temperature detection circuit and temperature measurement structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107560750A (en) * | 2016-06-30 | 2018-01-09 | 国神光电科技（上海）有限公司 | A kind of temperature measurement circuit and a kind of temperature measurement structure |
| CN110686790A (en) * | 2019-11-15 | 2020-01-14 | 武汉德泰纳新能源技术有限公司 | Integrated temperature measurement structure of AC/DC charging socket |
| CN113899462A (en) * | 2021-09-08 | 2022-01-07 | 海信家电集团股份有限公司 | Temperature measurement method, temperature measurement circuit and temperature measurement device |
| US20230335651A1 (en) * | 2022-04-15 | 2023-10-19 | Northrop Grumman Systems Corporation | Reconfigurable solar array for stable output voltage over a range of temperatures with high operational efficiency |
-
2016
- 2016-06-30 CN CN201620671210.8U patent/CN205981480U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107560750A (en) * | 2016-06-30 | 2018-01-09 | 国神光电科技（上海）有限公司 | A kind of temperature measurement circuit and a kind of temperature measurement structure |
| CN110686790A (en) * | 2019-11-15 | 2020-01-14 | 武汉德泰纳新能源技术有限公司 | Integrated temperature measurement structure of AC/DC charging socket |
| CN113899462A (en) * | 2021-09-08 | 2022-01-07 | 海信家电集团股份有限公司 | Temperature measurement method, temperature measurement circuit and temperature measurement device |
| CN113899462B (en) * | 2021-09-08 | 2024-04-09 | 海信家电集团股份有限公司 | Temperature measuring method, temperature measuring circuit and temperature measuring device |
| US20230335651A1 (en) * | 2022-04-15 | 2023-10-19 | Northrop Grumman Systems Corporation | Reconfigurable solar array for stable output voltage over a range of temperatures with high operational efficiency |
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